CN216353712U

CN216353712U - Chip transformer

Info

Publication number: CN216353712U
Application number: CN202121630370.5U
Authority: CN
Inventors: 娄建勇; 张旭东; 袁凯; 姚炜; 尹玮
Original assignee: Wuxi Shenwanghe Electronic Technology Co ltd
Current assignee: Wuxi Shenwanghe Electronic Technology Co ltd
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2022-04-19
Anticipated expiration: 2031-07-16

Abstract

The utility model discloses a chip transformer. The chip transformer includes the magnetic core and the winding of equipment, and the chip transformer still includes: the packaging layer is packaged outside the magnetic core and the winding; and the radiating fin is fixed on one side of the packaging layer, and the radiating fin and the packaging layer are integrally formed. According to the chip transformer, the radiating fins and the packaging layer are designed into an integrally formed structure, so that the radiating fins do not need to be additionally installed, and specified assembling holes do not need to be formed in the surface of the chip, the processing procedures of the chip transformer are reduced, and the production cost of the chip transformer is greatly reduced. In addition, the heat sink and the packaging layer are integrally formed, so that the integral structure is firmer. Furthermore, in the chip transformer, the positioning holes of the radiating fins do not need to be manufactured on the chip transformer, so that the area of the chip transformer is correspondingly saved, the size of the chip transformer is reduced, and the requirement of lightness and thinness of the chip transformer is met.

Description

Chip transformer

Technical Field

The utility model relates to the technical field of transformers, in particular to a chip transformer.

Background

A transformer is a stationary electrical device that transforms voltage or current between two or more windings at the same frequency by the principle of electromagnetic induction. A conventional wound transformer generally includes a coil support made of an insulating material, a coil wound on the coil support, and an iron core wrapped outside the coil. As power electronic devices are continuously developed toward smaller size, higher power density and higher efficiency, a transformer, which is one of the key components in the power electronic devices, tends to be designed in a miniaturized manner, so that a chip transformer is produced.

In the field of chip transformers, after a magnetic core and a winding are assembled, the assembled magnetic core and the winding are subjected to overall shape packaging through packaging materials such as epoxy resin, metal or ceramic, and the overall shape is consistent with the shape of a common chip. In practice, in the use process, because the chip transformer generates heat during operation, a heat sink needs to be additionally installed on the surface of the chip transformer to dissipate the heat of the chip transformer. Meanwhile, as the radiating fins are required to be installed, positioning and fixing devices are required to be manufactured on the surface of the chip transformer in advance, so that the chip transformer is convenient to be assembled with the radiating fins in a matched manner; meanwhile, a fixed assembling hole needs to be reserved on the surface of the chip transformer, and the complexity of the process is increased.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the embodiments of the present invention is to provide a chip transformer, which can integrally form a heat sink while integrally packaging the shape of the transformer, so that no extra heat sink is required to be installed, no specified assembly hole is required to be formed on the surface of a chip, the processing procedures of the chip transformer are reduced, and the production cost of the chip transformer is greatly reduced.

In order to solve the above technical problem, the present invention provides a chip transformer, which includes an assembled magnetic core and a winding, and further includes:

the packaging layer is packaged outside the magnetic core and the winding; and

and the radiating fin is fixed on one side of the packaging layer, and the radiating fin and the packaging layer are integrally formed.

In one possible implementation, the heat sink is formed by extending an outer surface of the encapsulation layer.

In one possible implementation, the heat sink is a resin heat sink.

In one possible implementation, the heat sink is a metal heat sink or a ceramic heat sink.

In one possible implementation manner, the number of the heat radiating fins is several, and the several heat radiating fins are arranged in a row-to-column manner.

In one possible implementation, the distances between two adjacent heat dissipation fins are equal in the row direction or the column direction.

In one possible implementation, the distance between two adjacent heat sinks is kept constant in the extending direction of the heat sinks.

In one possible implementation, the heat sink is linear or non-linear and elongated in the extending direction.

In one possible implementation, the non-linear strip-shaped heat sink is composed of a plurality of linear strips connected end to end.

In one possible implementation, the non-linear elongated fins are curved.

The implementation of the utility model has the following beneficial effects:

according to the chip transformer, the radiating fins and the packaging layer are designed into an integrally formed structure, so that the radiating fins do not need to be additionally installed, and specified assembling holes do not need to be formed in the surface of the chip, the processing procedures of the chip transformer are reduced, and the production cost of the chip transformer is greatly reduced. In addition, the heat sink and the packaging layer are integrally formed, so that the integral structure is firmer. Furthermore, in the chip transformer, the positioning holes of the radiating fins do not need to be manufactured on the chip transformer, so that the area of the chip transformer is correspondingly saved, the size of the chip transformer is reduced, and the requirement of lightness and thinness of the chip transformer is met.

Drawings

Fig. 1 is a side view of a chip transformer according to a first embodiment of the present invention;

fig. 2 is a front view of a chip transformer according to a first embodiment of the present invention;

fig. 3 is a side view of a chip transformer according to a second embodiment of the present invention;

fig. 4 is a side view of a chip transformer according to a third embodiment of the present invention;

fig. 5 is a side view of a chip transformer according to a fourth embodiment of the present invention.

Reference numerals in the drawings: 100-chip transformer, 110-core, 120-winding, 130-encapsulation layer, 140-heatsink, 150-pin, 200-chip transformer, 210-core, 220-winding, 230-encapsulation layer, 240-heatsink, 250-pin, 300-chip transformer, 310-core, 320-winding, 330-encapsulation layer, 340-heatsink, 350-pin, 400-chip transformer, 410-core, 420-winding, 430-encapsulation layer, 440-heatsink, 450-pin.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 and 2, a chip transformer 100 according to a first embodiment of the present invention includes an assembled magnetic core 110 and windings 120. In the chip transformer 100 of the present invention, the specific assembly method of the core 110 and the winding 120 is not limited. In the chip transformer 100 according to the present embodiment, the core 110 is U-shaped, and thus the winding 120 may be disposed around the core 110. Of course, in the chip transformer 100 according to the other embodiment, the shape of the magnetic core 110 is not limited to this, and may be, for example, an E-shape, and in this case, the magnetic core 110 may be considered to be disposed around the winding 120.

The chip transformer 100 of the present embodiment further includes an encapsulation layer 130 and a heat sink 140, as shown in fig. 1. The encapsulation layer 130 is encapsulated outside the magnetic core 110 and the winding 120 for protecting the magnetic core 110 and the winding 120. The heat sink 140 is fixed on one side of the package layer 130, and the heat sink 140 and the package layer 130 are integrally formed. The integral molding means that the heat sink 140 is integrally molded while the package layer 130 is manufactured. In the chip transformer 100 of the present embodiment, the heat sink 140 and the encapsulation layer 130 are integrally formed, so that the heat sink 140 does not need to be additionally mounted, and a predetermined assembly hole does not need to be formed on the surface of the chip, thereby reducing the number of processing steps of the chip transformer 100 and greatly reducing the production cost of the chip transformer 100.

In the chip transformer 100 of the present embodiment, the heat sink 140 is formed by extending the outer surface of the package layer 130 outward. In this case, the heat sink 140 and the package layer 130 are made of the same material. The outward extending length of the heat dissipation fins 140 may be set according to actual conditions.

In the chip transformer 100 of the present embodiment, the heat sink 140 is a resin heat sink 140. The resin heat sink 140 is preferably an epoxy heat sink 140 or a silicone heat sink 140. When the heat sink 140 is a resin heat sink 140, the material of the resin heat sink 140 is not limited to the above-described type of resin, and may be another resin that can function as the material of the package layer 130 and can perform a certain heat dissipation function.

In the chip transformer 100 of the present embodiment, the number of the heat radiation fins 140 is plural, and the plural heat radiation fins 140 are arranged in rows and columns. In this embodiment, each of the heat dissipation fins 140 can dissipate heat to the periphery, and thus the heat dissipation area of the plurality of heat dissipation fins 140 can be increased. Of course, the plurality of fins 140 may be arranged in other manners.

In the chip transformer 100 of the present embodiment, the distances between two adjacent heat dissipation fins 140 are equal in both the row direction and the column direction. In this embodiment, the heat dissipation space of each of the plurality of heat dissipation fins 140 is relatively uniform, which is beneficial to improving the heat dissipation effect.

In the chip transformer 100 of the present embodiment, the distance between two adjacent heat dissipation fins 140 is kept constant in the extending direction of the heat dissipation fins 140. The extending direction of the heat dissipation fins 140 is a direction from bottom to top as shown in fig. 1. Since the distance between two adjacent heat dissipation fins 140 is constant in the extending direction of the heat dissipation fins 140, a sufficient heat dissipation space can be provided for each heat dissipation fin 140, which is advantageous for improving the heat dissipation effect.

In the chip transformer 100 of the present embodiment, the heat sink 140 has a linear elongated shape in the extending direction, as shown in fig. 1 and 2. Specifically, the cross section of the heat sink 140 in the extending direction is rectangular.

In addition, the chip transformer 100 of the present embodiment further includes a pin 150 for connecting an external circuit, and the pin 150 is fixed to the winding 120.

The method for manufacturing the chip transformer 100 of the present embodiment includes the following steps: firstly, providing a die capable of simultaneously accommodating the magnetic core 110, the winding 120, the packaging layer 130 and the heat sink 140, then assembling the magnetic core 110 and the winding 120 provided with the pins 150 together, then placing the assembled magnetic core 110 and the winding 120 in the die, injecting raw materials for manufacturing the packaging layer 130 and the heat sink 140 into the die, and obtaining the packaging layer 130 packaged outside the magnetic core 110 and the winding 120 and the heat sink 140 fixed on one side of the packaging layer 130 after curing the raw materials.

In the chip transformer 100 according to the first embodiment of the present invention, the heat sink 140 is a resin heat sink 140, and the heat sink 140 is formed by extending outward from the outer surface of the package layer 130. In the chip transformer 100 according to the present invention, the heat sink 140 is not limited to the resin heat sink 140, and the heat sink 140 may be made of another material, and the method of manufacturing the heat sink 140 may be different depending on the material of the heat sink 140.

Referring to fig. 3, a chip transformer 200 according to a second embodiment of the present invention includes an assembled magnetic core 210 and a winding 220, and a pin 250 is disposed on the winding 220. The chip transformer 200 further includes an encapsulation layer 230 encapsulating the magnetic core 210 and the winding 220, and a heat sink 240 fixed to one side of the encapsulation layer 230, wherein the heat sink 240 is integrally formed with the encapsulation layer 230.

The heat sink 240 is a metal heat sink 240, and the metal heat sink 240 is linear and long in the extending direction. The metal heat sink 240 has a good thermal conductivity, and thus can perform a heat dissipation function.

The method for manufacturing the chip transformer 200 of the present embodiment includes the following steps: firstly, providing a mold capable of simultaneously accommodating the magnetic core 210, the winding 220, the packaging layer 230 and the heat sink 240, then assembling the magnetic core 210 and the winding 220 provided with the pins 250 together, then placing the assembled magnetic core 210 and the winding 220 in the mold, injecting the raw material for manufacturing the packaging layer 230 into the mold, inserting the metal heat sink 240 into the packaging material before solidification, and obtaining the packaging layer 230 packaged outside the magnetic core 210 and the winding 220 and the metal heat sink 240 fixed on one side of the packaging layer 230 after solidification of the packaging material.

In the chip transformer of the present invention, the heat sink may be a ceramic heat sink. When the heat sink is a ceramic heat sink, the heat sink can also play a role in heat dissipation, and can also be manufactured by the manufacturing method of the embodiment.

In the chip transformers according to the first and second embodiments of the present invention, the heat dissipation fins are linearly elongated in the extending direction. In the chip transformer according to the present invention, the heat sink is not limited to a linear strip shape in the extending direction, and may have other shapes.

Referring to fig. 4, a chip transformer 300 according to a third embodiment of the present invention includes an assembled core 310 and a winding 320, and a pin 350 is disposed on the winding 320. The chip transformer 300 further includes an encapsulation layer 330 encapsulating the magnetic core 310 and the winding 320, and a heat sink 340 fixed to one side of the encapsulation layer 330, wherein the heat sink 340 and the encapsulation layer 330 are integrally formed.

In the chip transformer 300 of the present embodiment, the heat sink 340 is an epoxy heat sink, and the heat sink 340 is elongated in a non-linear manner in the extending direction. Specifically, the non-linear strip-shaped heat sink 340 is composed of a plurality of linear strips connected end to end.

In the chip transformer 300 according to the present embodiment, the distances between the adjacent two heat dissipation fins 340 are equal, as shown in fig. 4.

Referring to fig. 5, a chip transformer 400 according to a fourth embodiment of the present invention includes an assembled magnetic core 410 and a winding 420, and pins are disposed on the winding 420. The chip transformer 400 further includes an encapsulation layer 430 encapsulated outside the magnetic core 410 and the winding 420, and a heat sink 440 fixed to one side of the encapsulation layer 430, wherein the heat sink 440 and the encapsulation layer 430 are integrally formed.

In the chip transformer 400 of the present embodiment, the heat sink 440 is an epoxy heat sink, and the heat sink 440 has a non-linear long shape in the extending direction. Specifically, the non-linear elongated fins 440 are curved.

In the chip transformer 400 according to the present embodiment, the distances between the adjacent two heat dissipation fins 440 are equal, as shown in fig. 5.

In the chip transformer according to the present invention, the heat sink is not limited to the shape of the third and fourth embodiments described above in the extending direction, and may have another non-linear long shape.

The method for manufacturing the chip transformer according to the third and fourth embodiments is the same as the method for manufacturing the chip transformer according to the first embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A chip transformer, chip transformer is including magnetic core and the winding of equipment, its characterized in that, chip transformer still includes:

the packaging layer is packaged outside the magnetic core and the winding; and

2. The chip transformer according to claim 1, wherein the heat sink is formed by an outer surface of the encapsulation layer extending outward.

3. The chip transformer according to claim 1 or 2, wherein the heat sink is a resin heat sink.

4. The chip transformer according to claim 1, wherein the heat sink is a metal heat sink or a ceramic heat sink.

5. The chip transformer according to claim 1, wherein the number of said heat sinks is several, and the several of said heat sinks are arranged in rows and columns.

6. The chip transformer according to claim 5, wherein the distance between two adjacent heat sinks is equal in both the row direction and the column direction.

7. The chip transformer according to claim 5, wherein a distance between adjacent two of the heat sinks is constant in an extending direction of the heat sinks.

8. The chip transformer according to any one of claims 1 to 7, wherein the heat sink has a linear shape or a non-linear shape in an extending direction.

9. The chip transformer according to claim 8, wherein said non-linear elongated heat sink is comprised of a plurality of linear strips connected end to end.

10. The chip transformer according to claim 8, wherein said non-linear elongated fins are curved.