CN216473541U - Electroplating conductive device - Google Patents

Abstract

The utility model belongs to the technical field of electroplate electrically conductive device, a electroplate electrically conductive device is disclosed. This electroplate electrically conductive device includes circulation tank, plate electrode, current conducting plate and electrically conductive brush, wherein be equipped with the circulating water in the circulation tank, the plate electrode setting is in circulation tank, the plate electrode is connected with the power electricity, the current conducting plate is used for connecting the hanger, the one end and the plate electrode of a plurality of electrically conductive brushes rotate to be connected, the other end sets up with the current conducting plate laminating, the junction submergence of electrically conductive brush and current conducting plate is in the circulating water, can reduce electrically conductive frictional force, ensure to electrically conduct evenly, avoid piece pollution bath liquid, improve electroplating quality.

Description

Electroplating conductive device

Technical Field

The utility model relates to an electroplate electric installation technical field, especially relate to an electroplate electric installation.

Background

The electroplating industry is an important processing industry in China, mainly adopts zinc plating, chromium plating, nickel plating and copper plating at present, is intensively distributed in the industrial fields of machine manufacturing, light industry, electronics, aerospace, instruments and meters and the like, and is mainly divided into vertical electroplating and horizontal electroplating in a continuous electroplating assembly line at present.

When the horizontal electroplating mode is adopted, the electroplated part is a cathode, the electroplated part is clamped by a hanger and is continuously conveyed by a chain to complete electroplating of the electroplated part, and a power supply is connected above the hanger to form a loop. Because the hanger is in a continuous moving state when clamping the electroplated part, the power supply is generally connected with a copper carbon brush, and the copper carbon brush is abutted with a conductive plate on the hanger to form a loop. However, the hanger is continuously moved in the electroplating process, the friction force between the copper carbon brush and the current conducting plate is large, so that the copper carbon brush is seriously abraded, a large amount of generated copper scraps can pollute the bath solution, poor contact between the copper carbon brush and the current conducting plate can be caused due to abrasion of the copper carbon brush, the hanger is poor in electric conduction, and the electroplating quality is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electroplate electrically conductive device can reduce electrically conductive frictional force, ensures to electrically conduct evenly, avoids piece pollution bath solution, improves and electroplates the quality.

To achieve the purpose, the utility model adopts the following technical proposal:

an electroplated conductive device, comprising:

a circulating water tank, wherein circulating water is arranged in the circulating water tank;

an electrode plate disposed in the circulating water tank, the electrode plate being electrically connected to a power supply;

the conductive plate is used for connecting the hanger;

one end of each conductive brush is rotatably connected with the electrode plate, and the other end of each conductive brush is attached to the conductive plate;

the connection part of the conductive brush and the conductive plate is immersed in the circulating water.

Optionally, the device further comprises a limiting assembly, wherein the limiting assembly comprises a first limiting member, a second limiting member and a clamp spring,

the first limiting part and the second limiting part are fixedly connected with the electrode plate, the second limiting part is sleeved with the clamp spring, one end of the clamp spring is connected with the first limiting part, and the other end of the clamp spring is connected with the conductive brush, so that the conductive brush is attached to the conductive plate.

Optionally, the second limiting member is a rotating shaft, and the conductive brush is rotatably connected to the rotating shaft.

Optionally, an end of the conductive brush is a planar structure, and the conductive brush is connected to the conductive plate by surface connection.

Optionally, the electric brush further comprises a lead, one end of the lead is electrically connected with the electrode plate, and the other end of the lead is electrically connected with the conductive brush.

Optionally, a protrusion is provided in the circulation water tank, the protrusion is provided along a length direction of the circulation water tank, and the electrode plate is fixed to the protrusion.

Optionally, the protrusion is provided with a positioning column, the electrode plate is provided with a positioning hole, and the positioning column penetrates through the positioning hole.

Optionally, the electrode plate and the protrusion are connected by a bolt.

Optionally, the length of the conductive plate is greater than the distance between adjacent conductive brushes.

The utility model has the advantages that:

the connecting part of the conductive brush and the conductive plate is immersed in the circulating water, so that on one hand, the conductive temperature can be stabilized, and the uniform conduction is ensured; on the other hand, the electric connection between the conductive brush and the conductive plate can be ensured by utilizing the conductivity of water, the phenomenon of poor conductivity is avoided, and the electroplating quality is improved; in another aspect, friction between the conductive brush and the conductive plate can be reduced, thereby reducing wear between the conductive brush and the conductive plate. Through set up the circulating water in circulating water tank, can clear up the piece that the friction produced between electrically conductive brush and the current conducting plate under the circulation effect of circulating water, ensure that the electrically conductive face is clean reliable, avoid the tank liquor to receive the pollution simultaneously, improve the electroplating quality.

Drawings

FIG. 1 is a schematic structural view of an electroplating conductive apparatus provided by the present invention;

fig. 2 is an assembly view of the electroplating conductive device and the hanger provided by the utility model.

In the figure:

100. a circulating water tank; 110. a protrusion; 120. a positioning column; 200. an electrode plate; 300. a conductive plate; 400. a hanger; 500. a conductive brush; 600. a limiting component; 610. a first limit piece; 620. a second limiting member; 630. a clamp spring; 700. a wire; 800. and (4) electroplating.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Traditional hanger power supply system mainly compresses tightly or elasticity compresses tightly the formula electrically conductive through electrically conductive brush gravity, often appears contact failure and unusual such as generate heat because of coefficient of friction is big in the continuous operation in-process, and then makes the hanger electrically conductive badly, and the piece that produces because of the friction simultaneously can pollute the groove liquid, reduces electroplating quality.

In view of the above problem, in an embodiment of the present invention, an electroplating conductive device is provided, as shown in fig. 1, the electroplating conductive device includes a circulation water tank 100, a plate electrode 200, a conductive plate 300, and a plurality of conductive brushes 500, wherein the plate electrode 200 is disposed in the circulation water tank 100 and connected to a power supply, one end of each conductive brush 500 is rotatably connected to the plate electrode 200, the other end is attached to the conductive plate 300, the conductive plate 300 is connected to a hanger 400, and electricity is transmitted to the electroplating part 800 through the hanger 400, so as to achieve electroplating of the electroplating part 800, the circulation water is disposed in the circulation water tank 100, and the depth of the circulation water should immerse the connection between the conductive brushes 500 and the conductive plate 300.

By immersing the connection part of the conductive brush 500 and the conductive plate 300 in circulating water, on one hand, the friction force between the conductive brush 500 and the conductive plate 300 can be reduced, and the abrasion is reduced; on the other hand, the conductive brush 500 can be always electrically connected with the conductive plate 300 by utilizing the conductive property of water, so that the phenomenon of poor conductivity caused by the abrasion of the conductive brush 500 and the conductive plate 300 is avoided; on the other hand, the temperature of the circulating water can be controlled to control the conductive temperature, so that the uniformity of the conductivity is improved. Through setting up circulation basin 100, can block that the piece that wearing and tearing produced between conductive brush 500 and the current conducting plate 300 falls into the plating bath, and can take away the piece through the circulation effect of circulating water, thoroughly avoid the tank liquor to be polluted, and then improve the electroplating quality.

Further, in order to enable the conductive brush 500 to abut against the conductive plate 300, a limiting assembly 600 may be provided, the limiting assembly 600 may include a first limiting member 610, a second limiting member 620 and a snap spring 630, the first limiting member 610 and the second limiting member 620 are both fixed on the electrode plate 200, the snap spring 630 is inserted into the second limiting member 620 to enable the snap spring 630 to rotate relative to the second limiting member 620, one end of the snap spring 630 is clamped to the first limiting member 610, the other end of the snap spring is clamped to the conductive brush 500, the conductive brush 500 is pressed against the conductive plate 300 through the snap spring 630, it is ensured that the conductive brush 500 and the conductive plate 300 are always in a fit state, the stability of current transmission is ensured, and the electroplating quality of the electroplated part 800 is prevented from being affected due to the open circuit condition.

Preferably, in an embodiment, the second limiting member 620 may be a rotating shaft, the conductive brush 500 is rotatably connected to the rotating shaft, and the conductive brush 500 is rotatably connected to the electrode plate 200 through the second limiting member 620, so that the number of parts of the electroplating conductive device can be reduced, the installation process can be reduced, and the cost can be saved. Set up electrically conductive brush 500 and rotate with electrode board 200 and be connected, when the wearing and tearing of the surface of electrically conductive brush 500 and current conducting plate 300 separation, can make electrically conductive brush 500 rotatory certain angle of relative axis of rotation and laminate current conducting plate 300 once more through the pressure that jump ring 630 applyed electrically conductive brush 500, guarantee that electrically conductive brush 500 and current conducting plate 300 laminate the setting all the time, improve electrically conductive stability.

Preferably, a shaft sleeve may be sleeved outside the rotating shaft, in an embodiment, the rotating shaft and the shaft sleeve may be made of copper, the shaft sleeve penetrates through the conductive brush 500, and the shaft sleeve is in clearance fit with the rotating shaft and is in interference fit with the conductive brush 500, so that the smoothness of rotation of the conductive brush 500 can be ensured, and the conductive brush 500 is tightly abutted to the conductive plate 300 by the elastic force of the snap spring 630. In other embodiments, the rotating shaft and the shaft sleeve can be made of other metal materials with conductive performance, and the rotating shaft and the shaft sleeve can be arranged according to actual needs.

Further, considering the stability of current transmission, the end of the conductive brush 500 may be set to be a planar structure, so that the direct contact between the conductive brush 500 and the conductive plate 300 is a surface contact, thereby increasing the contact area between the conductive brush 500 and the conductive plate 300 and reducing the risk of open circuit.

Preferably, the length of the conductive plate 300 can be set to be greater than the distance between two adjacent conductive brushes 500, so that each conductive plate 300 is at least attached to one conductive brush 500 at any time in the electroplating process, the electroplated part 800 is always electrified in the electroplating process, and the electroplating quality is prevented from being affected.

As a preferable technical solution, the lead 700 may be connected between the electrode plate 200 and the conductive brush 500, and specifically, one end of the lead 700 is electrically connected to the electrode plate 200, and the other end is electrically connected to the conductive brush 500, so that the current on the electrode plate 200 can be continuously and stably transmitted to the conductive brush 500, the stability of the current transmission between the electrode plate 200 and the conductive brush 500 can be improved, and the improvement of the plating quality is further facilitated.

Further, with reference to fig. 1, a protrusion 110 may be convexly disposed in the circulation water tank 100, the protrusion 110 is disposed along a length direction of the circulation water tank 100, the electrode plate 200 is fixed on the protrusion 110, and the contact between the electrode plate 200 and the bottom of the circulation water tank 100 is avoided, because debris generated by friction between the conductive brush 500 and the conductive plate 300 may sink into the bottom of the circulation water tank 100, the protrusion 110 is disposed to separate the electrode plate 200 from the debris, so that the influence of the debris on the operation of the electrode plate 200 is avoided, and the clean surface of the electrode plate 200 is ensured. And the electrode plate 200 is separated from the debris by the protrusions 110, which also facilitates the cleaning of the debris.

Preferably, in order to facilitate the assembly of the electrode plate 200 and the protrusion 110, a positioning column 120 may be disposed on the protrusion 110, and a positioning hole (not shown in the figure) matched with the positioning column 120 is formed in the electrode plate 200, so that during installation, the positioning column 120 is directly inserted into the positioning hole, so as to realize the rapid positioning of the electrode plate 200, and improve the installation efficiency of the electrode plate 200.

Further, in an embodiment, the electrode plate 200 and the protrusion 110 may be connected by a bolt, specifically, a through hole may be formed in the electrode plate 200, a blind threaded hole may be formed in the protrusion 110, and a bolt may pass through the blind threaded hole and be in threaded connection with the blind threaded hole, so that the bolt has good connection performance, and the connection stability between the electrode plate 200 and the protrusion 110 may be ensured. In other embodiments, the electrode plate 200 and the protrusion 110 may be connected in other manners, and the connection manner as long as the electrode plate 200 can be fixed on the protrusion 110 is within the protection scope of the present application.

Further, as shown in fig. 2, the implementation principle of the electroplating conductive apparatus provided by the present application is as follows: the power supply, through electrode plate 200 with current transmission for conductive brush 500, through the laminating setting between conductive brush 500 and the current conducting plate 300, with current transmission for current conducting plate 300, again by current conducting plate 300 with current transmission for hanger 400, hanger 400 gives the plated item 800 that hanger 400 links to each other with current transmission again, and then accomplishes the electroplating to plated item 800.

The utility model discloses a jump ring 630 makes electrically conductive brush 500 and current conducting plate 300 be in the laminating state all the time, has guaranteed current transmission's stability, is favorable to improving plated item 800's electroplating quality. By arranging the circulating water tank 100 and arranging circulating water in the circulating water tank 100, the connection part of the conductive brush 500 and the conductive plate 300 is immersed in the circulating water, on one hand, the conductivity stability between the conductive brush 500 and the conductive plate 300 can be improved by utilizing the conductivity of water; on the other hand, the chips can be cleaned by utilizing the circulating action of circulating water, so that the chips are prevented from polluting the bath solution, and the electroplating quality of the electroplated part 800 is improved; on the other hand, can control electrically conductive temperature through the temperature of control circulating water, and then guarantee whole electroplating in-process current transmission's stability, avoid appearing the condition of opening circuit, and then improve electrically conductive brush 500's life, be favorable to practicing thrift the cost. Through the length that sets up the conducting plate 300 be greater than the distance between the adjacent electrically conductive brush 500, can guarantee that the electrically conductive plate 300 sets up with the laminating of one electrically conductive brush 500 at least in electroplating process, guarantee plated item 800 circular telegram all the time, avoid electroplating quality to receive the influence. Through fixing plate electrode 200 on arch 110, can guarantee the cleanness on plate electrode 200 surface, guarantee the reliability of plate electrode 200 work, the clastic clearance of being convenient for simultaneously, and then guarantee electroplating quality.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (9)

1. An electroplated conductive apparatus, comprising:

the circulating water tank (100), wherein circulating water is arranged in the circulating water tank (100);

the electrode plate (200), the electrode plate (200) is set up in the said circulating water trough (100), the said electrode plate (200) is connected with power electrically;

a conductive plate (300), the conductive plate (300) being used for connecting a hanger (400);

one end of each conductive brush (500) is rotatably connected with the electrode plate (200), and the other end of each conductive brush (500) is attached to the conductive plate (300);

the connection part of the conductive brush (500) and the conductive plate (300) is immersed in the circulating water.

2. The electroplated conductive apparatus of claim 1, further comprising a limiting assembly (600), wherein the limiting assembly (600) comprises a first limiting member (610), a second limiting member (620), and a clamp spring (630),

the first limiting part (610) and the second limiting part (620) are fixedly connected with the electrode plate (200), the snap spring (630) is sleeved on the second limiting part (620), one end of the snap spring (630) is connected with the first limiting part (610), and the other end of the snap spring is connected with the conductive brush (500), so that the conductive brush (500) is attached to the conductive plate (300).

3. The electroplating conductive apparatus according to claim 2, wherein the second limiting member (620) is a rotating shaft, and the conductive brush (500) is rotatably connected to the rotating shaft.

4. The electroplating conductive apparatus according to claim 1, wherein the end of the conductive brush (500) is a planar structure, and the connection between the conductive brush (500) and the conductive plate (300) is a surface connection.

5. The plated conductive means according to claim 1, further comprising a wire (700), wherein one end of the wire (700) is electrically connected to the electrode plate (200) and the other end is electrically connected to the conductive brush (500).

6. The electroplating conductive device according to any one of claims 1 to 5, wherein a protrusion (110) is convexly provided in the circulating water tank (100), the protrusion (110) is provided along the length direction of the circulating water tank (100), and the electrode plate (200) is fixed to the protrusion (110).

7. The electroplating conductive apparatus according to claim 6, wherein the protrusions (110) are provided with positioning posts (120), the electrode plate (200) is provided with positioning holes, and the positioning posts (120) are disposed through the positioning holes.

8. The electroplating conductive apparatus according to claim 7, wherein the electrode plate (200) is connected with the protrusion (110) by a bolt connection.

9. The electroplated conductive apparatus of claim 1, wherein the length of the conductive plate (300) is greater than the distance between adjacent conductive brushes (500).

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