CN216393111U

CN216393111U - Distributed heatstroke prevention cooling air conditioning suit based on semiconductor refrigerating device

Info

Publication number: CN216393111U
Application number: CN202122266288.5U
Authority: CN
Inventors: 王宇冲; 陈卓; 廖明建; 许春华; 樊希安
Original assignee: Wuhan Segrui Co ltd
Current assignee: Wuhan Segrui Co ltd
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2022-04-29
Anticipated expiration: 2031-09-16

Abstract

The utility model relates to a distributed heatstroke prevention cooling air conditioning suit based on a semiconductor refrigerating device, which is provided with an air conditioning suit main body, a silica gel soft board, the semiconductor refrigerating device, a mobile power supply, a fan and a waistband; a silica gel soft board is fixed on the outer side of the back of the main body of the air-conditioning suit, a semiconductor refrigeration device array formed by connecting a plurality of groups of semiconductor refrigeration devices in series and in parallel is uniformly distributed on the other side surface of the silica gel soft board, and the array, the fan and the mobile power supply are connected by leads; the waist of the air-conditioning suit main body is provided with a waistband, the mobile power supply is fixed on the waistband, the air outlet of the fan is connected with the air distribution belt, the air of the fan is blown to the array through the air distribution holes of the air distribution belt, the temperature of the hot end of the refrigerating device is reduced, the refrigerating performance is enhanced, and the refrigerating device enables the silica gel soft plate to cool and transfer ice feeling to cool the human body. The air-conditioning suit has simple structure and easy manufacture, and the main body of the air-conditioning suit is easy to separate from the silica gel soft board and the waistband and is convenient to clean; the air-conditioning suit is comfortable to wear, can be used for cooling people in a high-temperature environment, and has a good heatstroke prevention and cooling effect.

Description

Distributed heatstroke prevention cooling air conditioning suit based on semiconductor refrigerating device

Technical Field

The utility model relates to a refrigerating air-conditioning suit, in particular to a distributed heatstroke prevention air-conditioning suit based on a semiconductor refrigerating device.

Background

In order to improve the working conditions of workers in high-temperature sultry environment, various air-conditioning clothes, including air-cooling type air-conditioning clothes, water-cooling type air-conditioning clothes and air-conditioning clothes refrigerated by semiconductor refrigerating devices, are developed on the market at present, and the air-conditioning clothes mainly have the function of providing working clothes with the functions of heat dissipation and heatstroke prevention for people such as frontier fighters, traffic polices, building and metallurgical personnel, electric welding personnel and special medical personnel who are on duty outdoors.

The air-conditioning clothes with air-cooled structure, such as the 'air-conditioning clothes for cooling human body based on micro/nano fan array drive' patent application number, which is announced in 2007, is 200510102700.2, which adopts 1 to 1000 pieces, each piece has an integral volume of 1mm³To 1cm³The range of the micro fan is connected with an external micro power supply in parallel through a circuit wire woven in the clothes; the fan is driven by the power supply to reinforce convection and evaporative heat dissipation on the local body surface of the human body; the technical essence is that a micro/nano fan is used for providing flowing air for a human body, the air speed is more uniform, the appearance is attractive, and forced convection heat transfer is formed on the surface of the skin, the defect is that a single fan cannot meet the requirement of enhanced heat dissipation due to small fan size, a large number of fans are needed to form an array to blow air to the inside of clothes, parts such as the adopted micro/nano fan and a micro/nano power supply are large in quantity, most of the parts are moving parts, the cost is high, the circuit complexity is high, and the clothes are easy to be made in the human body movement processVarious deformations are generated, so that the failure risk of the product is obviously increased, and the use of the product is limited in sand-wading and water-wading outdoor sports environments.

"air-conditioning clothes with neck air duct structure" announced in 11 months in 2020, patent No. 202020068899.1, and "air-permeable air-conditioning clothes" announced in 5 months in 2021, patent No. 202021598909.0, wherein the 2 kinds of air-conditioning clothes mainly rely on the fan to blow air into the clothes, and increase the amount of air flowing through the surface of human body to achieve the function of strengthening heat dissipation. The 2 kinds of air conditioning clothes have the defects that if the air volume is too small to achieve the expected heat dissipation effect, the air volume is too large, clothes are raised, bulges and the like are caused, the image is influenced, and noise and vibration generated during the operation of a fan can cause additional discomfort. Such air-conditioning garments are particularly unsuitable for wearing in toxic environments, such as in the case of viral departments of hospitals, where the use of air blasts into the interior of the garment may result in the risk of infection by the direct insufflation of viruses or toxic gases onto the skin surface of the person.

The patent application number 2018101264202 discloses a water circulation wearable air conditioner in 2019, which comprises a water circulation system, a cold and heat generating device and the like. The cold and heat generating device comprises a semiconductor refrigerating device, and can refrigerate and cool circulating water in a refrigerating mode. The drawback of this technique is that the circulating water inside the garment gradually evaporates or leaks over time, rendering the product ineffective. Meanwhile, various movement postures of the human body inevitably cause the capillary tube to be bent and twisted, so that the capillary tube is blocked, and the product is temporarily invalid; the circulating water inside the garment and its piping make the garment difficult to disassemble and clean, while significantly increasing the weight of the garment.

The other products disclose air-conditioning clothes which are refrigerated by adopting a semiconductor refrigerating device, wherein the air-conditioning clothes are refrigerated by directly contacting human skin, and the technology has the defects that the sectional area of the semiconductor refrigerating device is smaller, only the contacted small-area skin can be cooled, the excessive cooling of the part of the skin can cause discomfort of the human body due to the over-concentrated refrigerating capacity generated by the refrigerating device, and the skin which is not covered by the refrigerating device is still very hot. In addition, the concentrated refrigerating capacity of the refrigerating device can also cause the occurrence of condensed water, so that the clothes are soaked, and the greater trouble is caused.

Disclosure of Invention

The utility model aims to solve the problems in the prior art, and provides a semiconductor refrigeration device-based distributed heatstroke prevention air conditioning suit which is simple in structure, can generate a temperature difference lower than the ambient temperature by 15 ℃ and can uniformly cool the back of a human body in a large area in the wearing process.

In order to achieve the purpose, the technical measures adopted by the utility model are as follows: the distributed heatstroke prevention cooling air conditioning suit based on the semiconductor refrigerating device is provided with an air conditioning suit main body, a silica gel soft board, the semiconductor refrigerating device, a lead, a mobile power supply, a fan and a waistband; a silica gel soft board is fixed on the outer side of the back of the air-conditioning suit main body through a fixing piece, a semiconductor refrigerating device array consisting of a plurality of groups of low-power semiconductor refrigerating devices is uniformly distributed on the other side face of the silica gel soft board, and the semiconductor refrigerating device array, the mobile power supply and the fan are electrically connected through conducting wires; the waist of the air-conditioning suit main body is provided with a belt, and the mobile power supply is attached to the belt; the waistband on also be fixed with the fan through the mounting and divide the gas area, the fan with divide the gas area and be connected, divide gas area both ends be equipped with the flat part and be used for fixing on the waistband with dividing the gas area, divide the gas area interlude to have banded chamber, the one end in banded chamber is sealed, other end opening is connected with the fan air outlet, divide and be equipped with the gas distribution hole on the interlude side in gas area, the drill way is towards semiconductor refrigeration device array, the wind that the fan produced blows to semiconductor refrigeration device through dividing the gas hole perpendicularly, reduces semiconductor refrigeration device hot junction temperature, strengthens refrigeration performance, semiconductor refrigeration device refrigeration is used for making the whole cooling transmission ice of silica gel soft board feel for the human body cooling.

The groups of low-power semiconductor refrigerating devices are connected in series and in parallel to form a uniformly distributed semiconductor refrigerating device array.

The fixing part used for fixing the silica gel soft board and the fixing part used for fixing the gas distribution belt on the waistband on the air conditioning suit main body are matched buckles or zippers.

The portable power source be the polymer lithium cell or the cell-phone treasured that charges that integrate with the switch.

Furthermore, the semiconductor refrigeration device is additionally provided with a small-sized fin radiator on the hot surface thereof for improving the heat dissipation capacity of the semiconductor refrigeration device and the refrigeration efficiency.

The air conditioning suit of the utility model selects the small-sized low-power semiconductor refrigerating device sold in the market, because the small-sized low-power semiconductor refrigerating device only generates the temperature difference of 15 ℃ lower than the ambient temperature, the phenomenon that the semiconductor refrigerating device generates the local temperature which is too low when in work to cause the human body to feel uncomfortable can be avoided. Meanwhile, the low-power device has small self heat productivity and can operate at high efficiency under the condition of poor heat dissipation environment.

It should be noted that there are two implementation manners of the small low-power semiconductor refrigeration device, the first manner is to divide the electronic components in the conventional device into several parts and respectively manufacture the parts into independent small devices, the usage amount of semiconductor materials is not increased in this manner, the power sum of all the small devices is equal to that of a single conventional device, the endurance capacity of the product is not reduced, but the refrigeration and heat dissipation areas are greatly increased, which is beneficial to more efficient operation of the device. The second method is to directly reduce the input power of the conventional device, and this method can also greatly reduce the self heat generation amount of the device, but has the problems of low cooling efficiency and high cost. The small low-power semiconductor refrigeration device of the present invention is made by selecting the device of the first mode, that is, the low-power semiconductor refrigeration device manufactured by reducing the number of thermoelectric elements in the semiconductor refrigeration device.

The waistband is a general waistband or a thick cloth waistband; the air-conditioning suit main body can adopt common tools in various industries as the air-conditioning suit main body, and is suitable for long-sleeved clothes and collar-free clothes.

Compared with the prior art, the distributed heatstroke prevention air conditioning suit based on the semiconductor refrigerating device has the beneficial effects that:

the heatstroke-preventing cooling air-conditioning garment has the advantages that no liquid flowing refrigeration working medium is available, and the problem that the refrigeration working medium leaks to cause product failure is solved. The air conditioning suit does not need to blow air into the suit, can also play a good cooling effect on closed clothing such as closed protective clothing used in hospitals, and does not generate the risk caused by contact with toxic gas.

The semiconductor refrigerating device, the mobile power supply, the finned radiator and the fan used in the air conditioning suit have the advantages of small volume, low power consumption, good temperature regulation effect, safety in use and the like. Particularly, the low-power small semiconductor refrigeration device can generate low temperature which is 15 ℃ lower than the ambient temperature when in work, can continuously transmit low temperature cool to the back of a human body, and can not generate condensed water due to too low temperature in the running process.

The heatstroke prevention cooling air conditioning suit can be conveniently carried and worn, when the air conditioning suit is worn in outdoor work, the silica gel soft board and the matched air conditioning suit main body are well fixed, the mobile power supply fan and the air distribution belt are also well fixed on the waistband, and the cooling can be effectively carried out by opening the switch, so that the problems of influence on human health caused by a high-temperature environment and low working efficiency are solved, the human body can obtain an ice and cool feeling during operation, and the problems of frequent heatstroke of people in the high-temperature environment and the like are avoided.

The heatstroke-prevention air-conditioning suit disclosed by the utility model uses the detachable mobile power supply such as a polymer lithium battery or a mobile phone charger integrated with a switch, and can be used for 4-12 hours after being charged once, so that the requirements of users can be met.

Fifthly, the air-conditioning suit main body can be directly used by common tools of various industries, and the air-conditioning suit main body can be conveniently cleaned only by disassembling the silica gel soft board and taking down the portable power supply and the fan on the waistband before cleaning. The air-conditioning suit has simple structure, and particularly, the simplified air-conditioning suit can normally send cool to the human body only through the natural convection heat exchange between the hot surface of the semiconductor refrigerating device and the air or through the enhanced heat exchange efficiency of the finned radiator. Therefore, the air conditioning suit has the characteristics of user friendliness, low cost, wide applicability and the like.

Drawings

Fig. 1 is a schematic structural diagram of a distributed heatstroke prevention air conditioning suit of the present invention.

FIG. 2 is a schematic view of the connection structure of the blower, the air distribution belt and the waist belt.

Fig. 3 is a schematic diagram of an array structure in which a finned radiator is additionally provided on a semiconductor refrigeration device according to the present invention.

Fig. 4 is a schematic structural diagram of a simplified distributed heatstroke prevention air conditioning suit according to embodiment 2 of the present invention.

In the above figures: 1-main body of air-conditioning clothes; 2-silica gel soft board; 3-semiconductor refrigeration device; 4-a wire; 5, a waistband; 6, a mobile power supply; 7, a fan; 8, a fixing piece; 9-finned radiator; 10-air separation zone; 11-gas distributing hole.

Detailed Description

The present invention will be further described with reference to the drawings and specific embodiments, but the present invention is not limited thereto.

Example 1: the utility model provides a distributed heatstroke prevention cooling air conditioning suit based on a semiconductor refrigerating device, which has a structure shown in figures 1 and 2 and comprises an air conditioning suit main body 1, a silica gel soft board 2, a semiconductor refrigerating device 3, a lead 4, a mobile power supply 6, a fan 7 and a waistband 5; the back of the air-conditioning suit main body is provided with a fixing part 8 matched with the silica gel soft board, as shown in fig. 1, the fixing part of the embodiment is a clip, one surface of the silica gel soft board is pasted and buckled on the back of the air-conditioning suit main body through the clip, the other surface of the silica gel soft board is pasted with a plurality of groups of semiconductor refrigerating device arrays consisting of low-power semiconductor refrigerating devices 3, and the semiconductor refrigerating device arrays are electrically connected with a mobile power supply 6 and a fan 7 through leads 4; the waistband 5 is arranged between the waist of the main body of the air-conditioning suit, the mobile power supply is not arranged on the waistband, the fan is connected with the air distribution belt 10, the air distribution belt is made of flexible materials, two ends of the air distribution belt are provided with flat parts used for fixing the air distribution belt on the waistband through clamping buckles, the middle section of the air distribution belt is provided with a belt-shaped cavity, one end of the belt-shaped cavity is a closed end, the opening of the other end of the belt-shaped cavity is connected with an air outlet of the fan, one side edge of the middle section of the air distribution belt is provided with an air distribution hole 11, the opening of the opening faces the semiconductor refrigerating device array, wind generated by the fan is vertically blown to the semiconductor refrigerating device through the air distribution hole, the hot end temperature of the semiconductor refrigerating device is reduced, the refrigerating performance of the semiconductor refrigerating device is enhanced, the whole silica gel soft plate is uniformly cooled by the refrigerating device, the ice feeling is transferred to bring cool low temperature to the human body, and the effect of heat dissipation and cooling of the human body is achieved.

Preferably, the semiconductor refrigeration device adopts a low-power small device, only generates a temperature difference of 15 ℃ lower than the ambient temperature, avoids generating too low local temperature to cause discomfort to human bodies, and ensures the flexibility of the silica gel soft plate 2 to a certain extent. The portable power source described in this embodiment is a mobile phone power bank integrated with a switch.

The refrigeration air-conditioning suit of the embodiment is suitable for being used in sultry and high-temperature environments, such as the vicinity of high-temperature metallurgical equipment of a steel mill, the interior of an armored vehicle and the like. When the semiconductor refrigerating device 3 works, the disturbance of the fan to the air flow enables the hot surface of the semiconductor refrigerating device to form forced convection heat transfer, the heat dissipation capacity of the semiconductor refrigerating device is enhanced, the refrigerating efficiency is further increased, larger refrigerating capacity is generated, and meanwhile, the air flow generated by the fan 7 flows through the back and the head of a human body and can also generate the functions of heat dissipation and cooling for the skin of the back and the head.

Example 2: the utility model provides a distributed heatstroke prevention cooling air-conditioning suit based on a semiconductor refrigerating device, the structure of the air-conditioning suit of the embodiment is basically the same as that of the embodiment 1, except that the mobile power supply is a polymer lithium battery integrated with a switch; the fixing piece is a zipper; a small fin radiator 9 is attached to the semiconductor refrigeration device 3, as shown in fig. 3. The fin radiator 9 is used for improving the heat dissipation capacity of the semiconductor refrigerating device 3, the weight and the volume of the air conditioning suit cannot be obviously increased due to the additional fin radiator, but the refrigerating efficiency of the semiconductor refrigerating device 3 can be improved, and a human body can obtain lower temperature experience.

Example 3: the utility model provides a distributed heatstroke prevention and cooling air conditioning suit based on a semiconductor refrigerating device, which is a simplified semiconductor refrigerating air conditioning suit, as shown in figure 4, the structure of the air conditioning suit in the embodiment is basically the same as that of the embodiment 2, and the difference is that the main body of the air conditioning suit is a short-sleeve standing-collar-free tool, because the used semiconductor refrigerating device 3 is provided with a small-sized fin radiator 9, the efficiency of the semiconductor refrigerating device is improved, meanwhile, the self heating value of a low-power device is small, and the semiconductor refrigerating device can be operated efficiently under the environment condition without fan auxiliary heat radiation, so that the arrangement of a fan 7 and an air distribution belt 10 can be reduced. The air conditioning suit of the embodiment is suitable for being used in the environment with high temperature in the field and good air fluidity.

The air-conditioning suit has the advantages of simple structure, good heat dissipation and cooling effects, comfortable wearing because the main body of the air-conditioning suit can be directly made of common tools in various industries, easy separation from the silica gel soft plate and the waistband, convenient cleaning, user friendliness, low cost, wide applicability and the like.

Claims

1. A distributed heatstroke prevention cooling air conditioning suit based on a semiconductor refrigerating device is provided with an air conditioning suit main body, a silica gel soft board, a semiconductor refrigerating device, a lead, a mobile power supply, a fan and a waistband; the method is characterized in that: a silica gel soft board is fixed on the outer side of the back of the air-conditioning suit main body through a fixing piece, a semiconductor refrigerating device array consisting of a plurality of groups of low-power semiconductor refrigerating devices is uniformly distributed on the other side face of the silica gel soft board, and the semiconductor refrigerating device array, the mobile power supply and the fan are electrically connected through conducting wires; the waist of the air-conditioning suit main body is provided with a belt, and the mobile power supply is attached to the belt; the waistband on also be fixed with the fan through the mounting and divide the gas area, the fan with divide the gas area and be connected, divide gas area both ends be equipped with the flat part and be used for fixing on the waistband with dividing the gas area, divide the gas area interlude to have banded chamber, the one end in banded chamber is sealed, other end opening is connected with the fan air outlet, divide and be equipped with the gas distribution hole on the interlude side in gas area, the drill way is towards semiconductor refrigeration device array, the wind that the fan produced blows to semiconductor refrigeration device through dividing the gas hole perpendicularly, reduces semiconductor refrigeration device hot junction temperature, strengthens refrigeration performance, semiconductor refrigeration device refrigeration is used for making the whole cooling transmission ice of silica gel soft board feel for the human body cooling.

2. The distributed heatstroke prevention air conditioning suit based on semiconductor refrigeration device as claimed in claim 1, wherein: the groups of low-power semiconductor refrigerating devices are connected in series and in parallel to form a uniformly distributed semiconductor refrigerating device array.

3. The distributed heatstroke prevention air conditioning suit based on semiconductor refrigeration device as claimed in claim 1, wherein: the fixing part used for fixing the silica gel soft board and the fixing part used for fixing the gas distribution belt on the waistband on the air conditioning suit main body are matched buckles or zippers.

4. The distributed heatstroke prevention air conditioning suit based on semiconductor refrigeration device as claimed in claim 1, wherein: the portable power source be the polymer lithium cell or the cell-phone treasured that charges that integrate with the switch.

5. The distributed heatstroke prevention air conditioning suit based on semiconductor refrigeration device as claimed in claim 1, wherein: the semiconductor refrigeration device is additionally provided with a small-sized fin radiator on the hot surface thereof for improving the heat dissipation capacity of the semiconductor refrigeration device and the refrigeration efficiency.