CN216514123U - Chemical nickel-palladium-gold plating device for printed circuit board - Google Patents

Chemical nickel-palladium-gold plating device for printed circuit board Download PDF

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Publication number
CN216514123U
CN216514123U CN202123296214.2U CN202123296214U CN216514123U CN 216514123 U CN216514123 U CN 216514123U CN 202123296214 U CN202123296214 U CN 202123296214U CN 216514123 U CN216514123 U CN 216514123U
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Prior art keywords
circuit board
plating
box
printed circuit
gold plating
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CN202123296214.2U
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Chinese (zh)
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唐凤国
覃章宝
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King Field Electronic Co ltd Shenzhen
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King Field Electronic Co ltd Shenzhen
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Abstract

The utility model discloses a chemical nickel-palladium-gold plating device for a printed circuit board, which relates to the field of circuit boards and comprises a plating box, wherein first motors are arranged on two sides of the plating box, the output ends of the first motors are connected with a rotary table through a first rotary shaft, one side of the rotary table is connected with a net frame through a connecting rod, and a plurality of separation blocks are fixed inside the net frame. According to the utility model, the material taking assembly is arranged, when the circuit board is taken out, a user firstly takes off the top cover, then the second motor operates to enable the winding roller to rotate to wind the traction cable, so that the lifting frame can be pulled upwards, the circuit board between the plurality of separating blocks can be pushed up by the cross rod at the bottom end of the lifting frame along with the upward movement of the lifting frame, and the circuit board is exposed along the upward movement of the separating blocks, so that the circuit board can be conveniently taken by the user, the user does not need to manually probe into the plating solution to take the material, and the circuit board taking device is safer and more convenient, and the condition that the circuit board taking mode is not convenient and safer is avoided.

Description

Chemical nickel-palladium-gold plating device for printed circuit board
Technical Field
The utility model relates to the field of circuit boards, in particular to a chemical nickel-palladium-gold plating device for a printed circuit board.
Background
The printed circuit board is also called as a printed circuit board, and is a provider for electrical connection of electronic components, the printed circuit board needs to be chemically plated with nickel and palladium, so that the printed circuit board is more durable, and the chemical nickel and palladium are important surface treatment processes in the printed circuit board industry, and are widely applied to production process technologies of hard circuit boards (PCBs), flexible circuit boards (FPCs), rigid interference combined boards, metal substrates and the like.
Chinese patent for CN212812193U discloses a device for chemical nickel plating of printed circuit board, it is through providing more unanimous plating bath flow direction and more even plating bath flow mode, realized hanging the even exchange of plating bath between every piece of PCB in the basket, guaranteed the high-efficient circulation stirring of plating bath in the nickel groove, but when a plurality of circuit board plating baths finish need take out, drag for through the staff is manual, easily glue the plating bath, safety ring protects inadequately, plating bath station viscidity is stronger simultaneously, consequently easily glue in plating incasement wall, it is comparatively inconvenient to lead to follow-up clearance.
SUMMERY OF THE UTILITY MODEL
Based on the technical problems, the chemical nickel-palladium-gold plating device for the printed circuit board is provided to solve the technical problems that the circuit board is not convenient and safe to take out and plating solution is adhered to the inner wall of a plating box to cause inconvenient cleaning.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a chemical nickel plating palladium gold device for printed circuit board, is including plating the case, first motor is all installed to the both sides of plating the case, the output of first motor is connected with the carousel through first pivot, one side of carousel is connected with the net frame through the connecting rod, the inside of net frame is fixed with a plurality of minutes piece, the top of net frame is provided with gets the material subassembly, the inside below of plating the case is provided with the clearance subassembly.
Further, a top cover is installed in the middle of the top of the plating box, an observation window is installed above the outer surface of the plating box, an anti-skidding seat is arranged at the bottom of the plating box, and liquid discharge pipes penetrate through the lower portions of the two sides of the plating box.
Through adopting above-mentioned technical scheme, can put into the circuit board through the top cap, can look over the circuit board plating bath condition through the observation window.
Furthermore, the material taking assembly comprises a winding box arranged at the top of the plating box, a second motor is arranged on the outer surface of the winding box, the output end of the second motor is connected with a winding roller, a traction cable is wound on the outer surface of the winding roller, and a lifting frame is fixed at the bottom end of the traction cable.
Through adopting above-mentioned technical scheme, when taking out the circuit board, the user takes off the top cap earlier, and later the second motor operation lets the wind-up roll rotate the rolling haulage cable to can pull the lifting frame upwards.
Further, the lifting frame comprises a plurality of crossbars that the equidistance distributes, and is a plurality of the crossbeam all is located a plurality of separate between the piece.
Through adopting above-mentioned technical scheme, upwards along with the lifting frame, the horizontal pole of its bottom can be with being in the circuit board between a plurality of spacing pieces and push up, lets the circuit board expose along spacing piece rebound to the user takes, does not need the manual work of user to visit in the plating bath and gets the material, and is safe convenient more.
Furthermore, the cleaning assembly comprises a sealing plate arranged on the outer surface of the plating box, pull handles are fixed on two sides of the outer surface of the sealing plate, and a scraper is connected to the inner side of the sealing plate through a fixing rod.
Through adopting above-mentioned technical scheme, when needs will plate all plating liquids in the case and clear out, the user can stimulate the pull handle, lets the closing plate keep away from and plates the case for plate case surface below and expose, later along with the pull handle lasts the pulling, then the accessible dead lever further drives the scraper blade, lets the scraper blade remove towards plating case surface direction, can scrape out the plating solution of plating case both sides and bottom through the scraper blade, and is easy and simple to handle, the clearance of being convenient for.
Furthermore, the scraper blade is located the back of plating the case, the both sides and the bottom of scraper blade all laminate mutually with the inner wall of plating the case.
By adopting the technical scheme, the plating solution on the two sides and the bottom of the plating box can be scraped out by the scraper.
In summary, the utility model mainly has the following beneficial effects:
1. according to the utility model, the material taking assembly is arranged, when the circuit board is taken out, a user firstly takes off the top cover, then the second motor operates to enable the winding roller to rotate to wind the traction cable, so that the lifting frame can be pulled upwards, the circuit board between the plurality of separating blocks can be pushed up by the cross rod at the bottom end of the lifting frame along with the upward movement of the lifting frame, and the circuit board is exposed along the upward movement of the separating blocks, so that the circuit board can be conveniently taken by the user, the user does not need to manually probe into the plating solution to take the material, and the circuit board taking device is safer and more convenient, and the condition that the circuit board taking mode is not convenient and safer is avoided.
2. According to the utility model, through the arrangement of the cleaning assembly, when all plating solutions in the plating box need to be cleaned, a user can pull the pull handle to enable the sealing plate to be away from the plating box, so that the lower part of the outer surface of the plating box is exposed, and then the scraper can be further driven by the fixed rod along with the continuous pulling of the pull handle to enable the scraper to move towards the outer surface of the plating box, so that the plating solutions on the two sides and the bottom of the plating box can be scraped out through the scraper, the operation is simple and convenient, the cleaning is convenient, and the condition that the cleaning is inconvenient due to the fact that the plating solutions adhere to the inner wall of the plating box is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front sectional view of the plating tank of the present invention;
FIG. 3 is a schematic side sectional view of the plating tank of the present invention;
fig. 4 is a schematic top view of the screen frame according to the present invention.
In the figure: 1. plating a box; 2. a top cover; 3. an observation window; 4. a first motor; 5. a material taking assembly; 501. a rolling box; 502. a second motor; 503. a wind-up roll; 504. a traction cable; 505. a lifting frame; 6. cleaning the assembly; 601. a sealing plate; 602. pulling a handle; 603. fixing the rod; 604. a squeegee; 7. a first rotating shaft; 8. a turntable; 9. a connecting rod; 10. a screen frame; 11. a partitioning block.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following description will be made of an alignment example according to the overall structure of the present invention.
A chemical nickel-palladium-gold plating device for a printed circuit board comprises a plating box 1, a top cover 2 is installed in the middle of the top of the plating box 1, an observation window 3 is installed above the outer surface of the plating box 1, an anti-slip seat is arranged at the bottom of the plating box 1, liquid discharge pipes penetrate through the lower portions of two sides of the plating box 1, the circuit board can be placed in through the top cover 2, the condition of a plating solution of the circuit board can be checked through the observation window 3, first motors 4 are installed on two sides of the plating box 1, the output ends of the first motors 4 are connected with a rotary table 8 through first rotating shafts 7, one side of the rotary table 8 is connected with a net frame 10 through connecting rods 9, a plurality of partition blocks 11 are fixed inside the net frame 10, a material taking assembly 5 is arranged above the net frame 10, the material taking assembly 5 comprises a rolling box 501 installed at the top of the plating box 1, a second motor 502 is installed on the outer surface of the net frame 501, the output end of the second motor 502 is connected with a rolling roller 503, a traction cable 504 is wound on the outer surface of the winding roller 503, a lifting frame 505 is fixed at the bottom end of the traction cable 504, a cleaning assembly 6 is arranged below the inner part of the plating box 1, the cleaning assembly 6 comprises a sealing plate 601 installed on the outer surface of the plating box 1, pull handles 602 are fixed on two sides of the outer surface of the sealing plate 601, and a scraper 604 is connected to the inner side of the sealing plate 601 through a fixing rod 603.
Referring to fig. 1, 2, 3 and 4, the material taking assembly 5 includes a winding box 501 installed on the top of the plating box 1, a second motor 502 is installed on the outer surface of the winding box 501, a winding roller 503 is connected to the output end of the second motor 502, a traction cable 504 is wound on the outer surface of the winding roller 503, a lifting frame 505 is fixed at the bottom end of the traction cable 504, the lifting frame 505 is composed of a plurality of cross bars distributed at equal intervals, the plurality of cross bars are located between the plurality of separating blocks 11, when a user takes out a circuit board, the top cover 2 is taken off first by the user, then the second motor 502 operates to allow the winding roller 503 to rotate the winding and winding traction cable 504, so that the lifting frame 505 can be pulled upwards, the cross bars at the bottom end of the lifting frame 505 can push up the circuit board located between the plurality of separating blocks 11 with the lifting frame 505 upwards, the circuit board moves upwards along the separating blocks 11 to be exposed for the user to take, and the user does not need to manually probe into the plating solution for taking, is safer and more convenient.
Referring to fig. 1, 2 and 3, the cleaning assembly 6 includes a sealing plate 601 mounted on the outer surface of the plating box 1, pull handles 602 are fixed on both sides of the outer surface of the sealing plate 601, the inner side of the sealing plate 601 is connected with a scraper 604 through a fixing rod 603, the scraper 604 is located at the back of the plating box 1, both sides and the bottom of the scraper 604 are attached to the inner wall of the plating box 1, when all the plating solutions in the plating box 1 need to be cleaned, a user can pull the pull handles 602 to keep the sealing plate 601 away from the plating box 1, so that the lower part of the outer surface of the plating box 1 is exposed, and then the scraper 604 can be further driven through the fixing rod 603 as the pull handles 602 are continuously pulled, so that the scraper 604 moves towards the outer surface of the plating box 1, and the plating solutions on both sides and the bottom of the plating box 1 can be scraped out through the scraper 604, which is simple and convenient to clean.
The implementation principle of the embodiment is as follows: firstly, a user can put a plurality of circuit boards between a plurality of separating blocks 11 in a screen frame 10 one by one through a top cover 2, then a first motor 4 operates to drive a rotating disc 8 to rotate through a first rotating shaft 7, the screen frame 10 can swing through a connecting rod 9 to homogenize plating solution, then when the circuit boards are taken out, the user firstly takes down the top cover 2, then a second motor 502 operates to drive a winding roller 503 to rotate a winding traction rope 504, so that a lifting frame 505 can be pulled upwards, a cross rod at the bottom end of the lifting frame 505 can push up the circuit boards among the separating blocks 11 along the separating blocks 11 to enable the circuit boards to move upwards and expose along the separating blocks 11, the circuit boards can be conveniently taken by the user, the user does not need to manually probe into the plating solution to take the materials, the safety and the convenience are improved, and when all the plating solution in a plating box 1 needs to be cleaned out, the user can pull a pull handle 602 to enable a sealing plate 601 to be far away from the plating box 1, so that the lower part of the outer surface of the plating box 1 is exposed, and then the pulling handle 602 is continuously pulled, the scraper 604 can be further driven by the fixing rod 603, the scraper 604 moves towards the outer surface of the plating box 1, the plating solution on the two sides and the bottom of the plating box 1 can be scraped out by the scraper 604, the operation is simple and convenient, and the cleaning is convenient.
Although embodiments of the present invention have been shown and described, the present embodiments are merely illustrative of the present invention and are not intended to limit the present invention, and the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and those skilled in the art can make modifications, substitutions, variations, etc. of the embodiments as required without departing from the principle and spirit of the present invention, but within the scope of the claims of the present invention.

Claims (6)

1. The utility model provides a chemical nickel palladium gold plating device for printed circuit board, includes plating case (1), its characterized in that: plate the both sides of case (1) and all install first motor (4), the output of first motor (4) is connected with carousel (8) through first pivot (7), one side of carousel (8) is connected with net frame (10) through connecting rod (9), the inside of net frame (10) is fixed with a plurality of spacer blocks (11), the top of net frame (10) is provided with gets material subassembly (5), plate the inside below of case (1) and be provided with clearance subassembly (6).
2. The electroless nickel palladium gold plating device for the printed circuit board as claimed in claim 1, wherein: the novel multifunctional plating device is characterized in that a top cover (2) is installed in the middle of the top of the plating box (1), an observation window (3) is installed above the outer surface of the plating box (1), an anti-skidding seat is arranged at the bottom of the plating box (1), and liquid discharge pipes penetrate through the lower portions of the two sides of the plating box (1).
3. The electroless nickel palladium gold plating device for the printed circuit board as claimed in claim 1, wherein: get material subassembly (5) including installing in coiling case (501) of plating case (1) top, the surface mounting of coiling case (501) has second motor (502), the output of second motor (502) is connected with wind-up roll (503), the surface winding of wind-up roll (503) has pull rope (504), the bottom mounting of pull rope (504) has lifting frame (505).
4. The electroless nickel palladium gold plating device for the printed circuit board as claimed in claim 3, wherein: the lifting frame (505) is composed of a plurality of cross rods which are distributed at equal intervals, and the cross rods are all positioned between the separation blocks (11).
5. The electroless nickel palladium gold plating device for the printed circuit board as claimed in claim 1, wherein: the cleaning assembly (6) comprises a sealing plate (601) arranged on the outer surface of the plating box (1), pull handles (602) are fixed on two sides of the outer surface of the sealing plate (601), and a scraper (604) is connected to the inner side of the sealing plate (601) through a fixing rod (603).
6. The electroless nickel-palladium-gold plating device for the printed circuit board as claimed in claim 5, wherein: the scraper (604) is positioned at the back of the plating box (1), and the two sides and the bottom of the scraper (604) are attached to the inner wall of the plating box (1).
CN202123296214.2U 2021-12-24 2021-12-24 Chemical nickel-palladium-gold plating device for printed circuit board Active CN216514123U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123296214.2U CN216514123U (en) 2021-12-24 2021-12-24 Chemical nickel-palladium-gold plating device for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123296214.2U CN216514123U (en) 2021-12-24 2021-12-24 Chemical nickel-palladium-gold plating device for printed circuit board

Publications (1)

Publication Number Publication Date
CN216514123U true CN216514123U (en) 2022-05-13

Family

ID=81504828

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123296214.2U Active CN216514123U (en) 2021-12-24 2021-12-24 Chemical nickel-palladium-gold plating device for printed circuit board

Country Status (1)

Country Link
CN (1) CN216514123U (en)

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