CN216467001U - Dot three-dimensional 3D transfer printing structure - Google Patents

Abstract

A dot three-dimensional (3D) transfer structure is characterized by comprising: the adhesive layer comprises a substrate layer, a dot groove release layer, a hemispherical dot layer, a pattern layer, a bottom color layer and an adhesive layer which are sequentially compounded, wherein the dot groove release layer is provided with a plurality of hemispherical grooves, the hemispherical dot layer is provided with a plurality of hemispherical dots, and the grooves and the hemispherical dots are inlaid; when the thermal transfer printing is performed, the dot groove release layer may be separated from the hemispherical dot layer. The dot three-dimensional 3D transfer printing structure is reasonable in structural design, beneficial to process machining, capable of improving temperature resistance and adhesive property and high in practicability. The dot three-dimensional 3D transfer printing structure can be produced in a roll mode, production efficiency can be improved, and production cost can be reduced.

Description

Dot three-dimensional 3D transfer printing structure

[ technical field ] A

The utility model relates to the field of thermal transfer printing, in particular to a dot three-dimensional 3D transfer printing structure.

[ background of the utility model ]

The heat transfer printing process is widely used in the industries of plastics, cosmetics, toys, electrical appliances, building materials, gifts, food packages, stationery and the like. The apparatus for the thermal transfer process comprises: roast cup machine, roast cap machine, the overware machine, the vertical compression pyrograph machine, the pyrograph machine of shaking head etc. required consumptive material has professional heat transfer printing paper (rendition membrane) and heat transfer printing ink, plus printer, a computer, this project of heat transfer printing technology just can be done to the digital camera, can be at the leather, textile fabric, organic glass, metal, plastics, quartzy, woodwork, the digital printing machine of printing of transition colour on arbitrary relative plane materials such as copper edition paper, carry out disposable polychrome, arbitrary multiple colour, it does not need plate-making, chromatography and complicated sun-curing procedure, can not cause the damage to the material. The production process of the three-dimensional heat transfer film on the market is complex at present, and the three-dimensional gratings are pressed in the last step, so that the three-dimensional heat transfer film can be produced only one by one, but not coiled, and the production efficiency is low and the cost is high. Therefore, there is a need for an improvement of the conventional stereoscopic thermal transfer film.

[ Utility model ] content

The present invention provides a dot three-dimensional 3D transfer structure to solve the above problems.

In order to solve the problems, the utility model provides a dot three-dimensional 3D transfer printing structure which is characterized by comprising a base material layer, a dot groove release layer, a hemisphere dot layer and a pattern layer which are sequentially compounded, wherein the dot groove release layer is provided with a plurality of semi-spherical grooves, the hemisphere dot layer is provided with a plurality of semi-spherical hemisphere dots which are matched with the grooves and are semi-spherical, the hemisphere dots are embedded in the grooves, and when thermal transfer printing is carried out, the hemisphere dot layer and the pattern layer are transferred to a printing stock and can be separated from the dot groove release layer and the base material layer.

Further, a bottom color layer and an adhesive layer are respectively arranged on the pattern layer, and the adhesive layer is used for thermally transferring the adhesive layer onto a printing stock.

Furthermore, a bonding layer for improving the bonding force between the hemispherical dot layer and the pattern layer is arranged between the hemispherical dot layer and the pattern layer.

Further, the hemispherical dot layer is a TPU structure layer or a silica gel layer, and is formed by filling a fluid material on the dot groove release layer and curing the fluid material.

Further, the substrate layer is a PET layer.

Further, a matte release agent is coated on the surface of one side, back to the dot groove release layer, of the substrate layer.

Furthermore, the adhesive layer is a hot melt adhesive layer.

Further, the bottom color layer is a white PU layer.

The present invention advantageously contributes to effectively solving the above-mentioned problems. The dot three-dimensional 3D transfer printing structure comprises the substrate layer, the dot groove release layer, the hemisphere dot layer and the pattern layer which are sequentially stacked, and is reasonable in structural design, beneficial to process processing and high in practicability. The dot three-dimensional 3D transfer printing structure can be produced in a roll mode, the production efficiency is high, and the cost can be effectively reduced.

[ description of the drawings ]

Fig. 1 is a schematic diagram of the structural principle of the present invention.

Fig. 2 is a schematic view of the structure after thermal transfer.

The attached drawings are as follows: the base material layer 10, dot-groove release layer 20, groove 21, hemisphere dot layer 30, hemisphere dot 31, pattern layer 40, ground color layer 50, adhesive layer 60, anchor coat 70.

[ detailed description ] embodiments

The following examples are further illustrative and supplementary to the present invention and do not limit the present invention in any way.

As shown in fig. 1, the dot three-dimensional 3D transfer structure of the present invention includes a substrate layer 10, a dot groove release layer 20, a hemispherical dot layer 30, and a pattern layer 40, which are sequentially combined. Further, a base color layer 50 and an adhesive layer 60 are disposed on the pattern layer 40, and a bonding layer 70 is disposed between the hemispherical dot layer 30 and the pattern layer 40.

The substrate layer 10 is a carrier layer and has the characteristics of good temperature resistance, pressure resistance and small tensile deformation. In this embodiment, the substrate layer 10 is a PET film.

The dot groove release layer 20 is compounded on the substrate layer 10, and is provided with a semi-spherical groove 21. The dot groove release layer 20 has a release effect, and can be conveniently separated from a later combined structural layer. The groove 21 is used for forming a subsequent needed hemispherical dot 31 to finally form a three-dimensional effect. The parameters of the groove 21 can be set as required. Two adjacent grooves 21 are spaced from each other, and the spacing distance therebetween can be set according to the requirement. In this embodiment, the grooves 21 are uniformly distributed in an array.

The dot-groove release layer 20 may be formed by UV curing. In specific implementation, the substrate layer 10 is coated with UV glue, and then rolled by a mold having hemispherical dots 31, and UV light curing is performed to form the dot groove release layer 20 having hemispherical grooves 21 on the substrate layer 10.

The hemispherical dot layer 30 is provided with hemispherical dots 31. The hemispherical dots 31 and the grooves 21 are of a mosaic structure. The hemispherical dots 31 are disposed according to the grooves 21, and in a specific implementation, a fluid material is filled between the grooves 21 of the dot-groove release layer 20, i.e., the grooves 21 are filled, and then cured, so as to form the hemispherical dot layer 30 with the hemispherical dots 31.

In some embodiments, the hemispherical dot layer 30 is made of TPU, and the TPU material is filled between the grooves 21 of the dot-groove release layer 20 and then cured to form the hemispherical dot layer 30.

In some embodiments, the hemispherical dot layer 30 is made of a silicone material, and the silicone material is filled between the grooves 21 of the dot-groove release layer 20 and then cured to form the hemispherical dot layer 30.

The hemispherical dots 31 of the hemispherical dot layer 30 are uniformly arrayed, and the back surfaces of the hemispherical dots 31 are connected to each other to form a planar structure, thereby facilitating the disposition of the pattern layer 40 on the back surface thereof.

The pattern layer 40 is provided with a pattern, which is typically patterned by printing. For example, the desired pattern is printed by silk-screen printing, offset printing, ink-jet printing, digital printing, and the like. In one embodiment, the printing may be performed on the back of the hemispherical dot layer 30 to form the pattern layer 40. The pattern on the pattern layer 40 is a planar pattern, which may be a color pattern or a non-color pattern, and is matched with the hemispherical dots 31 on the hemispherical dot layer 30. The combination of the plane pattern and the three-dimensional grain can generate the three-dimensional change effect with strong real effect.

Further, in order to improve the adhesion between the pattern layer 40 and the hemispherical dot layer 30, the bonding layer 70 may be disposed on the hemispherical dot layer 30, so as to prevent the hemispherical dot layer 30 and the pattern layer 40 from being separated in the subsequent process, thereby improving the product quality. In practice, the bonding layer 70 is formed by applying a known cross-linking agent to the back of the hemispherical dot layer 30, i.e., the side opposite to the hemispherical dots 31.

In some embodiments, the bonding layer 70 may be formed by coating with a plasma surface treatment agent. In some embodiments, the bonding layer 70 may be formed by coating with a silicone cross-linking agent.

In order to improve the transfer effect, a base color layer 50 and an adhesive layer 60 may be disposed on the pattern layer 40.

The base color layer 50 is a coating support for the adhesive and serves as a substrate for the pattern layer 40. The base color layer 50 typically has some elasticity. In this embodiment, the bottom color layer 50 is a white PU layer. In practical implementation, the bottom color layer 50 can be formed by coating a white PU material on the pattern layer 40.

The adhesive layer 60 is used for adhering the integrated composite material to the surface of a printing stock during thermal transfer printing so that the material is firmly combined with the surface of the printing stock. In this embodiment, the adhesive used for the adhesive layer 60 is a hot melt adhesive, and thus is a hot melt adhesive layer. The hot melt adhesive layer can enable the transfer printing film to have better adhesive property and physical property, so that the transfer printing film can not be stretched and exploded during transfer printing, and simultaneously, various properties such as temperature resistance, water resistance and cold and heat shock resistance can be improved. In specific implementation, the adhesive layer 60 can be formed by coating hot melt adhesive on the base color layer 50.

Further, in order to facilitate production and improve product performance, a matte release agent can be coated on one side of the substrate layer 10, which is far away from the dot groove release layer 20. This matte release agent can play from the type effect, and matte release agent can form the concave-convex mesostructure on the surface of substrate layer 10 to can improve the circulation of air in process of production, avoid substrate layer 10 surface and production platform adhesion together, thereby in whole book production process, can guarantee that substrate layer 10 walks smoothly, guarantee to produce property ability.

In the utility model, the binding force between the dot-groove release layer 20 and the hemispherical dot layer 30 is weaker than that between other structural layers, so that the structural layers can be separated between the dot-groove release layer 20 and the hemispherical dot layer 30 during thermal transfer printing, so that the dot-groove release layer 20 and the substrate layer 10 can be torn off, and the hemispherical dot layer 30, the pattern layer 40 and the like are left on a printing stock.

The dot three-dimensional 3D transfer structure of the present invention can be manufactured by, but is not limited to, the following methods:

1. selecting a PET film as a substrate layer 10;

2. optionally coating a matte release agent on the surface of one side of the substrate layer 10 so as to facilitate the continuous walking of the substrate layer 10 on an assembly line;

3. coating UV glue on the surface of one side of the substrate layer 10, which is away from the matte release agent, and pressing the UV glue by using mould equipment with hemispherical dots 31 to form a dot-groove release layer 20 with grooves 21; in the process, the substrate layer 10 continuously travels, the mold equipment continuously performs texture pressing, and after the mold pressing, the UV glue is cured and molded, so that the dot groove release layer 20 can be continuously formed on the substrate layer 10 in the process of continuously traveling the substrate layer 10;

4. filling a TPU fluid material or a silica gel material on the continuously walking material layer, and scraping the material to ensure that the TPU material or the silica gel material is filled between the grooves 21 of the dot groove release layer 20; after the TPU fluid material or the silica gel material is solidified, a hemispherical dot layer 30 with hemispherical dots 31 can be formed on the dot groove release layer 20;

5. coating a cross-linking agent on the continuously running material layer to continuously form a bonding layer 70 on the hemispherical dot layer 30;

6. printing on the continuously transported material layer to form a pattern layer 40 on the bonding layer 70;

7. coating a white PU material on the continuously transported material layer, thereby forming a base color layer 50 on the pattern layer 40;

8. a hot melt adhesive is applied to the continuously transported material layers to form adhesive layer 60 on base color layer 50.

In the above steps, the dot groove release layer 20 is formed by UV coating and die pressing, and it can be continuously pressed on the substrate layer 10, so that it can be applied to roll production, and it is beneficial to improve the production efficiency.

The use mode of the dot three-dimensional 3D transfer printing structure is as follows: the dot three-dimensional 3D transfer printing structure is thermoprinted on the printing stock by using a digital lettering device and a thermal transfer printing device, and then the substrate layer 10 is peeled off, so that the dot groove release layer 20 can be torn off along with the substrate layer 10, and the hemisphere dots 31 (shown in fig. 2) of the hemisphere dot layer 30 are exposed, thereby forming a pattern with a three-dimensional effect on the printing stock.

While the utility model has been described with reference to the above embodiments, the scope of the utility model is not limited thereto, and the above components may be replaced with similar or equivalent elements known to those skilled in the art without departing from the spirit of the utility model.

Claims (8)

1. The utility model provides a three-dimensional 3D rendition structure of dot, its characterized in that, it is including compound substrate layer (10), dot recess in proper order from type layer (20), hemisphere dot layer (30) and pattern layer (40), the dot recess is equipped with a plurality of recesses (21) that are the hemisphere form from type layer (20), hemisphere dot layer (30) be equipped with a plurality of with recess (21) assorted is hemisphere dot (31) that the hemisphere is the hemisphere form, hemisphere dot (31) inlay and locate in recess (21), when carrying out the heat-transfer seal, hemisphere dot layer (30) and pattern layer (40) shift to the stock on and can with the dot recess is from type layer (20) and substrate layer (10) separation.

2. The three-dimensional 3D transfer printing structure with dots according to claim 1, wherein a bottom color layer (50) and an adhesive layer (60) are respectively provided on the pattern layer (40), and the adhesive layer (60) is used for thermal transfer printing to a printing material.

3. The dot solid 3D transfer structure according to claim 1, wherein a bonding layer (70) for improving a bonding force between the hemispherical dot layer (30) and the pattern layer (40) is provided between the hemispherical dot layer (30) and the pattern layer (40).

4. The dot solid 3D transfer structure according to claim 1, wherein the hemispherical dot layer (30) is a TPU structure layer or a silicone layer, and is formed by filling a fluid material on the dot groove release layer (20) and curing the fluid material.

5. The stereoscopic 3D transfer structure of dots according to claim 1, characterized in that the substrate layer (10) is a PET layer.

6. The three-dimensional dot 3D transfer printing structure according to claim 1, wherein a matte release agent is coated on the surface of the substrate layer (10) opposite to the dot groove release layer (20).

7. The three-dimensional 3D transfer structure with dots according to claim 2, wherein the adhesive layer (60) is a hot melt adhesive layer.

8. The dot solid 3D transfer structure according to claim 2, wherein the base color layer (50) is a white PU layer.

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