CN216389427U - OLED display panel and display - Google Patents

Abstract

The utility model relates to an OLED display panel and a display, wherein the OLED display panel comprises an undercut structure, a cathode material layer and a filling material layer; the undercut structure comprises an etching material layer and a supporting material layer, wherein the etching material layer and the supporting material layer are arranged in a stacked mode; a first through groove is formed in the etching material layer; a second through groove is formed in the supporting material layer; the first through groove and the second through groove are communicated to form an undercut opening of an undercut structure; the first part of the cathode material layer is arranged in a cavity defined by the undercut opening, and the second part of the cathode material layer is formed on the support material layer; the first part of filling material layer is filled in the cavity that the cathode material layer encloses, and the second part of cathode material layer covers on the second part of cathode material layer, and this application utilizes abundant filling material layer to fill the cathode material layer, reduces stress concentration in order to prevent the fracture of undercut structure, because the filling material layer has separation water oxygen ability, promotes anodal anti-oxidant, corrosion resistance better.

Description

OLED display panel and display

Technical Field

The utility model relates to the technical field of display, in particular to an OLED display panel and a display.

Background

With the continuous development of display technology, the OLED (Organic Light-Emitting Diode) display technology has the advantages of high contrast, fast response speed, self-Light emission, flexible bending, and the like, and thus becomes the mainstream choice of panel technology. The OLED display technology is rapidly applied, for example, to mobile phones, tablets, computers, televisions, and other devices. The top-emitting OLED product in the OLED display technology avoids the interference of a complex substrate circuit to light due to the light emitted from the top electrode, and can effectively improve the resolution, thereby being highly concerned in the industry. However, the design of thin electrodes also highlights the effect of voltage non-uniformity, and especially as the size of the television panel increases, the problem of voltage drop (IR-drop) seriously affects the display quality of the panel.

To solve the voltage drop problem, a design scheme of a display panel with an "undercut" structure is proposed in the conventional art. According to the scheme, the auxiliary electrode is in direct contact with the cathode, so that voltage drop loss is reduced, and voltage drop influence is effectively solved. However, in the scheme, due to the existence of the undercut structure, the inorganic thin film layer is difficult to completely cover the upper part of the cathode, so that the cathode is more easily exposed in a water vapor environment, and meanwhile, the inorganic thin film layer at the position is easy to cause stress concentration, so that the inorganic thin film layer has a fracture risk during bending, the packaging failure is caused, and the reliability of the panel is influenced.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is desirable to provide an OLED display panel and a display device with low reliability of the conventional OLED display panel.

In one aspect, the present application provides an OLED display panel including an undercut structure, a cathode material layer, and a filling material layer; the undercut structure comprises an etching material layer and a supporting material layer, wherein the etching material layer and the supporting material layer are arranged in a stacked mode;

a first through groove is formed in the etching material layer; a second through groove is formed in the supporting material layer; the first through groove and the second through groove are communicated to form an undercut opening of an undercut structure;

the first part of the cathode material layer is arranged in a cavity defined by the undercut opening, and the second part of the cathode material layer is formed on the support material layer;

the first part of the filling material layer is filled in a cavity surrounded by the cathode material layer, and the second part of the cathode material layer covers the second part of the cathode material layer.

Optionally, the packaging film further comprises an encapsulation layer; the packaging layer is arranged on the filling material layer.

Optionally, the encapsulation layer at least includes at least one set of encapsulation sublayers; the group packaging sub-layer comprises two inorganic material layers and one organic material layer; the organic material layer is sandwiched between two inorganic material layers.

Optionally, the organic material layer is an epoxy material layer or an acrylic material layer; the inorganic material layer is a silicon nitride material layer, a silicon-oxygen-nitrogen material layer or a silicon oxide material layer.

Optionally, a high-barrier material layer is further included; the high barrier material layer is arranged on the packaging layer.

Optionally, the adhesive material layer is further included; the adhesive material layer is sandwiched between the packaging layer and the high barrier material layer.

Optionally, the high-barrier material layer is a polyester resin material layer or a flexible glass material layer; the adhesive material layer is a pressure-sensitive adhesive material layer.

Optionally, the cathode material layer is also included; the etching material layer and the second part of the cathode material layer are formed on the auxiliary cathode material layer.

Optionally, the filling material layer is a silicon oxynitride material layer or a silicon oxide material layer.

In another aspect, the present application provides a display, which includes a controller and the OLED display panel; the controller is connected with the OLED display panel.

One of the above technical solutions has the following advantages and beneficial effects:

the utility model provides an OLED display panel includes undercut structure, cathode material layer and filling material layer, wherein, undercut structure includes etching material layer and supporting material layer, first logical groove has been seted up on the etching material layer, the second logical groove has been seted up on the supporting material layer, first logical groove and second logical groove intercommunication form the undercut opening of undercut structure, set up the first part of cathode material layer in the cavity that the undercut opening encloses, the second part of cathode material layer is formed on the supporting material layer, then utilize the first part of filling material layer to fill in the cavity that the cathode material layer encloses, the second part of cathode material layer covers on the second part of cathode material layer. This application utilizes abundant filling material layer to fill the cathode material layer, reduces stress concentration in order to prevent the fracture of undercut structure, because the filling material layer has separation water oxygen ability, promotes anodal anti-oxidant, anticorrosive performance better, promotes encapsulation performance, in addition, because the filling material layer has low elastic modulus for OLED display panel internal stress is littleer, is favorable to promoting the flexible ability of buckling.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular description of preferred embodiments of the application, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the subject matter of the present application.

Fig. 1 is a schematic view of a first structure of an OLED display panel in an embodiment of the present application.

Fig. 2 is a schematic diagram of a second structure of the OLED display panel in the embodiment of the present application.

Fig. 3 is a schematic diagram of a third structure of an OLED display panel in an embodiment of the present application.

Fig. 4 is a schematic diagram of a fourth structure of the OLED display panel in the embodiment of the present application.

Description of reference numerals:

1. an OLED display panel; 11. an undercut structure; 111. etching the material layer; 113. a layer of support material; 13. a layer of cathode material; 15. a layer of filler material; 17. a layer of auxiliary cathode material; 19. a packaging layer; 191. an inorganic material layer; 193. an organic material layer; 21. a layer of adhesive material; 23. a layer of high barrier material.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "disposed," "one end," "the other end," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the prior art, in order to solve the problem of voltage drop in the top-emitting OLED product, a display panel with an "undercut" structure is designed, but the existence of the "undercut" structure causes that the cathode cannot be completely encapsulated, so that the cathode is more easily exposed to a moisture environment. The "undercut" structure of the encapsulating layer 19 is prone to stress concentration, and there is a risk of breaking during bending, resulting in package failure and affecting the reliability of the panel, and for this purpose, as shown in fig. 1, an OLED display panel 1 is provided, which includes an undercut structure 11, a cathode material layer 132 and a filling material layer 153.

The undercut structure 11 is an open structure surrounded by material layers. In one example, the undercut structure 11 includes an etching material layer 111 and a support material layer 113, the etching material layer 111 and the support material layer 113 are stacked, that is, the support material layer 113 is disposed on the etching material layer 111, and the undercut structure 11 is formed by the etching material layer 111 and the support material layer 113. Wherein, a first through groove is formed on the etching material layer 111, a second through groove is formed on the supporting material layer 113, and the first through groove and the second through groove are communicated to form an undercut opening of the undercut structure 11. It should be noted that, in order to facilitate the implementation of the process, the first through groove and the second through groove are both through grooves with a top opening size larger than a bottom opening size. The size of the bottom opening of the second through groove is smaller than that of the top opening of the first through groove. The material of the etching material layer 111 can be selected according to actual conditions, and in one example, the etching material layer 111 is a PV (polyvinyl chloride) material layer, which is not particularly limited in this application. The material of the support material layer 113 may be selected according to actual circumstances, and in one example, the support material layer 113 is a PLN material layer, a PLN and metal mixed material layer, or a PLN and PV mixed material layer, which is not particularly limited in this application. In one example, the thickness of the etching material layer 111 ranges from 100A to 40000A, for example, 10000A, 20000A, 30000A. In one example, the support material layer 113 has a thickness in a range of 100A to 40000A, e.g., 10000A, 20000A, 30000A.

The cathode material layer 13 is used for transmitting electrical energy, and a first portion of the cathode material is disposed in a cavity defined by the undercut opening, specifically, the first portion of the cathode material is attached to the inner wall of the second through groove and attached to the auxiliary cathode material layer 1713 of the OLED display panel 1. A second portion of the cathode material layer 13 is formed on the support material layer 113, and specifically, the second portion of the cathode material layer 13 covers an end face of the support material layer 113 away from the etching material layer 111. The material of the cathode material layer 13 can be selected according to the actual situation, and in one example, the cathode material layer 13 is a silver material layer, a magnesium material layer, and an indium zinc oxide material layer, which is not particularly limited in this application. The cathode material layer 13 may be formed by evaporation, sputtering, or self-assembly. In one example, the cathode material layer 13 has a thickness in a range of 10 nanometers to 200 nanometers, e.g., 50 nanometers, 100 nanometers, 150 nanometers.

It should be noted that the OLED display panel 1 of the present application includes an auxiliary cathode material layer 1713 for reducing the voltage drop of the cathode material layer 13, the etching material layer 111 and the second portion of the cathode material layer 13 are formed on the auxiliary cathode material layer 1713, and further, the auxiliary cathode material layer 1713 is formed on a TFT (Thin Film Transistor) substrate.

The filler material layer 15 is used to fill the cathode material layer 13 and provide physical protection to the cathode material layer 13. Since the cathode material layer 13 is a film attached to the inner wall of the second through trench and the auxiliary cathode material layer 1713, the cathode material layer 13 forms an opening, and in order to fill the cathode material layer 13, the first portion of the filling material layer 15 is filled in the cavity surrounded by the cathode material layer 13, that is, the opening formed by the filling material layer 15 is filled with the filling material layer 15. A second portion of the layer of cathode material 13 overlies a second portion of the layer of cathode material 13, i.e., the cathode layer. A second portion of the layer of cathode material 13 overlies a second portion of the layer of cathode material 13. The material of the filling material layer 15 can be selected according to the actual situation, and in one example, the filling material layer 15 is a silicon oxynitride material layer or a silicon oxide material layer, which is not particularly limited in this application. The forming process of the filling material layer 15 is as follows: a layer of filling material, such as perhydropolysilazane, is coated on the cathode material layer 13 by means of roll coating or spray coating, and is reacted by means of ultraviolet irradiation or heating to form a dense silicon-oxygen-nitrogen material layer or a silicon oxide material layer, wherein the ultraviolet wavelength can be 170 nm to 200 nm, and the heating temperature can be set to 80 ℃ to 100 ℃. In one example, the thickness of the layer of filler material 15 ranges from 400 nanometers to 1000 nanometers, such that the layer of filler material 15 fills the undercut structures 11 and the layer of filler material 15 continuously covers the second portion of the layer of cathode material 13.

In the fabrication of the undercut structure 11, the cathode material layer 13 and the filler material layer 15, an overall encapsulation is required. To this end, as shown in fig. 2, the OLED display panel 1 of the present application further includes an encapsulation layer 19. The encapsulating layer 19 is used for encapsulating the undercut structure 11, the cathode material layer 13 and the filling material layer 15, and the encapsulating layer 19 has a water and oxygen blocking capability. The encapsulation layer 19 is arranged on the layer of filling material 15, i.e. the layer of filling material 15 is completely encapsulated.

The structure and material of the encapsulation layer 19 can be selected according to the actual situation. Illustratively, the encapsulation layer 19 includes at least one set of encapsulation sublayers, for example, one set of encapsulation sublayers, two sets of encapsulation sublayers, and three sets of encapsulation sublayers. As shown in fig. 3, the group encapsulation sub-layer includes two inorganic material layers 191 and one organic material layer 193, and the organic material layer 193 is sandwiched between the two inorganic material layers 191. What kind of material the inorganic material layer 191 is made of may be selected according to actual circumstances, and in one example, the inorganic material layer 191 is a silicon nitride material layer, a silicon oxynitride material layer or a silicon oxide material layer, which is not particularly limited in this application. The material of the organic material layer 193 may be selected according to the actual situation, and in one example, the inorganic material layer 191 is an epoxy-based material layer or an acrylic-based material layer, which is not particularly limited in this application. In one example, the inorganic material Layer 191 may be formed using a PECVD (Plasma Enhanced Chemical Vapor Deposition) or ALD (Atomic Layer Deposition) method. The organic material layer 193 may be formed by a method such as film-jet printing or spin coating.

In order to improve the encapsulation performance of the OLED display panel 1, as shown in fig. 4, the OLED display panel 1 further includes a high barrier material layer 23. A layer of high barrier material 23 is disposed on the encapsulation layer 19. The material of the high-barrier material layer 23 may be selected according to actual conditions, and in one example, the high-barrier material layer 23 is a polyester resin material layer or a flexible glass material layer, which is not particularly limited in this application.

For adhesion, as shown in fig. 4, the OLED display panel 1 of the present application further includes an adhesive material layer 21; the adhesive material layer 21 is sandwiched between the encapsulation layer 19 and the high barrier material layer 23. The material of the adhesive material layer 21 can be selected according to actual conditions, and in one example, the adhesive material layer 21 is a pressure sensitive adhesive material layer, and the application is not limited thereto.

The application provides an OLED display panel 1 includes undercut structure 11, cathode material layer 13 and filler material layer 15, wherein, undercut structure 11 includes etching material layer 111 and supporting material layer 113, first logical groove has been seted up on etching material layer 111, the second logical groove has been seted up on supporting material layer 113, first logical groove and second logical groove intercommunication form undercut opening of undercut structure 11, set up the first part of cathode material layer 13 in the cavity that undercut opening encloses, the second part of cathode material layer 13 is formed on supporting material layer 113, then utilize the first part of filler material layer 15 to fill in the cavity that cathode material layer 13 encloses, the second part of cathode material layer 13 covers on the second part of cathode material layer 13. This application utilizes abundant filling material layer 15 to fill cathode material layer 13, reduces stress concentration in order to prevent the fracture of undercut structure 11, because filling material layer 15 has separation water oxygen ability, promotes anodal anti-oxidant, anticorrosive performance better, promotes encapsulation performance, in addition, because filling material layer 15 has low elastic modulus for 1 internal stress of OLED display panel is littleer, is favorable to promoting the flexible ability of buckling.

The OLED display panel 1 is applied, and a display is provided and comprises a controller and the OLED display panel 1; the controller is connected with the OLED display panel 1.

It should be noted that the OLED display panel 1 in the present embodiment is the same as that described in the embodiments of the OLED display panel 1 in the present application, and please refer to the foregoing embodiments for details, which are not repeated herein. The controller is used to control the OLED display panel 1.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples are merely illustrative of several embodiments of the present application, and the description is more specific and detailed, but not to be construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The OLED display panel is characterized by comprising an undercut structure, a cathode material layer and a filling material layer;

the undercut structure comprises an etching material layer and a support material layer, wherein the etching material layer and the support material layer are arranged in a stacked mode;

a first through groove is formed in the etching material layer; a second through groove is formed in the supporting material layer; the first through groove and the second through groove are communicated to form an undercut opening of the undercut structure;

a first part of the cathode material layer is arranged in a cavity defined by the undercut opening, and a second part of the cathode material layer is formed on the support material layer;

the first part of the filling material layer is filled in a cavity surrounded by the cathode material layer, and the second part of the cathode material layer covers the second part of the cathode material layer.

2. The OLED display panel of claim 1, further comprising an encapsulation layer;

the packaging layer is arranged on the filling material layer.

3. The OLED display panel of claim 2, wherein the encapsulation layer includes at least one set of encapsulation sub-layers;

the group of packaging sub-layers comprise two inorganic material layers and one organic material layer; the organic material layer is sandwiched between two inorganic material layers.

4. The OLED display panel of claim 3, wherein the organic material layer is an epoxy-based material layer or an acryl-based material layer; the inorganic material layer is a silicon nitride material layer, a silicon-oxygen-nitrogen material layer or a silicon oxide material layer.

5. The OLED display panel of claim 2, further comprising a layer of high barrier material;

the high barrier material layer is arranged on the packaging layer.

6. The OLED display panel of claim 5, further comprising a layer of adhesive material;

the adhesive material layer is clamped between the packaging layer and the high-barrier material layer.

7. The OLED display panel according to claim 6, wherein the high barrier material layer is a polyester resin material layer or a flexible glass material layer; the adhesive material layer is a pressure-sensitive adhesive material layer.

8. The OLED display panel of claim 1, further comprising an auxiliary cathode material layer;

the etching material layer and the second part of the cathode material layer are formed on the auxiliary cathode material layer.

9. The OLED display panel of any one of claims 1 to 8, wherein the filler material layer is a silicon oxynitride material layer or a silicon oxide material layer.

10. A display comprising a controller and the OLED display panel of any one of claims 1-9; the controller is connected with the OLED display panel.

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