CN216388054U - Touch pad and electronic equipment - Google Patents

Abstract

The application provides a touch pad and electronic equipment, this touch pad includes: the PCB board, the PCB board includes multilayer conductive pattern layer, a plurality of electric capacity induction units and many electromagnetic induction lines have been arranged on at least one deck conductive pattern layer except that bottom conductive pattern layer in the multilayer conductive pattern layer, a plurality of electric capacity induction units with many electromagnetic induction line insulation set up, integrated circuit chip has been arranged on bottom conductive pattern layer, integrated circuit chip with a plurality of electric capacity induction units with many electromagnetic induction line electricity are connected, integrated circuit chip is used for according to the touch of signal detection finger that a plurality of electric capacity induction units output or according to the writing of the signal detection electromagnetic pen that many electromagnetic induction line output. The touch control panel can detect the touch of fingers and the writing of an electromagnetic pen.

Description

Touch pad and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of touch control, and more particularly relates to a touch pad and an electronic device.

Background

In the field of touch technology, the touch screen may be classified into a plurality of categories according to different working principles, such as a capacitive touch screen, an electromagnetic touch screen, an infrared touch screen, or an acoustic wave touch screen. Since various touch technologies have advantages and disadvantages, a concept of a hybrid touch technology has been proposed recently, that is, two or more touch technologies are used in one touch panel to achieve the purpose of complementary advantages and disadvantages between different touch technologies.

Because the capacitive touch screen can provide the advantages of 'touch and get' for people and the electromagnetic touch screen can be highly refined during drawing, the research of the hybrid touch screen based on the capacitive touch screen and the electromagnetic touch screen becomes a trend.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a touch pad and electronic equipment, which can realize the double-touch function of a stylus.

In a first aspect, a touch pad is provided, including: the PCB comprises a plurality of conductive pattern layers, wherein at least one conductive pattern layer except a bottom conductive pattern layer in the plurality of conductive pattern layers is provided with a plurality of capacitance induction units and a plurality of electromagnetic induction lines, the plurality of capacitance induction units and the plurality of electromagnetic induction lines are arranged in an insulating manner, the bottom conductive pattern layer is provided with an integrated circuit chip, the integrated circuit chip is electrically connected with the plurality of capacitance induction units and the plurality of electromagnetic induction lines, and the integrated circuit chip is used for detecting the touch of fingers according to signals output by the plurality of capacitance induction units or the writing of an electromagnetic pen according to signals output by the plurality of electromagnetic induction lines; the plurality of capacitance induction units comprise capacitance induction units in a first direction and capacitance induction units in a second direction, the first direction is perpendicular to the second direction, the plurality of electromagnetic induction lines comprise electromagnetic induction lines in a third direction and electromagnetic induction lines in a fourth direction, the third direction is perpendicular to the fourth direction, the capacitance induction units in the first direction are arranged in an insulating mode with the capacitance induction units in the second direction, and the electromagnetic induction lines in the third direction are arranged in an insulating mode with the electromagnetic induction lines in the fourth direction.

The touch pad is applied to a notebook computer, and can detect fingers and electromagnetic pens. In addition, because the touch control panel supports the electromagnetic pen for electromagnetic induction detection, only passive devices such as capacitors and coils are needed in the electromagnetic pen, and a driving chip is not needed, so that the high cost of the electromagnetic pen can be avoided. Furthermore, because the touch panel in the embodiment of the application adopts the PCB, and the PCB includes the plurality of conductive pattern layers, the capacitive sensing unit and the electromagnetic sensing line can be arranged in the plurality of conductive pattern layers, so that the dual functions of detecting finger touch and detecting writing of the electromagnetic pen can be realized.

In a possible implementation manner, the capacitive sensing unit in the first direction and the capacitive sensing unit in the second direction are not located on the same layer of the at least one conductive pattern layer, and the electromagnetic sensing line in the third direction and the electromagnetic sensing line in the fourth direction are not located on the same layer of the at least one conductive pattern layer.

Because the capacitance sensing unit of this first direction and the capacitance sensing unit of this second direction need be insulating just can realize the capacitance sensing, if set up the capacitance sensing unit of this first direction and the capacitance sensing unit of this second direction at the conductive pattern layer of same layer, then need carry out insulating setting between the capacitance sensing unit of this first direction and the capacitance sensing unit of this second direction, increased technology complexity.

In a possible implementation manner, the capacitive sensing unit in the first direction and the electromagnetic sensing line in the third direction are located on the same layer of the at least one conductive pattern layer, and the capacitive sensing unit in the second direction and the electromagnetic sensing line in the fourth direction are located on the same layer of the at least one conductive pattern layer; wherein, on the same layer of the at least one conductive pattern layer, one electromagnetic induction line is arranged around a plurality of adjacent capacitance induction units.

Arrange the conductive pattern layer with electric capacity induction unit and electromagnetic induction line on the same layer, can select the PCB board preparation touch-control board that the number of piles is less, thereby can reduce cost, and this electromagnetic induction line and electric capacity induction unit staggered arrangement, thereby make electric capacity induction function not influenced by electromagnetic induction, and electromagnetic induction function also does not influenced by electric capacity induction, consequently, this touch-control board both can detect the touch of finger through electric capacity induction, also can detect writing of electromagnetic pen through electromagnetic induction. In addition, the more the capacitive sensing units surrounded by the electromagnetic sensing lines are, the larger the magnetic flux change when the electromagnetic pen approaches the touch pad for sensing, namely, the larger the output signal quantity, thereby improving the sensitivity of electromagnetic detection.

In one possible implementation manner, in the same layer of the at least one conductive pattern layer, there is a partial overlap between the capacitive sensing units surrounded by at least two electromagnetic sensing lines of the plurality of electromagnetic sensing lines.

If the capacitor induction units surrounded by two adjacent electromagnetic induction lines are partially overlapped, the resolution ratio of electromagnetic detection is improved.

In one possible implementation manner, the PCB board includes four conductive pattern layers, a first layer of the at least one conductive pattern layer is disposed with the capacitive sensing units in the first direction and the electromagnetic sensing lines in the third direction, a second layer of the at least one conductive pattern layer is disposed with the capacitive sensing units in the second direction and the electromagnetic sensing lines in the fourth direction, and a third layer of the at least one conductive pattern layer is disposed with the power ground.

In one possible implementation, the plurality of capacitive sensing units and the plurality of electromagnetic sensing lines are disposed at different layers of the at least one conductive pattern layer.

The capacitive sensing units and the electromagnetic sensing lines are respectively arranged on the conductive pattern layers of different layers, so that the complexity of design can be reduced.

In a possible implementation manner, the PCB board includes six conductive pattern layers, a first layer and a second layer of the at least one conductive pattern layer are respectively disposed with the capacitive sensing unit in the first direction and the capacitive sensing unit in the second direction, a third layer and a fourth layer of the at least one conductive pattern layer are respectively disposed with the electromagnetic sensing line in the third direction and the electromagnetic sensing line in the fourth direction, and a fifth layer of the at least one conductive pattern layer is disposed with the power ground GND.

In a possible implementation manner, one capacitive sensing unit includes a plurality of H-shaped electrodes and one strip-shaped electrode, the one strip-shaped electrode connects the plurality of H-shaped electrodes in series, and an included angle between the one strip-shaped electrode in the capacitive sensing unit in the first direction and the one strip-shaped electrode in the capacitive sensing unit in the second direction is 90 degrees.

The capacitance sensing unit adopts a tooth-shaped electrode, the electrodes in two directions are sufficiently coupled, and the contact area is large, so that the signal quantity is strong, the capacitance variation is large, and the sensitivity of capacitance detection is high.

In one possible implementation mode, two electromagnetic induction lines which are randomly intersected in the same conductive pattern layer are arranged in an insulating mode at the intersection.

In one possible implementation, the plurality of capacitive sensing units and the plurality of electromagnetic sensing lines are connected to the integrated circuit chip through vias.

In a second aspect, an electronic device is provided, which includes the touch pad in the first aspect and any possible implementation manner of the first aspect.

In one implementation, the electronic device is a notebook computer.

Drawings

Fig. 1 is a structural stack diagram of a touch pad in a conventional notebook computer.

Fig. 2 is a structural stack diagram of a touch pad according to an embodiment of the present disclosure.

Fig. 3 is a schematic view of an insulation arrangement between different electromagnetic induction lines arranged in the same conductive pattern layer in the embodiment of the present application.

Fig. 4 and 5 are schematic plan views of the capacitive sensing elements and the electromagnetic sensing lines disposed in the same conductive pattern layer.

Fig. 6 to 9 show other pattern diagrams of the capacitive sensing cell.

Fig. 10 to 13 show schematic plan views of the capacitive sensing elements and the electromagnetic sensing lines arranged in different conductive pattern layers.

Fig. 14 and 15 are stacked views showing other structures of the touch panel according to the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

Touch screens, as an interactive device, are widely used in various fields, and mainly include resistive touch screens, capacitive touch screens, infrared touch screens, acoustic wave touch screens, electromagnetic induction touch screens, and the like. Although the touch technologies are of various types, each technology has advantages and disadvantages, and in recent years, a concept of a hybrid touch technology has been proposed, that is, two or more touch recognition technologies are adopted on one touch pad, so as to achieve the purpose of realizing the complementation between the advantages and disadvantages of multiple touch technologies.

The touch screen widely used at present mainly comprises a capacitive touch screen and an electromagnetic touch screen, wherein the capacitive touch screen is formed by manufacturing a plurality of driving channels and induction channels on the screen, the channels in two directions are vertically crossed and insulated from each other, each cross point forms a node capacitor, the node capacitor is reduced when the finger touches the screen, and the position touched by the hand is calculated according to the change condition of the node capacitor. The capacitive touch screen supports a multi-point touch function, has higher light transmittance and lower overall power consumption, and has high hardness of a contact surface, no need of pressing and long service life. The electromagnetic touch screen generally adopts a back-attached electromagnetic induction plate at present, the electromagnetic induction plate is composed of criss-cross metal wires, and position information is determined by inducing electromotive force when an electromagnetic pen slides on the screen. The electromagnetic touch screen has the advantages of high light transmittance, high resolution, sensitive response, Z-axis sensing capacity, suitability for drawing, handwriting identification and the like, and touch control without directly touching the screen.

Based on the above advantages of capacitive touch screens and electromagnetic touch screens, it is a trend to research hybrid touch screens based on capacitive and electromagnetic types, i.e., electromagnetic and capacitive integrated touch screens.

In one embodiment, a capacitive touch screen can be fabricated on the surface of the display screen to detect a finger, and an electromagnetic sensing board can be fabricated on the back of the display screen to detect an electromagnetic pen. When the finger operation is used, the capacitive touch screen is adopted for detection; when the electromagnetic pen is used for operation, an electromagnetic induction plate is adopted for detection.

Although the embodiment can detect both finger touch and an electromagnetic pen, the electromagnetic sensing board in the embodiment is a Flexible Printed Circuit (FPC) board independent from the capacitive touch screen, which results in higher cost and thickness of the entire touch screen.

In the current notebook computer, the touch pad usually does not support the function of writing by an electromagnetic pen, but only supports the function of finger touch. A typical structure stack is shown in fig. 1, the touch panel 100 is made of a Printed Circuit Board (PCB), the PCB includes a single conductive pattern layer, i.e., only one surface of an insulating substrate 110 is coated with copper, a capacitive sensing unit 120 is disposed on the surface of the coated copper, and a touch chip 130, a resistor, a capacitor, and other components may be disposed on the other surface of the insulating substrate 110 that is not coated with copper. The touch chip 130, the resistor or the capacitor, and other components may be soldered on the surface of the substrate 110. The capacitive sensing unit 120 may be connected to the touch chip 130 through a via hole. A cover (cover)140 may be further disposed above the PCB to protect the inner structure of the touch pad and to decorate the appearance of the touch pad.

The embodiment of the application provides a touch pad supporting detection of an electromagnetic pen, and the touch pad is applied to a notebook computer, and can detect fingers and the electromagnetic pen. In addition, because the touch control panel supports the electromagnetic pen for electromagnetic induction detection, the electromagnetic pen only needs passive devices such as capacitors and coils inside, and does not need to be provided with a driving chip, so that the high cost of the touch control pen can be avoided. Furthermore, because the touch panel in the embodiment of the application adopts the PCB, and the PCB includes the plurality of conductive pattern layers, the capacitive sensing unit and the electromagnetic sensing line can be arranged in the plurality of conductive pattern layers, so that the dual functions of detecting finger touch and detecting writing of the electromagnetic pen can be realized.

Fig. 2 shows a structure stack diagram of a touch pad 200 according to an embodiment of the present disclosure. As shown in fig. 2, the touch pad 200 includes: the PCB board 210, this PCB board 210 includes multilayer conductive pattern layer 215, a plurality of electric capacity induction units 211 and a plurality of electromagnetic induction lines 212 have been arranged on at least one layer of conductive pattern layer except bottom conductive pattern layer in this conductive pattern layer, this a plurality of electric capacity induction units 211 and this a plurality of electromagnetic induction lines 212 insulating setting, integrated circuit chip 213 has been arranged on this bottom conductive pattern layer, this integrated circuit chip 213 is connected with this a plurality of electric capacity induction units 211 and a plurality of electromagnetic induction lines 212 electricity, this integrated circuit chip 213 is used for detecting the touch of finger or the writing of electromagnetic pen according to the signal detection electromagnetic pen that this a plurality of electric capacity induction units 211 output.

The plurality of capacitive sensing units 211 include capacitive sensing units in a first direction and capacitive sensing units in a second direction, the first direction is perpendicular to the second direction, the plurality of electromagnetic sensing lines 212 include electromagnetic sensing lines in a third direction and electromagnetic sensing lines in a fourth direction, the third direction is perpendicular to the fourth direction, the capacitive sensing units in the first direction and the capacitive sensing units in the second direction are arranged in an insulating manner, and the electromagnetic sensing lines in the third direction and the electromagnetic sensing lines in the fourth direction are arranged in an insulating manner.

It should be understood that, in the embodiments of the present application, the capacitive sensing unit may also be referred to as a capacitive sensing electrode, and the electromagnetic sensing wire may also be referred to as an electromagnetic sensing electrode.

The PCB is generally covered on an insulating board (or a substrate) with copper foil, and is also called a copper clad laminate. The PCB may be divided into according to its conductive plate layer: single-sided PCB board, double-sided PCB board and multilayer PCB board. The PCB board 210 in the embodiment of the present application is referred to as a multi-layer PCB board. The multi-layer PCB is a printed board formed by laminating and bonding alternating conductive pattern layers and insulating material layers, that is, the PCB 210 of fig. 2 further includes an insulating layer 214. Interlayer electrical interconnections in a multilayer PCB board may be achieved through metallized holes.

For the capacitive sensing, the touch pad may be divided into a first direction and a second direction, the touch pad may be configured with at least one capacitive sensing unit in the first direction, the touch pad may be configured with at least one capacitive sensing unit in the second direction, and the first direction is perpendicular to the second direction. Optionally, if the touchpad detects a finger by using a mutual capacitance sensing method, the capacitive sensing unit in the first direction may be a driving channel, and the capacitive sensing unit in the second direction may be a sensing channel; or, the capacitive sensing unit in the second direction is a driving channel, and the capacitive sensing unit in the first direction is a sensing channel.

Also, for the electromagnetic induction, the touch pad may be divided into a third direction and a fourth direction, the touch pad may be configured with at least one electromagnetic induction line in the third direction, and the touch pad may be configured with at least one electromagnetic induction line in the fourth direction, the third direction and the fourth direction being perpendicular.

Optionally, in an embodiment of the present application, the first direction and the third direction are the same, and the second direction and the fourth direction are the same. Alternatively, the first direction and the fourth direction are the same, and the second direction and the third direction are the same.

Optionally, in another embodiment of the present application, the direction of the capacitive sensing unit is not related to the direction of the electromagnetic sensing line, that is, the first direction may be different from both the third direction and the fourth direction, and the second direction may also be different from both the third direction and the fourth direction.

Optionally, the touch pad 200 may further include a cover plate (not shown), and the cover plate 200 may be disposed above the PCB 210 to protect the internal structure of the touch pad 200 and to decorate the appearance of the touch pad 200, when a finger is operated on the touch pad 200 or an electromagnetic pen is operated on the touch pad, it is actually performed on the cover plate in the touch pad 200.

It should be noted that the multilayer PCB generally includes a top conductive pattern layer, a middle conductive pattern layer, and a bottom conductive pattern layer, where the top conductive pattern layer is a layer of the PCB close to the cover plate, and the bottom conductive pattern layer is a layer of the PCB far from the cover plate.

Optionally, in this embodiment of the application, the capacitive sensing element in the first direction and the capacitive sensing element in the second direction may not be located on the same layer of the at least one conductive pattern layer, and the electromagnetic sensing line in the third direction and the electromagnetic sensing line in the fourth direction may not be located on the same layer of the at least one conductive pattern layer.

It should be understood that, in the embodiment of the present application, the capacitive sensing units in the first direction and the capacitive sensing units in the second direction are not located on the same conductive pattern layer, which means that most of the electrodes of the capacitive sensing units in the first direction and most of the electrodes of the capacitive sensing units in the second direction are not located on the same conductive pattern layer; the electromagnetic induction lines in the third direction and the electromagnetic induction lines in the fourth direction are not located on the same conductive pattern layer, which means that most of the electromagnetic induction lines in the third direction and most of the electromagnetic induction lines in the fourth direction are not located on the same conductive pattern layer. For example, if the electromagnetic induction lines arranged in the same conductive pattern layer have intersection, the insulation setting needs to be realized by the via hole shown in fig. 3. That is, the first layer of conductive pattern layer is provided with electromagnetic induction lines 2121 and 2122 in the third direction, wherein the electromagnetic induction lines 2121 are electrically disconnected from the electromagnetic induction lines 2122 through vias, and the electromagnetic induction lines 2121 arranged in the first layer of conductive pattern layer are electrically connected with the electromagnetic induction lines 2121 arranged in the second layer of conductive pattern layer through the metal 216 in the vias. That is, most of the electromagnetic induction lines 2121 are arranged on the first layer of the conductive pattern layer, and only the electromagnetic induction lines 2121 at the positions where the electromagnetic induction lines 2121 on the same layer of the conductive pattern layer intersect with other electromagnetic induction lines are arranged on the second layer of the conductive pattern layer.

Because the capacitance sensing unit in the first direction and the capacitance sensing unit in the second direction need to be insulated to realize capacitance sensing, if the capacitance sensing unit in the first direction and the capacitance sensing unit in the second direction are arranged on the same layer of the PCB, the capacitance sensing unit in the first direction and the capacitance sensing unit in the second direction need to be insulated to increase the process complexity.

Optionally, in an embodiment of the present application, the capacitive sensing unit in the first direction and the electromagnetic sensing line in the third direction are located on the same layer of the at least one conductive pattern layer, and the capacitive sensing unit in the second direction and the electromagnetic sensing line in the fourth direction are located on the same layer of the at least one conductive pattern layer. Wherein, on the same layer of the at least one conductive pattern layer, an electromagnetic induction wire is arranged around at least one capacitive induction unit.

Those skilled in the art understand that the direction of the capacitive sensing element refers to the extending direction of the capacitive sensing element, and the direction of the electromagnetic sensing line refers to the direction of the long side of the electromagnetic sensing line.

Taking the capacitive sensing unit as a tooth-shaped electrode, taking the electromagnetic sensing line as an annular electrode for example, fig. 4 shows that the capacitive sensing unit in the first direction and the electromagnetic sensing line in the third direction are located on the same layer of the at least one conductive pattern layer, and the first direction and the third direction are the same, that is, both the first direction and the third direction are the X direction shown in fig. 4 and 5, that is, the capacitive sensing unit extends along the X direction, and the long side of the electromagnetic sensing line is along the X direction. Fig. 5 shows that the capacitive sensing cells in the second direction and the electromagnetic sensing lines in the fourth direction are located on the same layer of the PCB, and the second direction and the fourth direction are the same, that is, the second direction and the fourth direction are both the Y direction shown in fig. 4 and 5. That is, the capacitive sensing cells are extended in the Y direction, and the long sides of the electromagnetic sensing lines are extended in the Y direction. As can be seen from fig. 4 and 5, the electromagnetic induction line is disposed around at least one capacitive induction unit, and the electromagnetic induction line and the capacitive induction unit can be disposed in a staggered manner, so that the function of electromagnetic induction is not affected by the function of capacitive induction, and the function of capacitive induction is also not affected by the function of electromagnetic induction. In addition, the capacitance induction units and the electromagnetic induction lines are arranged on the same conductive pattern layer, so that the number of layers of the PCB can be reduced, and the cost can be reduced; therefore, the function of detecting finger touch and the function of detecting writing of the electromagnetic pen can be realized while the cost is reduced.

Alternatively, as shown in fig. 4 and 5, the capacitive sensing cell may include a plurality of H-type electrodes 2111 and one strip electrode 2112, the one strip electrode 2112 connecting the plurality of H-type electrodes 2111 in series. And the included angle between the strip-shaped electrode in the capacitance sensing unit in the first direction and the strip-shaped electrode in the capacitance sensing unit in the second direction is 90 degrees, namely the two are mutually vertical.

The capacitance sensing units adopt the tooth-shaped electrodes, the capacitance sensing units in the X direction and the Y direction are sufficiently coupled, and the contact area is large, so that the signal quantity is high, the capacitance variation is large, and the sensitivity of capacitance detection is high.

Alternatively, as shown in fig. 6 and 7, the pattern of the capacitive sensing cells may also be a diamond shape. Specifically, as shown in fig. 6, the capacitive sensing unit is a capacitive sensing unit in the X direction; as shown in fig. 7, the capacitive sensing unit is a capacitive sensing unit in the Y direction, and the X direction is perpendicular to the Y direction. Alternatively, as shown in fig. 8 and 9, the pattern of the capacitive sensing unit may also be a long strip, specifically, as shown in fig. 8, the capacitive sensing unit is a capacitive sensing unit in the X direction; as shown in fig. 9, the capacitive sensing unit is a capacitive sensing unit in the Y direction, and the X direction is perpendicular to the Y direction. The pattern of the capacitive sensing unit is not limited in the embodiments of the present application.

Optionally, in this embodiment of the present application, the electromagnetic induction wire is disposed around a plurality of adjacent capacitive sensing cells at the same layer of the at least one conductive pattern layer. The more the capacitive sensing units surrounded by the electromagnetic sensing lines, the larger the magnetic flux change when the electromagnetic pen approaches the touch pad for sensing, namely, the larger the output signal quantity, thereby improving the sensitivity of electromagnetic detection.

Optionally, in this embodiment of the application, in the same layer of the at least one conductive pattern layer, there is a partial overlap between the capacitive sensing cells surrounded by at least two electromagnetic sensing lines of the plurality of electromagnetic sensing lines, that is, as shown in fig. 4 and 5.

If the capacitor induction units surrounded by the two adjacent electromagnetic induction lines are partially overlapped, the distance between the two electromagnetic induction lines can be reduced, and the resolution ratio of electromagnetic detection is improved.

In another embodiment, the capacitive sensing cells surrounded by the two adjacent electromagnetic sensing lines are completely non-overlapping. Alternatively, a plurality of electromagnetic induction lines may be disposed around the same capacitive sensing unit, but the plurality of electromagnetic induction lines are overlapped, that is, if the distance between two adjacent capacitive sensing units is large, the plurality of electromagnetic induction lines may be disposed.

Optionally, in this embodiment of the present application, the plurality of capacitive sensing units and the plurality of electromagnetic sensing lines may be disposed in different conductive pattern layers of the PCB board. That is to say, the capacitive sensing unit in the first direction, the capacitive sensing unit in the second direction, the electromagnetic sensing line in the third direction, and the electromagnetic sensing line in the fourth direction are respectively disposed on different conductive pattern layers of the PCB. As shown in fig. 10-13. Fig. 10 shows a pattern of capacitive sensing cells arranged in a first direction, which is the X-direction, of a first layer of the at least one conductive pattern layer. Fig. 11 shows a pattern of capacitive sensing cells arranged in a second direction, which is the Y direction, of a second layer of the at least one conductive pattern layer. Fig. 12 shows a pattern of electromagnetic induction lines arranged in a third direction of a third layer of the at least one conductive pattern layer, the third direction being the X direction, and fig. 13 shows a pattern of electromagnetic induction lines arranged in a fourth direction of a fourth layer of the at least one conductive pattern layer, the fourth direction being the Y direction. As can be seen from fig. 10 to 13, the first direction and the third direction are the same, and the second direction and the fourth direction are the same, but since the capacitive sensing elements and the electromagnetic sensing lines are arranged in different conductive pattern layers of the PCB board, the direction of the electromagnetic sensing lines may be the same regardless of the direction of the capacitive sensing elements, i.e., the first direction may not be the same as the third direction, and the second direction may not be the same as the fourth direction, as long as the first direction and the second direction are perpendicular, the third direction and the fourth direction are perpendicular.

The capacitive sensing units and the electromagnetic sensing lines are respectively arranged on the conductive pattern layers of different layers, so that the complexity of design can be reduced.

It should be understood that the integrated circuit chip 360 of the present embodiment of the application can be used to detect both finger touch and electromagnetic pen writing. When the integrated circuit chip 360 is used to detect finger touch, the integrated circuit chip 360 can also be referred to as a touch chip; when the integrated circuit chip 360 is used to detect writing of the electromagnetic pen, the integrated chip 360 may also be referred to as a main control chip of the electromagnetic pen.

Fig. 14 shows a structural stack diagram of a touch pad according to an embodiment of the present application. As shown in fig. 14, the PCB 300 includes four conductive pattern layers 310 and three insulating layers 320, and the four conductive pattern layers 310 and the three insulating layers 320 are sequentially overlapped from top to bottom. A first layer of the four conductive pattern layers 310 is provided with a capacitance sensing unit 331 in a first direction and an electromagnetic induction line 341 in a third direction, a second layer of the four conductive pattern layers 310 is provided with a capacitance sensing unit 332 in the second direction and an electromagnetic induction line 342 in the fourth direction, a third layer of the four conductive pattern layers 310 is provided with a power ground 350, and a fourth layer of the four conductive pattern layers 310, namely a bottom conductive pattern layer, is provided with an integrated circuit chip 360 and other components 370 such as a capacitor and a resistor.

Alternatively, the integrated circuit chip 360 may be soldered to the underlying conductive pattern layer. Alternatively, the chip for controlling the touch of the finger and the chip for controlling the writing of the electromagnetic pen may be separate chips, which are respectively soldered on the underlying conductive pattern layer. Alternatively, the function for controlling finger touch and the function for controlling writing of the electromagnetic pen may be integrated on one chip and soldered on the underlying conductive pattern layer.

Alternatively, the conductive pattern layer disposed with the power ground 350 may be disposed with the power ground over the entire surface, or may be patterned, for example, the pattern of the power ground 350 is designed as the pattern of the capacitive sensing unit, so as to increase the signal amount of the electromagnetic pen.

Fig. 15 is a structural stack diagram of another touch pad according to an embodiment of the present disclosure. As shown in fig. 15, the PCB 400 includes six conductive pattern layers 410 and five insulating layers 420, and the six conductive pattern layers 410 and the five insulating layers 420 are sequentially overlapped from top to bottom. A first layer of the six conductive pattern layers 410 is arranged with a capacitance sensing unit 431 in a first direction, a second layer of the six conductive pattern layers 410 is arranged with a capacitance sensing unit 432 in a second direction, a third layer of the six conductive pattern layers 410 is arranged with an electromagnetic induction line 441 in a third direction, a fourth layer of the six conductive pattern layers 410 is arranged with an electromagnetic induction line 442 in a fourth direction, a fifth layer of the six conductive pattern layers 410 is arranged with a power ground 450, and a sixth layer of the six conductive pattern layers 410, namely a bottom conductive pattern layer is arranged with an integrated circuit chip 460 and other components 470 such as a capacitor and a resistor.

Alternatively, the integrated circuit chip 460 may be soldered to the underlying conductive pattern layer. Alternatively, the chip for controlling the touch of the finger and the chip for controlling the writing of the electromagnetic pen may be separate chips, which are respectively soldered on the underlying conductive pattern layer. Alternatively, the function for controlling finger touch and the function for controlling writing of the electromagnetic pen may be integrated on one chip and soldered on the underlying conductive pattern layer.

Alternatively, the conductive pattern layer disposed with the power ground 450 may be disposed with the power ground over the entire surface, or may be patterned, for example, the pattern of the power ground 350 is designed as the pattern of the capacitive sensing unit, so as to increase the signal amount of the electromagnetic pen.

Optionally, when the capacitive sensing units and the electromagnetic sensing lines are arranged in six layers of the PCB, a manner of arranging in four layers of the PCB may also be adopted, for example, the capacitive sensing units in the first direction and the electromagnetic sensing lines in the third direction are arranged in the same conductive pattern layer, the capacitive sensing units in the second direction and the electromagnetic sensing lines in the fourth direction are arranged in the same conductive pattern layer, and other signals may be arranged in the additional two conductive pattern layers.

Optionally, in this embodiment of the present application, the plurality of capacitance sensing units and the plurality of electromagnetic sensing lines are connected to the integrated circuit chip through vias as shown in fig. 3. For example, the electromagnetic induction lines 2121 of the second layer in fig. 3 can be regarded as an integrated circuit chip, and the electromagnetic induction lines 2121 of the first layer in fig. 3 can be regarded as any electromagnetic induction lines or any capacitance induction units.

The embodiment of the present application further provides an electronic device, which includes the touch pad described in the above various embodiments.

Alternatively, the electronic device may be a notebook computer.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A touch panel, comprising:

the PCB comprises a plurality of conductive pattern layers, wherein at least one conductive pattern layer except a bottom conductive pattern layer in the plurality of conductive pattern layers is provided with a plurality of capacitance induction units and a plurality of electromagnetic induction lines, the capacitance induction units and the electromagnetic induction lines are arranged in an insulating manner, the bottom conductive pattern layer is provided with an integrated circuit chip, the integrated circuit chip is electrically connected with the capacitance induction units and the electromagnetic induction lines, and the integrated circuit chip is used for detecting the touch of a finger according to signals output by the capacitance induction units or the writing of an electromagnetic pen according to signals output by the electromagnetic induction lines;

the plurality of capacitance induction units comprise capacitance induction units in a first direction and capacitance induction units in a second direction, the first direction is vertical to the second direction, the plurality of electromagnetic induction lines comprise electromagnetic induction lines in a third direction and electromagnetic induction lines in a fourth direction, the third direction is vertical to the fourth direction, the capacitance induction units in the first direction are arranged in an insulated mode with the capacitance induction units in the second direction, and the electromagnetic induction lines in the third direction are arranged in an insulated mode with the electromagnetic induction lines in the fourth direction.

2. The touch panel of claim 1, wherein the capacitive sensing elements in the first direction and the capacitive sensing elements in the second direction are not located on the same layer of the at least one conductive pattern layer, and the electromagnetic sensing lines in the third direction and the electromagnetic sensing lines in the fourth direction are not located on the same layer of the at least one conductive pattern layer.

3. The touch panel of claim 2, wherein the capacitive sensing units in the first direction and the electromagnetic sensing lines in the third direction are located on the same layer of the at least one conductive pattern layer, and the capacitive sensing units in the second direction and the electromagnetic sensing lines in the fourth direction are located on the same layer of the at least one conductive pattern layer;

wherein, on the same layer of the at least one conductive pattern layer, one electromagnetic induction wire is arranged around a plurality of adjacent capacitive induction units.

4. The touch panel of claim 3, wherein the capacitive sensing units surrounded by at least two of the plurality of electromagnetic induction lines are partially overlapped on the same layer of the at least one conductive pattern layer.

5. The touch panel of claim 4, wherein the PCB comprises four conductive pattern layers, a first layer of the at least one conductive pattern layer is arranged with the capacitive sensing units in the first direction and the electromagnetic sensing lines in the third direction, a second layer of the at least one conductive pattern layer is arranged with the capacitive sensing units in the second direction and the electromagnetic sensing lines in the fourth direction, and a third layer of the at least one conductive pattern layer is arranged with a power ground.

6. The touch pad of claim 2, wherein the plurality of capacitive sensing units and the plurality of electromagnetic sensing lines are disposed at different layers of the at least one conductive pattern layer.

7. The touch panel of claim 6, wherein the PCB comprises six conductive pattern layers, a first layer and a second layer of the at least one conductive pattern layer are respectively provided with the capacitive sensing unit in the first direction and the capacitive sensing unit in the second direction, a third layer and a fourth layer of the at least one conductive pattern layer are respectively provided with the electromagnetic sensing line in the third direction and the electromagnetic sensing line in the fourth direction, and a fifth layer of the at least one conductive pattern layer is provided with a power ground GND.

8. The touch panel according to any one of claims 1 to 7, wherein one of the capacitive sensing units comprises a plurality of H-shaped electrodes and one bar-shaped electrode, the one bar-shaped electrode connects the plurality of H-shaped electrodes in series, and an included angle between the one bar-shaped electrode in the capacitive sensing unit in the first direction and the one bar-shaped electrode in the capacitive sensing unit in the second direction is 90 degrees.

9. The touch panel according to any one of claims 1 to 7, wherein two electromagnetic induction lines arbitrarily intersecting in the same conductive pattern layer are insulated at the intersection.

10. The touch pad of any one of claims 1-7, wherein the plurality of capacitive sensing elements and the plurality of electromagnetic sensing lines are connected to the integrated circuit chip by vias.

11. An electronic device comprising the touch panel according to any one of claims 1 to 10.

12. The electronic device of claim 11, wherein the electronic device is a laptop computer.

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