CN216325064U - Intermediate package device for atomized copper powder - Google Patents
Intermediate package device for atomized copper powder Download PDFInfo
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- CN216325064U CN216325064U CN202022706081.0U CN202022706081U CN216325064U CN 216325064 U CN216325064 U CN 216325064U CN 202022706081 U CN202022706081 U CN 202022706081U CN 216325064 U CN216325064 U CN 216325064U
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- tundish
- slag
- prevention device
- copper
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Abstract
The utility model relates to the technical field of subsequent treatment of metal recovered from etching solution, in particular to a tundish device for atomized copper powder. The utility model relates to a tundish device for atomizing copper powder, which comprises a tundish body and a slag prevention device, wherein the slag prevention device is in a spherical crown shape, the top of the slag prevention device is provided with a discharge hole, and the discharge hole penetrates through the tundish body and the slag prevention device. The slag preventing device is adopted, and after the molten copper is poured, the molten copper can be accumulated between the slag preventing device and the tundish body, so that the effect of buffering the flow speed when the molten copper is just poured is achieved, and the problems that when the tundish is recycled, the impurities are not thoroughly cleaned, the molten copper impacts the discharge hole at an excessively high speed, and the production is influenced due to blockage of the tundish are avoided. The utility model is beneficial to improving the production efficiency and has the advantage of long service life.
Description
Technical Field
The utility model relates to the technical field of subsequent treatment of metal recovered from etching solution, in particular to a tundish device for atomized copper powder.
Background
In metal smelting and casting, the tundish is an important metallurgical process device, not only is a buffer for distributing and ensuring continuous casting of molten copper, but also is a key device for removing non-metallic inclusions, homogenizing the temperature of the molten copper, and ensuring uniform flow velocity, flow rate and other quality control of the molten copper.
And because the copper of retrieving in the etching solution is different with the copper through ore smelting, it is less to retrieve impurity in the gained copper, but the impurity that contains is mostly metal and wherein silver content is higher, because its density is greater than copper, the bottom that can be located middle package at the in-process of copper water continuous casting sneaks into in the copper water, it has impurity to cause to atomize in-process, influence the quality of product, also can cause the discharge opening to block up simultaneously and influence production, consequently need one kind at present and can reduce the impurity in the copper water, prevent that the discharge opening from causing stifled package and influence production, improve the middle package device of follow-up atomizing copper's purity.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides a tundish device which can reduce impurities in copper water, prevent a discharge hole from blocking a ladle to influence production and improve the purity of subsequent atomized copper.
The tundish device comprises a tundish body and a slag prevention device, wherein the slag prevention device is in a spherical crown shape, and a discharge hole is formed in the top of the slag prevention device and penetrates through the tundish body and the slag prevention device.
The slag preventing device is adopted, and after the molten copper is poured, the molten copper can be accumulated between the slag preventing device and the tundish body, so that the flow speed is buffered when the molten copper is just poured, and the influence on production caused by blockage due to impact of impurities to the discharge hole due to incomplete cleaning of the internal impurities when the tundish is reused is avoided.
Preferably, the top of the tundish body is provided with a cover body, the cover body is provided with a feed inlet, the bottom of the feed inlet is provided with a drainage rod, and the drainage rod is positioned above the side wall of the tundish body.
By adopting the structure, the copper liquid can slowly flow down along the side wall of the tundish through drainage, and impurities are prevented from turning up and entering the discharge hole.
Preferably, the bottom of the cover body is provided with an annular fixing block, and the annular fixing block is clamped on the outer side of the top of the tundish body.
The structure can strengthen the fixing stability of the cover body and the tundish body, and prevent the drainage rod from contacting with the tundish to cause surface abrasion of the tundish, thereby influencing the service life of the tundish.
Preferably, the side wall of the tundish body is provided with an annular slag blocking block, and the bottom of the annular slag blocking block is provided with a plurality of through holes.
The utility model is additionally provided with the annular slag blocking block, thereby further enhancing the slag discharging capability of the utility model and further improving the production efficiency of the utility model.
Preferably, the diameter of the tundish body is gradually reduced from top to bottom.
By adopting the structure, on one hand, the flow speed of the copper water can be slowed down, the impurities are prevented from turning up, and meanwhile, the amount of the copper water accumulated between the slag prevention device and the tundish body is reduced, and the production cost is reduced.
The utility model has the beneficial effects that: 1. the utility model can improve the purity of the product; 2. the utility model has long service life, 3. the utility model is helpful to reduce the production cost.
Drawings
FIG. 1 is a schematic diagram of a structure of the present invention.
Detailed Description
The utility model is further explained below with reference to specific embodiments.
Example 1
The utility model provides an atomizing copper powder's middle package device, includes middle package body 1 and prevents sediment device 2, prevents that sediment device 2 is the spherical crown shape, prevents that the top of sediment device 2 is equipped with discharge opening 3, and discharge opening 3 runs through middle package body 1 and prevents sediment device 2. The top of tundish body 1 is equipped with lid 4, is equipped with feed inlet 5 on the lid 4, and the bottom of feed inlet 5 is equipped with drainage rod 6, and drainage rod 6 is located the top of the lateral wall of tundish body 1. The bottom of the cover body 4 is provided with an annular fixing block 7, and the annular fixing block 7 is clamped at the outer side of the top of the tundish body 1. The lateral wall of middle package body 1 is equipped with annular slag stopping block 8, and the bottom of annular slag stopping block 8 is equipped with a plurality of through-hole 9. The diameter of the tundish body 1 gradually decreases from top to bottom.
According to the utility model, after copper water is poured, copper liquid flows onto the side wall of the tundish body 1 along the drainage rod 6 and is blocked by the annular slag blocking block 8, the copper water flows down from the through hole 9, part of impurities are accumulated on the annular slag blocking block 8, then the copper water is accumulated between the slag preventing device 2 and the tundish body 1, and the impurities are precipitated at the bottom and are accumulated between the tundish body 1 and the slag preventing device 2, so that the effect of buffering the flow speed when the copper water is just poured is achieved, and the phenomenon that when the tundish is reused, impurities are impacted to the discharge hole 3 due to the fact that the inside impurities are not thoroughly cleaned, the copper water is too fast, and the production is influenced is avoided.
Claims (4)
1. The tundish device for atomizing copper powder comprises a tundish body and a slag prevention device, and is characterized in that the slag prevention device is in a spherical crown shape, and a discharge hole is formed in the top of the slag prevention device and penetrates through the tundish body and the slag prevention device.
2. The tundish apparatus for atomizing copper powder of claim 1, wherein: the top of middle package body be equipped with the lid, the lid on be equipped with the feed inlet, the bottom of feed inlet be equipped with the drainage pole, the drainage pole be located the top of the lateral wall of middle package body.
3. The apparatus of claim 2, wherein: the bottom of the cover body is provided with an annular fixed block which is clamped outside the top of the tundish body, the side wall of the tundish body is provided with an annular slag stopping block, and the bottom of the annular slag stopping block is provided with a plurality of through holes.
4. A tundish means for atomizing copper powder as claimed in claim 3, wherein: the diameter of the tundish body is gradually reduced from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022706081.0U CN216325064U (en) | 2020-11-20 | 2020-11-20 | Intermediate package device for atomized copper powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022706081.0U CN216325064U (en) | 2020-11-20 | 2020-11-20 | Intermediate package device for atomized copper powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216325064U true CN216325064U (en) | 2022-04-19 |
Family
ID=81128683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022706081.0U Active CN216325064U (en) | 2020-11-20 | 2020-11-20 | Intermediate package device for atomized copper powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216325064U (en) |
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2020
- 2020-11-20 CN CN202022706081.0U patent/CN216325064U/en active Active
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