CN216338022U - Electroplating device for electronic copper foil production - Google Patents

Abstract

The utility model discloses an electroplating device for producing electronic copper foil, which comprises an electroplating pool, wherein a motor is fixedly arranged on one side of the electroplating pool, the end part of an output shaft of the motor is in transmission connection with a first rotating shaft, a second rotating shaft and a third rotating shaft are respectively arranged on two sides of the electroplating pool in a penetrating manner, a first stirring plate is arranged on the outer side of the first rotating shaft, a second stirring plate is arranged on the outer side of the second rotating shaft, a third stirring plate is arranged on the outer side of the third rotating shaft, and a transmission mechanism is connected among the first rotating shaft, the second rotating shaft and the third rotating shaft. The first shifting plate, the second shifting plate and the third shifting plate are driven by the motor to rotate, so that an electrolyte solution in the electroplating pool forms flowing liquid, the flowing speed of metal cations of a plating layer is accelerated, the metal cations of the plating layer can be rapidly supplemented to the periphery of the copper foil, and the electroplating efficiency of the copper foil can be effectively improved.

Description

Electroplating device for electronic copper foil production

Technical Field

The utility model relates to the field of electroplating, in particular to an electroplating device for producing an electronic copper foil.

Background

Copper foil is a negative electrolyte material that is deposited as a thin, continuous metal foil on the substrate layer of a circuit board that serves as the electrical conductor for the PCB. It is easy to adhere to the insulating layer, receive the printing protective layer, form the circuit pattern after corroding.

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.

During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant. The purpose of electroplating is to plate a metal coating on a substrate, altering the surface properties or dimensions of the substrate. The electroplating can enhance the corrosion resistance of the metal (the plating metal is mostly corrosion-resistant metal), increase the hardness, prevent abrasion, improve the conductivity, the smoothness, the heat resistance and the surface beauty.

The prior art has the following defects: most of the existing electroplating devices for producing electronic copper foils are static electroplating, and along with the progress of electroplating, metal cations of a plating layer around a copper foil are reduced on the surface of the copper foil to form a plating layer, so that the concentration of the metal cations of the plating layer around the copper foil is reduced, the metal cations of the plating layer at other places move towards the copper foil, and the plating efficiency is reduced due to the fact that the moving speed of the metal cations of the plating layer of the static electroplating is low.

Disclosure of Invention

In order to achieve the purpose, the technical scheme adopted by the utility model is as follows: the utility model provides an electron copper foil production is with electroplating device, includes the electroplating bath, the fixed motor that is provided with in electroplating bath one side, motor output shaft end transmission is connected with first pivot, electroplating bath both sides are run through respectively and are provided with second pivot and third pivot, the first pivot outside is provided with first stirring board, the second pivot outside is provided with the second stirring board, the third pivot outside is provided with the third stirring board, be connected with drive mechanism between first pivot, second pivot and the third pivot.

Preferably, both sides of the inner cavity of the electroplating pool are connected with water-permeable partition plates, and the electroplating pool is divided into three spaces by the two water-permeable partition plates.

Preferably, one end of the first rotating shaft, which is far away from the motor, two ends of the second rotating shaft and two ends of the third rotating shaft are connected with the electroplating pool in a sealing and rotating manner through a sealing rotating piece.

Preferably, the first rotating shaft, the second rotating shaft and the third rotating shaft are connected with fixed pipes, and the first toggle plate, the second toggle plate and the third toggle plate are respectively connected with the outer parts of the fixed pipes at corresponding positions.

Preferably, at least two of the first toggle plate, the second toggle plate and the third toggle plate are arranged and distributed in an annular array.

Preferably, the transmission mechanism comprises a driving sprocket connected to the outside of the first rotating shaft and a driven sprocket connected to the outside of the second rotating shaft and the third rotating shaft, and a chain is connected between the driving sprocket and the two driven sprockets.

Compared with the prior art, the utility model has the following beneficial effects: the first shifting plate, the second shifting plate and the third shifting plate are driven by the motor to rotate, so that the electrolyte solution forms flowing liquid in the electroplating pool, and the concentration of plating metal cations around the copper foil is continuously reduced when the plating metal cations are reduced to a plating layer on the surface of the copper foil.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a rear view of fig. 1 of the present invention.

Fig. 3 is a schematic view of a part of the first, second, and third toggle plates of the present invention.

Fig. 4 is a schematic view illustrating the rotation of the first toggle plate, the second toggle plate, and the third toggle plate according to the present invention.

Wherein, the names corresponding to the reference numbers are:

1. an electroplating pool; 2. a motor; 3. a first rotating shaft; 4. a second rotating shaft; 5. a third rotating shaft; 6. a first toggle plate; 7. a second toggle plate; 8. a third toggle plate; 9. a transmission mechanism; 91. a drive sprocket; 92. A driven sprocket; 93. a chain; 10. a fixed tube; 11. a water permeable barrier.

Detailed Description

The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.

Referring to the attached drawings 1 to 4 of the specification, an electroplating device for producing an electronic copper foil comprises an electroplating pool 1, wherein a motor 2 is fixedly arranged on one side of the electroplating pool 1, a first rotating shaft 3 is connected to the end portion of an output shaft of the motor 2 in a transmission manner, a second rotating shaft 4 and a third rotating shaft 5 are respectively arranged on two sides of the electroplating pool 1 in a penetrating manner, a first stirring plate 6 is arranged on the outer side of the first rotating shaft 3, a second stirring plate 7 is arranged on the outer side of the second rotating shaft 4, a third stirring plate 8 is arranged on the outer side of the third rotating shaft 5, and a transmission mechanism 9 is connected among the first rotating shaft 3, the second rotating shaft 4 and the third rotating shaft 5.

Furthermore, 1 inner chamber both sides of electroplating bath all are connected with water-permeable partition 11, and two water-permeable partition 11 divide into three space with electroplating bath 1, and the space in the middle of is convenient for set up first stirring board 6, second stirring board 7 and third stirring board 8, and the space of both sides is convenient for place carbon-point and copper foil, and the setting of water-permeable partition 11 is convenient for electrolyte solution to pass, can avoid first stirring board 6 or third stirring board 8 to cause the damage to carbon-point or copper foil in the space of both sides simultaneously.

Further, the one end that motor 2 was kept away from to first pivot 3, 4 both ends of second pivot and 5 both ends of third pivot all rotate through sealed rotation piece and electroplating bath 1 sealed rotation is connected, can prevent that first pivot 3, second pivot 4 and third pivot 5 from taking place to leak with electroplating bath 1 junction, and this sealed rotation piece does not do the injecture, can reach this effect all can, and sealed rotation piece in this scheme is sealed bearing.

Further, the outside of first pivot 3, the outside of second pivot 4 and the outside of third pivot 5 all are connected with fixed pipe 10, and first stirring board 6, second stirring board 7 and third stirring board 8 are connected respectively in the fixed pipe 10 outside of corresponding position, and the area of contact when fixed pipe 10 sets up and is convenient for increase first stirring board 6, second stirring board 7 and third stirring board 8 and connect for first stirring board 6, second stirring board 7 and third stirring board 8 are connected more stably.

Furthermore, at least two first poking plates, at least two second poking plates 7 and at least two third poking plates 8 are arranged and distributed in an annular array, and the first poking plates 6, the second poking plates 7 and the third poking plates 8 can enable the electrolyte solution to form flowing liquid in the electroplating pool 1 when rotating.

Further, drive mechanism 9 is including connecting at the outside drive sprocket 91 of first pivot 3, and connect at the outside driven sprocket 92 of second pivot 4 and third pivot 5, be connected with chain 93 between drive sprocket 91 and two driven sprocket 92, accessible chain 93 drives the driven sprocket 92 rotation of both sides when drive sprocket 91 rotates, drive mechanism 9 sets up and realizes that a motor 2 drives first pivot 3, second pivot 4 and third pivot 5 rotate simultaneously, resources are saved's use, the electric energy is practiced thrift simultaneously.

The implementation mode is as follows: in practical use, electrolyte solution of plating metal is filled into the electroplating pool 1, then the motor 2 is switched on to drive the first rotating shaft 3 and the first toggle plate 6 to rotate, the first rotating shaft 3 drives the second rotating shaft 4, the third rotating shaft 5, the second toggle plate 7 and the third toggle plate 8 to rotate in the same direction through the transmission mechanism 9, the first toggle plate 6, the second toggle plate 7 and the third toggle plate 8 stir the electrolyte solution on the upper layer in the electroplating pool 1 towards one direction when rotating, stir the electrolyte solution on the lower layer in the electroplating pool 1 towards the other direction, at the moment, the electrolyte solution forms flowing liquid in the electroplating pool 1, carbon rods and copper foil to be plated are respectively placed in spaces on two sides, metal cations of the plating layer begin to be reduced to the plating layer on the surface of the copper foil during electroplating, the concentration of the metal cations of the plating layer around the copper foil also begins to decrease continuously, and the electrolyte solution forms flowing liquid in the electroplating pool 1, the flow rate of the metal cations on the plating layer can be accelerated, so that the metal cations on the plating layer can be quickly supplemented to the periphery of the copper foil, and the electroplating efficiency of the copper foil can be effectively improved.

The above-mentioned embodiment is only one of the preferred embodiments of the present invention, and any insubstantial changes or modifications made within the spirit and scope of the main design of the present invention will solve the technical problems consistent with the present invention and shall be included in the scope of the present invention.

It is noted that, in this document, relational terms such as first and second, and the like, if any, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (6)

1. The utility model provides an electron copper foil production is with electroplating device, includes electroplating bath (1), its characterized in that, electroplating bath (1) one side is fixed to be provided with motor (2), motor (2) output shaft end transmission is connected with first pivot (3), electroplating bath (1) both sides are run through respectively and are provided with second pivot (4) and third pivot (5), first pivot (3) outside is provided with first board (6) of dialling, second pivot (4) outside is provided with the second and dials board (7), third pivot (5) outside is provided with the third and dials board (8), be connected with drive mechanism (9) between first pivot (3), second pivot (4) and third pivot (5).

2. The electroplating device for producing the electronic copper foil according to claim 1, wherein two sides of the inner cavity of the electroplating tank (1) are connected with water-permeable partition plates (11), and the two water-permeable partition plates (11) divide the electroplating tank (1) into three spaces.

3. The electroplating device for producing the electronic copper foil according to claim 1, wherein one end of the first rotating shaft (3) far away from the motor (2), two ends of the second rotating shaft (4) and two ends of the third rotating shaft (5) are hermetically and rotatably connected with the electroplating tank (1) through sealed rotating parts.

4. The electroplating apparatus for producing electronic copper foil according to claim 1, wherein a fixed pipe (10) is connected to the outside of the first rotating shaft (3), the outside of the second rotating shaft (4) and the outside of the third rotating shaft (5), and the first toggle plate (6), the second toggle plate (7) and the third toggle plate (8) are respectively connected to the outside of the fixed pipe (10) at corresponding positions.

5. The electroplating apparatus for producing electronic copper foil according to claim 1, wherein at least two of the first, second and third toggle plates (7, 8) are provided and are arranged in an annular array.

6. The electroplating apparatus for producing electronic copper foil according to claim 1, wherein the transmission mechanism (9) comprises a driving sprocket (91) connected to the outside of the first rotating shaft (3) and driven sprockets (92) connected to the outside of the second rotating shaft (4) and the third rotating shaft (5), and a chain (93) is connected between the driving sprocket (91) and the two driven sprockets (92).

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