CN216488044U - Semiconductor jumper and packaging structure - Google Patents

Abstract

The application provides a semiconductor jumper and a packaging structure, wherein the semiconductor jumper is of a plate-shaped structure, two ends of the semiconductor jumper are of symmetrical structures, bottom surfaces of the two ends are respectively provided with a concave part for fixing a semiconductor chip, the depth of each concave part is smaller than the thickness of the semiconductor chip, the middle part of the jumper is provided with a downward boss which is used for being attached to an adsorption hole of a jumper sucker; the projection of the concave part on the bottom surface of the jumper wire is different from the projection of the lug boss on the bottom surface of the jumper wire, so that when the jumper wire is sucked through the suction hole, the jumper wire can only be attached to the suction hole through the lug boss, and the correctness of the position of the jumper wire is guaranteed. The packaging structure comprises the semiconductor jumper wire and the lead frame, wherein the lead frame is provided with a first pin and a second pin, and two ends of the jumper wire are respectively connected with the first pin and the second pin. The jumper wire is convenient for the jumper wire sucking disc to adsorb fixedly, and the equipment of being convenient for is used to can prevent that the chip from dropping or shifting.

Description

Semiconductor jumper and packaging structure

Technical Field

The utility model belongs to the semiconductor device field especially relates to a semiconductor jumper and packaging structure.

Background

The semiconductor packaging structure is mainly based on a lead frame, a positive electrode pin and a negative electrode pin are formed on the lead frame through blanking, and then a semiconductor chip is solidified through multi-chip stacking or jumper connection to be connected with the positive electrode pin and the negative electrode pin. The structure of adopting the jumper connection is that a chip is usually arranged on pins of a frame, one end of the jumper is utilized to cover the chip, the other end of the jumper is connected with the other pin, then two ends of the two jumpers are both solidified through solder paste to realize connection, and finally, a packaging structure of a single semiconductor device is formed through plastic package.

The existing jumper usually adopts a multi-bending structure, such as a semiconductor packaging jumper disclosed in the chinese utility model with the application number of CN201720472123.4, and a novel jumper disclosed in the utility model with the application number of CN 201320354536.4. The cross section structure of the jumper wire is too complex, and the height difference of two ends is large, so that the thickness of the packaging body is large; the wire jumper volume is less to adopt the mode that the sucking disc was filled usually to fix in addition, then shifts to the lead frame through gluing the core device on, and the wire jumper structure similar to above-mentioned patent publication is irregular shape more, leads to the unable quick accurate absorption of sucking disc to fix, reduces the filling efficiency of sucking disc, perhaps can only adopt one artifical packing installation, leads to production efficiency lower.

SUMMERY OF THE UTILITY MODEL

For solving prior art not enough, the utility model provides a semiconductor wire jumper and packaging structure, the wire jumper sucking disc of being convenient for adsorbs fixedly, and the equipment of being convenient for is used to can prevent that the chip from dropping or shifting.

In order to realize the purpose of the utility model, the following scheme is proposed:

a semiconductor jumper is of a plate-shaped structure, two ends of the jumper are of symmetrical structures, bottom surfaces of the two ends are provided with concave parts for fixing a semiconductor chip, the depth of each concave part is smaller than the thickness of the semiconductor chip, the middle of the jumper is provided with a downward boss, and the boss is used for being attached to an adsorption hole of a jumper sucker;

the projection of the concave part on the bottom surface of the jumper wire is different from the projection of the boss on the bottom surface of the jumper wire, so that the jumper wire can be only attached to the adsorption hole through the boss when the adsorption hole absorbs the jumper wire, and the correctness of the position of the jumper wire is guaranteed.

Furthermore, the projection of the concave part on the bottom surface of the jumper is rectangular, the inner shape of the concave part is a rectangular pyramid hole structure, the boss is a cylindrical structure, and the projection of the concave part on the bottom surface of the jumper is circular.

Furthermore, the projection of the concave part on the bottom surface of the jumper is circular, the inner shape of the concave part is a conical hole structure, and the projection of the boss on the bottom surface of the jumper is rectangular.

A packaging structure comprises the semiconductor jumper wire and a lead frame, wherein the lead frame is provided with a first pin and a second pin, two ends of the jumper wire are respectively connected with the first pin and the second pin, a semiconductor chip is arranged between the top surface of the first pin or the second pin and the jumper wire, and the semiconductor chip is positioned in a concave part.

Furthermore, the first pin and the second pin are provided with limit grooves towards the edge of the boss, and the limit grooves are attached to the outer wall of the boss.

The beneficial effects of the utility model reside in that: the semiconductor jumper is of a plate-shaped structure, the lug boss is arranged on the bottom surface of the middle part of the semiconductor jumper, so that the jumper sucker can conveniently adsorb and fix the semiconductor jumper, the processing difficulty is low, the two ends of the jumper are of symmetrical structures, interchangeability is realized, the positions of the two ends do not need to be distinguished when the jumper is assembled on a lead frame, the semiconductor jumper is convenient to assemble and use, and the chip can be prevented from falling or shifting by covering the chip by the concave part.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

Fig. 1 shows a cross-sectional view of one embodiment of a semiconductor jumper.

Fig. 2 illustrates a bottom structural view of one embodiment of a semiconductor jumper.

Fig. 3 shows a bottom structural view of another embodiment of the semiconductor jumper.

Fig. 4 illustrates a top view of one embodiment of a package.

Fig. 5 illustrates a bottom view of one embodiment of a package.

The labels in the figure are: a concave part-1, a boss-2, a first pin-3 and a second pin-4.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are some embodiments of the present invention, not all embodiments.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the product of the present invention is usually placed when in use, and this is only for the convenience of description of the present invention and simplification of the description. The terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. The terms "parallel", "perpendicular", etc. do not require that the components be absolutely parallel or perpendicular, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Example 1

As shown in fig. 1 to 3, a semiconductor jumper has a plate-shaped structure so as to fill the suction holes of the jumper suction cups.

More specifically, two ends of the jumper are of symmetrical structures, orientation distinction is not needed during assembly, and the two ends of the jumper have position interchangeability. The bottom surfaces of the two ends of the jumper wire are provided with concave parts 1 for fixing the semiconductor chip so as to prevent the chip from falling or shifting and improve the installation stability of the semiconductor chip.

Preferably, the depth of the recess 1 is smaller than the thickness of the semiconductor chip, the top surface of the semiconductor chip is in contact with the top surface of the inside of the recess 1 during assembly, and the bottom surface of one end of the jumper used for installing the semiconductor chip is spaced from the lead of the lead frame, so as to avoid short circuit caused by the contact between the bottom surface of one end of the jumper used for installing the semiconductor chip and the lead.

Specifically, the middle part of wire jumper has decurrent boss 2, and boss 2 is used for adsorbing the hole laminating with the wire jumper sucking disc, and the wire jumper sucking disc adopts the vacuum to adsorb the wire jumper, utilizes to adsorb hole and 2 cooperations of boss to fixed wire jumper.

When the adsorption holes of the jumper wire suckers are used for adsorbing the jumper wire, the bottom surface of the jumper wire faces the jumper wire suckers, when the jumper wire is assembled to the lead frame, the jumper wire is sucked out of the jumper wire suckers and transferred by utilizing the needle plate or the bonding tool to be in contact with the top surface of the jumper wire, and during assembly, the bottom surface of the jumper wire faces the top surface of the lead frame.

More specifically, the projection of depressed part 1 in the wire jumper bottom surface is different with the projection shape of boss 2 in the wire jumper bottom surface to when adsorbing the hole and absorbing the wire jumper, the wire jumper only can pass through boss 2 and the laminating of absorption hole, with the exactness of assurance wire jumper position.

Example 2

As shown in fig. 2, the projection of the recessed portion 1 on the bottom surface of the jumper wire is rectangular, and the inner shape of the recessed portion is a rectangular pyramid hole structure, so that the recessed portion is convenient to punch and cooperate with a semiconductor chip. Boss 2 is the cylinder type structure, and its projection in the wire jumper bottom surface is circular, and the absorption hole of wire jumper sucking disc also is cylinder hole structure to the absorption hole of wire jumper sucking disc only can cooperate with boss 2, prevents that other positions of wire jumper from adsorbing the hole laminating.

Example 3

As shown in fig. 3, the projection of the concave portion 1 on the bottom surface of the jumper wire is circular, the inner shape of the concave portion is a conical hole structure, and the projection of the boss 2 on the bottom surface of the jumper wire is rectangular. The absorption hole of wire jumper sucking disc also is the rectangular hole structure, makes the wire jumper only can pass through boss 2 and absorption hole cooperation.

Further preferably, the projection of the boss 2 on the bottom surface of the jumper is rectangular, and the adsorption hole of the jumper sucker is also a rectangular hole. The adjacent two sides of the rectangle are different in size, so that the orientation of the two ends of the jumper wire in the jumper wire sucking disc is fixed, and the orientation of the two ends of the jumper wire is kept consistent.

Example 4

As shown in fig. 3, a package structure includes the semiconductor jumper and the lead frame, the lead frame has a first pin 3 and a second pin 4, two ends of the jumper are respectively connected to the first pin 3 and the second pin 4, a semiconductor chip is disposed between the top surface of the first pin 3 or the second pin 4 and the jumper, the semiconductor chip is located in the recess 1, the top surface inside the recess 1 contacts with the top surface of the semiconductor chip, and a space is provided between the bottom surface of one end of the jumper where the semiconductor chip is disposed and the lower pin.

Preferably, as shown in fig. 5, the first pin 3 and the second pin 4 are both provided with a limiting groove 31 at the edge facing the boss 2, and the limiting groove 31 is attached to the outer wall of the boss 2. The first pins 3 and the second pins 4 are provided with the limiting grooves 31 which are matched with the bosses 2, so that the jumper wire is fixed, the installation stability of the jumper wire is improved, the jumper wire is prevented from moving, and when the projection of the bosses 2 on the bottom surface of the jumper wire is circular, the limiting grooves 31 are of a semicircular structure; when the projection of the boss 2 on the bottom surface of the jumper is rectangular, the limiting groove 31 is of a rectangular structure.

The foregoing is only a preferred embodiment of the invention and is not intended to be the only or limiting embodiment of the invention. It should be understood by those skilled in the art that various changes and equivalent substitutions made herein may be made without departing from the scope of the invention as defined by the appended claims.

Claims (5)

1. A semiconductor jumper is characterized in that the jumper is of a plate-shaped structure, two ends of the jumper are of symmetrical structures, bottom surfaces of the two ends are respectively provided with a concave part (1) for fixing a semiconductor chip, the depth of each concave part (1) is smaller than the thickness of the semiconductor chip, the middle of the jumper is provided with a downward boss (2), and the bosses (2) are attached to adsorption holes of jumper suckers;

the projection of the concave part (1) on the bottom surface of the jumper wire is different from the projection of the boss (2) on the bottom surface of the jumper wire in shape, so that when the jumper wire is sucked by the suction hole, the jumper wire can only be attached to the suction hole through the boss (2).

2. The semiconductor jumper wire according to claim 1, wherein the projection of the concave part (1) on the bottom surface of the jumper wire is rectangular, the internal shape of the concave part is a rectangular pyramid hole structure, the boss (2) is a cylindrical structure, and the projection of the convex part on the bottom surface of the jumper wire is circular.

3. The semiconductor jumper wire according to claim 1, wherein the projection of the concave portion (1) on the bottom surface of the jumper wire is circular, the inner shape of the concave portion is a conical hole structure, and the projection of the convex plate (2) on the bottom surface of the jumper wire is rectangular.

4. A package structure, comprising the semiconductor jumper wire according to any one of claims 1 to 3 and a lead frame, wherein the lead frame has a first pin (3) and a second pin (4), two ends of the jumper wire are respectively connected to the first pin (3) and the second pin (4), a semiconductor chip is disposed between the top surface of the first pin (3) or the second pin (4) and the jumper wire, and the semiconductor chip is located in the recess (1).

5. The package structure according to claim 4, wherein the first pin (3) and the second pin (4) have a limiting groove (31) at the edge facing the boss (2), and the limiting groove (31) is attached to the outer wall of the boss (2).

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