CN216434270U - Miniaturized space radiation effect risk monitoring device - Google Patents

Miniaturized space radiation effect risk monitoring device Download PDF

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Publication number
CN216434270U
CN216434270U CN202122228656.7U CN202122228656U CN216434270U CN 216434270 U CN216434270 U CN 216434270U CN 202122228656 U CN202122228656 U CN 202122228656U CN 216434270 U CN216434270 U CN 216434270U
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probe
module
total dose
effect
displacement
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杨艳
郑义
高志强
钟亮
郑玉展
史青
彭泳卿
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Beijing Research Institute of Telemetry
Aerospace Long March Launch Vehicle Technology Co Ltd
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Beijing Research Institute of Telemetry
Aerospace Long March Launch Vehicle Technology Co Ltd
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Abstract

The utility model provides a miniaturized space radiation effect risk monitoring device, which comprises a detector shell, an electrified probe module, a total dose effect probe module, a displacement probe module and a single event upset sensitive probe module, wherein the electrified probe module, the total dose effect probe module and the displacement probe module are arranged on the upper surface of the detector shell; the electrified probe module is of a stacked telescope structure and comprises an insulating bracket, and a surface current probe, a surface potential probe and an internal electrified current probe which are sequentially stacked in the insulating bracket from top to bottom; the total dose effect probe module and the displacement probe module are arranged on the same circuit board. The utility model discloses small, the quality is light, the low power dissipation, it is low to satellite platform occupation of resources volume, approximate point measurement accuracy is high, installation simple to use is favorable to carrying under current conditions very much and is applied to various big, well, miniature satellite platform, develops the space environment measurement of multiple spot position.

Description

Miniaturized space radiation effect risk monitoring device
Technical Field
The utility model relates to a measure test technical field, concretely relates to miniaturized space radiation effect risk monitoring devices.
Background
The space radiation effect refers to the phenomena of performance degradation, function obstruction or loss of space components and materials under the action of space radiation particles. The main space radiation effect comprises a surface charging effect, an inner charging effect, a total dose effect, a displacement damage effect, a single-particle upset effect and the like.
The surface charging effect is that charges are accumulated on the surface of the spacecraft due to the interaction between the spacecraft and a surface material after the spacecraft is impacted and collided by high-energy charged particles in space during the on-orbit operation, so that the surface charging phenomenon is caused. The energetic charged particles generate a charging potential and a charging current in the material.
The internal charging effect is that the spacecraft is immersed in a high-energy electronic environment for a long time, and high-energy electrons penetrate through the cabin wall of the spacecraft, are deposited on materials such as internal electronic devices and the like, and are charged.
The total dose effect is a phenomenon that a large amount of radiation particles enter the interior of a semiconductor device material and are ionized with electrons outside the atomic nucleus of the material to generate additional charges, and the charges are accumulated on an oxide layer in the device, so that the performance of the device is degraded and even finally lost.
The displacement damage effect is a phenomenon that a large number of radiation particles enter the interior of a semiconductor device material and elastically collide with atomic nuclei of the material to cause displacement of material lattice atoms, so that defects are generated in the interior of the device material, the service life of minority carriers is influenced, and the related performance of the device is gradually reduced and even finally lost.
The single event upset effect is the phenomenon of the change or damage of the logic state, function and performance of a device caused by the additional charge formed by the spatial single high-energy heavy particles or protons through the direct ionization action or the indirect ionization action of secondary particles generated by nuclear reaction in the material of the device.
The inner charging effect, the total dose effect and the displacement damage effect are different effects generated when radiation penetrates through the cabin wall of the spacecraft and enters the spacecraft, so that the radiation effect under different shielding thicknesses is monitored when the risk caused by space radiation is judged.
At present, few spacecraft space radiation effect risk monitoring devices are used in China, technical conditions are not mature, a plurality of different space radiation effects cannot be monitored in real time through simple structural design and circuit design, and meanwhile, the monitoring devices are large in size and cannot efficiently utilize precious satellite platform resources.
Disclosure of Invention
The utility model provides a small-sized space radiation effect risk monitoring device with small volume, light weight and low power consumption, which has low resource occupation of the satellite platform, high approximate point measurement accuracy and simple installation and use, and is very favorable for carrying and applying to various large, medium and small satellite platforms under the existing condition and carrying out multi-point space environment measurement for the problem of space radiation effect risk monitoring; the utility model discloses a multiple probe combination is laid, under the shielding thickness of difference, can realize the discrimination of space radiation effect multiparameter like risks such as surface charging effect, interior charging effect, total dose effect, displacement damage effect, single event upset effect.
The electrified probe module is of a stacked telescope structure and comprises an insulating support, and a surface current probe, a surface potential probe and an internal electrified current probe which are sequentially stacked in the insulating support from top to bottom, wherein the internal electrified current probe comprises two or more internal electrified current probes with different shielding depths;
the total dose effect probe module and the displacement probe module are arranged on the same circuit board.
The utility model provides a miniaturized space radiation effect risk monitoring devices, as preferred mode, interior electrified current probe includes that from the top down stacks in proper order electrified current probe in the first in the insulating support, second in and the third in the electrified current probe.
The utility model provides a miniaturized space radiation effect risk monitoring devices, as preferred mode, total dose effect probe module and displacement probe module set up on same circuit board.
The utility model provides a miniaturized space radiation effect risk monitoring devices, as preferred mode, total dose effect probe module includes that 0mm shields total dose effect probe of thickness, 1mm shields total dose effect probe of thickness, 2mm shields total dose effect probe of thickness and 3mm shields total dose effect probe of thickness.
The utility model provides a miniaturized space radiation effect risk monitoring device, as the preferred mode, the displacement probe module includes first displacement probe, second displacement probe, third displacement probe and fourth displacement probe;
the total dose effect probe with the shielding thickness of 0mm and the first displacement probe are arranged on the first circuit board, the total dose effect probe with the shielding thickness of 1mm and the second displacement probe are arranged on the second circuit board, the total dose effect probe with the shielding thickness of 2mm and the third displacement probe are arranged on the third circuit board, and the total dose effect probe with the shielding thickness of 3mm and the fourth displacement probe are arranged on the first circuit board;
the detector shell comprises a detector shell body, a first circuit board, a second circuit board, a third circuit board and a fourth circuit board, wherein the upper surface of the detector shell body is provided with a first step, a second step, a third step and a fourth step which are different in protruding height, the first circuit board is arranged on the first step, the second circuit board is arranged on the second step, and the third circuit board is arranged on the third step.
The utility model provides a miniaturized space radiation effect risk monitoring devices, as preferred mode, still include drive module, the measuring module of being connected with the equal electricity of electrified probe module, total dose effect probe module, displacement probe module, the digital processing module who is connected with single event upset sensitive probe module, measuring module electricity, the communication module who is connected with the digital processing module electricity and the power module who is connected with drive module, measuring module, digital processing module, the equal electricity of communication module.
The utility model provides a miniaturized space radiation effect risk monitoring devices, as preferred mode, drive module is constant current source drive circuit.
The utility model provides a miniaturized space radiation effect risk monitoring device, as the preferred mode, the measuring module includes surface potential measuring circuit, surface current measuring circuit, inner charged current measuring circuit, total dose effect measuring circuit and displacement effect measuring circuit;
the surface potential measuring circuit, the surface current measuring circuit and the internal live current measuring circuit all comprise an ultrahigh impedance low-bias operational amplifier, a multilayer shielding cable, a potential protection ring, a protection grid and a protection layer;
the total dose effect measuring circuit and the displacement effect measuring circuit both comprise a multi-path analog switch switching path.
The utility model provides a miniaturized space radiation effect risk monitoring device, as an optimal mode, a detector shell comprises a plurality of layers of shells, and the shells of all layers are connected by using sub-ports;
the digital processing module comprises an ARM, an ADC and a multi-path analog switch.
The utility model provides a miniaturized space radiation effect risk monitoring device, as the preferred mode, the surface current probe includes the conductor plate, the surface potential probe includes insulating medium and conductor plate electrode, the inner live current probe includes the copper clad laminate; the total dose effect probe module comprises a PMOS field effect transistor; the single event upset sensitive probe module comprises an SRAM device.
The utility model adopts the following technical proposal:
a miniaturized space radiation effect risk monitoring device comprises a power supply module, a first detection module and a second detection module, wherein the power supply module is used for supplying power to the miniaturized space radiation effect risk monitoring device; the probe module is used for receiving the radiation of the space environment and converting the radiation effect into a related analog signal; the driving module is used for driving the probe module to normally work; the measuring module is used for conditioning the analog signal converted by the probe module and outputting the conditioned signal to the digital processing module; the digital processing module is used for controlling the measurement module to acquire the analog signals of the probe module, and sending the analog signals to the superior equipment through the communication module after calculation, correction and framing; the communication module is used for sending the data information processed by the processing module; the detector shell is used for protecting internal probes and circuits and is installed on a satellite platform.
Further, miniaturized space radiation effect risk monitoring devices, characterized in that, the probe module includes 1 area electric probe module, 4 total dose effect probes and displacement effect probes and 1 single event upset sensitive probe of different shielding thickness (0mm, 1mm, 2mm, 5 mm).
Furthermore, miniaturized space radiation effect risk monitoring devices, its characterized in that, electrified probe module includes 1 surface potential probe, 1 surface current probe, 3 different shielding depth's interior electrified current probe.
Furthermore, the miniaturized space radiation effect risk monitoring device is characterized in that a total dose effect probe adopts a PMOS field effect transistor, a displacement effect probe adopts a photodiode, and a single-particle upset sensitive probe adopts an SRAM device.
Further, miniaturized space radiation effect risk monitoring devices, its characterized in that, the design of integrating is carried out to the probe module, effectively reduces the complete machine volume. The electrified probe module adopts a stacked telescope type structure, and 4 total dose effect probes and displacement effect probes with different shielding thicknesses are integrated on a circuit board, so that the electrical connection is simplified.
Furthermore, miniaturized space radiation effect risk monitoring devices, its characterized in that, the surface potential probe comprises insulating medium and conductor plate electrode, and surface current probe adopts the conductor plate, and interior electrified current probe adopts copper clad laminate.
Further, the miniaturized space radiation effect risk monitoring device is characterized in that in order to protect the total dose effect probe and the displacement effect probe from being damaged by irradiation in a calibration experiment, the SRAM device is connected with an external calibration device through an interface when the single-particle upset sensitive probe is calibrated, and the SRAM device is inserted back into the device again to reserve the slot after the calibration is completed.
And after the SRAM is calibrated, inserting the SRAM into a product. Because the calibration experiment of the SRAM has radiation influence on other probes, the calibration experiment needs to be performed outside, and plugs are used for connecting cables, so that the SRAM is separately placed near a radiation source.
Further, miniaturized space radiation effect risk monitoring devices, characterized in that, the drive module is constant current source drive circuit, and the effect is that the electric current adds on total dose effect probe.
Further, miniaturized space radiation effect risk monitoring devices, its characterized in that, measuring module includes surface potential measuring circuit, surface current measuring circuit, interior electrified current measuring circuit, total dose effect measuring circuit and displacement effect measuring circuit.
Furthermore, the miniaturized space radiation effect risk monitoring device is characterized in that the surface potential measuring circuit, the surface current measuring circuit and the inner live current measuring circuit all adopt ultrahigh impedance and low bias current operational amplifiers, the measuring circuits are easily interfered by the outside, such as leakage current, static electricity, piezoelectricity and the like, so that equipotential shielding is carried out to reduce electrostatic interference and electromagnetic interference, and multilayer shielding cables are adopted to reduce interference introduced by a cable transmission path; and the design of a potential protection ring, a protection grid and a protection layer is adopted, so that the influence of leakage current of the printed board is reduced.
Furthermore, miniaturized space radiation effect risk monitoring devices, characterized in that, total dose effect measuring circuit and displacement effect measuring circuit adopt multichannel analog switch switching path to measure, reduce the hardware circuit, make the printed board miniaturized.
Furthermore, miniaturized space radiation effect risk monitoring devices, its characterized in that, digital processing module includes ARM, ADC, multichannel analog switch etc..
Furthermore, the miniaturized space radiation effect risk monitoring device is characterized in that the digital processing module adopts an integrated chip to control and process signals, the number of devices is greatly reduced, the circuit design of the whole machine is simplified, the area of a printed board is effectively reduced, and meanwhile, the dynamic logic can reduce power consumption.
Further, miniaturized space radiation effect risk monitoring devices, characterized in that, communication module adopts RS422 interface and UART communication protocol.
Furtherly, miniaturized space radiation effect risk monitoring devices, its characterized in that, the detector casing promotes electromagnetic compatibility through anti-interference design, improves device measurement accuracy.
The utility model has the advantages of it is following:
(1) the utility model has small volume, light weight, low power consumption, low occupation amount of satellite platform resources, high approximate point measurement precision and simple installation and use, and is very favorable for carrying and applying to various large, medium and small satellite platforms under the existing condition and carrying out multi-point space environment measurement; the utility model discloses a multiple probe combination is laid, under different shielding thickness, can realize the discrimination of space radiation effect multiparameter such as surface electrification effect, interior electrification effect, total dose effect, displacement damage effect, single event upset effect risk;
(2) the charged probe module adopts a stacked telescope type structure, the same-position measurement is respectively carried out on the surface charging current, the surface charging potential and the internal charged current, the measurement precision is provided, and meanwhile, the internal charged current probe can measure the internal charged current with different equivalent shielding thicknesses and establish an internal charged current model through the structure.
(3)4 total dose effect probes and displacement effect probes with different shielding thicknesses are integrated on a circuit board, so that the electrical connection is simplified; because a measuring circuit of the measuring module is easily interfered by the outside, such as leakage current, static electricity, piezoelectricity and the like, equipotential shielding is carried out to reduce electrostatic interference and electromagnetic interference, a multilayer shielding cable is adopted to reduce interference introduced by a cable transmission path, and a potential protection ring, a protection grid and a protection layer are adopted to reduce the influence of printed board leakage current and the like; the total dose effect measuring circuit and the displacement effect measuring circuit adopt a multi-path analog switch switching path for measurement, hardware lines are reduced, and a printed board is miniaturized.
(4) The digital processing module adopts an integrated chip to control and process signals, so that the number of devices is greatly reduced, the circuit design of the whole machine is simplified, the area of a printed board is effectively reduced, and meanwhile, the dynamic logic can reduce the power consumption; the detector shell improves electromagnetic compatibility through anti-interference design, and improves the measurement accuracy of the device.
Drawings
FIG. 1 is a schematic view of a miniaturized spatial radiation effect risk monitoring device;
FIG. 2 is a schematic diagram of a miniaturized spatial radiation effect risk monitoring device;
fig. 3 is a telescopic structure view of a charged probe module of a miniaturized space radiation effect risk monitoring device.
Reference numerals:
1. a probe housing; 2. a live probe module; 21. an insulating support; 22. a surface current probe; 23. a surface potential probe; 24. an internal live current probe; 241. a first inner live current probe; 242. a second inner live current probe; 243. a third inner live current probe; 3. a total dose effect probe module; 31. a 0mm shield thickness total dose effect probe; 32. 1mm shield thickness total dose effect probe; 33. 2mm shield thickness total dose effect probe; 34. a 3mm shield thickness total dose effect probe; 4. a displacement probe module; 5. a single event upset sensitive probe module; 6. a drive module; 7. a measurement module; 8. a digital processing module; 9. a communication module; 10. and a power supply module.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
As shown in fig. 1-2, a miniaturized spatial radiation effect risk monitoring device includes a detector housing 1, a charged probe module 2, a total dose effect probe module 3, a displacement probe module 4 disposed on the upper surface of the detector housing 1, a single event upset sensitive probe module 5 disposed inside the detector housing 1, a driving module 6 and a measuring module 7 electrically connected to the charged probe module 2, the total dose effect probe module 3, and the displacement probe module 4, a digital processing module 8 electrically connected to the single event upset sensitive probe module 5 and the measuring module 7, a communication module 9 electrically connected to the digital processing module 8, and a power module 10 electrically connected to the driving module 6, the measuring module 7, the digital processing module 8, and the communication module 9;
the detector shell 1 is used for protecting internal probes and circuits and is arranged on a satellite platform;
the detector shell 1 comprises a plurality of layers of shells, and the shells are connected by using sub-ports;
the charged probe module 2, the total dose effect probe module 3, the displacement probe module 4 and the single event upset sensitive probe module 5 are used for receiving space environment radiation and converting the space environment radiation into analog signals for output;
the live probe module 2 is of a stacked telescope structure, the live probe module 2 comprises an insulating support 21, and a surface current probe 22, a surface potential probe 23 and an inner live current probe 24 which are sequentially stacked in the insulating support 21 from top to bottom, and the inner live current probe 24 comprises two or more inner live current probes with different shielding depths;
as shown in fig. 3, the live probe module 2 is configured to perform the same position measurement of the surface current, the surface potential and the internal live current, the surface current probe 22 is configured to perform the surface current measurement while shielding interference for the surface potential probe 23 and the internal live current probe 24, the surface potential probe 23 is configured to perform the surface potential measurement while shielding interference for the internal live current probe 24, and the internal live current probe 24 is configured to perform the internal live current measurement of different shielding thicknesses and convert to obtain the internal live current of the equivalent shielding thickness, thereby establishing an internal live current model;
the surface current probe 22 uses a conductor plate, the surface potential probe 23 uses an insulating medium and a conductor plate electrode, and the internal live current probe 24 uses a copper clad laminate;
the inner live current probe 24 includes a first inner live current probe 241, a second inner live current probe 242, and a third inner live current probe 243, which are stacked in the insulating support 21 in this order from top to bottom;
the surface of the surface current probe 22 is plated with a polyimide film, the surface potential probe 23 is made of an aluminum plate with the polyimide film attached to the surface, and the inner live current probes 24 are all copper clad laminates;
the total dose effect probe module 3 and the displacement probe module 4 are arranged on the same circuit board;
the total dose effect probe module 3 is used for realizing total dose effect detection of multi-shielding thickness through different heights of steps on the outer side of the detector shell 1;
the total dose effect probe module 3 comprises a 0mm shielding thickness total dose effect probe 31, a 1mm shielding thickness total dose effect probe 32, a 2mm shielding thickness total dose effect probe 33 and a 3mm shielding thickness total dose effect probe 34;
the total dose effect probe module 3 uses a PMOS field effect transistor;
the displacement probe module 4 comprises a first displacement probe, a second displacement probe, a third displacement probe and a fourth displacement probe;
the 0mm shielding thickness total dose effect probe 31 and the first displacement probe are arranged on the first circuit board, the 1mm shielding thickness total dose effect probe 32 and the second displacement probe are arranged on the second circuit board, the 2mm shielding thickness total dose effect probe 33 and the third displacement probe are arranged on the third circuit board, and the 3mm shielding thickness total dose effect probe 34 and the fourth displacement probe are arranged on the first circuit board;
the upper surface of the detector shell 1 is provided with a first step, a second step, a third step and a fourth step which are different in protruding height, a first circuit board is arranged on the first step, a second circuit board is arranged on the second step, the second circuit board is arranged on the second step, and a third circuit board is arranged on the third step.
The displacement probe uses a photodiode;
the single event upset sensitive probe module 5 uses an SRAM device;
the single event upset sensitive probe module 5 stores the measured data in an SRAM device during measurement, the digital processing module 8 judges whether single event upset occurs or not by timing check and refresh of the measured data and data bit comparison, if the data bit is abnormal, the single event upset is judged to occur, and if the data bit is not abnormal, the single event upset is judged not to occur;
the single event upset sensitive probe module 5 also comprises a calibration mode, wherein in the calibration mode, the SRAM device is taken out and placed at one side of a radiation source for calibration, and then is inserted back into the detector shell 1 after calibration;
the driving module 6 is used for driving the electric probe module 2, the total dose effect probe module 3 and the displacement probe module 4 to work;
the driving module 6 is a constant current source driving circuit;
the measuring module 7 comprises a surface potential measuring circuit, a surface current measuring circuit, an internal charged current measuring circuit, a total dose effect measuring circuit and a displacement effect measuring circuit; the surface potential measuring circuit, the surface current measuring circuit and the internal live current measuring circuit all use an ultrahigh impedance low-bias operational amplifier, a multilayer shielding cable, a potential protection ring, a protection grid and a protection layer;
the total dose effect measuring circuit and the displacement effect measuring circuit both use a multi-path analog switch switching path;
the measuring module 7 is used for conditioning the analog signal and outputting the conditioned signal to the digital processing module 8;
the digital processing module 8 is used for controlling the measurement module 7 to collect analog signals, calculate, correct and frame the analog signals and then send the analog signals to a superior device through the communication module 9, and the digital processing module 8 is used for detecting the analog signals collected by the single event upset sensitive probe module 5, calculating, correcting and frame the analog signals and then sending the analog signals to the superior device through the communication module 9;
the digital processing module 8 comprises an ARM, an ADC and a multi-path analog switch;
the communication module 9 uses an RS422 interface and a UART communication protocol;
the power module 10 is used for supplying power.
Example 2
Fig. 2 shows a system architecture diagram of the present embodiment, which includes a power module 10, a probe module, a driving module 6, a measuring module 7, a digital processing module 8, a communication module 9, and a detector housing 1. The power module 10 is used for supplying power to the whole device; the probe module comprises a surface current probe 22, a surface voltage probe 23, an internal charged current probe 24, a total dose effect probe 3, a displacement effect probe 4 and a single event upset sensitive probe 5, and is used for receiving space environment radiation and converting radiation effects into related analog signals; the driving module 6 is used for driving the probe module to normally work; the measuring module 7 is used for conditioning the analog signal converted by the probe module and outputting the conditioned signal to the digital processing module 8; the digital processing module 8 is used for controlling the measuring module 7 to collect analog signals of the probe module, and sending the analog signals to superior equipment through the communication module 9 after calculation, correction and framing; the communication module 9 is used for sending the data information processed by the processing module; the detector housing 1 is used for protecting internal probes and circuits and for installation on a satellite platform.
Fig. 1 shows a schematic structural diagram of a spatial radiation effect risk monitoring device according to an embodiment of the present invention, which includes a rectangular chassis (detector housing 1) and a probe module disposed inside the detector housing 1, wherein the surface current probe 22, the surface potential probe 23, the first inner live current probe 241, the second inner live current probe 242, and the third inner live current probe 243 are in a stacked telescope structure and are respectively used for measuring a surface charging current, a surface charging potential, and an inner live current; shielding layers with different shielding thicknesses are respectively arranged above the total dose effect probe 3 and the displacement effect probe 4 to monitor the total dose effect and the displacement effect respectively, and the shielding layers are respectively a shielding layer I, a shielding layer II, a shielding layer III and a shielding layer IV; the single event upset sensitive probe 5 is mounted on the circuit board and monitors for a single event upset effect.
Fig. 3 shows a stacked telescope structure diagram of the live probe module 2, by which the inner live current probe 24 can measure inner live currents of different equivalent shielding thicknesses, which are respectively the equivalent shielding thickness one, the equivalent shielding thickness two, and the equivalent shielding thickness three.
The surface potential adopts a plate capacitance principle to perform capacitance voltage division on a signal received by the probe, and the surface potential is obtained by measuring a voltage division value; basic principles of surface current and internal charge current measurement: the metal plate is impacted by charged particles to generate current, and the current signal amplifies the charging current into a voltage signal output in a low resistance mode through the super high resistance amplifier; basic principle of total dose effect measurement: the PMOS field effect transistor generates and traps radiation induced charges in the gate oxide layer so as to change the threshold voltage, the constant current of the driving module is added on the PMOS, and the monitoring of the total radiation dose is completed by monitoring the change of the voltage value; basic principle of displacement damage effect measurement: the characteristic that the dark current of the photodiode is the most seriously influenced parameter by irradiation is utilized, and the displacement damage effect is monitored by measuring the change of the dark current; the single event upset effect measurement is to store specific data in an SRAM, carry out timing check and refresh on the specific data through a digital processing module, and judge the probability of upset occurrence by comparing whether the data bit is abnormal or not, wherein the single event upset is considered to occur.
The case (detector shell 1) is composed of a plurality of layers of shells, and all the layers are connected through sub-ports, so that the installation stability and the electromagnetic compatibility are improved. 4 total dose effect probes 3 and displacement effect probes 4 are arranged on the periphery of the electrified probe module 2, and different shielding thicknesses (0mm, 1mm, 2mm and 5mm) are realized through different heights of the step on the outer side of the case shell.
The effective radiation receiving surfaces of the tops of the surface current probe 22, the surface potential probe 23 and the three inner live current probes 24 in the live probe module 2 are all circular,the effective areas are all 10cm by the limitation of the insulating support 212The whole body is of a folding telescope type structure. Since the internal insulating material may also have an internal charging effect in space, the volume of the insulating material is designed to be reduced as much as possible to reduce the influence. The surface current probe 22 is an aluminum plated polyimide film, and the surface potential probe 23 is an aluminum plate with a polyimide film attached to the surface. The three inner live current probes 24 are all copper clad laminates, namely, the top layer of the PCB is coated with copper and is windowed, and the thickness of the plate is 2 mm. Five probe layers are positioned in the insulating support.
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.

Claims (10)

1. A miniaturized space radiation effect risk monitoring device which characterized in that: the single event upset sensitive detector comprises a detector shell (1), a charged probe module (2) arranged on the upper surface of the detector shell (1), a total dose effect probe module (3), a displacement probe module (4) and a single event upset sensitive probe module (5) arranged in the detector shell (1);
the electrified probe module (2) is of a stacked telescope structure, the electrified probe module (2) comprises an insulating support (21), and a surface current probe (22), a surface potential probe (23) and an inner electrified current probe (24) which are sequentially stacked in the insulating support (21) from top to bottom, and the inner electrified current probe (24) comprises two or more inner electrified current probes with different shielding depths;
the total dose effect probe module (3) and the displacement probe module (4) are arranged on the same circuit board.
2. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 1, wherein: the inner live current probe (24) comprises a first inner live current probe (241), a second inner live current probe (242) and a third inner live current probe (243) which are sequentially stacked in the insulating bracket (21) from top to bottom.
3. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 1, wherein: the total dose effect probe module (3) comprises a 0mm shielding thickness total dose effect probe (31), a 1mm shielding thickness total dose effect probe (32), a 2mm shielding thickness total dose effect probe (33) and a 3mm shielding thickness total dose effect probe (34).
4. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 3, wherein: the displacement probe module (4) comprises a first displacement probe, a second displacement probe, a third displacement probe and a fourth displacement probe.
5. A miniaturized spatial radiation effect risk monitoring device according to claim 4, characterized in that:
the 0mm shielding thickness total dose effect probe (31) and the first displacement probe are arranged on a first circuit board, the 1mm shielding thickness total dose effect probe (32) and the second displacement probe are arranged on a second circuit board, the 2mm shielding thickness total dose effect probe (33) and the third displacement probe are arranged on a third circuit board, and the 3mm shielding thickness total dose effect probe (34) and the fourth displacement probe are arranged on the first circuit board;
the detector shell (1) upper surface sets up first step, second step, third step and the fourth step that the outstanding height is different, first circuit board sets up on the first step, the second circuit board sets up on the second step, the third circuit board sets up on the third step.
6. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 1, wherein: the single particle upset sensitive probe comprises a charged probe module (2), a total dose effect probe module (3) and a displacement probe module (4), and further comprises a driving module (6) and a measuring module (7) which are electrically connected with each other, a digital processing module (8) which is electrically connected with the single particle upset sensitive probe module (5) and the measuring module (7), a communication module (9) which is electrically connected with the digital processing module (8), and a power supply module (10) which is electrically connected with the driving module (6), the measuring module (7), the digital processing module (8) and the communication module (9) respectively.
7. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 6, wherein: the driving module (6) is a constant current source driving circuit.
8. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 7, wherein: the measuring module (7) comprises a surface potential measuring circuit, a surface current measuring circuit, an internal charged current measuring circuit, a total dose effect measuring circuit and a displacement effect measuring circuit;
the surface potential measuring circuit, the surface current measuring circuit and the inner live current measuring circuit respectively comprise an ultrahigh impedance low-bias operational amplifier, a multilayer shielding cable, a potential protection ring, a protection grid and a protection layer;
the total dose effect measuring circuit and the displacement effect measuring circuit both comprise a multi-path analog switch switching path.
9. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 6, wherein:
the detector shell (1) comprises a plurality of layers of shells, and the shells of all layers are connected by using sub-ports;
the digital processing module (8) comprises an ARM, an ADC and a multi-path analog switch.
10. A miniaturized spatial radiation effect risk monitoring device as claimed in claim 1, wherein: the surface current probe (22) comprises a conductor plate, the surface potential probe (23) comprises an insulating medium and a conductor plate electrode, and the internal live current probe (24) comprises a copper clad laminate; the total dose effect probe module (3) comprises a PMOS field effect transistor; the single event upset sensitive probe module (5) comprises an SRAM device.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116562630A (en) * 2023-07-07 2023-08-08 数字太空(北京)智能技术研究院有限公司 Risk assessment method and device for satellite influenced by space environment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116562630A (en) * 2023-07-07 2023-08-08 数字太空(北京)智能技术研究院有限公司 Risk assessment method and device for satellite influenced by space environment
CN116562630B (en) * 2023-07-07 2023-09-15 数字太空(北京)智能技术研究院有限公司 Risk assessment method and device for satellite influenced by space environment

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