CN216389360U - LED lamp bead for realizing series connection of chips with vertical structures - Google Patents
LED lamp bead for realizing series connection of chips with vertical structures Download PDFInfo
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- CN216389360U CN216389360U CN202122208864.0U CN202122208864U CN216389360U CN 216389360 U CN216389360 U CN 216389360U CN 202122208864 U CN202122208864 U CN 202122208864U CN 216389360 U CN216389360 U CN 216389360U
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Abstract
The utility model discloses an LED lamp bead for realizing serial connection of chips with vertical structures, wherein an LED support is divided into a negative electrode functional area and a plurality of separated independent functional areas through white channels, one corner of the LED support is provided with an identification angle, six independent functional areas in the separated independent functional areas are fixed with the chips through crystal fixing glue, chip electrodes are connected with a negative electrode bonding pad and a positive electrode bonding pad through leads, the negative electrode bonding pad and the positive electrode bonding pad are welded on a PCB through tin paste, a negative electrode pin is arranged on the side of the negative electrode functional area, a positive electrode pin is arranged on the side of the positive electrode bonding pad, and a reflecting surface is arranged around the bonding pad; the chip electrode is a negative electrode, and the bottom of the chip is a positive electrode. According to the utility model, a single whole piece of metal of the anode and the cathode of the LED support is divided into a plurality of pieces of metal by adopting a special design, then the chips with vertical structures are respectively die-bonded in a plurality of metal areas and are connected in series in a welding mode, so that the purpose of realizing high voltage of a single LED lamp bead is achieved.
Description
Technical Field
The utility model relates to the technical field of LEDs, in particular to an LED lamp bead for realizing series connection of chips with vertical structures.
Background
With the continuous improvement of the luminous efficiency of the LED, the appearance of new combined modules also leads the power of a single LED tube (module) to be continuously improved. The breakthrough and development of the novel optical design can further reverse the situation of single products, and the gradual change shows the wide prospect of the LED in the illumination application. The energy states of electrons and holes are different in different semiconductor materials, and the energy released when the electrons and holes are recombined is different, and the more the energy released, the shorter the wavelength of the emitted light. Commonly used are red, yellow, blue and green emitting diodes; when the electrons and the holes are combined, visible light can be radiated, so that the light-emitting diode can be manufactured; gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. It is important to point out that, at present, because the voltage range of the red light chip and the yellow light chip of the LED is 1.8-2.4V and is limited by the relation between the manufacturing process and the cost, most of the chips are manufactured by adopting a vertical structure, and in practical application, the use of high voltage cannot be satisfied.
If a single red LED and a single yellow LED are required to meet high-voltage requirements, the conventional method is to place a plurality of red light chips with horizontal structures on a bracket and form a high-voltage lamp bead in a series connection mode. The cost of the red and yellow light high-voltage LED is very high due to the mode, and the main reason is that the price of the chip with the horizontal structure is 2-3 times higher than that of the chip with the vertical structure, so that the cost of the lamp bead is several times higher. Accordingly, there is a need for a reasonable improvement to the prior art in view of the above.
The chips with horizontal structures are connected in series, and the chips are provided with a positive electrode and a negative electrode, so that the chips can be placed in a functional area, and wires can be directly welded on the positive electrode and the negative electrode of the chips during wire bonding. However, if the chip is in a vertical structure and only one electrode is arranged on the chip, a plurality of single-electrode chips cannot be connected in series on the conventional support. Based on the mismatching of the single electrode chip and the conventional support, the existing LED lamp bead is generally only provided with one single electrode chip, and the scheme of serially connecting a plurality of single electrodes and chips cannot be adopted.
The positive and negative electrodes of the current LED support are respectively composed of a single whole metal (copper material or iron material), so that the design of a series connection scheme of a single electrode chip is not convenient, and the following defects exist:
firstly, the method comprises the following steps: influence the reliability of LED lamp pearl:
analysis from chip structure:
for manufacturing the LED chip, the choice of the substrate material is the primary consideration, and which suitable substrate should be adopted needs to be selected according to the requirements of equipment and LED devices; the current international substrates are essentially divided into three materials: sapphire (AL 2O 3), silicon (Si), silicon carbide (SiC).
Both SiC and Si material substrates are used for single electrode structure chips because these substrate materials are conductive and only need a single electrode thereon, and chips employing such substrates are also called vertical structure chips.
The double-electrode structure generally uses sapphire as a substrate, and because the material is not conductive, the anode and the cathode are all made on the same surface, so the double-electrode structure is a double-electrode structure, and a chip adopting the substrate is called a horizontal structure chip.
The dual-electrode chip has the following disadvantages compared with the single-electrode chip:
a. the heat conduction performance of the double-electrode chip is not as good as that of the single-electrode chip:
a-a) the substrates are different: the single electrode is made of SiC material, and the heat conductivity coefficient is 490W/m.K, which is more than 10 times higher than that of the sapphire substrate (the heat conductivity coefficient of the sapphire AL2O3 is 46W/m.K); sapphire substrates have the following problems at the same time:
1. lattice mismatch and thermal stress mismatch can produce a large number of defects in the epitaxial layer;
2. sapphire is an insulator, and two electrodes are manufactured on the upper surface, so that the effective light-emitting area is reduced;
3. the photoetching and etching process is added, and the manufacturing cost is high.
a. The contact mode is different: the single electrode adopts L contact (horizontal contact), and heat can be directly conducted out by the electrode; the sapphire substrate employs a V-contact (vertical contact), and a heat dissipation path increases.
b. Antistatic ability: due to the differences in chip materials and structures, single-electrode chips generally have better antistatic capabilities than dual-electrode chips.
c. The welding wire mode is different: the double-electrode chip needs to weld two leads on the electrodes; the single electrode chip is an upper electrode and a lower electrode, the single lead is in a vertical structure, only the single electrode lead is needed, the bottom of the electrode is directly and fixedly connected with the support through conductive adhesive or solder paste, and the contact area is larger than that of the lead welded on the electrode, so that the reliability of the lamp bead can be improved to a certain degree (for example, potential hazards of the lead such as poor welding, improper wire arc, wire breakage and the like).
The analysis shows that the single-electrode chip is obviously superior to the double-electrode chip in the heat dissipation and ESD (electro-static discharge) antistatic capability, the LED chip is used as a main component of the LED lamp bead, and the performance of the LED lamp bead is directly influenced by the performance of the chip.
Second, the LED chip cost increases: for example, because the existing single-electrode chips for red light, yellow light, orange light and the like are inconvenient to be connected in series, aiming at the voltage requirement of 4V \6V or higher of a client, the red light, yellow light and orange light chips with a double-electrode horizontal structure are generally required to be connected in series. However, the cost price of the double-electrode chip is far higher than that of the single-electrode chip, generally about 2-3 times of the price, and the brightness of the double-electrode chip is only half or even lower than that of the single-electrode chip under the same size, so that the number of the lamp beads of the LED finished product with the same specification needs to be doubled, and the price of the LED finished product is higher and is not easy to be accepted by a client.
In conclusion, the utility model designs the LED lamp bead for realizing the serial connection of the chips with the vertical structures.
Disclosure of Invention
Aiming at the defects in the prior art, the utility model aims to provide the LED lamp bead for realizing the serial connection of the chips with the vertical structures.
In order to achieve the purpose, the utility model is realized by the following technical scheme: an LED lamp bead for realizing series connection of chips with vertical structures comprises a negative electrode functional area, a negative electrode pin, an identification angle, a positive electrode pin, a lead, a chip, crystal-fixing glue, a reflecting surface, a white channel, separated independent functional areas, a negative electrode pad and a positive electrode pad, wherein the LED support is divided into the negative electrode functional area and a plurality of separated independent functional areas through the white channel; the chip electrode is a negative electrode, and the bottom of the chip is a positive electrode.
Preferably, the separated independent functional area comprises an area a pad, an area b pad, an area c pad, an area d pad, an area e pad, an area f pad and an area g pad, the area a pad, the area b pad, the area c pad, the area d pad, the area e pad and the area f pad are all provided with chips, a chip electrode of the area a pad is connected to the negative electrode functional area, the area a pad is connected to a chip electrode on the area b pad through a lead, the area b pad is connected to a chip electrode on the area c pad through a lead, the area c pad is connected to a chip electrode on the area f pad through a lead, the area f pad is connected to a chip electrode on the area e pad through a lead, the area e pad is connected to a chip electrode on the area d pad through a lead, and the area d pad is connected to the area g pad through a lead.
Preferably, the solid crystal glue is conductive silver glue or tin paste.
Preferably, the chip is a single-electrode chip or a double-electrode chip.
The utility model has the following beneficial effects:
1. the problem of vertical structure chip series connection is solved:
the scheme can not only connect the horizontal structure chips in series, but also connect the vertical structure chips in series, thereby breaking through the bottleneck that the vertical structure chips can not be connected in series, and achieving the design of various voltages of the lamp beads;
2. promote LED lamp pearl reliability:
a: the problems of over-high junction temperature and difficult heat dissipation of a double-electrode or multi-electrode chip with a horizontal structure cannot be broken through all the time because the chip is a sapphire substrate;
b: the ESD of the single-electrode LED chip is superior to that of the double-electrode LED chip;
c: the single-electrode LED chip only needs to be welded on one electrode. The double-electrode or multi-electrode chip needs to weld wires on two or more electrodes, thereby increasing the difficulty of welding wires, easily causing the hidden troubles of poor welding wires, improper wire arc design mode and the like.
And the chips are not connected with each other through wires, and only the LED chips are required to be subjected to wire welding, so that the difficulty of wire welding is reduced, and the wire welding mode and the wire arcs can be wire-bonded in a conventional mode, thereby improving the integral reliability of the product.
3. Reduce LED lamp pearl cost: the price of the single-electrode red, orange and other chips in the current market is far lower than that of the double-electrode red, orange and other chips; if the problem of single electrode chip series connection has been solved, along with the continuous development of technique, chips such as bluish green light also can design into single electrode structure, can let the lamp pearl more have the price/performance ratio like this.
Drawings
The utility model is described in detail below with reference to the drawings and the detailed description;
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a bonding pad of the present invention;
FIG. 3 is a functional block diagram of the present invention;
FIG. 4 is a functional partition diagram according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a series connection of a single-electrode and a two-electrode chip according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another single-electrode to dual-electrode chip in series according to an embodiment of the present invention;
fig. 7 is a schematic size diagram of a 5050 stent according to an embodiment of the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
Referring to fig. 1 to 7, the following technical solutions are adopted in the present embodiment: an LED lamp bead for realizing series connection of chips with vertical structures comprises a negative electrode functional area 1, a negative electrode pin 2, an identification angle 3, a positive electrode pin 4, a lead 5, a chip 6, a crystal-fixing glue 7, a reflecting surface 8, a white channel 9, a separated independent functional area 10, a negative electrode pad 11 and a positive electrode pad 12, wherein the LED support is divided into the negative electrode functional area 1 and a plurality of separated independent functional areas 10 through the white channel 9, the identification angle 3 is arranged at one corner of the LED support, six independent functional areas in the separated independent functional areas 10 are fixed with the chip 6 through the crystal-fixing glue 7, a chip electrode is connected with the negative electrode pad 11 and the positive electrode pad 12 through the lead 5, the negative electrode pad 11 and the positive electrode pad 12 are welded on a PCB through tin paste, the negative electrode pin 2 is arranged on the side of the negative electrode functional area 1, the positive electrode pad 4 is arranged on the side of the positive electrode pad 12, and the reflecting surface 8 is arranged around the pad; the electrode of the chip 6 is a negative electrode, and the bottom of the chip is a positive electrode.
The separated independent function area 10 comprises an area a bonding pad, an area b bonding pad, an area c bonding pad, an area d bonding pad, an area e bonding pad, an area f bonding pad and an area g bonding pad, wherein chips are arranged on the area a bonding pad, the area b bonding pad, the area c bonding pad, the area d bonding pad, the area e bonding pad and the area f bonding pad, chip electrodes of the area a bonding pad are connected to a negative electrode function area, the area a bonding pad is connected to chip electrodes on the area b bonding pad through leads, the area b bonding pad is connected to chip electrodes on the area c bonding pad through leads, the area c bonding pad is connected to chip electrodes on the area f bonding pad through leads, the area f bonding pad is connected to chip electrodes on the area e bonding pad through leads, the area e bonding pad is connected to chip electrodes on the area d bonding pad through leads, and the area d bonding pad is connected to the area g bonding pad through leads.
The solid crystal glue 7 adopts conductive silver glue or tin paste and the like.
The chip 6 adopts a single electrode chip.
Example 1: a package size LED:
firstly, the method comprises the following steps: LED support glue material, relevant substitution of shape and size:
a) the method comprises the following steps Plastic material: the plastic material is used for fixing the functional area and creating a corresponding safe space for the design of the electric circuit. Thus:
a1) the method comprises the following steps The color and material of the plastic material can be designed in various ways according to the purpose: such as white PCT, white PPA, black PPA, transparent PC, white EMC, white ceramic, etc.;
a2) the shape and size of the plastic material can be designed in various ways according to the purpose.
b) The method comprises the following steps LED functional area: the function region is designed to be different types according to the use to satisfy the corresponding electrical arrangement. Thus:
b1) the method comprises the following steps The functional areas have various shapes: the functional regions with different shapes of structures can be combined and fixed with the metal bracket and the plastic material; the functional area can be divided into blocks with different numbers and shapes according to the purpose; not only one functional area but also functional areas on both sides can be divided. As shown in fig. 4.
b2) The method comprises the following steps The electrical design is diversified: the functional areas with different shapes can be distributed with various chips to realize different design purposes. The serial connection between single-electrode chips can be realized, and the serial connection between the single-electrode chips and the double-electrode chips can also be realized. As shown in fig. 5 and 6.
c) The method comprises the following steps The shape and the size of the bracket are as follows: the overall shape and size of the bracket can be designed into different shapes and sizes according to the use of a designer, so that:
c1) the method comprises the following steps The support rim of a cup can be designed to be circular, square, oval and the like:
c2) the bracket can be sized as 3528,5050,2835,5730, EMC3030, EMC5050, etc. Taking 5050 as an example, as shown in fig. 7:
the foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (4)
1. An LED lamp bead for realizing series connection of chips with vertical structures is characterized by comprising a negative electrode functional area (1), a negative electrode pin (2), an identification angle (3), a positive electrode pin (4), a lead (5), a chip (6), a crystal-fixing glue (7), a reflecting surface (8), a white road (9), separated independent functional areas (10), a negative electrode bonding pad (11) and a positive electrode bonding pad (12), wherein the LED support is divided into the negative electrode functional area (1) and a plurality of separated independent functional areas (10) through the white road (9), the identification angle (3) is arranged at one corner of the LED support, six independent functional areas in the separated independent functional areas (10) are fixed with the chip (6) through the crystal-fixing glue (7), a chip electrode is connected with the negative electrode bonding pad (11) and the positive electrode bonding pad (12) through the lead (5), the negative electrode bonding pad (11) and the positive electrode bonding pad (12) are welded on a PCB through tin paste, a cathode pin (2) is arranged on the side of the cathode functional region (1), an anode pin (4) is arranged on the side of the anode bonding pad (12), and the reflecting surface (8) is arranged around the bonding pad; the electrode of the chip (6) is a negative electrode, and the bottom of the chip is a positive electrode.
2. The LED lamp bead for realizing the serial connection of the chips with the vertical structure according to claim 1, the separated independent function area (10) is characterized by comprising an area a bonding pad, an area b bonding pad, an area c bonding pad, an area d bonding pad, an area e bonding pad, an area f bonding pad and an area g bonding pad, wherein chips are arranged on the area a bonding pad, the area b bonding pad, the area c bonding pad, the area d bonding pad, the area e bonding pad and the area f bonding pad, chip electrodes of the area a bonding pad are connected to a negative electrode function area, the area a bonding pad is connected to chip electrodes on the area b bonding pad through leads, the area b bonding pad is connected to chip electrodes on the area c bonding pad through leads, the area c bonding pad is connected to chip electrodes on the area f bonding pad through leads, the area f bonding pad is connected to chip electrodes on the area e bonding pad through leads, the area e bonding pad is connected to chip electrodes on the area d bonding pad through leads, and the area d bonding pad is connected to the area g bonding pad through leads; the chip (6) adopts a single-electrode chip.
3. The LED lamp bead for realizing the serial connection of the chips with the vertical structures as claimed in claim 1, wherein the die bond adhesive (7) is conductive silver adhesive or solder paste.
4. The LED lamp bead for realizing the serial connection of the chips with the vertical structures as claimed in claim 1, wherein the chip (6) adopts a double-electrode chip or a double-electrode chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122208864.0U CN216389360U (en) | 2021-09-13 | 2021-09-13 | LED lamp bead for realizing series connection of chips with vertical structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122208864.0U CN216389360U (en) | 2021-09-13 | 2021-09-13 | LED lamp bead for realizing series connection of chips with vertical structures |
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| Publication Number | Publication Date |
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| CN216389360U true CN216389360U (en) | 2022-04-26 |
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| CN202122208864.0U Active CN216389360U (en) | 2021-09-13 | 2021-09-13 | LED lamp bead for realizing series connection of chips with vertical structures |
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- 2021-09-13 CN CN202122208864.0U patent/CN216389360U/en active Active
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