CN216491259U - High-precision metallized semi-pore plate - Google Patents

Abstract

The utility model discloses a high-precision metallized semi-pore plate which comprises a circuit board main body, wherein an element position frame is arranged at the upper end of the circuit board main body, a plurality of metallized semi-pores are arranged at the left end and the right end of the circuit board main body, mounting holes are formed in four corners of the upper end of the circuit board main body, expansion plates are mounted at the front end and the rear end of the circuit board main body, the expansion plates and the circuit board main body are in an integral structure, two bilaterally symmetrical positioning holes are formed in the upper end of each expansion plate, an opening is formed in one end, close to the circuit board main body, of each expansion plate, a plurality of splitting holes are formed in the joint of each expansion plate and the circuit board main body, and connecting components are arranged at the left end and the right end of the circuit board main body. According to the high-precision metallized semi-pore plate, the probability of insufficient soldering and infirm soldering when the metallized semi-pore is welded with the pin of the plug-in is reduced by arranging the connecting assembly to be matched with the mounting hole, and the circuit board main body and the expansion plate can be detached by arranging the detaching hole, so that the high-precision metallized semi-pore plate is high in practicability.

Description

High-precision metallized semi-pore plate

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-precision metallized semi-pore plate.

Background

The semi-metallized hole process of the edge of the finished board is a mature process in PCB processing, but how to control the quality of the product after the semi-metallized hole of the edge of the board is formed is as follows: such as the upwarp and the residue of copper pricks on the hole wall are always a difficult problem in the machining process. The PCB with the whole row of semi-metallized holes on the edge of the board is characterized in that the PCB is small in size, is mostly used on a carrier board and is used as a daughter board of a mother board, and the semi-metallized holes are welded with the mother board and pins of components, so that a connector and space can be saved. However, if there are copper burrs left in the semi-metallized holes, when a plug-in manufacturer performs soldering, the solder legs are not firm and are in cold solder, and a bridging short circuit between two pins is seriously caused, so that a high-precision metallized semi-perforated plate is provided.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a high-precision metalized semi-pore plate which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a high-accuracy metallization half orifice plate, includes the circuit board main part, circuit board main part upper end is provided with component position frame, circuit board main part left end and right-hand member all are provided with a plurality of metallization half orifice, the mounting hole has all been opened in circuit board main part upper end four corners, the expansion board is all installed to circuit board main part front end and rear end, the expansion board is a body structure with the circuit board main part, open the expansion board upper end has two bilateral symmetry's locating hole, the expansion board is close to the one end of circuit board main part and opens there is the opening, open the junction of expansion board and circuit board main part has a plurality of split hole, circuit board main part left end and right-hand member all are provided with coupling assembling.

Preferably, coupling assembling includes the connecting plate, the connecting plate is close to the one end of circuit board main part and installs the concave piece of a plurality of metallization, all installs the insulating block jointly between two adjacent metallization concave pieces around, the bottom plate of symmetry, two around two are installed to the connecting plate lower extreme the erection column is all installed, two to the bottom plate upper end the pad foot is all installed to the bottom plate lower extreme.

Preferably, the number of the metalized concave blocks is the same as that of the metalized half holes, one end, close to the circuit board main body, of each metalized concave block is an arc surface, the diameter of each arc surface is the same as that of each metalized half hole, and the metalized concave blocks are matched with the metalized half holes respectively.

Preferably, the mounting post is located in the mounting hole, and the diameter of the mounting post is equal to the diameter of the mounting hole.

Preferably, the upper end face of the bottom plate is in close contact with the lower end face of the circuit board main body.

Preferably, a plurality of the splitting holes are distributed in a linear array.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the high-precision metallized semi-hole plate, the connecting assembly is arranged to be matched with the mounting hole to reduce the probability of insufficient soldering or the probability of infirm soldering when the metallized semi-hole is soldered with the pin of the plug-in unit, the metallized concave block matched with the metallized semi-hole is arranged to form a cylindrical cavity between the metallized semi-hole and the pin of the plug-in unit, so that the contact area between the metallized semi-hole and the pin of the plug-in unit is increased, the soldering quality is improved, the phenomenon of bridging short circuit caused by contact between every two pins is effectively avoided by arranging the insulating block, the whole connecting assembly can protect the metallized semi-hole, and the damage caused by collision in the transportation process is avoided;

2. according to the high-precision metallized semi-pore plate, the circuit board main body and the expansion plate can be detached by arranging the detaching holes, so that the volume of the whole metallized semi-pore plate is favorably reduced, and the metallized semi-pore plate is conveniently connected with a mother board;

3. according to the high-precision metallized semi-pore plate, the circuit board main body is overhead by arranging the foot pads, so that air circulation below the circuit board main body is facilitated, and the heat dissipation efficiency of the circuit board main body is improved.

Drawings

FIG. 1 is a schematic view of the overall structure of a high-precision metallized semi-pore plate according to the present invention;

FIG. 2 is a bottom view of the overall structure of the high-precision metallized semi-pore plate of the utility model;

FIG. 3 is a schematic diagram of the overall structure of the circuit board main body of the high-precision metallized semi-pore plate of the utility model;

fig. 4 is a schematic view of a part of the structure of the circuit board main body of the high-precision metallized semi-pore plate of the utility model;

fig. 5 is a schematic view of the overall structure of the connecting assembly of the high-precision metallized semi-orifice plate according to the present invention.

In the figure: 1. a circuit board main body; 2. an element position frame; 3. a metallized half-hole; 4. mounting holes; 5. an expansion board; 6. positioning holes; 7. an opening; 8. splitting the hole; 9. a connecting assembly; 21. a connecting plate; 22. metallizing the concave block; 23. an insulating block; 24. a base plate; 25. mounting a column; 26. and (5) a foot pad.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-5, a high-precision metallized semi-pore plate, including circuit board main body 1, 1 upper end of circuit board main body is provided with component position frame 2, 1 left end of circuit board main body and right-hand member all are provided with a plurality of metallized semi-pore 3, 1 upper end four corners of circuit board main body all open mounting hole 4, 1 front end of circuit board main body and rear end all install expansion board 5, expansion board 5 is a body structure with circuit board main body 1, 5 upper ends of expansion board open there are two bilateral symmetry's locating hole 6, the one end that expansion board 5 is close to circuit board main body 1 is opened there is opening 7, the junction of expansion board 5 and circuit board main body 1 is opened has a plurality of split hole 8, 1 left end of circuit board main body and right-hand member all are provided with coupling assembling 9.

Coupling assembling 9 includes connecting plate 21, connecting plate 21 is close to the one end of circuit board main part 1 and installs a plurality of metallization concave 22, all install insulating block 23 jointly between two adjacent metallization concave 22 around, the bottom plate 24 of symmetry around two is installed to connecting plate 21 lower extreme, erection column 25 is all installed to two bottom plate 24 upper ends, pad foot 26 is all installed to two bottom plate 24 lower extremes, metallization concave 22 and metallization half-hole 3 contact completely together, both all possess the conducting capacity, pad foot 26 adopts the insulating rubber material.

The quantity of the metallized concave blocks 22 is the same as the quantity of the metallized half holes 3, one end, close to the circuit board main body 1, of each metallized concave block 22 is set to be an arc surface, the diameter of each arc surface is the same as that of each metallized half hole 3, the metallized concave blocks 22 are respectively matched with the metallized half holes 3, and the quantity and the positions of the metallized concave blocks 22 are adjusted according to the quantity and the positions of the metallized half holes 3.

The mounting post 25 is positioned in the mounting hole 4, the diameter of the mounting post 25 is equal to that of the mounting hole 4, and the mounting post 25 is inserted in the mounting hole 4.

The upper end surface of the bottom plate 24 is in close contact with the lower end surface of the circuit board main body 1.

The plurality of splitting holes 8 are distributed in a linear array, and the principle of the splitting holes 8 is similar to that of a stamp perforation.

The high-precision metallized semi-hole plate is characterized in that the connecting assembly 9 is arranged to be matched with the mounting hole 4, so that the probability of insufficient soldering or the probability of infirm soldering during the soldering of the metallized semi-hole 3 is reduced, the metallized concave block 22 matched with the metallized semi-hole 3 is arranged to form a cylindrical cavity between the metallized semi-hole 3 and the metallized semi-hole 3, the contact area between the metallized semi-hole 3 and a pin of an insert is increased, the soldering quality is improved, the insulating block 23 is arranged to effectively avoid the phenomenon of bridging short circuit caused by the contact between every two pins, the whole connecting assembly 9 can protect the metallized semi-hole 3, and the damage caused by collision in the transportation process is avoided; the circuit board main body 1 and the expansion board 5 can be detached by arranging the detaching holes 8, so that the volume of the whole metallized semi-pore plate is favorably reduced, and the circuit board main body and the expansion board are conveniently connected with a mother board; the circuit board main body 1 is erected through the arrangement of the foot pads 26, so that air circulation below the circuit board main body 1 is facilitated, and the heat dissipation efficiency of the circuit board main body 1 is improved.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. A high-precision metallized semi-pore plate comprises a circuit board main body (1), and is characterized in that: circuit board main part (1) upper end is provided with component position frame (2), circuit board main part (1) left end and right-hand member all are provided with a plurality of metallization half-hole (3), mounting hole (4) have all been opened in circuit board main part (1) upper end four corners, expansion board (5) are all installed to circuit board main part (1) front end and rear end, expansion board (5) are a body structure with circuit board main part (1), expansion board (5) upper end is opened locating hole (6) that have two bilateral symmetry, opening (7) have been opened to the one end that expansion board (5) are close to circuit board main part (1), the junction of expansion board (5) and circuit board main part (1) is opened and is had a plurality of split hole (8), circuit board main part (1) left end and right-hand member all are provided with coupling assembling (9).

2. The high-precision metallized half-hole plate of claim 1, wherein: coupling assembling (9) are including connecting plate (21), connecting plate (21) are close to the one end of circuit board main part (1) and install a plurality of metallization concave block (22), all install between two adjacent metallization concave block (22) insulating block (23) jointly around, bottom plate (24) of two longitudinal symmetries are installed to connecting plate (21) lower extreme, two erection column (25), two are all installed to bottom plate (24) upper end bottom plate (24) lower extreme all installs and fills up foot (26).

3. A high precision metallized half-hole plate as claimed in claim 2, wherein: the quantity of the metalized concave blocks (22) is the same as that of the metalized half holes (3), one end, close to the circuit board main body (1), of each metalized concave block (22) is arranged to be an arc surface, the diameter of each arc surface is the same as that of each metalized half hole (3), and the metalized concave blocks (22) are matched with the metalized half holes (3) respectively.

4. A high precision metallized half-hole plate as claimed in claim 3, wherein: the mounting column (25) is located in the mounting hole (4), and the diameter of the mounting column (25) is equal to that of the mounting hole (4).

5. The high-precision metallized half-hole plate of claim 4, wherein: the upper end face of the bottom plate (24) is in close contact with the lower end face of the circuit board main body (1).

6. The high-precision metallized half-hole plate of claim 5, wherein: the plurality of splitting holes (8) are distributed in a linear array.

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