CN216291952U - Enhanced heat pipe radiating module - Google Patents
Enhanced heat pipe radiating module Download PDFInfo
- Publication number
- CN216291952U CN216291952U CN202122508348.XU CN202122508348U CN216291952U CN 216291952 U CN216291952 U CN 216291952U CN 202122508348 U CN202122508348 U CN 202122508348U CN 216291952 U CN216291952 U CN 216291952U
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- Prior art keywords
- heat pipe
- mounting substrate
- heat
- ring
- enhanced
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000001704 evaporation Methods 0.000 claims abstract description 29
- 230000008020 evaporation Effects 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 230000000903 blocking effect Effects 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000003466 welding Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to an enhanced heat pipe radiating module which is characterized by comprising a mounting substrate, a heat pipe shell, an air blocking cover and radiating fins, wherein the front side and the back side of the mounting substrate are fixedly connected with a power module, a heat pipe evaporation cavity is arranged in the mounting substrate, the mounting substrate is fixedly connected with the heat pipe shell, the heat pipe evaporation cavity is communicated with the heat pipe shell, a heat pipe core structure is arranged in the heat pipe evaporation cavity, the air blocking cover is fixedly connected with the end face of the mounting substrate, and the radiating fins are fixedly connected with the heat pipe shell. The advantages are that: the occupied volume of the heat dissipation module is reduced, the contact thermal resistance between the original whole heat pipe and the substrate is eliminated, and the heat conduction capability of the heat pipe is enhanced. The connecting part of the radiating fin and the heat pipe shell adopts a step-shaped circular ring structure, so that the contact area between the radiating fin and the heat pipe shell is enlarged, and the heat exchange area between the heat pipe and the radiating fin is increased, thereby improving the heat exchange strength and efficiency of the radiating fin.
Description
Technical Field
The utility model belongs to the field of heat pipe heat dissipation, and particularly relates to an enhanced heat pipe heat dissipation module suitable for an intelligent control power grid system in the power industry.
Background
With the rapid increase of the economic level of China, the independent innovation capability and the new technology in each field are continuously improved, and the application of new materials and new processes is continuously shown. The electric power is used as a 'direct application energy' of the manufacturing industry in China, and has a great promotion effect on the industrial upgrading of the manufacturing industry. The existing power equipment is old, the power transmission and conversion efficiency is low, and the development of the manufacturing industry is gradually restricted, so that the 'improvement, upgrade and update' of the existing power facilities by adopting the advanced modern technology is an urgent need. The intelligent upgrading of the power industry mainly depends on the intelligent control technology of a power module, which is a main core device of power equipment. At present, the intelligent technology of the power module is mature, and the intelligent upgrading and updating requirements of the power industry are completely met. However, compared with the original power module, the intelligent power module has the advantages that the module capacity and the intelligence are improved, so that the heat dissipation power of the intelligent power module during working is greatly improved, and the original heat dissipation product cannot meet the heat dissipation requirement of the intelligent power module during working. Therefore, it is desirable to provide a product that satisfies the heat dissipation requirements of an intelligent power module, and to solve the heat dissipation problem during operation.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model aims to provide an enhanced heat pipe radiating module, which enhances the radiating capacity, improves the radiating effect and ensures the safe and stable operation of an intelligent control power grid system in the power industry.
In order to achieve the purpose, the utility model is realized by the following technical scheme:
the utility model provides an enhancement mode heat pipe heat dissipation module, includes mounting substrate, heat pipe tube, choke cover, fin, mounting substrate tow sides and power module fixed connection, the inside heat pipe evaporation chamber that is equipped with of mounting substrate, mounting substrate and heat pipe tube fixed connection, heat pipe evaporation chamber is linked together with the heat pipe tube, is equipped with heat pipe tube core structure in the heat pipe evaporation chamber, the terminal surface fixed connection of choke cover and mounting substrate, fin and heat pipe tube fixed connection.
The heat pipe evaporation cavity is welded with the heat pipe shell.
The welding surface of the mounting substrate and the heat pipe shell is provided with a groove, and sealant is filled in the groove.
The mounting substrate is fixedly connected with the wind shield through bolts.
The outer part of the heat pipe core structure is in a round pipe shape, the inner part of the heat pipe core structure is in a convex-concave structure, and the section of the convex-concave structure is in a trapezoid shape, a triangle shape or a rectangle shape.
The heat pipe core structure is in interference fit or sintering fixation with the heat pipe evaporation cavity.
The heat radiating fins are provided with stepped rings, and the stepped rings are in interference fit with the heat pipe shell.
The stepped ring is an integral structure and consists of a bottom ring and a top ring, the bottom ring is connected with the top ring, the bottom ring and the radiating fins are integrally formed, the top ring is in interference fit with the heat pipe shell, and the top ring extends into the bottom ring of the stepped ring of the adjacent radiating fins.
The top ring is in interference fit with the bottom ring of the stepped circular ring of the adjacent radiating fin.
The mounting substrate is made of copper or aluminum, the heat pipe shell is made of copper or aluminum, and the radiating fins are made of copper or aluminum.
Compared with the prior art, the utility model has the beneficial effects that:
the power modules can be arranged on the front side and the back side of the mounting substrate of the enhanced heat pipe radiating module, the occupied volume of the radiating module is reduced, the heat pipe evaporation cavity is arranged in the mounting substrate and is connected with the heat pipe shell in a welding mode, the contact thermal resistance between the original whole heat pipe and the substrate is eliminated, and the heat conducting capacity of the heat pipe is enhanced. Meanwhile, the heat pipe core structure is adopted in the heat pipe evaporation cavity, so that the heat exchange area between the heat pipe working medium and the substrate is further enlarged, and the heat exchange efficiency of the heat pipe is greatly improved. The connecting part of the radiating fin and the heat pipe shell adopts a step-shaped circular ring structure, so that the contact area between the radiating fin and the heat pipe shell is enlarged, and the heat exchange area between the heat pipe and the radiating fin is increased, thereby improving the heat exchange strength and efficiency of the radiating fin.
Drawings
Fig. 1 is a front view of an enhanced heat pipe heat dissipation module.
Fig. 2 is a side view of an enhanced heat pipe heat dissipation module.
Fig. 3 is a front view of the mounting substrate.
Fig. 4 is a plan view of the mounting substrate.
Fig. 5 is a sectional view of the mounting substrate.
Fig. 6 is a schematic diagram of the structure of a heat pipe evaporation cavity and a heat pipe wick within a mounting substrate.
FIG. 7 is a schematic view of a welding structure between a heat pipe evaporation cavity and a heat pipe shell in a mounting substrate.
FIG. 8 is an enlarged view of the heat pipe evaporation cavity and the heat pipe shell.
Fig. 9 is a schematic structural view of the heat sink.
Fig. 10 is a schematic sectional view of the heat sink.
Fig. 11 is a schematic view of the connection structure of the heat pipe shell and the heat sink.
FIG. 12 is a schematic view of the structure of the windshield.
In the figure: 1-mounting substrate 2-choke cover 3-radiating fin 4-heat pipe shell 5-screw hole 6-choke cover mounting screw hole 7-heat pipe core structure 8-heat pipe evaporation cavity 9-welding groove 10-sealing groove 11-welding flux 12-sealing silica gel 13-ladder-shaped ring 14-bottom ring 15-top ring 16-long hole 17-screw through hole 18-rivet nut 19-fastening screw.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings, but it should be noted that the present invention is not limited to the following embodiments.
Referring to fig. 1-5, an enhanced heat pipe heat dissipation module comprises a mounting substrate 1, a choke cover 2, a heat sink 3 and a heat pipe shell 4, wherein power modules are mounted on the front and back surfaces of the mounting substrate 1, a threaded hole 5 for fastening the power modules is processed on the mounting surface of the mounting substrate, a heat pipe evaporation cavity 8 is processed inside the mounting substrate 1, the end part of the heat pipe evaporation cavity 8 is arranged on the end surface of the mounting substrate 1, a welding groove 9 and a sealing groove 10 are processed on the end part of the heat pipe evaporation cavity 8, and a heat pipe core structure 7 is mounted in the heat pipe evaporation cavity 8. The mounting substrate 1 is provided with a wind shield mounting threaded hole 6 on the end face, and the mounting substrate 1 and the wind shield 2 are fixedly mounted by the fastening screw 19 and the wind shield mounting threaded hole 6.
Referring to fig. 6, the heat pipe core structure 7 has a circular tube shape on the outside and a convex-concave structure on the inside, and the cross section of the convex-concave structure is trapezoidal, triangular or rectangular. The heat pipe core structure 7 and the heat pipe evaporation cavity 8 in the mounting substrate 1 are fixed on the inner wall of the heat pipe evaporation cavity 8 by interference fit or sintering technology.
Referring to fig. 7 and 8, the heat pipe evaporation cavity 8 and the heat pipe shell 4 are welded into a whole in the welding groove 9 of the mounting substrate 1 by using a welding flux 11, and after the welding is finished, the sealing groove 10 of the mounting substrate 1 is filled with sealing silica gel 12 for sealing protection.
Referring to fig. 9-11, a stepped ring 13 is formed on the heat sink 3, and the stepped ring is in interference fit with the heat pipe shell 4. The stepped ring of the integrated structure is composed of a bottom ring 14 and a top ring 15, the bottom ring 14 is connected with the top ring 15, the bottom ring 14 and the radiating fins 3 are integrally formed, the top ring 15 is in interference fit with the heat pipe shell 4, the top ring 15 extends into the bottom ring 14 of the stepped ring 13 of the adjacent radiating fins 3, and the top ring 15 is fixed with the bottom ring 14 of the stepped ring 13 of the adjacent radiating fins 3 in interference fit.
Referring to fig. 12, the choke cover 2 is provided with a plurality of elongated holes 16 and screw through holes 17, the rivet pressing nut 18 is fixed on the choke cover 2, the elongated holes 16 penetrate through the heat pipe tube shell 4 and then are placed on the end surface of the mounting substrate 1 where the sealing groove 10 is formed, and the fastening screws 19 penetrate through the screw through holes 17 on the choke cover 2 and are matched with the choke cover mounting threaded holes 6, so that the choke cover 2 is fixed on the mounting substrate 1.
The power modules are arranged on the front surface and the back surface of the mounting substrate 1, the heat pipe evaporation cavity 8 is formed in the mounting substrate 1, and the heat pipe evaporation cavity 8 is connected with the heat pipe shell 4 in a welding mode, so that the contact thermal resistance between the original whole heat pipe and the mounting substrate 1 is eliminated, and the heat conduction capability of the heat pipe is enhanced. Meanwhile, the heat pipe core structure 7 is adopted in the heat pipe evaporation cavity 8, so that the heat exchange area between the heat pipe working medium and the mounting substrate 1 is further enlarged, and the heat exchange efficiency of the heat pipe is greatly improved. The radiating fins 3 adopt a stepped ring 13 structure, so that the contact area between the radiating fins 3 and the heat pipe shell 4 is enlarged, and the heat exchange area between the heat pipe and the radiating fins 3 is increased, thereby improving the heat exchange strength and efficiency of the radiating fins.
Claims (10)
1. The enhanced heat pipe radiating module is characterized by comprising a mounting substrate, a heat pipe shell, an air blocking cover and radiating fins, wherein the front side and the back side of the mounting substrate are fixedly connected with a power module, a heat pipe evaporation cavity is arranged in the mounting substrate, the mounting substrate is fixedly connected with the heat pipe shell, the heat pipe evaporation cavity is communicated with the heat pipe shell, a heat pipe core structure is arranged in the heat pipe evaporation cavity, the air blocking cover is fixedly connected with the end face of the mounting substrate, and the radiating fins are fixedly connected with the heat pipe shell.
2. An enhanced heat pipe heat dissipation module as defined in claim 1, wherein the heat pipe evaporation cavity is welded to the heat pipe shell.
3. The enhanced heat pipe cooling module as claimed in claim 2, wherein the mounting substrate has a groove on a bonding surface with the heat pipe casing, and the groove is filled with a sealant.
4. An enhanced heat pipe heat dissipation module as defined in claim 1, wherein the mounting substrate is fixedly connected to the choke cover by bolts.
5. An enhanced heat pipe heat dissipation module as defined in claim 1, wherein the heat pipe core structure has an outer portion in a shape of a circular tube and an inner portion in a shape of a convex-concave structure, and the cross section of the convex-concave structure is trapezoidal, triangular or rectangular.
6. An enhanced heat pipe heat dissipation module as defined in claim 1, wherein the heat pipe core structure is fixed to the heat pipe evaporation cavity by interference fit or sintering.
7. An enhanced heat pipe heat dissipation module as defined in claim 1, wherein the heat sink has a stepped ring, and the stepped ring is in interference fit with the heat pipe case.
8. An enhanced heat pipe heat dissipation module as defined in claim 7, wherein the stepped ring is a unitary structure comprising a bottom ring and a top ring, the bottom ring is connected to the top ring, the bottom ring is integrally formed with the heat sink, the top ring is in interference fit with the heat pipe casing, and the top ring extends into the bottom ring of the stepped ring of the adjacent heat sink.
9. An enhanced heat pipe heat rejection module as claimed in claim 8 wherein said top ring is an interference fit with a bottom ring of an adjacent heat sink stepped annular ring.
10. The enhanced heat pipe cooling module of claim 1, wherein the mounting substrate is made of copper or aluminum, the heat pipe casing is made of copper or aluminum, and the heat sink is made of copper or aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122508348.XU CN216291952U (en) | 2021-10-18 | 2021-10-18 | Enhanced heat pipe radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122508348.XU CN216291952U (en) | 2021-10-18 | 2021-10-18 | Enhanced heat pipe radiating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216291952U true CN216291952U (en) | 2022-04-12 |
Family
ID=81068031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122508348.XU Active CN216291952U (en) | 2021-10-18 | 2021-10-18 | Enhanced heat pipe radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216291952U (en) |
-
2021
- 2021-10-18 CN CN202122508348.XU patent/CN216291952U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240124 Address after: 114000 No. 18, Daqi street, Tiexi District, Anshan City, Liaoning Province Patentee after: Anshan Anming Heat Pipe Technology Co.,Ltd. Country or region after: China Address before: 114000 No. 18, Daqi street, Tiexi District, Anshan City, Liaoning Province Patentee before: ANSHAN ANMING INDUSTRY Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |