CN101786368A - Methods for adding protective film on electronic product and notebook computer - Google Patents
Methods for adding protective film on electronic product and notebook computer Download PDFInfo
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- CN101786368A CN101786368A CN200910006008A CN200910006008A CN101786368A CN 101786368 A CN101786368 A CN 101786368A CN 200910006008 A CN200910006008 A CN 200910006008A CN 200910006008 A CN200910006008 A CN 200910006008A CN 101786368 A CN101786368 A CN 101786368A
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- diaphragm
- electronic product
- glue
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- printing
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Abstract
The invention discloses a method for sticking a protective film on an electronic product, which comprises the following steps: taking a synthetic resin material with relatively high hardness as a base material; printing glue uniformly distributed in points on the back of the base material; and sticking a film printed with the glue on the surface of the electronic product. The invention also provides another method for sticking the protective film on the electronic product, which comprises the following steps: taking a flexible material, such as leather, as the base material; printing the glue uniformly distributed in points on the back of the base material; and sticking the film printed with the glue on the surface of the electronic product. Compared with the prior art, the methods for sticking the protective film on the electronic product adopt a bond coat formed from the dotted glue to stick the protective film on the surface of the electronic product and generate no air bubbles. The technical scheme can be used for adding the protective film on the electronic product using the synthetic resin material as the base material and also can be applied to protective films which use the flexible material as the base material.
Description
Technical field
The present invention relates to the electronic product surface protection technique, especially relate to two kinds of methods that increase diaphragm for electronic product.The present invention provides the notebook computer of this method of use simultaneously.
Background technology
There is the technology that its surface is increased overcoat in many electronic products, and for example mobile phone, notebook computer etc. all wish to attach diaphragm in its surface, make the aesthetic feeling that its surface is more wear-resisting and increase its appearance.
Prior art has proposed the multiple method that increases diaphragm for electronic product.Mainly comprise transfer technique in the film, hot transfer printing or water transfer technique, directly use diaphragm attaching technology etc.
Transfer technique is that the diaphragm that will be printed on pattern is placed in the plastic mould and vacuumizes in the described film, injection moulding then, after injection moulding is finished, diaphragm just and plastic cement combine together.The final diaphragm that forms is divided into three layers, and wherein outermost layer is a high-abrasive material, and the centre is an ink lay, and the bottom is a substrate layer.The advantage of this technology is that the shell color that obtains is magnificent and have a wearability preferably.But there is the too high problem of cost in this technology.Mainly be because the printing ink of its use must not produce thawing under the high-temperature condition, and diaphragm need to be fitted in the plastic cement surface fully in vacuum.For satisfying above-mentioned requirements, need to use resistant to elevated temperatures printing ink and special diaphragm, its mould also needs to be fit to allow the complicated die of diaphragm vacuum suction and transfer printing, and these material prices are high, especially the injection mold of this technology use needs making processing charges up to a million.These all make this technology can only be used to produce in enormous quantities occasion.
Described hot transfer printing or water transfer technique at first are imprinted on pattern on the transfer film, then diaphragm are placed on electronical elements surface, and wherein figuratum part is downward.During hot transfer printing, use special perming with on the required electronical elements surface of pattern hotness; The water transfer printing then uses transfer film to be placed on the transfer printing tank, with needing the article of impressing pattern, presses close to the water transfer film gradually along its profile, and the picture and text layer of water transfer film can slowly be transferred to product surface under the effect of hydraulic pressure.The pattern that the technology of above-mentioned hot transfer printing or water transfer printing realizes is clear inadequately, and the water transfer printing can't be located printing, and more serious problem is, the case hardness of this dual mode is all not high enough, and product is easily in use by scratch and wearing and tearing.
Described diaphragm attaching technology is that glue is adhered at the back side in membrane surface printed patterns and color.This technology is fairly simple, is suitable for using on various digital products.But the diaphragm that this technology is used can only attach in the plane, can't bend, and can not realize whole pad pasting to digital product; And damage easily when attaching, diaphragm air down can't get rid of owing to gluing influence; In addition, the wearability of diaphragm is poor.
Summary of the invention
At above-mentioned defective, the technical problem that the present invention solves is, a kind of method for electronic product increase diaphragm is provided, and this method not only can make the surface color and polish of electronic product magnificent, and cost is lower, and hardness is higher.
The invention provides a kind of method, comprise the steps: for electronic product attaching diaphragm
Use has the synthetic resin material of higher hardness as base material;
Glue in the uniform spot distribution of substrate backside printing;
The diaphragm that has printed glue is attached to the electronic product surface.
Preferably, before diaphragm is attached to the electronic product surface, also comprise the steps:
Use this diaphragm of moulding mould hot pressing, make it become three-dimensional diaphragm with shelly frame structure that the electronic product with diaphragm to be attached matches;
Use cutting die to handle this solid diaphragm, cut redundance, three-dimensional diaphragm and electronic product surface are matched fully.
Preferably, before printing glue, also have the color of certain pattern, only print a kind of pattern of color at every turn, finally form the pattern of one or more colors in described substrate backside printing.
Preferably, the step of printed patterns comprises, only prints the pattern of color at every turn, finally forms the pattern of one or more colors.
Preferably, after all pattern colors all are completed for printing, at the pattern of the patterned surfaces evaporation minute surface texture that is completed for printing.
Preferably, during the glue of described spot distribution in substrate backside printing, exist at interval between its adjacent glue spots.
Preferably, the diameter of described glue spots is 2mm, and the centre-to-centre spacing between the adjacent glue spots is 4mm.
It is the method that electronic product attaches diaphragm that the present invention also provides another, comprises the steps:
Use leather, timber, fabric etc. to have flexible material as base material;
Glue in the uniform spot distribution of substrate backside printing;
The base material that has printed glue is attached to the electronic product surface.
Preferably, before base material is attached to the electronic product surface, also comprise the steps:
Use cutting die to handle this base material, cut redundance, base material and electronic product surface are matched fully.
The invention provides a kind of notebook computer, this notebook computer uses the described electronic product of above-mentioned arbitrary technical scheme to attach the method for diaphragm, attaches diaphragm on its surface.
Compared with prior art; the method that increases diaphragm for electronic product provided by the invention; the bonding coat that adopts point-like glue to form is realized the applying on diaphragm and electronic product surface, can reliably diaphragm be fitted in the surface of electronic product, can not produce the problem of bubble.This technical scheme not only is used to adopt the synthetic resin material to increase diaphragm as the electronic product of base material, also can be used for leather, timber, fabric etc. and have the diaphragm of flexible material as base material.
In a preferred embodiment of the invention; for the diaphragm that adopts the synthetic resin material as base material; adopt the method for moulding mould hot pressing and cutting die cutting, make diaphragm become the three-dimensional diaphragm that matches fully with the electronic product outer surface, make the surface that it can fine applying electronic product.
Description of drawings
Fig. 1 is the flow chart of first embodiment of the invention;
Fig. 2 is the schematic cross-section of the diaphragm of the present invention the firstth embodiment formation;
Fig. 3 is the S102 of first embodiment of the invention, the schematic diagram of S103 step;
Fig. 4 is the flow chart of second embodiment of the invention.
The specific embodiment
Please referring to Fig. 1, this illustrates the flow chart of first embodiment of the invention.Please be simultaneously referring to Fig. 2, this figure is the schematic diagram of the diaphragm of present embodiment formation.
Step S101 uses to have the synthetic resin material of higher hardness as base material.
In the present embodiment, adopt PET (polyethylene terephthalate, PETG) transparent material etc. to have the synthetic resin material of higher hardness as base material.Adopt the higher synthetic resin material of hardness as the reason of base material to be, this base material finally need if hardness is not high, the mill cut then in use occur easily as outermost diaphragm, causes the outward appearance of electronic product not attractive in appearance.The hardness test standard that industry is generally acknowledged is with the Mitsubishi's pencil that indicates the hardness label 500 grams that bear a heavy burden, and streaks the about 6.5mm in inspected object surface with the miter angle degree, and the surface nothing is scraped the hardness number that damage judges that then the hardness label that reaches this pencil shows.When diaphragm was used on the notebook product, this base material hardness needed to reach 2H at least.For the diaphragm that is used for other electronic products, then according to the specific requirement of this electronic product, this base material need reach its respective standard.So-called higher hardness just is meant the desired hardness of the electronic product that reaches to be attached.
Step S102 has the color of certain pattern in described substrate backside printing.
Please referring to Fig. 3, this illustrates the schematic diagram of this step and next procedure.As shown in Figure 3, the printing process of these patterns is to use a kind of pattern color of printing equipment printing at every turn, shown in Fig. 3, at first printed patterns color A, printed patterns color B then, every kind of pattern color all has certain pattern form, and several color stacks form complete pattern.Above printing process is all at the pattern of common texture.Increase the pattern of one deck minute surface texture if desired at these patterned surfaces again, then can adopt the method for evaporation, with the pattern color C evaporation of minute surface texture on pattern color A that has finished printing and pattern color B.
Step S103 is at the glue of the uniform spot distribution of substrate backside printing.
In this step, adopt method of printing, the patterned surfaces in that above-mentioned steps 2 is completed for printing adopts method of printing, makes the glue of its surperficial well-distributed points shape.In the present embodiment, the diameter of each glue spots is 2mm, and the center of each glue spots centre-to-centre spacing each other is 4mm, finally forms an equally distributed point-like glue array.Like this, when being bonded to the electronic product surface, just can not produce bubble at bond area.
More than three steps begun to take shape the diaphragm diaphragm, the final diaphragm that forms is in the distribution situation of each layer as shown in Figure 2.At the back side of PET base material 1, fitting is printed on base material 1 back side by printing process, and comprises the graph layer 2 of a plurality of pattern color layers; On the surface of graph layer 2, cover this evaporation layer 3 with the minute surface texture pattern in the evaporation coating method applying; On the surface of evaporation layer 3, the bonding coat 4 that the described equally distributed point-like glue of then fitting forms.
Step S104 uses this diaphragm of moulding mould hot pressing, makes it form the shelly frame structure that the electronic product with diaphragm to be attached matches.
Because the diaphragm that the front several steps forms is plane diaphragm, these diaphragms itself do not form the shape that matches with electronic product.For example, form the complete preservation film if desired on the surface of notebook computer, just must form the shelly frame structure that the shape and size with notebook computer match.Adopt plane diaphragm to finish, must handle according to the profile of notebook computer by this plane diaphragm.This step is to use suitable moulding mould, this diaphragm of hot pressing, because the thermoplasticity of PET base material, diaphragm finally under the effect of moulding mould, finally forms the three-dimensional diaphragm of shelly frame structure.
Step S105 uses cutting die to handle this diaphragm, cuts redundance, and diaphragm and electronic product surface are matched fully.
Because in fact the shape of the rapid diaphragm that forms of previous step does not fit like a glove as yet with the outer surface of notebook computer or other electronic products, generally speaking, use the edge of the three-dimensional diaphragm of moulding mould hot pressing formation all to have certain surplus, need handle the edge.So, in this step, further use cutting die that its unnecessary marginal portion is cut, this solid diaphragm and notebook computer or other surfaces for the treatment of the electronic product of pad pasting are fitted like a glove.
Step S106 is attached to the electronic product surface with described three-dimensional diaphragm.
Since described three-dimensional diaphragm with treat that the pad pasting electronic product matches fully, and its surface printing uniform point-like glue, make it can well bind surface at electronic product.
Pass through above-mentioned steps; can form diaphragm on the electronic product surface with bright-coloured color and beautiful pattern; and; because the point-like glue that its bonding coat adopts printing to get on; during applying; bubble can be discharged from the gap of these point-like glue, therefore, can not produce bubble between the surface of diaphragm and product.
Please referring to Fig. 4, this figure is the flow chart of second embodiment of the invention.This embodiment provides a kind of leather, timber, fabric etc. of using to have the method as electronic product increase diaphragm of flexible material as the diaphragm base material.
Step S401 uses leather, timber, fabric etc. to have flexible material as base material.
Therefore above-mentioned material does not need to form the step of three-dimensional diaphragm because the quality softness can be amounted to into different shape as required.In addition, because above-mentioned material is during as diaphragm, expectation uses the texture of this material itself as pattern, so, need be at its surface printing or any pattern of evaporation.
Step S402 is at the glue of the uniform spot distribution of substrate backside printing.
There is the glue of the spot distribution of fixed intervals each other in the same preferred employing of this step, and purpose is diaphragm and electronics to be produced between the sheet surface can not produce bubble owing to fitting.
Step S403 uses cutting die to handle this base material, cuts redundance, and base material and electronic product surface are matched fully.
This step is used to cut the redundance of base material, makes itself and electronic product need the surface of pad pasting to fit like a glove.
Step S404 is attached to the electronic product surface with the base material that has printed glue.
Above-mentioned steps has finally formed diaphragm on electronic product, and because the glue of its printing is the glue of spot distribution, this diaphragm can not form bubble at the applying position of diaphragm and electronic product.
Among above-mentioned two embodiment, all use method, when diaphragm and electronic product are binded, can not form bubble at the glue of diaphragm and electronic product bonding surfaces printing point-like.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. the method for electronic product attaching diaphragm is characterized in that, comprises the steps:
Use has the synthetic resin material of higher hardness as base material;
Glue in the uniform spot distribution of substrate backside printing;
The diaphragm that has printed glue is attached to the electronic product surface.
2. electronic product according to claim 1 increases the method for diaphragm, it is characterized in that, before diaphragm is attached to the electronic product surface, also comprises the steps:
Use this diaphragm of moulding mould hot pressing, make it become three-dimensional diaphragm with shelly frame structure that the electronic product with diaphragm to be attached matches;
Use cutting die to handle this solid diaphragm, cut redundance, three-dimensional diaphragm and electronic product surface are matched fully.
3. electronic product according to claim 1 attaches the method for diaphragm; it is characterized in that before printing glue, also having the color of certain pattern in described substrate backside printing; only print a kind of pattern of color at every turn, finally form the pattern of one or more colors.
4. electronic product according to claim 3 attaches the method for diaphragm, it is characterized in that the step of printed patterns comprises, only prints the pattern of color at every turn, finally forms the pattern of one or more colors.
5. according to the method for claim 3 or the described electronic product attaching of 3A diaphragm, it is characterized in that, after all pattern colors all are completed for printing, at the pattern of the patterned surfaces evaporation minute surface texture that is completed for printing.
6. attach the method for diaphragm according to any described electronic product of claim 1-5, it is characterized in that, during the glue of described spot distribution in the substrate backside printing, exist at interval between its adjacent glue spots.
7. electronic product according to claim 5 attaches the method for diaphragm, it is characterized in that the diameter of described glue spots is 2mm, and the centre-to-centre spacing between the adjacent glue spots is 4mm.
8. the method for electronic product attaching diaphragm is characterized in that, comprising:
Use leather, timber, fabric etc. to have flexible material as base material;
Glue in the uniform spot distribution of substrate backside printing;
The base material that has printed glue is attached to the electronic product surface.
9. electronic product according to claim 8 attaches the method for diaphragm, it is characterized in that, before base material is attached to the electronic product surface, also comprises the steps:
Use cutting die to handle this base material, cut redundance, base material and electronic product surface are matched fully.
10. a notebook computer is characterized in that, uses above-mentioned claim 1-claim 9 any described electronic products to attach the method for diaphragm, attaches diaphragm on its surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910006008A CN101786368A (en) | 2009-01-22 | 2009-01-22 | Methods for adding protective film on electronic product and notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910006008A CN101786368A (en) | 2009-01-22 | 2009-01-22 | Methods for adding protective film on electronic product and notebook computer |
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| Publication Number | Publication Date |
|---|---|
| CN101786368A true CN101786368A (en) | 2010-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910006008A Pending CN101786368A (en) | 2009-01-22 | 2009-01-22 | Methods for adding protective film on electronic product and notebook computer |
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| CN (1) | CN101786368A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103832012A (en) * | 2012-11-21 | 2014-06-04 | 爱元福科技股份有限公司 | Making method for three-dimensional explosion-proof glass |
| CN104291016A (en) * | 2013-07-16 | 2015-01-21 | 丰新科技股份有限公司 | Membrane body and use method thereof |
| WO2016178093A3 (en) * | 2015-04-24 | 2017-01-26 | Palagano Lucio | Bonding method of leather onto pc-tablets |
| CN108146092A (en) * | 2017-09-27 | 2018-06-12 | 深圳市锦兆天电子科技有限公司 | Ultra-thin photomask silica gel face glue transfer printing process |
-
2009
- 2009-01-22 CN CN200910006008A patent/CN101786368A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103832012A (en) * | 2012-11-21 | 2014-06-04 | 爱元福科技股份有限公司 | Making method for three-dimensional explosion-proof glass |
| CN104291016A (en) * | 2013-07-16 | 2015-01-21 | 丰新科技股份有限公司 | Membrane body and use method thereof |
| WO2016178093A3 (en) * | 2015-04-24 | 2017-01-26 | Palagano Lucio | Bonding method of leather onto pc-tablets |
| CN108146092A (en) * | 2017-09-27 | 2018-06-12 | 深圳市锦兆天电子科技有限公司 | Ultra-thin photomask silica gel face glue transfer printing process |
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Application publication date: 20100728 |