CN216330116U - Heat abstractor and photocuring three-dimensional inkjet printer - Google Patents
Heat abstractor and photocuring three-dimensional inkjet printer Download PDFInfo
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- CN216330116U CN216330116U CN202122599601.7U CN202122599601U CN216330116U CN 216330116 U CN216330116 U CN 216330116U CN 202122599601 U CN202122599601 U CN 202122599601U CN 216330116 U CN216330116 U CN 216330116U
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Abstract
The application provides a heat abstractor and photocuring three-dimensional inkjet printer, wherein, heat abstractor is applied to three-dimensional inkjet printer, heat abstractor includes: the refrigeration system comprises a refrigeration unit, a cold guide unit, a heat dissipation unit, a cold guide piece and a hot guide piece, wherein the cold guide piece and the heat guide piece are used for guiding air to flow; the refrigerating unit comprises a refrigerating surface and a first heat radiating surface which are arranged oppositely; the cold guide unit is arranged on the refrigerating surface, and the cold guide piece is arranged on the cold guide unit; the heat dissipation unit is arranged on the first heat dissipation surface, and the heat conduction piece is arranged on the heat dissipation unit. The heat abstractor that this application embodiment provided, under the condition of being applied to three-dimensional printer, can utilize the cooperation setting of refrigeration unit, lead cold unit, radiating unit, cold drainage piece and hot drainage piece, fully absorb a large amount of heats that light curing three-dimensional printer produced at the during operation, carry out the cooling processing to light curing three-dimensional printer is whole, make light curing three-dimensional printer obtain better radiating effect.
Description
Technical Field
The application relates to the technical field of three-dimensional printing, in particular to a heat dissipation device and a photocuring three-dimensional printer.
Background
The photocuring three-dimensional printer is a three-dimensional printing device which irradiates resin by using a light source with a specific wavelength to initiate a corresponding photochemical reaction so as to enable the resin to be cured and formed from a liquid state.
When the light-cured three-dimensional printer works, the light source generates heat, and the resin is cured and molded to generate a large amount of heat, so that the temperature of the printer is overhigh. When the temperature is too high, the resin can not be cured normally, and the normal work of a light source and a display screen of the printer is influenced, so that the normal printing of the printer is influenced. At present, the photocuring three-dimensional printer mostly radiates through a mode of applying a radiating fin and/or a fan, and the radiating mode can only take away partial heat, so that the mode has limitation on the heat generated by resin curing and molding, and the radiating effect of the existing printer is poor.
Disclosure of Invention
An object of this application is to provide a heat abstractor and photocuring three-dimensional inkjet printer for solve the not good problem of radiating effect of printer.
In a first aspect, an embodiment of the present application provides a heat dissipation device, which is applied to a three-dimensional printer, the heat dissipation device includes:
the refrigeration system comprises a refrigeration unit, a cold guide unit, a heat dissipation unit, a cold guide piece and a hot guide piece, wherein the cold guide piece and the heat guide piece are used for guiding air to flow;
the refrigeration unit comprises a refrigeration surface and a first heat dissipation surface which are arranged in a back-to-back manner; the cold guide unit is arranged on the refrigerating surface, and the cold guide piece is arranged on the cold guide unit; the heat dissipation unit is arranged on the first heat dissipation surface, and the heat conduction piece is arranged on the heat dissipation unit.
Optionally, the heat dissipation unit includes a second heat dissipation surface abutted to the first heat dissipation surface, and an area of the second heat dissipation surface is larger than an area of the first heat dissipation surface.
Optionally, a first heat conduction medium is disposed between the cold guide unit and the refrigeration surface, the heat conduction efficiency of the first heat conduction medium is higher than that of the cold guide unit, and the heat conduction efficiency of the first heat conduction medium is higher than that of the refrigeration surface;
and a second heat conduction medium is arranged between the heat dissipation unit and the first heat dissipation surface, the heat conduction efficiency of the second heat conduction medium is higher than that of the heat dissipation unit, and the heat conduction efficiency of the second heat conduction medium is higher than that of the first heat dissipation surface.
Optionally, a plurality of first heat conduction blocks are arranged on the refrigeration surface, the plurality of first heat conduction blocks are arranged in an array, and the plurality of first heat conduction blocks are all abutted to the first heat conduction medium;
the first radiating surface is provided with a plurality of second heat conduction blocks, the second heat conduction blocks are arranged in an array mode, and the second heat conduction blocks are abutted to the second heat conduction medium.
Optionally, the heat dissipation device further includes a casing, the casing is disposed on the heat dissipation unit, and the heat conduction member is located in a cavity surrounded by the casing;
the shell is provided with a plurality of heat dissipation through holes which are arranged in an array.
Optionally, the area of the longitudinal section of the cavity enclosed by the casing is gradually increased along a direction away from the heat conduction member.
Optionally, the refrigeration unit includes refrigeration fins, the heat dissipation unit includes heat sinks, and the cold flow guide and the hot flow guide include fans.
In a second aspect, an embodiment of the present application further provides a photocuring three-dimensional printer, where the photocuring three-dimensional printer includes the heat dissipation device of the first aspect.
Optionally, the photocuring three-dimensional printer comprises a base, a casing and a light source assembly;
the casing and the light source assembly are arranged on the base, the light source assembly is located in a cavity surrounded by the casing, and the heat dissipation device is arranged on the side face of the casing.
Optionally, the photocuring three-dimensional printer further includes a sealing ring, and the sealing ring is disposed between the base and the casing.
The technical scheme has the following advantages or beneficial effects:
the heat abstractor that this application embodiment provided utilizes the cooperation setting of refrigeration unit, cold conduction unit, heat dissipation unit, cold drainage piece and heat drainage piece, and abundant light-absorbing curing three-dimensional printer is at a large amount of heats that the during operation produced, and the whole cooling of light-curing three-dimensional printer is handled, makes light-curing three-dimensional printer obtain better radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another heat dissipation apparatus provided in the embodiment of the present application;
FIG. 3 is a schematic structural diagram of a photo-curing three-dimensional printer according to an embodiment of the present disclosure;
fig. 4 is a second schematic structural diagram of a photocuring three-dimensional printer according to an embodiment of the present application;
fig. 5 is a third schematic structural diagram of a photocuring three-dimensional printer according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. In case of conflict, the embodiments and features of the embodiments described below may be combined with each other. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation device provided in an embodiment of the present application, the heat dissipation device is applied to a three-dimensional printer, and the heat dissipation device includes:
a refrigeration unit 11, a cold guide unit 12, a heat dissipation unit 13, and a cold flow guide 14 and a hot flow guide 15 for guiding air flow;
the refrigerating unit 11 comprises a refrigerating surface and a first heat radiating surface which are arranged in a back-to-back manner; the cold guide unit 12 is arranged on the refrigerating surface, and the cold guide piece 14 is arranged on the cold guide unit 12; the heat dissipation unit 13 is disposed on the first heat dissipation surface, and the heat conduction member 15 is disposed on the heat dissipation unit 13.
As above, by means of the matching arrangement of the refrigerating unit 11, the cold guide unit 12, the heat dissipation unit 13, the cold guide piece 14 and the heat guide piece 15, a large amount of heat generated by the photocuring three-dimensional printer during working is fully absorbed, and the whole photocuring three-dimensional printer is cooled, so that the photocuring three-dimensional printer obtains a better heat dissipation effect.
Wherein, lead cold unit 12 and be used for expanding the heat absorption scope of refrigerating unit 11, radiating unit 13 is used for diffusing the heat dissipation scope of refrigerating unit 11, and cold drainage piece 14 is used for guiding the air flow to accelerate refrigerating unit 11's heat absorption efficiency, hot drainage piece 15 is used for guiding the air flow, gives off efficiency with the heat that accelerates refrigerating unit 11.
Optionally, the heat dissipation unit 13 includes a second heat dissipation surface abutting against the first heat dissipation surface, and the area of the second heat dissipation surface is larger than that of the first heat dissipation surface.
In heat abstractor's working process, the refrigeration face of refrigeration unit 11 is used for absorbing the heat, and the first cooling surface of refrigeration unit 11 is used for giving off the heat, utilizes the bigger second cooling surface butt first cooling surface of area, makes the heat that refrigeration unit 11 gived fully conduct to cooling unit 13 department to outside conduction rapidly via heat conduction piece 15, refrigeration unit 11 obtains better radiating effect.
Optionally, a first heat-conducting medium 161 is disposed between the cold-conducting unit 12 and the refrigerating surface, the heat-conducting efficiency of the first heat-conducting medium 161 is higher than that of the cold-conducting unit 12, and the heat-conducting efficiency of the first heat-conducting medium 161 is higher than that of the refrigerating surface;
a second heat transfer medium 162 is disposed between the heat dissipation unit 13 and the first heat dissipation surface, the heat transfer efficiency of the second heat transfer medium 162 is higher than that of the heat dissipation unit 13, and the heat transfer efficiency of the second heat transfer medium 162 is higher than that of the first heat dissipation surface.
As shown in fig. 2, the heat transfer efficiency between the cold guide unit 12 and the cooling surface is increased by the arrangement of the first heat transfer medium 161 between the cold guide unit 12 and the cooling surface to further increase the heat absorption efficiency of the cooling unit 11.
By the arrangement of the second heat transfer medium 162 between the heat dissipation unit 13 and the first heat dissipation surface, the heat transfer efficiency between the heat dissipation unit 13 and the first heat dissipation surface is increased, so that the heat dissipation efficiency of the refrigeration unit 11 is further improved, and the heat absorption efficiency of the refrigeration unit 11 is indirectly improved.
For example, the first heat conduction medium 161 and the second heat conduction medium 162 may be heat conduction silicone grease or heat conduction silicone, the first heat conduction medium 161 may be placed between the cold conducting unit 12 and the refrigerating surface in the form of a gasket, or may be coated between the cold conducting unit 12 and the refrigerating surface in the form of a coating, and a setting manner of the second heat conduction medium 162 between the heat dissipating unit 13 and the first heat dissipating surface is the same as a setting manner of the first heat conduction medium 161, which is not described herein again; in practice, the material and the arrangement of the first heat transfer medium 161 and the second heat transfer medium 162 may be adaptively adjusted by a user, which is not limited in the embodiment of the present application.
Optionally, a plurality of first heat conduction blocks 163 are disposed on the cooling surface, the plurality of first heat conduction blocks 163 are arranged in an array, and the plurality of first heat conduction blocks 163 are all abutted to the first heat conduction medium 161;
the first heat dissipating surface is provided with a plurality of second heat conducting blocks 164, the plurality of second heat conducting blocks 164 are arranged in an array, and the plurality of second heat conducting blocks 164 are all abutted to the second heat conducting medium 162.
As shown in fig. 2, with the arrangement of the plurality of first heat transfer blocks 163, the contact area between the cooling surface and the first heat transfer medium 161 is increased to further improve the heat absorption efficiency of the cooling unit 11;
by arranging the plurality of second heat conduction blocks 164 in an array, the contact area between the first heat dissipation surface and the second heat conduction medium 162 is increased, so as to further improve the heat dissipation efficiency of the refrigeration unit 11.
For example, it is preferable that the first heat conduction block 163 is integrally formed with the cooling unit 11, and the first heat conduction block 163 may be a hollow bump (e.g., a square bump, a semicircular bump, etc.) on the cooling surface, and the purpose of the second heat conduction block 164 is the same as that of the first heat conduction block 163, which is not described herein, and in practice, a user may adaptively adjust the shapes of the first heat conduction block 163 and the second heat conduction block 164, which is not limited in this embodiment of the present application.
Optionally, the heat dissipation device further includes a casing 17, the casing 17 is disposed on the heat dissipation unit 13, and the heat conduction member 15 is located in a cavity surrounded by the casing 17;
the housing 17 is provided with a plurality of heat dissipating through holes 171, and the plurality of heat dissipating through holes 171 are arranged in an array.
By means of the arrangement of the cover shell 17, the heat conduction piece 15 is protected, and the probability that the heat conduction piece 15 is damaged is reduced; by utilizing the array arrangement of the plurality of heat dissipation through holes 171, the air outside the casing 17 and the air in the cavity surrounded by the casing 17 keep circulating, the adverse effect of the casing 17 in the heat dissipation process of the heat dissipation device is reduced, the direct contact between (the hand of) a user and the heat conduction element 15 is blocked, and the probability that the user is injured is reduced.
Alternatively, the area of the longitudinal section of the cavity enclosed by the casing 17 increases progressively in the direction away from the heat conducting element 15.
The cavity enclosed by the housing 17 is trumpet-shaped, and the area of the longitudinal section of the trumpet-shaped cavity is the smallest at the position connected with the heat dissipation unit 13; along the axis of heat dissipation through-hole 171, towards the direction of keeping away from heat conduction piece 15 (keeping away from radiating unit 13 promptly), the area of the longitudinal section of this tubaeform cavity increases gradually, utilizes tubaeform cavity, further heat conduction piece 15 drive air flow's efficiency, promotes the radiating efficiency of refrigerating unit 11.
Optionally, the refrigeration unit 11 comprises refrigeration fins, the heat dissipation unit 13 comprises heat dissipation fins, and the cold and hot drains 14, 15 comprise fans.
Under the condition that the refrigerating unit 11 comprises a refrigerating sheet, the heat radiating unit 13 comprises a heat radiating sheet, and the cold flow guiding piece 14 and the heat flow guiding piece 15 comprise fans, the refrigerating sheet is enabled to form a refrigerating surface for absorbing heat and a first heat radiating surface for radiating heat by utilizing a Peltier effect (Peltier effect), wherein the refrigerating surface can absorb a large amount of heat generated by the three-dimensional printer in the working process through the matching of the cold flow guiding unit 12 and the cold flow guiding piece 14, so that the heat radiating rate and the heat radiating effect of the three-dimensional printer are both improved; the first heat dissipating surface dissipates heat generated during the operation of the refrigerating unit 11 to the outside through the cooperation of the heat dissipating unit 13 and the heat inducing member 15.
In practice, the user can adaptively adjust the specific structures of the refrigeration unit 11, the heat dissipation unit 13, the cold conduction unit 12, the cold conduction member 14 and the hot conduction member 15, which is not limited in the embodiment of the present application.
In some embodiments of the present application, a heat dissipation device includes: a refrigeration unit 11, a cold guide unit 12, a heat dissipation unit 13, and a cold flow guide 14 and a hot flow guide 15 for guiding air flow;
the refrigerating unit 11 comprises a refrigerating surface and a first heat radiating surface which are arranged in a back-to-back manner; the cold guide unit 12 is arranged on the refrigerating surface, and the cold guide piece 14 is arranged on the cold guide unit 12; the heat dissipation unit 13 is disposed on the first heat dissipation surface, and the heat conduction member 15 is disposed on the heat dissipation unit 13.
Further, the heat dissipating unit 13 includes a second heat dissipating surface abutting against the first heat dissipating surface, and an area of the second heat dissipating surface is larger than an area of the first heat dissipating surface.
Further, a first heat conduction medium 161 is arranged between the cold guide unit 12 and the refrigerating surface, the heat conduction efficiency of the first heat conduction medium 161 is higher than that of the cold guide unit 12, and the heat conduction efficiency of the first heat conduction medium 161 is higher than that of the refrigerating surface;
a second heat transfer medium 162 is disposed between the heat dissipation unit 13 and the first heat dissipation surface, the heat transfer efficiency of the second heat transfer medium 162 is higher than that of the heat dissipation unit 13, and the heat transfer efficiency of the second heat transfer medium 162 is higher than that of the first heat dissipation surface.
Furthermore, a plurality of first heat conduction blocks 163 are arranged on the refrigerating surface, the plurality of first heat conduction blocks 163 are arranged in an array, and the plurality of first heat conduction blocks 163 are all abutted with the first heat conduction medium 161;
the heat dissipating surface is provided with a plurality of second heat conducting blocks 164, the plurality of second heat conducting blocks 164 are arranged in an array, and the plurality of second heat conducting blocks 164 are all abutted to the second heat conducting medium 162.
Further, the heat dissipation device further comprises a housing 17, the housing 17 is arranged on the heat dissipation unit 13, and the heat conduction member 15 is located in a cavity surrounded by the housing 17;
the housing 17 is provided with a plurality of heat dissipating through holes 171, and the plurality of heat dissipating through holes 171 are arranged in an array.
Further, the area of the cross section of the cavity enclosed by the casing 17 is gradually increased in the direction away from the heat conduction member 15.
Further, the cooling unit 11 includes cooling fins, the heat dissipating unit 13 includes cooling fins, and the cold and hot drains 14 and 15 include fans.
As shown in fig. 3, other embodiments of the present application further provide a photo-curing three-dimensional printer including the heat dissipation device.
As shown in fig. 4 and 5, the photo-curing three-dimensional printer further includes a base 20, a housing 30, and a light source assembly 40;
the casing 30 and the light source assembly 40 are both disposed on the base 20, the light source assembly 40 is located in a cavity surrounded by the casing 30, and the heat sink is disposed on a side surface of the casing 30.
An exposure screen 70 is arranged on the machine shell 30, a resin box 60 is arranged on the exposure screen 70, a cold flow guiding piece 14 of the heat dissipation device faces the light source component 40, and a hot flow guiding piece 15 of the heat dissipation device faces the outside of the machine shell 30; in photocuring three-dimensional printer working process, can produce a large amount of heats in the cavity (main heat source is the regional and exposure screen 70 regional of light source subassembly 40 place), utilize heat abstractor's setting, fully absorb the heat in the cavity (cold drainage piece 14 drives the air flow in the cavity, make each department keep close temperature in the cavity), make the whole better radiating effect that obtains of photocuring three-dimensional printer, and corresponding improvement three-dimensional printer's printing efficiency, the life of each part (like light source subassembly 40, exposure screen 70 etc.) in the extension three-dimensional printer.
The heat sink is disposed at the side of the casing 30 to avoid increasing the overall height of the casing 30 (compared to the case where the heat sink is disposed at the bottom of the casing 30).
Further, the photo-curing three-dimensional printer further includes a sealing ring 50, and the sealing ring 50 is disposed between the base 20 and the housing 30.
Utilize the setting of sealing washer 50, seal the cavity that the casing 30 encloses, can guarantee on the one hand that heat abstractor's heat absorption function obtains abundant application in the cavity, on the other hand also can the separation dust etc. get into the cavity, avoid light source subassembly 40 to be adsorbed by the dust and receive interference or damage.
For example, the sealing ring 50 may be an annular rubber ring, and in practice, a user may also adjust the material and shape of the sealing ring 50, which is not limited in the embodiment of the present application.
The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and refinements can be made without departing from the principle described in the present application, and these modifications and refinements should be regarded as the protection scope of the present application.
Claims (10)
1. The utility model provides a heat abstractor, is applied to three-dimensional inkjet printer, its characterized in that includes:
the refrigeration system comprises a refrigeration unit, a cold guide unit, a heat dissipation unit, a cold guide piece and a hot guide piece, wherein the cold guide piece and the heat guide piece are used for guiding air to flow;
the refrigeration unit comprises a refrigeration surface and a first heat dissipation surface which are arranged in a back-to-back manner; the cold guide unit is arranged on the refrigerating surface, and the cold guide piece is arranged on the cold guide unit; the heat dissipation unit is arranged on the first heat dissipation surface, and the heat conduction piece is arranged on the heat dissipation unit.
2. The heat dissipating device according to claim 1, wherein the heat dissipating unit includes a second heat dissipating surface abutting against the first heat dissipating surface, and an area of the second heat dissipating surface is larger than an area of the first heat dissipating surface.
3. The heat dissipation device as claimed in claim 1, wherein a first heat transfer medium is disposed between the cold conducting unit and the refrigeration surface, the first heat transfer medium having a heat transfer efficiency higher than that of the cold conducting unit and a heat transfer efficiency higher than that of the refrigeration surface;
and a second heat conduction medium is arranged between the heat dissipation unit and the first heat dissipation surface, the heat conduction efficiency of the second heat conduction medium is higher than that of the heat dissipation unit, and the heat conduction efficiency of the second heat conduction medium is higher than that of the first heat dissipation surface.
4. The heat dissipating device of claim 3, wherein the cooling surface has a plurality of first heat conducting blocks disposed thereon, the plurality of first heat conducting blocks being arranged in an array, and the plurality of first heat conducting blocks all abutting against the first heat conducting medium;
the first radiating surface is provided with a plurality of second heat conduction blocks, the second heat conduction blocks are arranged in an array mode, and the second heat conduction blocks are abutted to the second heat conduction medium.
5. The heat dissipating device of claim 1, further comprising a casing disposed on the heat dissipating unit, wherein the heat conducting member is located in a cavity defined by the casing;
the shell is provided with a plurality of heat dissipation through holes which are arranged in an array.
6. The heat dissipating device of claim 5, wherein the area of the longitudinal cross section of the cavity enclosed by the casing increases in a direction away from the heat conducting member.
7. The heat sink of claim 1, wherein the refrigeration unit comprises refrigeration fins, the heat sink unit comprises heat fins, and the cold and hot drains comprise fans.
8. A photocuring three-dimensional printer comprising the heat dissipating device of any one of claims 1 to 7.
9. The stereolithographic printer of claim 8, wherein said stereolithographic printer includes a base, a housing, and a light source assembly;
the casing and the light source assembly are arranged on the base, the light source assembly is located in a cavity surrounded by the casing, and the heat dissipation device is arranged on the side face of the casing.
10. The photo-cured three-dimensional printer according to claim 9, further comprising a gasket disposed between the base and the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122599601.7U CN216330116U (en) | 2021-10-27 | 2021-10-27 | Heat abstractor and photocuring three-dimensional inkjet printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122599601.7U CN216330116U (en) | 2021-10-27 | 2021-10-27 | Heat abstractor and photocuring three-dimensional inkjet printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216330116U true CN216330116U (en) | 2022-04-19 |
Family
ID=81131561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122599601.7U Active CN216330116U (en) | 2021-10-27 | 2021-10-27 | Heat abstractor and photocuring three-dimensional inkjet printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216330116U (en) |
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2021
- 2021-10-27 CN CN202122599601.7U patent/CN216330116U/en active Active
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