CN216491246U - Flexible copper foil high-thermal-conductivity substrate - Google Patents
Flexible copper foil high-thermal-conductivity substrate Download PDFInfo
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- CN216491246U CN216491246U CN202123174284.0U CN202123174284U CN216491246U CN 216491246 U CN216491246 U CN 216491246U CN 202123174284 U CN202123174284 U CN 202123174284U CN 216491246 U CN216491246 U CN 216491246U
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Abstract
The utility model discloses a high heat conduction base plate of flexible copper foil, including the flexible line plate body and locate the copper foil hose layer of terminal surface about the flexible line plate body respectively, soft aluminium base board, be equipped with LED lamp pearl group on the flexible line plate body, the one end that the flexible line plate body was kept away from to copper foil hose layer is equipped with fire-retardant power layer of unloading, the up end on fire-retardant power layer of unloading is equipped with anti-oxidant membrane, the one end that the flexible line plate body was kept away from to soft aluminium base board is equipped with the heat dissipation strip, the louvre of ventilating has been seted up on the heat dissipation strip, the one end of soft aluminium base board towards the flexible line plate body is equipped with the filling groove, be equipped with heat insulating layer in the filling groove. The realization is carried out the symmetry formula high efficiency heat conduction heat dissipation of ventilating of downside to the high temperature on the flexible line board of transmitting the LED lamp pearl group of work, has improved the heat conduction heat dissipation of ventilating of flexible line plate body, has improved the upper end surface of flexible line plate body to outside oxidation resistance, elasticity and the fire resistance of shocking resistance.
Description
Technical Field
The utility model relates to a flexible line way board technical field specifically is flexible copper foil high heat conduction base plate.
Background
At present during the LED flexible line way board more hot and have breakthrough flexible line way board, LED lamp pearl can send different colours, and the body is soft, and it is all convenient and fast that the installation is laid.
However, the conventional flexible circuit board having the copper foil flexible board layer has poor ventilation, heat conduction and heat dissipation properties, and the upper end surface of the flexible circuit board has low oxidation resistance to the outside, and further, the flexible circuit board has poor impact resilience and flame retardancy.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a flexible copper foil high heat conduction base plate to the upper end surface that has the flexible line plate body of copper foil hose layer among the solution prior art is relatively poor, the flexible line plate body to the oxidation resistance of outside lower, the flexible line plate body shock resistance elasticity and the relatively poor problem of fire resistance.
In order to achieve the above object, the utility model provides a following technical scheme: high heat conduction base plate of flexible copper foil, including the flexible line plate body and locate flexible line plate body about the copper foil soft board layer of terminal surface, soft aluminium base board respectively, be equipped with LED lamp pearl group on the flexible line plate body, the one end that the flexible line plate body was kept away from on the copper foil soft board layer is equipped with fire-retardant power layer of unloading, the up end on fire-retardant power layer of unloading is equipped with the oxidation-resistant membrane, the one end that flexible line plate body was kept away from to soft aluminium base board is equipped with the heat dissipation strip, the louvre of ventilating has been seted up on the heat dissipation strip, the one end of soft aluminium base board towards the flexible line plate body is equipped with the filling groove, be equipped with heat insulating layer in the filling groove.
Preferably, the LED lamp bead group penetrates through the anti-oxidation film and the flame-retardant stress relief layer and is welded with the flexible circuit board body, so that heat generated by the LED lamp bead group can be effectively transmitted from the upper side to the lower side.
Preferably, the two ends of the copper foil flexible board layer are provided with heat dissipation groove groups, the heat dissipation groove groups are longitudinally arranged on the overlooking surface, and the heat dissipation area of the copper foil flexible board layer is increased.
Preferably, the filling groove is of an inner cavity cover body structure with a U-shaped cross section, so that the heat conduction insulating layer is prevented from leaking and seeping outside.
Preferably, the heat dissipation strips are seven in transverse arrangement and are longitudinally arranged and laid along the depression surface of the flexible circuit board body, the ventilation and heat dissipation holes transversely penetrate through the heat dissipation strips, the heat dissipation strips and the soft aluminum substrate are made of the same soft aluminum material, and the flexibility is high.
Preferably, the oxidation resistant film is a PVDF fluorocarbon resin transparent film and has excellent oxidation resistance and weather resistance.
Preferably, the flame-retardant stress relief layer is an elastic flame-retardant rubber pad, so that the flame-retardant flexible circuit board has excellent elastic flame-retardant heat insulation performance, and the flame-retardant impact resistance of the flexible circuit board body is improved.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a set up the copper foil flexible printed circuit board layer that has the heat dissipation groove group in the upper end of flexible printed circuit board body to fill the heat dissipation strip structure that sets up heat-conducting insulation layer and have the louvre of ventilating at the lower extreme of flexible printed circuit board body, realize carrying out the symmetrical formula high efficiency heat conduction heat dissipation of ventilating of downside to the high temperature that the flexible printed circuit board was gone up in the LED lamp pearl group transmission of work, improved the heat conduction heat dissipation of ventilating of the flexible printed circuit board body that has copper foil flexible printed circuit board layer greatly.
2. The utility model discloses a set up the fire-retardant layer of unloading that has anti-oxidant membrane on the copper foil flexible sheet layer of flexible line plate body, not only improved the upper end surface of flexible line plate body to outside oxidation resistance, improved the elasticity and the fire resistance of shocking resistance of flexible line plate body moreover.
Drawings
FIG. 1 is a sectional view of the whole structure of the present invention;
fig. 2 is an enlarged view of a point a in fig. 1 according to the present invention;
fig. 3 is a cross-sectional view of B-B in fig. 1 according to the present invention.
In the figure: the LED lamp comprises a flexible circuit board body 1, an LED lamp bead group 11, a copper foil flexible board layer 2, a heat dissipation groove group 21, a flame-retardant stress relief layer 3, an antioxidant film 4, a soft aluminum substrate 5, a heat dissipation strip 51, an air and heat dissipation hole 511, a filling groove 6 and a heat conduction insulating layer 7.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1, 2 and 3, the flexible copper foil high thermal conductivity substrate in the figure includes a flexible circuit board 1, a copper foil flexible board layer 2 and a flexible aluminum substrate 5 respectively disposed on the upper and lower end surfaces of the flexible circuit board 1, an LED lamp bead group 11 is disposed on the flexible circuit board 1, a flame retardant stress relief layer 3 is disposed at one end of the copper foil flexible board layer 2 away from the flexible circuit board 1, an oxidation resistant film 4 is disposed on the upper end surface of the flame retardant stress relief layer 3, a heat dissipation strip 51 is disposed at one end of the flexible aluminum substrate 5 away from the flexible circuit board 1, a ventilation heat dissipation hole 511 is disposed on the heat dissipation strip 51, a filling groove 6 is disposed at one end of the flexible aluminum substrate 5 facing the flexible circuit board 1, and a thermal insulation layer 7 is disposed in the filling groove 6.
LED lamp pearl group 11 passes oxidation-resistant membrane 4, fire-retardant unloading layer 3 and welds with flexible line plate body 1, guarantees that the heat that LED lamp pearl group 11 work produced can effectively carry out the transmission of downside and spill.
The heat dissipation groove group 21 has been seted up at the both ends of copper foil hose layer 2, and heat dissipation groove group 21 sets up for overlooking the vertical arrangement of face, has improved the heat radiating area of copper foil hose layer 2 greatly, and then improves the heat dissipation of ventilating of the flexible circuit board body 1 that has copper foil hose layer 2.
The filling groove 6 is an inner cavity cover body structure with a U-shaped cross section, and can wrap the whole heat conduction insulating layer 7, so that heat conduction is guaranteed, and the heat conduction insulating layer 7 is prevented from leaking and seeping.
The heat dissipation strips 51 are seven and are arranged horizontally and are laid along the overlook surface of the flexible circuit board body 1, the ventilation and heat dissipation holes 511 transversely penetrate through the heat dissipation strips 51, the heat dissipation strips 51 and the soft aluminum substrate 5 are made of the same aluminum material, the heat conductivity is high, and two ends of a cross section inner hole of each ventilation and heat dissipation hole 511 are of a diffusion structure, so that the heat dissipation effect is greatly improved.
The oxidation resistant film 4 is a PVDF fluorocarbon resin transparent film, has excellent oxidation resistance and weather resistance, and prolongs the service life of the flexible circuit board body 1.
The flame-retardant stress relief layer 3 is an elastic flame-retardant rubber pad, has excellent elastic flame-retardant heat insulation performance, improves the flame retardance of the flexible circuit board body 1, and has high elasticity for effectively relieving external impact and improving the protection of the flexible circuit board body 1.
When used in this embodiment: when the LED lamp bead group 11 is electrified, high-temperature heat can be generated, part of the high-temperature heat is rapidly transmitted to the heat dissipation groove groups 21 on the two sides through the copper foil flexible board layer 2 and is dissipated outside, meanwhile, the other part of the high-temperature heat is comprehensively conducted onto each heat dissipation strip 51 of the soft aluminum substrate 5 through effective heat conduction of the heat conduction insulating layer 7, and is effectively dissipated through the ventilating and radiating holes 511, so that the ventilating and heat-conducting heat dissipation performance of the flexible circuit board body 1 with the copper foil flexible board layer 2 is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. High heat conduction base plate of flexible copper foil, its characterized in that includes:
the flexible circuit board comprises a flexible circuit board body (1) and a copper foil flexible board layer (2) and a flexible aluminum substrate (5) which are arranged on the upper end face and the lower end face of the flexible circuit board body (1) respectively, wherein an LED lamp bead group (11) is arranged on the flexible circuit board body (1), one end, away from the flexible circuit board body (1), of the copper foil flexible board layer (2) is provided with a flame-retardant stress relief layer (3), the upper end face of the flame-retardant stress relief layer (3) is provided with an oxidation resistant film (4), one end, away from the flexible circuit board body (1), of the flexible aluminum substrate (5) is provided with a heat dissipation strip (51), a ventilation hole (511) is formed in the heat dissipation strip (51), a filling groove (6) is formed in one end, towards the flexible circuit board body (1), of the flexible aluminum substrate (5), and a heat conduction insulating layer (7) is arranged in the filling groove (6).
2. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the LED lamp bead group (11) penetrates through the anti-oxidation film (4) and the flame-retardant stress relief layer (3) and is welded with the flexible circuit board body (1).
3. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the two ends of the copper foil soft board layer (2) are provided with heat sink groups (21), and the heat sink groups (21) are longitudinally arranged on the overlook surface.
4. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the filling groove (6) is an inner cavity cover body structure with a U-shaped section.
5. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the heat dissipation strips (51) are seven and are arranged horizontally, and are arranged and paved longitudinally along the overlooking surface of the flexible circuit board body (1), and the ventilation and heat dissipation holes (511) penetrate through the heat dissipation strips (51) horizontally.
6. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the oxidation resistant film (4) is a PVDF fluorocarbon resin transparent film.
7. The flexible copper foil high thermal conductivity substrate according to claim 1, wherein: the flame-retardant stress relief layer (3) is an elastic flame-retardant rubber pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174284.0U CN216491246U (en) | 2021-12-07 | 2021-12-07 | Flexible copper foil high-thermal-conductivity substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174284.0U CN216491246U (en) | 2021-12-07 | 2021-12-07 | Flexible copper foil high-thermal-conductivity substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491246U true CN216491246U (en) | 2022-05-10 |
Family
ID=81422876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123174284.0U Active CN216491246U (en) | 2021-12-07 | 2021-12-07 | Flexible copper foil high-thermal-conductivity substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491246U (en) |
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2021
- 2021-12-07 CN CN202123174284.0U patent/CN216491246U/en active Active
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