CN216323723U

CN216323723U - A wafer cleaning machine for wafer processing

Info

Publication number: CN216323723U
Application number: CN202123096965.XU
Authority: CN
Inventors: 高文峰
Original assignee: Shanghai Yifeng Environmental Protection Technology Co ltd
Current assignee: Shanghai Yifeng Environmental Protection Technology Co ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-04-19
Anticipated expiration: 2031-12-10

Abstract

The utility model relates to the technical field of wafer cleaning machines, and discloses a wafer cleaning machine for wafer processing, which comprises a box shell and a turnover cover positioned at the top of the box shell, wherein straight rods are rotatably connected to the front side wall and the rear side wall of an inner cavity of the box shell, a wafer fixing part is fixedly connected between the two straight rods, a power part in transmission connection with the straight rods on the back side is arranged on the box shell, transverse pipes positioned on the left side of the wafer fixing part are rotatably connected inside the box shell, the right ends of the transverse pipes are communicated with short pipes, and the right sides of the short pipes are communicated with spray heads distributed at equal intervals. This a wafer cleaning machine for wafer processing possesses advantages such as cleaning efficiency height, has solved prior art, treats that abluent wafer board is fixed on wafer cleaning machine's clean bench, washes the wafer board on the clean bench through the shower nozzle that is located the clean bench top, and the cleaning range is limited, can not wash the reverse side of wafer board, needs reverse placing the wafer board once more for the problem that cleaning efficiency is low.

Description

A wafer cleaning machine for wafer processing

Technical Field

The utility model relates to the technical field of wafer cleaning machines, in particular to a wafer cleaning machine for wafer processing.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, in the production and cleaning process of the silicon wafer, a cleaning machine is used for effectively removing organic matters, particles, metal impurities, natural oxidation layers, quartz, plastics and other pollutants on the surface of the silicon wafer, the surface characteristics of the wafer are not damaged, corresponding cleaning units are configured according to different cleaning processes, and each part is independently controlled and randomly combined.

In the prior art, a wafer plate to be cleaned is fixed on a cleaning table of a wafer cleaning machine, a water spray head positioned above the cleaning table is used for washing the wafer plate on the cleaning table, the cleaning range is limited, the reverse side of the wafer plate cannot be cleaned, and the wafer plate needs to be placed again in the reverse direction, so that the cleaning efficiency is low, and the wafer cleaning machine for wafer processing is provided to solve the problem.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer cleaning machine for wafer processing, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a wafer cleaning machine for wafer processing, includes case shell and the flip that is located the case shell top, both sides wall all rotates around the inner chamber of case shell and is connected with the straight-bar, two fixedly connected with wafer mounting between the straight-bar, be provided with on the case shell with the back the power spare that the straight-bar transmission is connected, the inside of case shell is rotated and is connected with and is located the left violently pipe of wafer mounting, the right-hand member intercommunication of violently managing has the nozzle that the equidistance distributes, violently be provided with the driving medium of being connected with the power spare transmission on the pipe, the left end fixedly connected with of nozzle stub is located the left rotary joint of case shell.

The utility model has the beneficial effects that:

this a wafer cleaning machine for wafer processing, through treating abluent wafer board to fix on the wafer mounting, through rotary joint and water pipe intercommunication, water pipe and outside pump body intercommunication, make water pass through rotary joint and violently inside pipe entering nozzle stub, again by the shower nozzle blowout, wash wafer board on the wafer mounting, cooperate power spare and driving medium simultaneously, make the straight-bar drive wafer mounting and rotate, the wafer mounting drives the brilliant plectane on it and rotates, violently pipe drive nozzle stub rotation simultaneously, the nozzle stub drives the shower nozzle and removes, and then increase the scope of washing, make shower nozzle spun hydroenergy make a round trip to wash the two sides of brilliant plectane, from reaching the purpose that the cleaning efficiency is high.

As a still further scheme of the utility model: the back of case shell and flip is articulated through the hinge, the straight-bar is around the symmetric distribution.

Adopt above-mentioned further scheme's beneficial effect be, cooperate the hinge, conveniently open and shut flip on the case shell.

As a still further scheme of the utility model: the wafer fixing piece comprises ring blocks fixedly connected with two opposite ends of the straight rods, and the tops of the ring blocks are fixedly connected with compression rings through bolts distributed in an annular mode.

The wafer plate to be cleaned is positioned between the ring block and the pressure ring by disassembling the bolts, and then the bolts are installed to fix the wafer plate to be cleaned.

As a still further scheme of the utility model: the power part comprises a motor fixedly connected with the back face of the box shell, a rotating shaft is fixedly connected with the output end of the motor, a main gear is sleeved on the outer side of the rotating shaft, first belt wheels are sleeved on the outer sides of the rotating shaft and the back face of the straight rod, and the two first belt wheels are in transmission connection through a first transmission belt.

The beneficial effect of adopting the above further scheme is that the motor drives the rotating shaft to rotate, the rotating shaft drives the first belt wheel and the main gear to rotate, the straight rod on the back surface is enabled to rotate by matching with the first transmission belt, the straight rod drives the ring block to rotate, and the wafer plate to be cleaned on the ring block is enabled to rotate along with the ring block.

As a still further scheme of the utility model: the front end and the rear end of the short pipe are both in a sealed shape, and the transverse pipe is perpendicular to the short pipe.

The beneficial effect of adopting above-mentioned further scheme is that, through rotary joint and water pipe intercommunication, water pipe and outside pump body intercommunication make water pass through rotary joint and violently pipe entering nozzle stub insidely, is again spouted by the shower nozzle, washs wafer board on the wafer mounting.

As a still further scheme of the utility model: the transmission part comprises a round shaft rotationally connected with the left side wall of the inner cavity of the box shell, a pinion meshed with the main gear is sleeved on the outer side of the round shaft, second belt wheels are sleeved on the outer sides of the round shaft and the rotating shaft, and the two second belt wheels are in transmission connection through a second transmission belt;

as a still further scheme of the utility model: the bearing fixedly connected with the inside of the box shell is sleeved on the outer side of the transverse pipe, and the circular shaft is perpendicular to the rotating shaft.

The beneficial effect of adopting above-mentioned further scheme is that, drive the pinion by the master gear and rotate, and the pinion drives the circle axle and rotates, and the second band pulley rotation on it is driven to the circle axle, cooperates the second drive belt for violently managing and driving the nozzle shift of pipe nipple rotation, and then increase the scope of washing.

Drawings

FIG. 1 is a schematic diagram of a wafer cleaning machine for wafer processing;

FIG. 2 is a left side view of a wafer cleaning machine for wafer processing;

FIG. 3 is a top view of a power unit of a wafer cleaning machine for wafer processing;

FIG. 4 is a right side sectional view of a wafer holder in a wafer cleaning machine for wafer processing.

In the figure: 1. a cabinet housing; 2. a cover is turned; 3. a straight rod; 4. a wafer fixing member; 41. a ring block; 42. a bolt; 43. pressing a ring; 5. a power member; 51. a motor; 52. a rotating shaft; 53. a main gear; 54. a first pulley; 55. a first drive belt; 6. a transverse tube; 7. a short pipe; 8. a spray head; 9. a transmission member; 91. a circular shaft; 92. a pinion gear; 93. a second pulley; 94. a second belt; 10. a rotary joint.

Detailed Description

Referring to fig. 1 to 4, in the embodiment of the utility model, a wafer cleaning machine for wafer processing comprises a box shell 1 and a flip cover 2 positioned at the top of the box shell 1, straight rods 3 are rotatably connected to the front side wall and the rear side wall of an inner cavity of the box shell 1, a wafer fixing member 4 is fixedly connected between the two straight rods 3, a power member 5 in transmission connection with the straight rod 3 at the back side is arranged on the box shell 1, a transverse pipe 6 positioned at the left side of the wafer fixing member 4 is rotatably connected inside the box shell 1, a short pipe 7 is communicated with the right end of the transverse pipe 6, spray heads 8 distributed equidistantly are communicated with the right side of the short pipe 7, a transmission member 9 in transmission connection with the power member 5 is arranged on the transverse pipe 6, a rotary joint 10 positioned at the left side of the box shell 1 is fixedly connected with the left end of the short pipe 7, the backs of the box shell 1 and the straight rods 3 are hinged through hinges, the front and rear symmetrical distribution of the straight rods 3, and the flip cover are matched with hinges to facilitate opening and closing of the flip cover 2 on the box shell 1, the wafer fixing part 4 comprises a ring block 41 fixedly connected with one end of the two straight rods 3 opposite to each other, the top of the ring block 41 is fixedly connected with a pressing ring 43 through bolts 42 distributed in an annular manner, the wafer plate to be cleaned is positioned between the ring block 41 and the pressing ring 43 by disassembling the bolts 42, then the bolts 42 are installed to fix the wafer plate to be cleaned, the power part 5 comprises a motor 51 fixedly connected with the back of the box shell 1, the output end of the motor 51 is fixedly connected with a rotating shaft 52, a main gear 53 is sleeved on the outer side of the rotating shaft 52, first pulleys 54 are sleeved on the outer sides of the rotating shaft 52 and the straight rods 3 on the back, the two first pulleys 54 are in transmission connection through a first transmission belt 55, the rotating shaft 52 is driven by the motor 51 to rotate, the rotating shaft 52 drives the first pulleys 54 and the main gear 53 to rotate, the straight rods 3 on the back are matched with the first transmission belt 55 to enable the straight rods 3 to drive the ring block 41 to rotate, so that the wafer plate to be cleaned on the straight rods 3 rotates along with the straight rods, the front end and the rear end of the short pipe 7 are both in a sealing shape, the transverse pipe 6 and the short pipe 7 are mutually vertical and are communicated with a water pipeline through a rotary joint 10, the water pipeline is communicated with an external pump body, water enters the short pipe 7 through the rotary joint 10 and the transverse pipe 6 and is sprayed out by a spray head 8 to clean a wafer plate on the wafer fixing part 4, a transmission part 9 comprises a round shaft 91 rotationally connected with the left side wall of the inner cavity of the box shell 1, an auxiliary gear 92 meshed with the main gear 53 is sleeved on the outer side of the round shaft 91, second belt wheels 93 are sleeved on the outer side of the round shaft 91 and the outer side of the rotating shaft 52, two second belt wheels 93 are in transmission connection through a second transmission belt 94, a bearing fixedly connected with the inner part of the box shell 1 is sleeved on the outer side of the transverse pipe 6, the round shaft 91 and the rotating shaft 52 are mutually vertical, the auxiliary gear 92 is driven by the main gear 53 to rotate, the auxiliary gear 92 drives the round shaft 91 to rotate, the round shaft 91 drives the second belt wheels 93 to rotate, the second transmission belt 94 is matched, so that the transverse pipe 6 drives the short pipe 7 to rotate, the short pipe 7 drives the spray head 8 to move, and the washing range is enlarged.

The working principle of the utility model is as follows:

the first step is as follows: opening the turnover cover 2 on the box shell 1, enabling the wafer plate to be cleaned to be positioned between the ring block 41 and the pressing ring 43 by disassembling the bolts 42, installing the bolts 42, and fixing the wafer plate to be cleaned;

the second step is that: the water pipe is communicated with an external pump body through the rotary joint 10, so that water enters the short pipe 7 through the rotary joint 10 and the transverse pipe 6 and is sprayed out of the spray head 8 to clean the wafer plate on the wafer fixing piece 4;

the third step: the motor 51 drives the rotating shaft 52 to rotate, the rotating shaft 52 drives the first belt pulley 54 and the main gear 53 to rotate, the first transmission belt 55 is matched, the straight rod 3 on the back face is made to rotate, the straight rod 3 drives the ring block 41 to rotate, the wafer plate to be cleaned on the straight rod rotates along with the rotation, the main gear 53 drives the auxiliary gear 92 to rotate, the auxiliary gear 92 drives the circular shaft 91 to rotate, the circular shaft 91 drives the second belt pulley 93 on the circular shaft to rotate, the second transmission belt 94 is matched, the transverse pipe 6 drives the short pipe 7 to rotate, the short pipe 7 drives the spray head 8 to move, the washing range is further enlarged, and water sprayed by the spray head 8 can wash the two faces of the wafer plate back and forth.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to or changed within the scope of the present invention.

Claims

1. A wafer cleaning machine for wafer processing comprises a box shell (1) and a turnover cover (2) positioned at the top of the box shell (1), it is characterized in that the front side wall and the rear side wall of the inner cavity of the box shell (1) are respectively and rotatably connected with a straight rod (3), a wafer fixing piece (4) is fixedly connected between the two straight rods (3), the box shell (1) is provided with a power part (5) in transmission connection with the straight rod (3) on the back, a transverse pipe (6) positioned at the left side of the wafer fixing piece (4) is rotatably connected inside the box shell (1), the right end of the transverse pipe (6) is communicated with a short pipe (7), the right side of the short pipe (7) is communicated with spray heads (8) which are distributed equidistantly, a transmission piece (9) in transmission connection with the power piece (5) is arranged on the transverse pipe (6), the left end of the short pipe (7) is fixedly connected with a rotary joint (10) positioned on the left side of the box shell (1).

2. The wafer cleaning machine for wafer processing as claimed in claim 1, wherein the back surfaces of the box (1) and the flip (2) are hinged through hinges, and the straight rods (3) are symmetrically distributed in front and back.

3. The wafer cleaning machine for wafer processing as claimed in claim 2, wherein the wafer fixing member (4) comprises a ring block (41) fixedly connected with one end of the two straight rods (3) opposite to each other, and a pressing ring (43) is fixedly connected with the top of the ring block (41) through bolts (42) distributed in an annular shape.

4. The wafer cleaning machine for wafer processing as claimed in claim 3, wherein the power member (5) includes a motor (51) fixedly connected to the back of the housing (1), an output end of the motor (51) is fixedly connected to a rotating shaft (52), a main gear (53) is sleeved on an outer side of the rotating shaft (52), the rotating shaft (52) and an outer side of the straight rod (3) on the back are sleeved with first belt pulleys (54), and the two first belt pulleys (54) are in transmission connection through a first transmission belt (55).

5. The wafer cleaning machine for wafer processing as claimed in claim 4, characterized in that the short tube (7) is closed at the front and rear ends, and the horizontal tube (6) and the short tube (7) are perpendicular to each other.

6. The wafer cleaning machine for wafer processing as claimed in claim 5, wherein the transmission member (9) comprises a circular shaft (91) rotatably connected with the left side wall of the inner cavity of the housing (1), a secondary gear (92) meshed with the main gear (53) is sleeved on the outer side of the circular shaft (91), second belt pulleys (93) are sleeved on the outer sides of the circular shaft (91) and the rotating shaft (52), and the two second belt pulleys (93) are in transmission connection through a second transmission belt (94).

7. The wafer cleaning machine for wafer processing as claimed in claim 6, wherein the outside of the horizontal tube (6) is sleeved with a bearing fixedly connected with the inside of the box shell (1), and the circular shaft (91) and the rotating shaft (52) are perpendicular to each other.