CN216376582U - Material links up conveying platform - Google Patents
Material links up conveying platform Download PDFInfo
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- CN216376582U CN216376582U CN202122806103.5U CN202122806103U CN216376582U CN 216376582 U CN216376582 U CN 216376582U CN 202122806103 U CN202122806103 U CN 202122806103U CN 216376582 U CN216376582 U CN 216376582U
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- conveying
- linear bearing
- conveying platform
- transfer orbit
- die bonder
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Abstract
The utility model relates to a material connecting and conveying platform which comprises a motor, a conveying rail, a conveying belt, a feeding sensor and a discharging sensor, wherein the conveying rail is used for limiting the conveying direction of materials, the motor is used for driving the conveying belt to rotate, the conveying belt is used for driving the materials in the conveying rail to move, the feeding sensor is arranged at an inlet of the conveying rail and used for sensing the materials to enter from the conveying rail, and the discharging sensor is arranged at an outlet of the conveying rail and used for sensing the materials to be discharged from the conveying rail. The material linking and conveying platform is used for conveying materials from one die bonder to another adjacent die bonder, and transforming the single-machine linkage of the die bonder into on-line equipment, so that the compatibility of the die bonder for producing chip products with various specifications and sizes is solved, the equipment utilization rate and the production rate are improved, the equipment versatility is improved, the time of product detention on site is shortened, the abnormal occurrence probability is reduced, the personnel cost input is reduced, and the operation ratio of a human machine is optimized.
Description
Technical Field
The utility model relates to the technical field of chip packaging and manufacturing, in particular to a material connection and transmission platform.
Background
In the chip packaging and manufacturing process, a die bonder is required, and the existing die bonder works alone and cannot work online. The process flow of the die bonder for producing single-model chip products is as follows: mounting, curing and bonding; the technological process for producing chip products with various specifications and sizes comprises the following steps: chip one mounting → chip one curing → chip two mounting → chip two curing → bonding. The ideal process flow of the chip products with various specifications and sizes is as follows: the first chip is mounted → the second chip is mounted → solidified → bonded, so the time for solidifying the first chip is reduced. However, each die bonder can only produce a single type product at the same time, and cannot be compatible with multiple chips at the same time, equipment conversion frequency and conversion time waste are required to be increased in each production, so that the production efficiency is low, the production time is increased to influence the delivery period of customers, the equipment production limitation is large, the equipment and labor cost investment is increased, the product detention field time is increased, and the probability of other hidden quality is increased to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a material connection and transmission platform which is used for transforming two adjacent die bonder into online equipment so as to meet the production requirements of chips with various specifications and sizes.
The utility model is realized by the following steps: the utility model provides a material links up conveying platform, includes motor, transfer orbit, conveyer belt, pan feeding sensor and ejection of compact sensor, the transfer orbit is used for restricting the direction of transfer of material, the motor is used for driving the conveyer belt rotation, the conveyer belt is used for the material removal in the drive transfer orbit, the pan feeding sensor sets up in transfer orbit's entrance for the response material gets into from the transfer orbit, ejection of compact sensor sets up in transfer orbit's exit for the response material is seen off from the transfer orbit.
Wherein, the conveying track includes left track board, right track board, track bracing piece, linear bearing and linear bearing positioning seat, track bracing piece vertical fixation sets up on right track board, the linear bearing positioning seat sets up on left track board to lock through the fastener, linear bearing sets up on the linear bearing positioning seat, the track bracing piece sets up in linear bearing.
The material linking and conveying platform further comprises a base, and the right track plate is fixedly arranged on the base.
Wherein, material links up conveying platform still includes the motor frame, the motor passes through the fixed setting on the base of motor frame.
The material linking and conveying platform comprises a plurality of conveying shafts and belt pulleys, the conveying shafts are vertically and fixedly arranged on the right rail plate, the conveying belt is arranged on the conveying shafts, and the conveying belt is tightly arranged on the belt pulleys.
And a side baffle is fixedly arranged on the right track plate and is used for shielding the conveyor belt.
The utility model has the beneficial effects that: the material linking and conveying platform is used for conveying a material (lead frame) from one die bonder to another adjacent die bonder, and the die bonder is transformed into online equipment through single machine linkage. One die bonder firstly mounts the chip into a chip, then the chip is conveyed into the other die bonder through the material connecting and conveying platform to mount the chip into a chip by two, then curing and bonding are carried out together, which belongs to the most ideal process flow for producing chip products with multiple specifications and sizes, solves the compatibility of a die bonder for producing the chip products with multiple specifications and sizes, cancels the waiting time of the first chip curing time and the second chip mounting production, simultaneously produces the first chip mounting and the second chip mounting, reduces the production flow of the chips with multiple specifications and sizes, cancels the baking curing time for producing the first chip in the chips with multiple specifications and sizes, improves the utilization rate and the production rate of equipment, therefore, the productivity of the equipment is improved, the equipment cost investment of the die bonder is reduced, the equipment versatility is improved, the time of the product staying on the site is shortened, the abnormal occurrence probability is reduced, the personnel cost investment is reduced, and the man-machine operation ratio is optimized.
Drawings
FIG. 1 is a front view of an exemplary embodiment of a material engagement transport platform according to the present invention;
FIG. 2 is a top view of an exemplary embodiment of a material engagement transport platform of the present invention;
FIG. 3 is a side view of an exemplary embodiment of a material engagement transport platform according to the present invention;
FIG. 4 is a perspective view of an exemplary embodiment of a material engagement transport platform of the present invention;
FIG. 5 is a perspective view of another angle of an exemplary embodiment of a material engaging transport platform according to the present invention;
fig. 6 is an exploded view of an exemplary embodiment of a material engaging and conveying platform according to the present invention.
1. A motor; 2. a transfer rail; 21. a left track plate; 22. a right track plate; 23. a rail support bar; 24. a linear bearing; 25. a linear bearing positioning seat; 3. a conveyor belt; 4. a feeding sensor; 5. a discharge sensor; 6. a base; 7. a motor frame; 8. a transfer shaft; 9. a belt pulley; 10. side dams.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
As an embodiment of the material connecting and conveying platform of the present invention, as shown in fig. 1 to 6, the material connecting and conveying platform includes a motor 1, a conveying rail 2, a conveying belt 3, a feeding sensor 4 and a discharging sensor 5, the conveying rail 2 is used for limiting a conveying direction of a material, the motor 1 is used for driving the conveying belt 3 to rotate, the conveying belt 3 is used for driving the material in the conveying rail 2 to move, the feeding sensor 4 is disposed at an inlet of the conveying rail 2 and is used for sensing the material entering from the conveying rail 2, and the discharging sensor 5 is disposed at an outlet of the conveying rail 2 and is used for sensing the material exiting from the conveying rail 2.
The material linking and conveying platform is used for conveying a material (lead frame) from one die bonder to another adjacent die bonder, and the die bonder is transformed into online equipment through single machine linkage. One die bonder firstly mounts the chip into a chip, then the chip is conveyed into the other die bonder through the material connecting and conveying platform to mount the chip into a chip by two, then curing and bonding are carried out together, which belongs to the most ideal process flow for producing chip products with multiple specifications and sizes, solves the compatibility of a die bonder for producing the chip products with multiple specifications and sizes, cancels the waiting time of the first chip curing time and the second chip mounting production, simultaneously produces the first chip mounting and the second chip mounting, reduces the production flow of the chips with multiple specifications and sizes, cancels the baking curing time for producing the first chip in the chips with multiple specifications and sizes, improves the utilization rate and the production rate of equipment, therefore, the productivity of the equipment is improved, the equipment cost investment of the die bonder is reduced, the equipment versatility is improved, the time of the product staying on the site is shortened, the abnormal occurrence probability is reduced, the personnel cost investment is reduced, and the man-machine operation ratio is optimized.
In this embodiment, the conveying track 2 includes a left track plate 21, a right track plate 22, a track support rod 23, a linear bearing 24 and a linear bearing positioning seat 25, the track support rod 23 is vertically and fixedly disposed on the right track plate 22, the linear bearing positioning seat 25 is disposed on the left track plate 21 and is locked by a fastener, the linear bearing 24 is disposed on the linear bearing positioning seat 25, and the track support rod 23 is disposed in the linear bearing 24. When the fasteners are loosened, the left track plate 21 can move left and right along the linear bearing 24, the distance between the left track plate 21 and the right track plate 22 can be adjusted to adapt to materials (lead frames) with different widths, the adaptability of the materials to be connected with the conveying platform is improved, after the adjustment is completed, the fasteners are screwed, and the left track plate 21 is completely fixed on the linear bearing 24.
In this embodiment, the material joining and conveying platform further includes a base 6, and the right track plate 22 is fixedly disposed on the base 6. The material linking and conveying platform further comprises a motor frame 7, and the motor 1 is fixedly arranged on the base 6 through the motor frame 7. The material linking and conveying platform is conveniently fixed between the two die bonder.
In this embodiment, material links up conveying platform includes a plurality of conveying axle 8 and belt pulley 9, conveying axle 8 is fixed setting perpendicularly on right track board 22, conveyer belt 3 sets up on conveying axle 8, conveyer belt 3 sets up on belt pulley 9 tautly, and 3 upper portions of conveyer belt keep the level, and the position is higher than conveying track 2 slightly, can drive the material and remove.
In this embodiment, a side baffle 10 is further fixedly disposed on the right track plate 22, and the side baffle 10 is used for shielding the conveyor belt 3.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. The utility model provides a material links up conveying platform, a serial communication port, includes motor, transfer orbit, conveyer belt, pan feeding sensor and ejection of compact sensor, the transfer orbit is used for restricting the direction of transfer of material, the motor is used for driving the conveyer belt rotation, the conveyer belt is used for the material removal in the drive transfer orbit, the pan feeding sensor sets up at transfer orbit's entrance for the response material gets into from the transfer orbit, ejection of compact sensor sets up in transfer orbit's exit for the response material is seen off from the transfer orbit.
2. The material splicing and conveying platform according to claim 1, wherein the conveying track comprises a left track plate, a right track plate, a track support rod, a linear bearing and a linear bearing positioning seat, the track support rod is vertically and fixedly arranged on the right track plate, the linear bearing positioning seat is arranged on the left track plate and locked by a fastener, the linear bearing is arranged on the linear bearing positioning seat, and the track support rod is arranged in the linear bearing.
3. The material engagement conveying platform of claim 2, further comprising a base, wherein the right track plate is fixedly disposed on the base.
4. The material engagement conveying platform of claim 3, further comprising a motor frame, wherein the motor is fixedly disposed on the base via the motor frame.
5. The material engagement conveying platform of claim 2, wherein the material engagement conveying platform comprises a plurality of conveying shafts and pulleys, the conveying shafts are vertically and fixedly disposed on the right rail plate, the conveying belt is disposed on the conveying shafts, and the conveying belt is disposed on the pulleys in a tensioned manner.
6. The material splicing conveying platform according to claim 5, wherein a side baffle is further fixedly arranged on the right track plate and used for shielding the conveying belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122806103.5U CN216376582U (en) | 2021-11-12 | 2021-11-12 | Material links up conveying platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122806103.5U CN216376582U (en) | 2021-11-12 | 2021-11-12 | Material links up conveying platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216376582U true CN216376582U (en) | 2022-04-26 |
Family
ID=81253217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122806103.5U Active CN216376582U (en) | 2021-11-12 | 2021-11-12 | Material links up conveying platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216376582U (en) |
-
2021
- 2021-11-12 CN CN202122806103.5U patent/CN216376582U/en active Active
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