CN216491716U - Liquid cooling structure of controller and controller - Google Patents
Liquid cooling structure of controller and controller Download PDFInfo
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- CN216491716U CN216491716U CN202122855496.9U CN202122855496U CN216491716U CN 216491716 U CN216491716 U CN 216491716U CN 202122855496 U CN202122855496 U CN 202122855496U CN 216491716 U CN216491716 U CN 216491716U
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Abstract
The utility model discloses a liquid cooling structure of a controller and the controller, wherein the liquid cooling structure comprises a middle frame, a first PCB and a liquid cooling plate, the first PCB is arranged at the bottom side of a middle plate of the middle frame, the liquid cooling plate is arranged at the top side of the middle plate of the middle frame, the middle frame is provided with a first heat dissipation part, and the bottom surface of the liquid cooling plate is indirectly contacted with a chip of the first PCB through the first heat dissipation part. Adopt the liquid cooling mode to dispel the heat the cooling to the chip of PCB board, compare the air-cooled mode, heat transfer efficiency is higher, therefore the cooling effect is better to can satisfy the heat dissipation demand of controller. The first heat dissipation part is a part of the middle frame, so that the first heat dissipation part does not need to be additionally processed and produced, and the cost is reduced. Therefore, the liquid cooling structure meets the heat dissipation requirement and the low-cost requirement of the controller.
Description
Technical Field
The utility model relates to the technical field of control equipment, in particular to a liquid cooling structure of a controller and the controller adopting the liquid cooling structure.
Background
In order to realize more intelligent automatic driving, the automobile controller is equipped with more chips on the PCB board of the controller, except the automobile controller, other controllers are also the same, and in order to realize more intelligent control, more chips are inevitably equipped.
The controller can also be provided with a heat dissipation mechanism to assist the controller in heat dissipation, and the heat dissipation mechanism adopted by the existing controller is mainly an air cooling mechanism. The increase of the packaging quantity of the chips leads to the increase of the heating value of the controller during working, and the air cooling mechanism can not meet the heat dissipation requirement of the controller. Adopt liquid cooling mechanism to dispel the heat to the controller, can satisfy the heat dissipation demand of controller, but have the problem with high costs.
In view of this, how to satisfy both the heat dissipation requirement of the controller and the low cost requirement is a technical problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In one aspect, the utility model provides a liquid cooling structure of a controller, which comprises a middle frame, a first PCB and a liquid cooling plate, wherein the first PCB is arranged on the bottom side of a middle plate of the middle frame, the liquid cooling plate is arranged on the top side of the middle plate of the middle frame, the middle frame is provided with a first heat dissipation part, and the bottom surface of the liquid cooling plate is indirectly contacted with a chip of the first PCB through the first heat dissipation part.
In one embodiment, the liquid cooling structure includes a second PCB disposed on a top side of the liquid cooling plate and a second heat sink portion disposed between the second PCB and the liquid cooling plate, wherein a top surface of the liquid cooling plate is in indirect contact with a chip of the second PCB through the second heat sink portion.
In one embodiment, the first heat sink member and the second heat sink member each have a heat sink protrusion with which a chip of a corresponding PCB board is contacted.
In one embodiment, the first heat sink member and the second heat sink member each have a heat sink plate; the heat dissipation bulge of the first heat dissipation part protrudes out of the bottom surface of the heat dissipation plate of the first heat dissipation part, and the top surface of the heat dissipation plate of the first heat dissipation part is in contact with the liquid cooling plate; the heat dissipation bulge of the second heat dissipation part protrudes out of the top surface of the heat dissipation plate, and the bottom surface of the heat dissipation plate is in contact with the liquid cooling plate.
In one embodiment, the second heat sink piece is a forging.
In one embodiment, the second heat sink portion is welded to the liquid cooling plate.
In one embodiment, the middle frame is a casting.
In one embodiment, the first heat sink part and the liquid cooling plate are bonded by a heat conductive adhesive.
In one embodiment, the liquid cooling plate comprises a first plate body and a second plate body which are mutually closed, a flow channel is formed between the first plate body and the second plate body, and the flow channel is arranged at the position of the liquid cooling plate corresponding to a chip of the PCB.
In another aspect, the present application provides a controller that employs any of the liquid cooling structures described above.
The liquid cooling structure provided by the utility model adopts a liquid cooling mode to carry out heat dissipation and cooling on the chip of the PCB, and compared with an air cooling mode, the liquid cooling structure has higher heat transfer efficiency and better cooling effect, thereby meeting the heat dissipation requirement of a controller. Moreover, the liquid cooling structure enables the middle frame to be provided with the first heat dissipation part, so that the first heat dissipation part is not required to be additionally processed and produced, and the cost is reduced. Therefore, the heat dissipation requirement and the low-cost requirement of the controller are met. Correspondingly, the controller adopting the liquid cooling structure has the technical effects of good heat dissipation performance, stable operation and low cost.
Drawings
Fig. 1 is a schematic diagram of a liquid cooling structure of a controller according to an embodiment of the present invention;
FIG. 2 is another perspective view of FIG. 1;
fig. 3 is a schematic exploded view of a first plate and a second plate of the liquid cooling plate;
fig. 4 is a schematic view of a second heat sink member.
The reference numerals are explained below:
10 middle frame, 101 first heat dissipation part, A1 first heat dissipation protrusion, B1 first heat dissipation plate, 102 frame;
20 a first PCB board;
30 liquid cooling plates, 301 first plate body, 301a runner groove and 302 second plate body;
40 a second PCB board;
50 second heat dissipation parts, A2 second heat dissipation protrusions and B2 second heat dissipation plates.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution of the present invention is further described in detail below with reference to the accompanying drawings and the detailed description.
In order to achieve more intelligent control, more chips are packaged on a PCB (Printed Circuit Board) of the controller, so that the heat dissipation requirement of the controller cannot be met by air cooling. Therefore, the application provides a liquid cooling structure of a controller. The liquid cooling structure includes a middle frame 10, a first PCB board 20, and a liquid cooling board 30.
The middle frame 10 is used to provide a mounting base for devices inside the controller. The middle frame 10 is an integrated structure, and includes a middle plate, a frame 102 surrounding the middle plate, and a first heat sink 101.
The liquid cooling plate 30 is disposed on the top side of the middle plate of the middle frame 10, and a flow passage in which a cooling liquid flows is formed inside the liquid cooling plate 30.
The first PCB 20 is disposed at the bottom side of the middle plate of the middle frame 10, and the first PCB 20 is integrally installed with a chip and a plurality of electrical components (such as resistors, switches, relays, indicator lamps, etc.), some of which may protrude from the top surface of the first PCB 20, so that the chip on the first PCB 20 cannot directly contact the liquid cooling plate 30 located at the top side thereof. The first heat sink portion 101 is responsible for indirectly contacting the chips of the first PCB 20 with the liquid cooling plate 30, so that the cooling capacity of the cooling liquid can be efficiently transmitted to the first heat sink portion 101 through the liquid cooling plate 30 and then to the chips of the first PCB 20, thereby rapidly dissipating heat and cooling the chips of the first PCB 20.
This scheme adopts the liquid cooling mode to dispel the heat the cooling to the chip of first PCB board 20, compares the forced air cooling mode, and heat transfer efficiency is higher, therefore the cooling effect is better to can satisfy the heat dissipation demand of controller. In addition, according to the scheme, the first heat dissipation part 101 is arranged on the middle frame 10, or the first heat dissipation part 101 is formed as a part of the middle frame 10 and integrally formed with the middle plate, the frame 102 and the like of the middle frame 10, so that the first heat dissipation part is not required to be additionally processed and produced, and the cost is reduced. Therefore, the heat dissipation requirement and the low-cost requirement of the controller are met.
Specifically, the first heat dissipation portion 101 may be provided with a first heat dissipation protrusion a1 and a first heat dissipation plate B1 (in the illustrated embodiment, the first heat dissipation plate B1 is also a middle plate of the middle frame 10), and the first heat dissipation protrusion a1 protrudes from a bottom surface of the first heat dissipation plate B1. The bottom surface of the liquid cold plate 30 contacts the top surface of the first heat spreader plate B1. The electric components protruded from the top surface of the first PCB 20 are staggered from the first heat dissipation protrusions a1 such that the first heat dissipation protrusions a1 can protrude near the top surface of the first PCB 20, thereby allowing the bottom surfaces of the first heat dissipation protrusions a1 to contact the chips of the first PCB 20. The liquid cooling plate 30 is contacted with the top surface of the first heat dissipation plate B1, so that a large contact area can be obtained, and the high-efficiency transmission of cold energy is facilitated. Of course, the top surface of the first heat dissipating protrusion a1 may be directly contacted with the liquid cooling plate 30 without providing the first heat dissipating plate B1.
In the illustrated embodiment, the liquid cooling structure further includes a second PCB 40 and a second heat sink 50, the second PCB 40 is disposed on the top side of the liquid cooling plate 30, the second heat sink 50 is disposed between the second PCB 40 and the liquid cooling plate 30, and the top surface of the liquid cooling plate 30 is indirectly contacted with the chip of the second PCB 40 through the second heat sink 50. By such design, the liquid-cooled plate 30 can cool the first PCB 20 and the second PCB 40 at the same time without separately configuring a liquid-cooled plate for each PCB, thereby further reducing the cost of the controller.
Specifically, the second heat dissipation part 50 may be provided with second heat dissipation protrusions a2 and a second heat dissipation plate B2, and the second heat dissipation protrusions a2 protrude from the bottom surface of the second heat dissipation plate B2. The top surface of the liquid cold plate 30 contacts the bottom surface of the second heat spreader plate B2. The electric components protruded from the bottom surface of the second PCB 40 are staggered from the second heat dissipation protrusions a2 such that the second heat dissipation protrusions a2 can protrude near the bottom surface of the second PCB 40, thereby allowing the top surfaces of the second heat dissipation protrusions a2 to contact the chips of the second PCB 40. The liquid cooling plate 30 is contacted with the bottom surface of the second heat dissipation plate B2, a large contact area can be obtained, so that the high-efficiency transmission of cold energy is facilitated, and the second heat dissipation plate B2 is used for connecting a plurality of second heat dissipation protrusions A2 together, so that the second heat dissipation part 50 is integrated. Of course, the bottom surface of the second heat dissipating protrusion a2 may directly contact the liquid cooling plate 30 without providing the second heat dissipating plate B2.
Specifically, the second heat dissipation portion 50 can be a forged part formed by forging, the forged part is low in processing cost, the low-cost requirement of the controller is met, and the casting part is basically free of defects such as air holes and the like which obstruct the transmission of cooling liquid volume, so that the high-efficiency transmission of cooling liquid volume is facilitated, and the heat dissipation effect of the controller can be further improved.
Specifically, the second heat sink portion 50 can be welded to the liquid cooling plate 30, and brazing can be adopted, so that the welding is low in cost, and the connection is reliable and not easy to loosen.
Specifically, the middle frame 10 may be a die-cast casting, which has low processing cost and is easy to form a complex shape, and meets the low-cost requirement of the controller and the modeling requirement of the middle frame.
Specifically, the first heat dissipation portion 101 of the middle frame 10 and the liquid cooling plate 30 can be bonded through the heat conducting glue, so that the liquid cooling plate 30 can be fixedly installed, and the heat conducting contact between the first heat dissipation portion 101 and the liquid cooling plate 30 is not affected.
Specifically, the flow channel of the liquid cooling plate 30 may be disposed corresponding to the chip position of the PCB, so that the flow channel is disposed at the position of the liquid cooling plate 30 corresponding to the chip of the PCB. By the design, the transmission path for transmitting the cooling capacity of the cooling liquid to the chip can be shortened, and the dissipation of the cooling capacity is reduced, so that the heat dissipation effect of the controller can be further improved.
In the illustrated embodiment, the liquid cooling plate 30 includes a first plate 301 and a second plate 302 that are opposite to each other, and a flow channel is formed between the first plate 301 and the second plate 302. The first plate 301 is provided with the channel groove 301a formed by stamping, and the second plate 302 is a flat plate, so that only the first plate 301 needs to be stamped, and the second plate 302 does not need to be stamped, thereby further reducing the cost.
It should be noted that in the description of the present invention, the directions or positional relationships indicated by "top", "bottom", etc. are based on the positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed in a specific direction and operate, and thus, should not be construed as limiting the present invention.
The liquid cooling structure of the controller and the controller provided by the utility model are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. The liquid cooling structure of controller, its characterized in that includes center (10), first PCB board (20) and liquid cooling board (30), first PCB board (20) are arranged the medium plate bottom side of center (10), liquid cooling board (30) are arranged the medium plate top side of center (10), center (10) are equipped with first heat dissipation portion (101), the bottom surface of liquid cooling board (30) passes through first heat dissipation portion (101) with the chip indirect contact of first PCB board (20).
2. The liquid-cooled structure of the controller of claim 1, comprising a second PCB board (40) and a second heat sink portion (50), said second PCB board (40) being disposed on a top side of said liquid-cooled board (30), said second heat sink portion (50) being disposed between said second PCB board (40) and said liquid-cooled board (30), a top surface of said liquid-cooled board (30) being in indirect contact with a chip of said second PCB board (40) through said second heat sink portion (50).
3. The liquid cooling structure of the controller according to claim 2, wherein the first heat sink member (101) and the second heat sink member (50) each have a heat sink protrusion with which a chip of a corresponding PCB board is contacted.
4. The liquid cooling structure of the controller according to claim 3, wherein the first heat sink member (101) and the second heat sink member (50) each have a heat sink plate; the heat dissipation bulge of the first heat dissipation part (101) protrudes out of the bottom surface of the heat dissipation plate, and the top surface of the heat dissipation plate is in contact with the liquid cooling plate (30); the heat dissipation bulge of the second heat dissipation part (50) protrudes out of the top surface of the heat dissipation plate, and the bottom surface of the heat dissipation plate is in contact with the liquid cooling plate (30).
5. The liquid-cooled structure of a controller of claim 2, wherein the second heat sink portion (50) is a forged piece.
6. The liquid-cooled structure of a controller of claim 2, wherein the second heat sink portion (50) is welded to the liquid-cooled plate (30).
7. The liquid-cooled structure of a controller according to claim 1, characterized in that the middle frame (10) is a casting.
8. The liquid-cooled structure of a controller according to claim 1, wherein the first heat sink member (101) is bonded to the liquid-cooled plate (30) by a thermally conductive adhesive.
9. The liquid cooling structure of the controller according to any one of claims 1 to 8, wherein the liquid cooling plate (30) comprises a first plate body (301) and a second plate body (302) which are mutually folded, a flow channel is formed between the first plate body (301) and the second plate body (302), and the flow channel is arranged at a position of the liquid cooling plate (30) corresponding to a chip of a PCB.
10. A controller, wherein the controller employs a liquid-cooled structure as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122855496.9U CN216491716U (en) | 2021-11-19 | 2021-11-19 | Liquid cooling structure of controller and controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122855496.9U CN216491716U (en) | 2021-11-19 | 2021-11-19 | Liquid cooling structure of controller and controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491716U true CN216491716U (en) | 2022-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122855496.9U Active CN216491716U (en) | 2021-11-19 | 2021-11-19 | Liquid cooling structure of controller and controller |
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| Country | Link |
|---|---|
| CN (1) | CN216491716U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115515344A (en) * | 2022-07-20 | 2022-12-23 | 岚图汽车科技有限公司 | Controller shell, central controller and automobile |
-
2021
- 2021-11-19 CN CN202122855496.9U patent/CN216491716U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115515344A (en) * | 2022-07-20 | 2022-12-23 | 岚图汽车科技有限公司 | Controller shell, central controller and automobile |
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