CN216354135U - Swing arm crystal suction system of IC die bonder and wafer carrying device - Google Patents

Abstract

The utility model provides a swing arm crystal suction system of an IC die bonder and a wafer carrying device, wherein the swing arm comprises a first swing arm and a second swing arm, the front ends of the first swing arm and the second swing arm are respectively provided with a first suction nozzle and a second suction nozzle, the DD motor module comprises a rotating module and a swing arm module, the swing arm module comprises a first swing arm module and a second swing arm module, the first swing arm module drives the first swing arm to move up and down by a first voice coil motor, and the second swing arm module drives the second swing arm to move up and down by a second voice coil motor. According to the swing arm crystal suction system and the wafer carrying device of the IC die bonder, the two swing arms are driven by two independent voice coil motors through the double swing arms of the first swing arm and the second swing arm, the suction nozzle is pressed down independently to suck a wafer, the two groups of crystal suction swing arms are alternately switched through the DD motor module, crystal suction is performed alternately, and crystal suction and crystal bonding are performed simultaneously, so that the working efficiency is improved.

Description

Swing arm crystal suction system of IC die bonder and wafer carrying device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a swing arm crystal sucking system of an IC die bonder and a wafer conveying device.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer is circular, the wafer is a carrier used for producing the integrated circuit, is the most common semiconductor material, and is divided into specifications of 6 inches, 8 inches and the like according to the diameter of the wafer, and the larger the wafer specification is, the more ICs can be produced on the same wafer, but the higher the requirements on the wafer production technology are. In the process of producing the wafer, the wafer is transferred from one working platform to another working platform, the wafer is often carried by manually holding the wafer, the efficiency is low, the stability is poor, the quality of the wafer is affected due to the fact that the wafer is easily scratched or broken due to improper operation of workers, and the wafer is scrapped when the wafer is serious.

The existing mechanical carrying mode also has various problems, and the mechanical mode usually adopts a suction nozzle to adsorb wafers, so that the operation is not flexible enough. Traditional solid brilliant machine is single swing arm structure, and single swing arm mechanism is connected with the servo motor module, realizes that swing arm 0 degree/180 degree rotates in turn, and the swing arm pushes down and is realized by servo motor drive cam mechanism, and single swing arm operation is being inhaled crystalline substance position, and the eutectic waits, and at the crystalline substance position altogether, inhale crystalline substance and wait, work efficiency is not high. Therefore, how to improve the efficiency of wafer transportation and thus the work efficiency is a problem to be solved.

Disclosure of Invention

The utility model provides a swing arm crystal suction system of an IC die bonder and a wafer conveying device, aiming at improving the efficiency of wafer conveying.

The utility model provides a swing arm die sucking system of an IC die bonder, which comprises a base, a swing arm and a motor module, wherein the swing arm and the motor module are arranged on the base, the swing arm comprises a first swing arm and a second swing arm, a first suction nozzle is arranged at the front end of the first swing arm, a second suction nozzle is arranged at the front end of the second swing arm, the motor module comprises a rotating module and a swing arm module, the swing arm is arranged on the rotating module and driven to rotate by the rotating module, the swing arm module comprises a first swing arm module and a second swing arm module, the first swing arm module drives the first swing arm to move up and down, and the second swing arm module drives the second swing arm to move up and down.

Optionally, the first swing arm and the second swing arm are horizontally and symmetrically installed.

Optionally, an original point separation blade is arranged on the base and used for blocking the swing arm.

Optionally, an origin photoelectric device is further arranged on the base, and the origin photoelectric device is used for sensing the movement of the swing arm.

Optionally, the swing arm includes swing arm active cell, swing arm stator and swing arm active cell connecting piece, the swing arm active cell sets up on the track of swing arm stator, the swing arm stator sets up on the base, the drive the swing arm active cell is in the track of swing arm stator moves on the drive the swing arm connecting piece reciprocates.

Optionally, the swing arm is driven by a voice coil motor.

Optionally, the swing arm further comprises a third swing arm, a third suction nozzle is arranged at the front end of the third swing arm, the swing arm module comprises a third swing arm module, and the third swing arm module drives the third swing arm to move up and down.

Optionally, the first swing arm, the second swing arm and the third swing arm are respectively arranged at an included angle of 120 degrees.

The utility model also provides a wafer carrying device which comprises a bearing table and the IC die bonder swing arm crystal absorption system, wherein the IC die bonder swing arm crystal absorption system absorbs wafers and carries the wafers onto the bearing table.

According to the swing arm crystal suction system and the wafer carrying device of the IC die bonder, provided by the utility model, the operation of independently pressing down the suction nozzles to suck wafers by the two swing arms of the first swing arm and the second swing arm is realized, and the motor module is used for realizing the alternate transposition of the two groups of crystal suction swing arms, alternate crystal suction and alternate eutectic operation, and the crystal suction and eutectic operation are simultaneously carried out, so that the working efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a swing arm wafer suction system of an IC die bonder provided in an embodiment of the present invention;

fig. 2 is a schematic diagram of a partial explosion structure of a swing arm crystal suction system of an IC die bonder according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the present invention and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

As shown in fig. 1 and fig. 2, the utility model further provides a swing arm die-sucking system of an IC die bonder, which includes a base 10, a swing arm 20 and a motor module 30, which are disposed on the base 10, wherein the base 10 is used for carrying or supporting the whole device, other necessary structures can be attached or attached to the base 10, and the base 10 includes other related devices for sucking a wafer, such as an air tube or an electrical device, to achieve the functions of the utility model.

In this embodiment, the swing arm 20 includes a first swing arm and a second swing arm, a first suction nozzle is disposed at a front end of the first swing arm, and a second suction nozzle is disposed at a front end of the second swing arm, it can be understood that the front end herein may also refer to an outermost end, a farthest end, or an end far away from the base, the first swing arm and the second swing arm are respectively provided with two sets of crystal absorption swing arms in 180-degree horizontal symmetry, the two sets of crystal absorption swing arms may be respectively driven by two sets of voice coil motors to realize independent pressing down and lifting of the two sets of swing arms, the two sets of crystal absorption swing arm mechanisms may be installed on a DD (direct drive) motor rotor ring, and the DD motor is driven to rotate to realize 0-degree/180-degree alternate rotation of the swing arms.

The front end of the first swing arm is provided with a first suction nozzle, the front end of the second swing arm is provided with a second suction nozzle, the suction nozzles are used for adsorbing wafers, the suction nozzles are communicated with an exhaust tube, and the exhaust tube can be connected to an air pump to realize air pressure adsorption.

On the moving mechanism, the motor module 10 includes the rotation module and the swing arm module, and the swing arm 20 is set up on the rotation module and is rotated by the rotation module drive, and also the rotation module drives the swing arm 20 to rotate to adjust the adsorbed wafer of suction nozzle.

Wherein, the swing arm module includes first swing arm module and second swing arm module, and first swing arm of first swing arm module drive reciprocates, and second swing arm module drive second swing arm reciprocates, and it is to take or place the wafer at the swing arm, all adsorb the operation through the suction nozzle on the vertical movement wafer about through the swing arm, and two swing arms are controlled through respective swing arm module respectively, inhale crystalline alternately, and the operation is carried out simultaneously with crystalline to the absorption crystalline.

In the installation setting, first swing arm and second swing arm horizontal symmetry installation, be exactly 180 degrees horizontal symmetry installation, the symmetry sets up and can make swing arm swing amplitude unanimous, and two swing arms are other angles certainly, do not influence this implementation yet and realize its corresponding function, can set to other angles according to needs such as customer or place.

When the two swing arm 20 mechanisms are horizontally and symmetrically arranged at 180 degrees, the two groups of crystal absorption swing arms 20 can be respectively driven by A, B voice coil motors, and the two groups of crystal absorption swing arm 20 mechanisms are arranged on a DD motor rotor ring; when the DD motor rotates 180 degrees, the suction nozzle, the swing arm and the voice coil motor module on one side are located at a eutectic position, the voice coil motor module on the side drives the swing arm mechanism to press downwards, and a chip on the suction nozzle on the side is attached to the material sheet base in a guiding mode to complete eutectic operation; meanwhile, the suction nozzle, the swing arm mechanism and the voice coil motor module on the other side are located at a crystal suction position, the voice coil motor module on the one side drives the swing arm mechanism to press downwards, and the suction nozzle on the one side reaches a top needle position of the wafer disc to finish crystal suction operation. When the DD motor rotates to 0 degree, the two swing arms 20 are exchanged to repeat the action of telling upward to complete the operations of eutectic crystallization and crystal absorption alternately.

The basic principle and structure of the DD motor rotating machine are permanent magnetic, special disc surface motors can be designed, the space of two end surfaces of the outer rotor type structure can be fully utilized, the stators of the two disc surface motors and the stators of the outer rotor type structure are fixed together, and the rotor discs of the two disc surface motors and the rotor cylinder of the outer rotor type structure form a three-dimensional closed outer rotor. The direct drive mode is to directly couple or connect a novel rotary motor or a novel linear motor to a driven load to realize driving. Because many intermediate links in the traditional system, such as a belt or a chain or a steel wire rope, a gear box and other parts are eliminated, the structure is greatly simplified, and the whole system has the advantages of high efficiency, low consumption, high speed, high precision, high reliability, no maintenance, high rigidity, quick response, no need of lubrication, quiet operation and the like.

In order to better protect the wafer, the base 10 is provided with an original point baffle 11, and the original point baffle 11 is used for blocking the swing arm, so that the improper displacement of the swing arm caused by mechanical faults and the like can be prevented, and the possibility of accidents is reduced. Further, still be provided with original point photoelectric device 12 on the base 10, original point photoelectric device 12 is used for responding to the removal of swing arm 20, and when swing arm 20 moved to like the original point position, original point photoelectric device 12 can sense the photoelectric signal of swing arm 20 to can send corresponding photoelectric information and confirm the position of swing arm, make controlling means carry out further management and control.

In a specific structure, as shown in the figure, the swing arm 20 includes a swing arm mover 21, a swing arm stator 22 and a swing arm mover connector 23, the swing arm mover 21 is disposed on a track of the swing arm stator 22, the swing arm stator 22 is disposed on the base 10, and the swing arm mover 21 is driven to move the swing arm connector 23 on the track of the swing arm stator 22 to move up and down, so that the swing arm 20 moves up and down, and the track therein may be grooved or other structures that realize mutual movement.

The swing arm 20 is driven by a Voice Coil Motor (Voice Coil Motor), the Voice Coil Motor is a special direct drive Motor, the Voice Coil Motor has the characteristics of simple structure, small size, high speed, high acceleration response speed and the like, the working principle is that a force is generated when an electrified Coil (conductor) is placed in a magnetic field, the force is proportional to the current applied to the Coil, and the motion form of the Voice Coil Motor manufactured based on the principle can be a straight line or an arc. The double swing arms of the first swing arm 21 and the second swing arm 22 are used for driving the two swing arms to be driven by two independent voice coil motors, independently pressing down suction nozzles to adsorb wafers, and realizing the alternate transposition of the two groups of crystal adsorption swing arms through a DD motor module.

The swing arm stator 22 and the swing arm rotor 21 are assembled by crossed tracks to realize the purpose of axial motion of the motor, the suction nozzle is installed on the arm span and is connected with the voice coil motor rotor by a swing arm rotor connector 23 in a reliable mechanical transmission manner, and the suction nozzle head is usually installed at the front end of the swing arm. The head of suction nozzle is when being pushed down and contact the wafer surface by the voice coil motor drive, the contact force can be conducted to the voice coil motor through swing arm 20, the driver accessible electrical parameter's of voice coil motor feedback combines with equipment host computer program algorithm and gives real-time pressure parameter, the visual defect that traditional swing arm pushes down the unable real-time supervision of mechanism and pushes down the pressure degree of this pressure parameter has been solved in the visualization, the uniformity of atress when having guaranteed because of wafer relative position nonconformity, the effectual wafer that prevents to cause breaks the problem because the pressure degree is too big.

Further, swing arm 20 still includes the third swing arm, the front end of third swing arm is provided with the third suction nozzle, the swing arm module includes the third swing arm module, third swing arm module drive third swing arm reciprocates, also be exactly the structure that adopts three swing arm, thereby can realize carrying three wafer simultaneously, the preferred can be with first swing arm, second swing arm and swing arm are 120 degrees contained angles setting respectively, can also set up more swing arm structures certainly, the needs that correspond this moment make in addition the length of swing arm have sufficient space.

The embodiment further provides a wafer carrying device, which comprises a carrying table and the swing arm wafer sucking system of the IC die bonder, wherein the swing arm wafer sucking system of the IC die bonder sucks a wafer to carry the wafer to the carrying table, so that the wafer is carried.

The single swing arm can solve the problems of low production efficiency and no feedback of crystal absorption and eutectic force of the traditional single swing arm, the traditional single swing arm is driven by a servo motor, the rotation speed, the precision and the stability are not as good as those of a DD motor, the double swing arms of the embodiment can realize simultaneous crystal absorption and eutectic operation, and the production efficiency is 2 times that of the single swing arm; traditional single swing arm pushes down by servo motor drive not have the feedback of pushing down the pressure degree, and this embodiment uses voice coil motor to realize that the swing arm pushes down and to inhale brilliant, the eutectic dynamics after can effectively feeding back pushes down, effectively improves and inhales brilliant, the chip quality of eutectic in-process.

According to the swing arm crystal suction system and the wafer carrying device of the IC die bonder, provided by the utility model, the operation of independently pressing down the suction nozzles to suck wafers by the two swing arms of the first swing arm and the second swing arm is realized, and the motor module is used for realizing the alternate transposition of the two groups of crystal suction swing arms, alternate crystal suction and alternate eutectic operation, and the crystal suction and eutectic operation are simultaneously carried out, so that the working efficiency is improved.

Finally, it should be clear that the above examples are only given for the sake of clarity of the description of the utility model and are not limitative of the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention are intended to be included within the scope of the present invention.

Claims (9)

1. The swing arm crystal suction system of the IC die bonder is characterized by comprising a base, a swing arm and a motor module, wherein the swing arm and the motor module are arranged on the base, the swing arm comprises a first swing arm and a second swing arm, a first suction nozzle is arranged at the front end of the first swing arm, a second suction nozzle is arranged at the front end of the second swing arm, the motor module comprises a rotating module and a swing arm module, the swing arm is arranged on the rotating module and driven to rotate by the rotating module, the swing arm module comprises a first swing arm module and a second swing arm module, the first swing arm module drives the first swing arm to move up and down, and the second swing arm module drives the second swing arm to move up and down.

2. The swing arm die sucking system of the IC die bonder as claimed in claim 1, wherein the first swing arm and the second swing arm are horizontally and symmetrically installed.

3. The swing arm crystal suction system of the IC die bonder according to claim 1 or 2, wherein an origin baffle is arranged on the base and used for blocking the swing arm.

4. The swing arm crystal suction system of the IC die bonder according to claim 1 or 2, wherein an origin photoelectric device is further arranged on the base and used for sensing the movement of the swing arm.

5. The swing arm die sucking system of the IC die bonder according to claim 1 or 2, wherein the swing arm comprises a swing arm rotor, a swing arm stator and a swing arm rotor connector, the swing arm rotor is disposed on a track of the swing arm stator, the swing arm stator is disposed on the base, and the swing arm rotor is driven to move on the track of the swing arm stator to drive the swing arm connector to move up and down.

6. The swing arm die sucking system of the IC die bonder according to claim 1 or 2, wherein the swing arm is driven by a voice coil motor.

7. The swing arm die sucking system of the IC die bonder according to claim 1 or 2, wherein the swing arm further comprises a third swing arm, a third suction nozzle is arranged at the front end of the third swing arm, the swing arm module comprises a third swing arm module, and the third swing arm module drives the third swing arm to move up and down.

8. The swing arm die sucking system of the IC die bonder according to claim 1 or 2, wherein the first swing arm, the second swing arm and the third swing arm are respectively disposed at an included angle of 120 degrees.

9. A wafer conveying apparatus, comprising a carrying table and the swing arm wafer sucking system of the IC die bonder according to any one of claims 1 to 8, wherein the swing arm wafer sucking system of the IC die bonder sucks and conveys a wafer onto the carrying table.

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