CN216387483U

CN216387483U - SFP photoelectric conversion interface device

Info

Publication number: CN216387483U
Application number: CN202123078902.1U
Authority: CN
Inventors: 徐柏奕; 朱晓明; 杨中田
Original assignee: Pacific Optoelectronic Technology Co ltd
Current assignee: Pacific Shandong Optoelectronic Technology Co ltd
Priority date: 2021-12-09
Filing date: 2021-12-09
Publication date: 2022-04-26
Anticipated expiration: 2031-12-09

Abstract

The utility model belongs to the technical field of optical modules, and provides an SFP photoelectric conversion interface device which comprises a shell, a joint node, a pulling-on piece, a packaging cover, a locking piece and a dustproof plug, wherein a plurality of guide strips distributed at intervals up and down are arranged on the inner side wall of the shell, a sliding heat conduction device is inserted between every two adjacent guide strips, one end, facing the center of the shell, of the sliding heat conduction device is provided with a heat conduction block, the side surface, close to the dustproof plug, of the shell is provided with a guide head, the locking piece is a U-shaped plate with a downward opening, the inner side of the locking piece is provided with a guide groove in sliding fit with the guide head, the section of the guide groove is in a T shape, the top of the locking piece is provided with a positioning bolt, the bottom of the positioning bolt is connected with the packaging cover, and the dustproof plug is in a split structure. The device has the advantages of reasonable design, simple structure, higher packaging reliability, better dustproof performance, stronger heat dissipation capability, contribution to ensuring the working performance of the optical module and suitability for large-scale popularization.

Description

SFP photoelectric conversion interface device

Technical Field

The utility model belongs to the technical field of optical modules, and particularly relates to an SFP photoelectric conversion interface device.

Background

The SFP optical module is a hot-plug small-package module packaged by the SFP, the highest speed can reach 10.3G, and an interface is LC. The SFP optical module is mainly composed of a laser. SFP classification can be classified into rate classification, wavelength classification, mode classification. The SFP optical module includes a laser, a wiring board IC, and external components. Wherein the laser comprises a transmitter TOSA and a receiver ROSA; the external part comprises a shell, a base, a PCBA, a pull ring, a buckle, an unlocking piece and a dustproof plug.

The existing optical module has the problems that firstly, the packaging stability is easily influenced by the vibration of equipment to generate a packaging gap, and the connection reliability of an electric connecting line is directly influenced; secondly, most of the dustproof plugs at the end parts of the shell are of an integrated structure, but the dustproof plugs are not easy to take down when the optical module is assembled, are easy to damage due to hard disassembly, and are low in repeated utilization rate; thirdly, the heat conduction stability is poor, and the actual working performance of the optical module is influenced to a certain extent.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problems of the optical module, the utility model provides the SFP photoelectric conversion interface device which has the advantages of reasonable design, simple structure, higher packaging reliability, better dustproof performance, stronger heat dissipation capability and contribution to ensuring the working performance of the optical module.

In order to achieve the above object, the utility model adopts a technical scheme that the SFP photoelectric conversion interface device provided by the utility model comprises a shell, a connector node for connecting an electric circuit is arranged in the shell, a pulling piece is arranged at one end of the top of the shell, an encapsulation cover is arranged above the shell, the cross section shape of the shell and the cross section shape of the encapsulation cover are both in a U shape, the encapsulation cover is connected with one end of the shell through a locking piece, a dustproof plug is arranged at one end of the encapsulation cover close to the locking piece, a plurality of guide strips distributed at intervals up and down are arranged on the inner side wall of the shell, a sliding heat conduction device is inserted between the adjacent guide strips, a heat conduction block is arranged at one end of the sliding heat conduction device facing the center of the shell, a guide head is arranged on the side surface of the shell close to the dustproof plug, and the locking piece is a U-shaped plate with a downward opening, the inboard of latch fitting is provided with the guide way with direction head sliding fit, the section shape of guide way is the T font, the top of latch fitting is provided with positioning bolt, positioning bolt's bottom and encapsulation lid are connected, the dust plug is split type structure.

Preferably, the dustproof plug comprises a flat plug with a rectangular cross section, one side of the flat plug is provided with a V-shaped groove, the middle of the V-shaped groove is provided with a pull hole which penetrates through the groove from top to bottom, the other side of the flat plug is horizontally and symmetrically provided with two cylindrical bodies, a multi-curved-surface plug which is sleeved with the cylindrical bodies is arranged in the center direction of the cylindrical bodies, the center of the multi-curved-surface plug is horizontally provided with a through hole in a penetrating manner, the multi-curved-surface plug comprises a conical mouth part, a cylindrical waist part, a conical waist part and a cylindrical tail part which are integrally formed from front to back, a port of the cylindrical tail part is connected with the cylindrical bodies, and an annular groove is formed in the inner wall of the cylindrical tail part.

Preferably, the sliding heat conduction device comprises a heat conduction sliding block with a T-shaped horizontal section, a plurality of screw holes are formed in the heat conduction sliding block, a connector is arranged in each screw hole, a heat conduction lever is arranged at the bottom of the connector, and the bottom of one end, far away from the connector, of the heat conduction lever is connected with the heat conduction block.

Preferably, a plurality of anti-skid protrusions are arranged on the inner bottom surface of the shell and the inner top surface of the packaging cover.

Compared with the prior art, the utility model has the advantages and positive effects that:

1. according to the SFP photoelectric conversion interface device, the sliding heat conduction device can be in contact with an electric component in the shell to achieve the purpose of heat dissipation, and the sliding heat conduction device has the advantages of good adjustability and high stability; the locking piece is movably matched with the guide head, so that the shell and the packaging cover can be conveniently disassembled and assembled, and the positioning bolt can fixedly connect the shell and the packaging cover, so that the working reliability of the optical module is ensured; the dustproof plug with the split structure can reduce the difficulty of dismounting the dustproof plug and can improve the cyclic utilization rate of the dustproof plug. The device has the advantages of reasonable design, simple structure, higher packaging reliability, better dustproof performance, stronger heat dissipation capability, contribution to ensuring the working performance of the optical module and suitability for large-scale popularization.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is an isometric view of an SFP photoelectric conversion interface device according to an embodiment;

fig. 2 is a front view of an SFP photoelectric conversion interface device according to an embodiment;

FIG. 3 is a cross-sectional view of an SFP optical-to-electrical conversion interface device in the direction D-D according to an embodiment;

FIG. 4 is a side view of an SFP optical-to-electrical conversion interface device according to an embodiment;

FIG. 5 is a cross-sectional view of an SFP photoelectric conversion interface device in the direction E-E according to an embodiment;

fig. 6 is a rear view of an SFP photoelectric conversion interface device according to an embodiment;

FIG. 7 is an operation diagram of the sliding heat conducting device according to the embodiment;

FIG. 8 is an isometric view of a dust plug provided with an embodiment;

in the above figures, 1, a housing; 11. a guide strip; 12. a guide head; 13. anti-skid projections; 2. a joint node; 3. a pull tab; 4. a package cover; 5. a lock; 51. a guide groove; 52. positioning the bolt; 6. a dust plug; 61. a plate flattening plug; 62. a L-shaped groove; 63. hole drawing; 64. a cylindrical portion; 65. a multi-curved plug; 651. a conical mouth; 652. a barrel-shaped waist; 653. a tapered waist portion; 654. a barrel-shaped tail; 7. a sliding heat conducting device; 71. a heat conducting block; 72. a heat conducting slider; 73. a screw hole; 74. a connector; 75. a heat conducting bar.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict. For convenience of description, the words "upper", "lower", "left" and "right" used herein refer to the same directions as the drawings, and do not limit the structure.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited to the specific embodiments of the present disclosure.

In an embodiment, as shown in fig. 1 to 6, the SFP photoelectric conversion interface device provided by the present invention includes a housing 1, a connector node 2 for connecting an electrical circuit is disposed inside the housing 1, a pull tab 3 is disposed at one end of the top of the housing 1, an encapsulation cover 4 is disposed above the housing 1, both the cross-sectional shape of the housing 1 and the cross-sectional shape of the encapsulation cover 4 are U-shaped, the encapsulation cover 4 is connected with one end of the housing 1 through a locking piece 5, and a dust plug 6 is disposed at one end of the encapsulation cover 4 close to the locking piece. Wherein, the pulling-on piece 3 is used for manually extracting or inserting the device from the interface of the communication equipment; the housing 1 and the sealing cover 4 are sealed in an up-down opposite wrapping manner. On the basis, the inner side wall of the shell 1 is provided with a plurality of guide strips 11 which are distributed at intervals up and down, a sliding heat conduction device 7 is inserted between every two adjacent guide strips 11, one end, facing the center of the shell 1, of the sliding heat conduction device 7 is provided with a heat conduction block 71, the side face, close to the dustproof plug 6, of the shell 1 is provided with a guide head 12, the locking piece 5 is a U-shaped plate with a downward opening, the inner side of the locking piece 5 is provided with a guide groove 51 in sliding fit with the guide head 12, the section of the guide groove 51 is in a T shape, the top of the locking piece 5 is provided with a positioning bolt 52, the bottom of the positioning bolt 52 is connected with the packaging cover 4, and the dustproof plug 6 is of a split structure. The contact end of the sliding heat conducting device 7 and the housing 1 can be vertically positioned through the guide bar 11, and the friction force between the sliding heat conducting device 7 and the guide bar 11 ensures that the sliding heat conducting device cannot freely slide transversely. The sliding heat conducting device 7 can be manually adjusted to be in contact with different electrical components for heat conduction through specific positions on the inner wall of the shell 1, such as heat conduction by transferring heat of the PCBA or the ROSA to the shell 1 after being in contact with the PCBA or the ROSA. This device adopts the dustproof stopper 6 of split type structure can reduce the degree of difficulty of the dustproof stopper 6 of dismouting, can improve the cyclic utilization who prevents dust stopper 6 moreover.

Further, for the locking piece 5, the bottom of the guide slot 51 is matched with the guide head 12 to press the sealing cover 4 and the housing 1, and the sealing cover 4, the housing 1 and the locking piece 5 can be trained into a stable combined structure by screwing the positioning bolt 52; conversely, the positioning bolt 52 is withdrawn, and the guide groove 51 of the locking piece 5 slides along the guide head 12 until the locking piece 5 swings and turns out to the end direction of the dust plug 6 of the housing 1, so that the packaging cover 4 can be quickly removed. This latch fitting 5 reasonable in design, simple structure, it is better and connect the reliability higher to connect the flexibility, is favorable to guaranteeing the stability of optical module on communication equipment.

As shown in fig. 8, in order to improve the utilization rate of the dust plug 6, the dust plug 6 provided by the present invention includes a plate flat plug 61 with a rectangular cross section, a l-shaped groove 62 is provided on one side of the plate flat plug 61, a pull hole 63 penetrating through the l-shaped groove 62 from top to bottom is provided in the middle of the l-shaped groove 62, two cylinders 64 are horizontally and symmetrically provided on the other side of the plate flat plug 61, a multi-curved plug 65 sleeved with the cylinders 64 is provided in the center direction of the cylinders 64, a through hole is horizontally provided through the center of the multi-curved plug 65, the multi-curved plug 65 includes a tapered mouth portion 651, a cylindrical waist portion 652, a tapered waist portion 653 and a cylindrical tail portion 654 integrally formed from front to back, the port of the cylindrical tail portion 654 is connected with the cylinders 64, and an annular groove is provided on the inner wall of the cylindrical tail portion 654. The plate flat plug 61 seals the end flat mouth of the optical module; the cone mouth 651, the cylinder waist 652, the cone waist 653 and the cylinder tail 654 of the multi-curved plug 65 can be inserted into the joint node 2 and inserted into the flat plug 61 to form a complete dust plug 6, thereby protecting the optical module from dust with high performance. Furthermore, the plate flat plug 61 can be effectively detached by pulling the middle part of the L-shaped groove 62, namely the pull hole 63, and the annular groove of the multi-curved-surface plug 65 can be clamped with a tool shaped like a mushroom head to be separated from the optical module, so that the convenience of disassembly and assembly is improved, and higher cyclic utilization rate can be obtained.

As shown in fig. 7, in order to improve the practicability of the sliding heat conduction device 7, the sliding heat conduction device 7 includes a heat conduction slider 72 having a T-shaped horizontal cross-section, a plurality of screw holes 73 are provided on the heat conduction slider 72, a connector 74 is provided in the screw hole 73, a heat conduction bar 75 is provided at the bottom of the connector 74, and the bottom of one end of the heat conduction bar 75 away from the connector 74 is connected to the heat conduction block 71. The connector 74 has a connecting function, the heat conducting block 71 can be connected to different positions of the heat conducting slider 72 by connecting the connector with different screw holes 73 on the heat conducting slider 72, and the screwing depth and angle of the connector and the screw holes 73 can directly adjust the height and angle of the heat conducting block 71; the heat conducting bar 75 and the heat conducting slider 72 can extend the heat conducting block 71 to the center of the housing 1 by different lengths to be in contact connection with different electrical components inside the optical module, so that the operating heat of the components is transmitted to the housing 1 through the heat conducting bar 75, the connector 74 and the heat conducting slider 72, and then the housing 1 and part of air media realize heat dissipation.

As shown in fig. 7, in order to improve the stability of the device in matching with the internal electrical components, the inner bottom surface of the housing 1 and the inner top surface of the encapsulation cover 4 are both provided with a plurality of anti-slip protrusions 13, and the anti-slip protrusions 13 can directly press-fit the electrical components distributed near the anti-slip protrusions, thereby being beneficial to ensuring that the optical module has stable operation performance.

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in other forms, and any person skilled in the art may apply the above modifications or changes to the equivalent embodiments with equivalent changes, without departing from the technical spirit of the present invention, and any simple modification, equivalent change and change made to the above embodiments according to the technical spirit of the present invention still belong to the protection scope of the technical spirit of the present invention.

Claims

1. An SFP photoelectric conversion interface device comprises a shell, wherein a joint node used for connecting an electric circuit is arranged in the shell, a pulling piece is arranged at one end of the top of the shell, an encapsulation cover is arranged above the shell, the cross-sectional shape of the shell and the cross-sectional shape of the encapsulation cover are both U-shaped, the encapsulation cover is connected with one end of the shell through a locking piece, a dustproof plug is arranged at one end of the encapsulation cover close to the locking piece, the SFP photoelectric conversion interface device is characterized in that a plurality of guide strips distributed at intervals up and down are arranged on the inner side wall of the shell, a sliding heat conduction device is inserted between the adjacent guide strips, a heat conduction block is arranged at one end of the sliding heat conduction device facing the center of the shell, a guide head is arranged at the side face of the shell close to the dustproof plug, the locking piece is a U-shaped plate with a downward opening, a guide groove in sliding fit with the guide head is arranged at the inner side of the locking piece, the section shape of guide way is the T font, the top of latch fitting is provided with positioning bolt, positioning bolt's bottom and encapsulation lid are connected, the dustproof stopper is split type structure.

2. The SFP photoelectric conversion interface device as in claim 1, wherein the dust plug comprises a flat plug with a rectangular cross section, one side of the flat plug is provided with a L-shaped groove, the middle of the L-shaped groove is provided with a pull hole which penetrates through the groove from top to bottom, the other side of the flat plug is horizontally and symmetrically provided with two cylinders, the center of each cylinder is provided with a multi-curved plug which is sleeved with the cylinder, the center of the multi-curved plug is horizontally provided with a through hole, the multi-curved plug comprises a conical mouth part, a cylindrical waist part, a conical waist part and a cylindrical tail part which are integrally formed from front to back, the port of the cylindrical tail part is connected with the cylinder, and the inner wall of the cylindrical tail part is provided with an annular groove.

3. The SFP photoelectric conversion interface device as claimed in claim 2, wherein the sliding heat conduction device comprises a heat conduction slider with a T-shaped horizontal cross-section, the heat conduction slider is provided with a plurality of screw holes, the screw holes are provided with connectors, the bottoms of the connectors are provided with heat conduction bars, and the bottoms of the ends of the heat conduction bars, which are far away from the connectors, are connected with the heat conduction blocks.

4. An SFP photoelectric conversion interface device according to claim 3, wherein a plurality of anti-slip bumps are provided on both the inner bottom surface of the housing and the inner top surface of the encapsulation cover.