CN216354186U

CN216354186U - Semiconductor frame

Info

Publication number: CN216354186U
Application number: CN202122630772.1U
Authority: CN
Inventors: 张国委
Original assignee: Fujian Weiwang Semiconductor Co ltd
Current assignee: Fujian Weiwang Semiconductor Co ltd
Priority date: 2021-10-30
Filing date: 2021-10-30
Publication date: 2022-04-19
Anticipated expiration: 2031-10-30

Abstract

The utility model relates to the technical field of semiconductor frames, and discloses a semiconductor frame which comprises a frame, wherein the upper end of the frame extends downwards to form a mounting groove, mounting seats are arranged on two sides of the bottom surface of the inner cavity of the mounting groove in a relatively parallel mode, a tin block groove is formed in the upper end of the inner cavity of the mounting seat in a penetrating mode, a tin block is arranged in the inner cavity of the tin block groove, an inserting groove is formed in one side of the upper end of the mounting seat, the tin block in the inner cavity of the tin block groove is heated through hot air, and the semiconductor can be quickly pressed downwards at the moment so that pins of the semiconductor are connected with the tin block.

Description

Semiconductor frame

Technical Field

The utility model relates to the technical field of semiconductor frames, in particular to a semiconductor frame.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.

When the existing semiconductor is installed with a frame, the semiconductor and the frame are generally installed in a glue mode, then the semiconductor and the frame are connected in a soldering tin mode, the pins are required to be welded one by one, and when the semiconductor and the frame are installed, the tin block is heated and melted and then connected, so that the installation efficiency is improved.

The problems described above are addressed. To this end, a semiconductor frame is proposed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor frame, when a semiconductor needs to be connected with the frame, the semiconductor can be placed in a mounting groove, then a tin block in an inner cavity of the tin block groove is heated through hot air, and the semiconductor can be quickly pressed downwards at the moment, so that pins of the semiconductor are connected with the tin block, and the problems in the background art are solved.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor frame, includes the frame, the mounting groove that the downwardly extending was seted up in frame upper end, the relative parallel arrangement in mounting groove inner chamber bottom surface both sides has the mount pad, and the mount pad inner chamber upper end runs through and has seted up the tin billet groove, and tin billet inslot chamber is provided with the tin billet, and the inserting groove has been seted up to mount pad upper end one side.

Preferably, an opening at the lower end of the insertion groove is provided with an inclined plate, and a pair of inclined plates vertically extend downwards to be provided with positioning grooves.

Preferably, a telescopic groove is formed below the positioning groove, and a telescopic plate is arranged in an inner cavity of the telescopic groove.

Preferably, the lower end of the telescopic plate is provided with a baffle plate, and the baffle plate is positioned in the inner cavity of the telescopic groove.

Preferably, the width of the insertion groove is larger than that of the positioning groove.

Preferably, the mounting groove bottom surface is provided with the lug, and the lug bottom surface is provided with the cylinder, and the cylinder both ends are provided with the horizontal pole, and the horizontal pole front is provided with the connecting rod with the back, and the connecting rod end links to each other with the baffle, and the cylinder lower extreme is provided with the elastic plate.

Preferably, the elastic plate is a member made of a metal material.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the semiconductor frame, when a semiconductor needs to be connected with the frame, the semiconductor can be placed in the mounting groove, then the tin block in the inner cavity of the tin block groove is heated through hot air, and the semiconductor can be quickly pressed downwards, so that pins of the semiconductor are connected with the tin block.

2. According to the semiconductor frame, after a tin block is melted, the semiconductor is pressed downwards at the moment, the semiconductor presses the convex block downwards, the convex block then drives the cross rod and the connecting rod, the baffle is driven by the connecting rod, the telescopic plate arranged at the upper end of the baffle moves downwards, so that the pins move to the inner cavity of the positioning groove, and then the tin block is solidified quickly.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a front view of the internal structure of the frame of the present invention;

FIG. 3 is a schematic top view of the internal structure of the frame of the present invention;

FIG. 4 is a schematic view of the mounting base structure of the present invention;

FIG. 5 is an enlarged view of the structure at A in FIG. 4 according to the present invention;

FIG. 6 is a side view of the mounting base of the present invention.

In the figure: 1. a frame; 11. mounting grooves; 12. a mounting seat; 121. a tin block groove; 122. a tin block; 123. inserting grooves; 124. positioning a groove; 125. a telescopic groove; 126. a retractable plate; 127. a baffle plate; 128. an inclined plane plate; 13. a bump; 131. a cross bar; 132. a connecting rod; 133. a cylinder; 134. an elastic plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to solve the technical problem of the quick connection of the semiconductor and the frame 1, as shown in fig. 1 and 4, the following preferred technical solutions are provided:

the utility model provides a semiconductor frame, including frame 1, the mounting groove 11 that frame 1 upper end downwardly extending seted up, 11 relative parallel arrangement in mounting groove bottom surface both sides have a mount pad 12, 12 inner chamber upper ends of mount pad run through and have seted up tin piece groove 121, tin piece groove 121 inner chamber is provided with tin piece 122, inserting groove 123 has been seted up to 12 upper end one side of mount pad, inserting groove 123 lower extreme opening part is provided with inclined plane board 128, a pair of inclined plane board 128 vertical downwardly extending is provided with constant head tank 124, inserting groove 123 width is greater than constant head tank 124 width.

Specifically, when the semiconductor needs to be connected with the frame 1, the semiconductor can be placed in the mounting groove 11, the pins of the semiconductor are placed in the inner cavity of the insertion groove 123, then the tin block 122 in the inner cavity of the tin block groove 121 is heated through hot air, after the tin block 122 is melted, the semiconductor can be quickly pressed downwards, so that the pins of the semiconductor are connected with the tin block 122, the tin block 122 cannot be connected with the adjacent tin block 122, and the phenomenon of adhesion is prevented.

In order to solve the technical problem of the outflow of the solder bumps 122 in the solder bump bath 121, as shown in fig. 2-3 and fig. 5-6, the following preferred technical solutions are provided:

locating slot 124 has been seted up flexible groove 125 below, flexible groove 125 inner chamber is provided with expansion plate 126, expansion plate 126 lower extreme is provided with baffle 127, baffle 127 is located flexible groove 125 inner chamber, mounting groove 11 bottom surface is provided with lug 13, lug 13 bottom surface is provided with cylinder 133, cylinder 133 both ends are provided with horizontal pole 131, the front and the back of horizontal pole 131 are provided with connecting rod 132, the terminal and the baffle 127 that link 132 links to each other, cylinder 133 lower extreme is provided with elastic plate 134, elastic plate 134 is the component that a metal material made.

Specifically, after the solder bump 122 melts, when the semiconductor is pressed downwards at this time, the semiconductor presses the bump 13 downwards, the bump 13 then drives the cross bar 131 and the connecting rod 132, the baffle 127 is driven by the connecting rod 132, the baffle 127 enables the expansion plate 126 arranged at the upper end to move downwards, so that the pin moves to the inner cavity of the positioning groove 124, and then the solder bump is solidified quickly.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor frame comprising a frame (1), characterized in that: the tin soldering tin is characterized in that the upper end of the frame (1) extends downwards to form a mounting groove (11), mounting seats (12) are arranged on two sides of the bottom surface of the inner cavity of the mounting groove (11) in a relatively parallel mode, a tin block groove (121) is formed in the upper end of the inner cavity of the mounting seat (12) in a penetrating mode, a tin block (122) is arranged in the inner cavity of the tin block groove (121), and a plug-in groove (123) is formed in one side of the upper end of the mounting seat (12).

2. A semiconductor frame as claimed in claim 1, wherein: an opening at the lower end of the inserting groove (123) is provided with an inclined plane plate (128), and a pair of inclined plane plates (128) vertically extend downwards to be provided with a positioning groove (124).

3. A semiconductor frame as claimed in claim 2, wherein: a telescopic groove (125) is formed below the positioning groove (124), and a telescopic plate (126) is arranged in the inner cavity of the telescopic groove (125).

4. A semiconductor frame as claimed in claim 3, wherein: the lower end of the telescopic plate (126) is provided with a baffle plate (127), and the baffle plate (127) is positioned in the inner cavity of the telescopic groove (125).

5. The semiconductor frame of claim 4, wherein: the width of the insertion groove (123) is larger than that of the positioning groove (124).

6. A semiconductor frame as claimed in claim 5, wherein: the bottom surface of the mounting groove (11) is provided with a convex block (13), the bottom surface of the convex block (13) is provided with a cylinder (133), two ends of the cylinder (133) are provided with cross rods (131), the front surface and the back surface of each cross rod (131) are provided with connecting rods (132), the tail ends of the connecting rods (132) are connected with the baffle plates (127), and the lower ends of the cylinders (133) are provided with elastic plates (134).

7. The semiconductor frame of claim 6, wherein: the elastic plate (134) is a member made of a metal material.