CN216413040U - Press-fitting assembly for processing semiconductor element - Google Patents

Press-fitting assembly for processing semiconductor element Download PDF

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Publication number
CN216413040U
CN216413040U CN202122451424.8U CN202122451424U CN216413040U CN 216413040 U CN216413040 U CN 216413040U CN 202122451424 U CN202122451424 U CN 202122451424U CN 216413040 U CN216413040 U CN 216413040U
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fixedly connected
inner chamber
press
cavity
department
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CN202122451424.8U
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Chinese (zh)
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戴凡雄
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Xi'an Changrui Electromechanical Technology Co.,Ltd.
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Individual
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Abstract

The utility model discloses a press-fitting assembly for processing a semiconductor element, which comprises a supporting seat, wherein a semiconductor element body is arranged at the middle position of the top of the supporting seat, when the press-fitting assembly is used, a press plate is pressed to move downwards through mutual matching among a first servo motor, a rotating shaft and a cam, so that a chip is packaged, the press plate is uniformly stressed to avoid the chip from being damaged, and the press plate is convenient to reset through mutual matching among a first slide block, a first slide groove, a limiting rod and a spring, so that the processing efficiency is improved.

Description

Press-fitting assembly for processing semiconductor element
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a press-fitting assembly for processing a semiconductor element.
Background
The semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and a press-fitting component which is required to be used when a semiconductor element is processed is used for packaging a chip.
The existing press-fitting assembly for processing the semiconductor element is mainly manually pressed through manual operation, and the stress on two sides above the pressing plate is inconsistent due to the fact that the manual press-fitting is easy, so that the stress of the semiconductor element is uneven, the chip is damaged, and the existing press-fitting assembly is easy to enable the semiconductor element to slide in a displacement mode when the semiconductor element is pressed, and the working efficiency and the working quality are reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a press-fitting assembly for processing a semiconductor element.
One of the purposes of the utility model is realized by adopting the following technical scheme:
the utility model provides a pressure equipment subassembly is used in semiconductor element processing, includes the supporting seat, the top intermediate position department of supporting seat is equipped with the semiconductor element body, the supporting seat top is close to the equal fixedly connected with curb plate of left and right sides department, two be close to bottom department between the curb plate and be equipped with the clamp plate, just the top of clamp plate is equipped with pressing mechanism, be equipped with stop gear on the clamp plate, the cavity has been seted up on the supporting seat, just cavity top left and right sides department has all seted up the fluting, the cavity inner chamber is equipped with fixture.
Furthermore, pressing means includes two cams, and two the cam is located the clamp plate top respectively and is close to left and right sides department, two be close to bottom department on the cam and run through jointly and be equipped with the pivot, two be close to the equal fixedly connected with first bearing in top department on the curb plate, the right-hand member of pivot is pegged graft at adjacent first bearing, is located the left curb plate left side fixedly connected with protecting crust, just a protecting crust inner chamber left side fixedly connected with servo motor, the left end of pivot runs through adjacent first bearing inner chamber to with a servo motor's power take off end fixed connection.
Furthermore, stop gear includes two dead levers, and two dead lever difference fixed connection is in the clamp plate left and right sides department, two the dead lever is kept away from the equal fixedly connected with first slider of one end of clamp plate, two adjacent one side of curb plate is close to bottom department and all has seted up first spout, and two first slider swing joint is close to top department at adjacent first spout inner chamber respectively.
Further, two all seted up the perforation on the first slider, just the perforation inner chamber runs through and is equipped with the gag lever post, two the upper and lower both ends of gag lever post respectively with first spout inner chamber top and bottom fixed connection, two the gag lever post outside all is equipped with the spring, just the upper and lower both ends of spring respectively with first slider and first spout inner chamber bottom fixed connection.
Further, fixture includes two movable blocks, and two the movable block is located cavity inner chamber bottom respectively and is close to left and right sides department, two center department runs through jointly on the movable block and is equipped with the threaded rod, the equal fixedly connected with second bearing in the cavity left and right sides, the supporting seat right side is seted up flutedly, just recess inner chamber bottom fixedly connected with second servo motor, peg graft at adjacent second bearing inner chamber the left end of threaded rod, just the right-hand member of threaded rod runs through adjacent second bearing inner chamber to with second servo motor's power take off end fixed connection, two the equal fixedly connected with montant in top of movable block, two adjacent fluting inner chamber is run through respectively on the top of montant, and fixedly connected with splint, two splint are located the left and right sides of semiconductor element body respectively.
Further, two the inner chamber of movable block all sets up the internal thread that matches each other with the threaded rod, and two the internal thread opposite direction of movable block inner chamber, two the equal fixedly connected with second slider in bottom of movable block, the second spout has been seted up to cavity inner chamber bottom, and two the equal swing joint of second slider is at second spout inner chamber.
Furthermore, a plurality of radiating holes are formed in the bottom of the protective shell, and the radiating holes are arranged in a rectangular array shape by taking the bottom of the protective shell as the center.
Compared with the prior art, the utility model has the beneficial effects that:
1. the pressing plate is pressed to move downwards through the mutual matching among the first servo motor, the rotating shaft and the cam, so that the chip is packaged, the chip is prevented from being damaged due to the uniform stress of the pressing plate, and the pressing plate is convenient to reset through the mutual matching among the first sliding block, the first sliding groove, the limiting rod and the spring, so that the processing efficiency is improved;
2. through the mutual cooperation between movable block, montant, splint, threaded rod, second slider, second spout and the second servo motor can carry out the centre gripping to the semiconductor component of multiple size of a dimension and fix, avoid semiconductor component to take place the displacement slip in the pressure equipment in-process, improved pressure equipment quality and pressure equipment efficiency.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of the present embodiment;
FIG. 2 is a top view of the component clamping plate;
FIG. 3 is a right side view of the component cam;
fig. 4 is an enlarged view of a portion a in fig. 1.
In the figure: 1. a supporting seat; 2. a semiconductor element body; 3. a splint; 4. a vertical rod; 5. a movable block; 6. a threaded rod; 7. a second servo motor; 8. a side plate; 9. pressing a plate; 10. fixing the rod; 11. a cam; 12. a rotating shaft; 13. a first servo motor; 14. a protective shell; 15. a limiting rod; 16. a spring.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, a press-fitting assembly for processing a semiconductor element comprises a supporting seat 1, a semiconductor element body 2 is arranged at the middle position of the top of the supporting seat 1, side plates 8 are fixedly connected to the positions, close to the left side and the right side, of the top of the supporting seat 1, a pressing plate 9 is arranged between the two side plates 8 and close to the bottom of the two side plates, a pressing mechanism is arranged at the top of the pressing plate 9, a limiting mechanism is arranged on the pressing plate 9, a cavity is formed in the supporting seat 1, grooves are formed in the positions, close to the left side and the right side, of the top of the cavity, and a clamping mechanism is arranged in the cavity;
the pressing mechanism comprises two cams 11, the two cams 11 are respectively positioned at the top of the pressing plate 9 and close to the left side and the right side, a rotating shaft 12 is arranged on the two cams 11 and close to the bottom of the two cams, first bearings are fixedly connected to the two side plates 8 and close to the top of the two side plates, the right end of the rotating shaft 12 is inserted into the adjacent first bearings, a protective shell 14 is fixedly connected to the left side of the left side plate 8, a plurality of radiating holes are formed in the bottom of the protective shell 14, the plurality of radiating holes are arranged in a rectangular array shape by taking the bottom of the protective shell 14 as the center, the radiating effect of the first servo motor 13 is improved, a first servo motor 13 is fixedly connected to the left side of the inner cavity of the protective shell 14, the left end of the rotating shaft 12 penetrates through the inner cavity of the adjacent first bearings and is fixedly connected with the power output end of the first servo motor 13, and the semiconductor element body 2 can be conveniently pressed;
the limiting mechanism comprises two fixing rods 10, the two fixing rods 10 are respectively and fixedly connected to the left side and the right side of the pressing plate 9, one ends, far away from the pressing plate 9, of the two fixing rods 10 are fixedly connected with first sliding blocks, the positions, close to the bottom, of the adjacent sides of the two side plates 8 are respectively provided with a first sliding groove, the two first sliding blocks are respectively and movably connected to the positions, close to the top, of the inner cavities of the adjacent first sliding grooves, through holes are formed in the two first sliding blocks, limiting rods 15 penetrate through the inner cavities of the through holes, the upper end and the lower end of each limiting rod 15 are respectively and fixedly connected with the top and the bottom of the inner cavity of the first sliding groove, springs 16 are sleeved on the outer sides of the two limiting rods 15, the upper end and the lower end of each spring 16 are respectively and fixedly connected with the first sliding block and the bottom of the inner cavity of the first sliding groove, the pressing plate 9 can be reset conveniently while the limiting is carried out, and the pressing efficiency is improved;
the clamping mechanism comprises two movable blocks 5, the two movable blocks 5 are respectively positioned at the bottom of the cavity inner cavity and close to the left side and the right side, a threaded rod 6 is arranged at the upper center of the two movable blocks 5 in a penetrating manner, the left side and the right side of the cavity are fixedly connected with second bearings, a groove is formed in the right side of the supporting seat 1, a second servo motor 7 is fixedly connected to the bottom of the groove inner cavity, the left end of the threaded rod 6 is inserted into the adjacent second bearing inner cavity, the right end of the threaded rod 6 penetrates through the adjacent second bearing inner cavity and is fixedly connected with the power output end of the second servo motor 7, vertical rods 4 are fixedly connected to the tops of the two movable blocks 5, the top ends of the two vertical rods 4 respectively penetrate through the adjacent slotted inner cavities and are fixedly connected with clamping plates 3, the two clamping plates 3 are respectively positioned at the left side and the right side of the semiconductor element body 2, inner cavities of the two movable blocks 5 are respectively provided with inner threads matched with the threaded rod 6, and the internal thread direction of the inner cavities of the two movable blocks 5 is opposite, the bottom parts of the two movable blocks 5 are fixedly connected with second sliding blocks, second sliding grooves are formed in the bottoms of the inner cavities of the cavities, the two second sliding blocks are movably connected to the inner cavities of the second sliding grooves, the semiconductor element body 2 is clamped and fixed, and the press-fitting quality is improved.
The working principle is as follows: when the utility model is used, a semiconductor element body 2 is placed at the middle position on a supporting seat 1, a second servo motor 7 is started through an external power supply, the second servo motor 7 works to drive a threaded rod 6 to rotate, the threaded rod 6 rotates and is arranged through the internal threads of the inner cavities of two movable blocks 5, the internal threads of the inner cavities of the two movable blocks 5 are opposite in direction, so that the two movable blocks 5 are driven to move relatively, the two movable blocks 5 move relatively to drive two second sliding blocks to slide in the inner cavity of a second sliding chute to limit the movable blocks 5, the two movable blocks 5 move relatively to drive two clamping plates 3 to move relatively through two adjacent vertical rods 4, so that the semiconductor element body 2 is clamped and fixed, the semiconductor element body 2 is prevented from moving and sliding in the press-mounting process, the press-mounting quality is effectively improved, the first servo motor 13 is started through the external power supply, the first servo motor 13 works to drive a rotating shaft 12 to rotate, the rotatory two cams 11 of drive of pivot 12 are rotatory, top and clamp plate 9 when two cams 11 contact, and press down clamp plate 9 and remove downwards, clamp plate 9 removes downwards and drives first slider and slide downwards and extrude spring 16 in first spout inner chamber through two dead levers 10, move downwards through clamp plate 9 and carry out the pressure equipment to semiconductor element body 2, and the atress of the clamp plate 9 top left and right sides is even, thereby avoid causing the damage of semiconductor element body 2, after the pressure equipment is accomplished, start first servo motor 13 counter-rotation, thereby drive two cams 11 and reset, clamp plate 9 moves upwards under the effect of the upper force of two springs 16, thereby be convenient for going on of follow-up pressure equipment, press fitting efficiency has effectively been improved, setting through a plurality of louvre in protecting crust 14 bottom, the radiating effect of first servo motor 13 has been improved.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims (7)

1. The utility model provides a semiconductor component processing is with pressure equipment subassembly, includes supporting seat (1), its characterized in that: the top intermediate position department of supporting seat (1) is equipped with semiconductor element body (2), supporting seat (1) top is close to equal fixedly connected with curb plate (8) of left and right sides department, two be close to bottom department between curb plate (8) and be equipped with clamp plate (9), just the top of clamp plate (9) is equipped with pressing mechanism, be equipped with stop gear on clamp plate (9), the cavity has been seted up on supporting seat (1), just cavity top left and right sides department has all seted up the fluting, the cavity inner chamber is equipped with fixture.
2. A press-fitting assembly for semiconductor device fabrication as set forth in claim 1, wherein: pressing means includes two cam (11), and two cam (11) are located clamp plate (9) top respectively and are close to left and right sides department, two be close to bottom department on cam (11) and run through jointly and be equipped with pivot (12), two be close to the first bearing of the equal fixedly connected with in top department on curb plate (8), the right-hand member of pivot (12) is pegged graft at adjacent first bearing, is located left curb plate (8) left side fixedly connected with protecting crust (14), just first servo motor (13) of protecting crust (14) inner chamber left side fixedly connected with, the left end of pivot (12) runs through adjacent first bearing inner chamber to with the power take off end fixed connection of first servo motor (13).
3. A press-fitting assembly for semiconductor device fabrication as set forth in claim 1, wherein: stop gear includes two dead levers (10), and two dead lever (10) fixed connection respectively is in clamp plate (9) left and right sides department, two the equal fixedly connected with first slider of one end that clamp plate (9) were kept away from in dead lever (10), two the adjacent one side of curb plate (8) is close to bottom department and has all seted up first spout, and two first slider swing joint is close to top department at adjacent first spout inner chamber respectively.
4. A press-fitting assembly for semiconductor device fabrication as set forth in claim 3, wherein: two all seted up the perforation on the first slider, just the perforation inner chamber runs through and is equipped with gag lever post (15), two the upper and lower both ends of gag lever post (15) respectively with first spout inner chamber top and bottom fixed connection, two gag lever post (15) outside all is overlapped and is equipped with spring (16), just the upper and lower both ends of spring (16) respectively with first slider and first spout inner chamber bottom fixed connection.
5. A press-fitting assembly for semiconductor device fabrication as set forth in claim 1, wherein: the clamping mechanism comprises two movable blocks (5), the two movable blocks (5) are respectively positioned at the bottom of a cavity inner cavity and are close to the left side and the right side, a threaded rod (6) jointly penetrates through the upper center of the two movable blocks (5), the left side and the right side of the cavity are both fixedly connected with second bearings, a groove is formed in the right side of the supporting seat (1), a second servo motor (7) is fixedly connected to the bottom of the groove inner cavity, the left end of the threaded rod (6) is inserted into an adjacent second bearing inner cavity, the right end of the threaded rod (6) penetrates through the adjacent second bearing inner cavity and is fixedly connected with the power output end of the second servo motor (7), a vertical rod (4) is fixedly connected to the top of each movable block (5), the top ends of the two vertical rods (4) respectively penetrate through adjacent slotted inner cavities and are fixedly connected with clamping plates (3), the two clamping plates (3) are respectively positioned at the left side and the right side of the semiconductor element body (2).
6. A press-fitting assembly for semiconductor device fabrication as set forth in claim 5, wherein: two the internal thread that matches each other with threaded rod (6) is all seted up to the inner chamber of movable block (5), and two the internal thread opposite direction of movable block (5) inner chamber, two the equal fixedly connected with second slider in bottom of movable block (5), the second spout has been seted up to cavity inner chamber bottom, and two the equal swing joint of second slider is at second spout inner chamber.
7. A press-fitting assembly for semiconductor device fabrication as set forth in claim 2, wherein: a plurality of heat dissipation holes are formed in the bottom of the protective shell (14), and the heat dissipation holes are arranged in a rectangular array shape by taking the bottom of the protective shell (14) as the center.
CN202122451424.8U 2021-10-12 2021-10-12 Press-fitting assembly for processing semiconductor element Active CN216413040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122451424.8U CN216413040U (en) 2021-10-12 2021-10-12 Press-fitting assembly for processing semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122451424.8U CN216413040U (en) 2021-10-12 2021-10-12 Press-fitting assembly for processing semiconductor element

Publications (1)

Publication Number Publication Date
CN216413040U true CN216413040U (en) 2022-04-29

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ID=81295919

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122451424.8U Active CN216413040U (en) 2021-10-12 2021-10-12 Press-fitting assembly for processing semiconductor element

Country Status (1)

Country Link
CN (1) CN216413040U (en)

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Effective date of registration: 20221109

Address after: 710000 No. 1, North Row, Panjiazhuang Village Industrial Park, Changyanbao Street, Yanta District, Xi'an, Shaanxi

Patentee after: Xi'an Changrui Electromechanical Technology Co.,Ltd.

Address before: 311100 Room 201, unit 2, Building 29, No. 1218, Wenyi West Road, Cangqian street, Yuhang District, Hangzhou, Zhejiang Province (201-5)

Patentee before: Dai Fanxiong