CN216311483U - Thermal piezoresistor convenient to encapsulate - Google Patents
Thermal piezoresistor convenient to encapsulate Download PDFInfo
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- CN216311483U CN216311483U CN202121745590.2U CN202121745590U CN216311483U CN 216311483 U CN216311483 U CN 216311483U CN 202121745590 U CN202121745590 U CN 202121745590U CN 216311483 U CN216311483 U CN 216311483U
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- thermal
- piezoresistor
- protective shell
- sensitive resistor
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Abstract
The utility model discloses a thermal piezoresistor convenient to package, which comprises a protective shell, a thermal piezoresistor body, a bottom plate, pin holes and positioning plates, wherein the thermal piezoresistor body is arranged at one end inside the protective shell, the bottom plate is arranged at the bottom of the protective shell below the thermal piezoresistor body, the positioning plates are fixed at two sides of the bottom end of the bottom plate, the pin holes are formed in one side inside the positioning plates, two ends of each pin hole extend to the outside of the positioning plate, threaded holes are formed in the bottom of the protective shell at the positions of the pin holes, locking bolts are arranged at the bottom ends of the positioning plates at the positions of the pin holes, and the top ends of the locking bolts penetrate through the pin holes and are in threaded connection with the threaded holes. The utility model not only improves the processing efficiency of the hot piezoresistor during use, prolongs the service life of the hot piezoresistor, but also reduces the maintenance cost of the hot piezoresistor during use.
Description
Technical Field
The utility model relates to the technical field of thermal piezoresistors, in particular to a thermal piezoresistor convenient to package.
Background
The thermal piezoresistor is a short-name voltage-sensitive resistor, and is a non-linear resistor element, the resistance value of the piezoresistor is related to the voltage applied at two ends, when the voltage applied to the piezoresistor is within its nominal value, the resistance value of the resistor is in infinite state, almost no current can pass through, when the voltage at two ends of the piezoresistor is slightly greater than the nominal voltage, the piezoresistor can be quickly broken down and switched on, its resistance value can be quickly reduced, so that the resistor is in conduction state, when the voltage is reduced to below the nominal voltage, its resistance value can be increased, the piezoresistor can be restored to high resistance state, when the voltage at two ends of the piezoresistor exceeds its maximum limit voltage, it can be completely broken down, and can not be restored by itself.
The thermal varistor in the market today is not easy to package, resulting in a package-processing efficiency that is difficult to expect and needs to be improved.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to provide a thermal thermistor which is easy to package, so as to solve the problem of the prior art that the thermal thermistor is inconvenient to package.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a hot pressure sensitive resistor convenient to encapsulation, includes protecting sheathing, hot pressure sensitive resistor body, bottom plate, pinhole and locating plate, the inside one end of protecting sheathing is equipped with hot pressure sensitive resistor body, the bottom plate is installed to the protecting sheathing bottom of hot pressure sensitive resistor body below, the both sides of bottom plate bottom all are fixed with the locating plate, the inside one side of locating plate is equipped with the pinhole, the both ends of pinhole all extend to the outside of locating plate, the protecting sheathing bottom of pinhole position department is equipped with the screw hole, locking bolt is installed to the locating plate bottom of pinhole position department, locking bolt's top run through the pinhole and with screw hole threaded connection.
Preferably, a heat collecting plate is arranged inside the protective casing above the thermal pressure-sensitive resistor body, and the bottom end of the heat collecting plate is in contact with the top end of the thermal pressure-sensitive resistor body, so that heat energy inside the protective casing can be absorbed.
Preferably, the top end of the heat collection plate is provided with heat conduction fin columns at equal intervals, one end of each heat conduction fin column, which is far away from the heat collection plate, extends to the outside of the protection shell, and two groups of heat conduction fin rings are fixed on the outer walls of the heat conduction fin columns, so that heat energy absorbed by the heat collection plate can be guided out of the protection shell.
Preferably, both sides of the bottom plate are provided with communication holes, and the top ends of the communication holes extend to the outside of the bottom plate so as to mount the bottom plate.
Preferably, the inside of intercommunicating pore is equipped with the spiral connector, the top of spiral connector extend to the outside of intercommunicating pore and with the bottom fixed connection of hot pressure-sensitive resistor body, the bottom of spiral connector extends to the outside of intercommunicating pore, the connecting plate is installed to the bottom of spiral connector to install the processing to the pin.
Preferably, a pin is arranged at the center of the bottom end of the connecting plate, a spiral connector is connected to the inner thread of the spiral connector, and the bottom end of the spiral connector is fixedly connected with the top end of the connecting plate so as to install and process the pin.
Compared with the prior art, the utility model has the beneficial effects that: the hot piezoresistor convenient to package not only improves the processing efficiency when the hot piezoresistor is used, prolongs the service life of the hot piezoresistor, but also reduces the maintenance cost when the hot piezoresistor is used;
(1) the communication hole is aligned at the position of the spiral interface, the bottom plate is pressed upwards to be installed at the bottom of the protective shell, the top end of the positioning plate is attached to the bottom end of the protective shell, and the locking bolt is rotated to enable the top end of the locking bolt to penetrate through the pin hole and be screwed into the threaded hole, so that the purpose of fast packaging is achieved, and the processing efficiency of the thermal pressure sensitive resistor during use is improved;
(2) the heat energy in the protective shell is absorbed by the heat collecting plate, and the heat conducting performance of the heat conducting fin column is enhanced by the heat conducting fin ring, so that the heat energy absorbed by the heat collecting plate is led out of the protective shell by the heat conducting fin column, the purpose of efficient heat dissipation is achieved, the phenomenon that the thermal pressure sensitive resistor body is burnt due to high temperature can be reduced, and the service life of the thermal pressure sensitive resistor is prolonged;
(3) through the swivelling joint board, make it drive screwed joint and twist out to the outside of screw interface to dismantle the processing to the pin, when the pin produced the damage phenomenon, can change the processing alone to the pin, thereby reduced the maintenance cost when hot pressure sensitive resistor uses.
Drawings
FIG. 1 is a schematic front sectional view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of the structure of FIG. 1 at B according to the present invention;
fig. 4 is a schematic view of a heat collecting plate of the present invention in a top view.
In the figure: 1. a protective housing; 2. a thermal varistor body; 3. a heat collecting plate; 4. a heat conducting fin ring; 5. a heat-conducting fin column; 6. a base plate; 7. a threaded hole; 8. a pin hole; 9. locking the bolt; 10. positioning a plate; 11. a screw interface; 12. a screw joint; 13. a communicating hole; 14. a connecting plate; 15. and (7) a pin.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of the present invention is shown: a hot piezoresistor convenient for packaging comprises a protective shell 1, a hot piezoresistor body 2, a bottom plate 6, a pin hole 8 and a positioning plate 10, wherein the hot piezoresistor body 2 is arranged at one end inside the protective shell 1, a heat collecting plate 3 is arranged inside the protective shell 1 above the hot piezoresistor body 2, and the bottom end of the heat collecting plate 3 is contacted with the top end of the hot piezoresistor body 2;
when in use, the heat collecting plate 3 is arranged inside the protective shell 1 above the thermal voltage dependent resistor body 2 so as to absorb the heat energy inside the protective shell 1;
the top end of the heat collection plate 3 is provided with heat conduction fin columns 5 at equal intervals, one end of each heat conduction fin column 5, far away from the heat collection plate 3, extends to the outside of the protective shell 1, and two groups of heat conduction fin rings 4 are fixed on the outer walls of the heat conduction fin columns 5;
when in use, after the heat conduction performance of the heat conduction finned column 5 is enhanced through the heat conduction finned ring 4, the heat conduction finned column 5 leads out the heat energy absorbed by the heat collection plate 3 to the outside of the protective shell 1;
a bottom plate 6 is arranged at the bottom of the protective shell 1 below the thermal voltage dependent resistor body 2, communication holes 13 are formed in two sides of the bottom plate 6, and the top ends of the communication holes 13 extend to the outside of the bottom plate 6;
when in use, the two groups of communication holes 13 are arranged at two sides in the bottom plate 6 so as to install the bottom plate 6;
a spiral connector 11 is arranged inside the communication hole 13, the top end of the spiral connector 11 extends to the outside of the communication hole 13 and is fixedly connected with the bottom end of the thermal pressure-sensitive resistor body 2, the bottom end of the spiral connector 11 extends to the outside of the communication hole 13, and a connecting plate 14 is installed at the bottom end of the spiral connector 11;
when the connector is used, the connecting plate 14 is arranged at the bottom end of the spiral connector 11, so that the pins 15 can be arranged;
a pin 15 is arranged at the center of the bottom end of the connecting plate 14, a spiral connector 12 is connected to the inner thread of the spiral connector 11, and the bottom end of the spiral connector 12 is fixedly connected with the top end of the connecting plate 14;
when in use, the screw joint 12 is screwed into the screw interface 11, so that the pin 15 can be installed;
the bottom of the protective shell 1 at the position of the pin hole 8 is provided with a threaded hole 7, the bottom end of the positioning plate 10 at the position of the pin hole 8 is provided with a locking bolt 9, and the top end of the locking bolt 9 penetrates through the pin hole 8 and is in threaded connection with the threaded hole 7.
When the heat-dissipating device is used, firstly, the communication hole 13 is aligned at the position of the spiral connector 11, then the bottom plate 6 is pressed upwards, so that the bottom plate 6 is installed at the bottom of the protective shell 1, at the moment, the top end of the positioning plate 10 is attached to the bottom end of the protective shell 1, then the locking bolt 9 is rotated, so that the top end of the locking bolt penetrates through the pin hole 8 and is screwed into the threaded hole 7, thereby achieving the purpose of rapid packaging, then, the heat energy inside the protective shell 1 is absorbed through the heat-collecting plate 3, after the heat-conducting performance of the heat-conducting fin column 5 is enhanced through the heat-conducting fin ring 4, the heat energy absorbed by the heat-conducting fin column 5 is led out of the protective shell 1, thereby achieving the purpose of efficient heat dissipation, finally, the connecting plate 14 is rotated to drive the spiral connector 12 to be screwed out of the spiral connector 11, so as to disassemble the pin 15, when the pin 15 is damaged, the pins 15 can be replaced individually, thereby completing the use of the thermal piezoresistor.
Claims (6)
1. A thermal piezoresistor convenient for packaging is characterized by comprising a protective shell (1), a thermal piezoresistor body (2), a bottom plate (6), pin holes (8) and a positioning plate (10), one end inside the protective shell (1) is provided with a thermal voltage dependent resistor body (2), a bottom plate (6) is arranged at the bottom of the protective shell (1) below the thermal piezoresistor body (2), positioning plates (10) are fixed on two sides of the bottom end of the bottom plate (6), pin holes (8) are arranged on one side of the inner part of each positioning plate (10), both ends of the pin hole (8) extend to the outside of the positioning plate (10), a threaded hole (7) is arranged at the bottom of the protective shell (1) at the position of the pin hole (8), a locking bolt (9) is arranged at the bottom end of the positioning plate (10) at the position of the pin hole (8), the top end of the locking bolt (9) penetrates through the pin hole (8) and is in threaded connection with the threaded hole (7).
2. A thermally sensitive resistor for facilitating packaging as claimed in claim 1, wherein: the solar thermal voltage-sensitive resistor is characterized in that a heat collecting plate (3) is arranged inside the protective shell (1) above the thermal voltage-sensitive resistor body (2), and the bottom end of the heat collecting plate (3) is contacted with the top end of the thermal voltage-sensitive resistor body (2).
3. A thermally sensitive resistor for facilitating packaging according to claim 2, wherein: the heat collecting device is characterized in that heat conducting fin columns (5) with equal intervals are arranged at the top end of the heat collecting plate (3), one ends, far away from the heat collecting plate (3), of the heat conducting fin columns (5) extend to the outside of the protective shell (1), and two groups of heat conducting fin rings (4) are fixed on the outer wall of each heat conducting fin column (5).
4. A thermally sensitive resistor for facilitating packaging as claimed in claim 1, wherein: both sides of the bottom plate (6) are provided with communicating holes (13), and the top ends of the communicating holes (13) extend to the outside of the bottom plate (6).
5. A thermal varistor for facilitating packaging according to claim 4, wherein: the inside of intercommunicating pore (13) is equipped with screw connector (11), the top of screw connector (11) extend to the outside of intercommunicating pore (13) and with the bottom fixed connection of hot pressure sensitive resistor body (2), the bottom of screw connector (11) extends to the outside of intercommunicating pore (13), connecting plate (14) are installed to the bottom of screw connector (11).
6. A thermally sensitive resistor for facilitating packaging according to claim 5, wherein: the connecting plate is characterized in that a pin (15) is arranged at the center of the bottom end of the connecting plate (14), a spiral connector (12) is connected to the inner thread of the spiral connector (11), and the bottom end of the spiral connector (12) is fixedly connected with the top end of the connecting plate (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121745590.2U CN216311483U (en) | 2021-07-27 | 2021-07-27 | Thermal piezoresistor convenient to encapsulate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121745590.2U CN216311483U (en) | 2021-07-27 | 2021-07-27 | Thermal piezoresistor convenient to encapsulate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216311483U true CN216311483U (en) | 2022-04-15 |
Family
ID=81086443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121745590.2U Active CN216311483U (en) | 2021-07-27 | 2021-07-27 | Thermal piezoresistor convenient to encapsulate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216311483U (en) |
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2021
- 2021-07-27 CN CN202121745590.2U patent/CN216311483U/en active Active
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