CN216291132U - Lens mounting structure, camera module and electronic equipment - Google Patents
Lens mounting structure, camera module and electronic equipment Download PDFInfo
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- CN216291132U CN216291132U CN202122511250.XU CN202122511250U CN216291132U CN 216291132 U CN216291132 U CN 216291132U CN 202122511250 U CN202122511250 U CN 202122511250U CN 216291132 U CN216291132 U CN 216291132U
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Abstract
The application discloses camera lens mounting structure, module and electronic equipment make a video recording. The lens mounting structure comprises a fixed mounting part, a conductive elastic part, a fixed mounting part, an optical anti-shake driving assembly, an automatic focusing driving assembly and a plurality of integrated chips. The movable installation part is connected with the fixed installation part through the conductive elastic part, and one part of the integrated chips are connected with the fixed installation part and electrically connected with the automatic focusing drive component so as to be used for driving and sensing the movable state of the lens along the optical axis direction of the lens; the other part of the integrated chip is connected with the movable installation part and is electrically connected with the optical anti-shake driving component so as to drive and sense the movable state of the photosensitive element in the direction vertical to the optical axis of the lens; the integrated chip arranged on the fixed installation part is connected with the integrated chip arranged on the movable installation part in parallel through the conductive elastic part so as to simplify the internal wiring of the optical lens installation structure.
Description
Technical Field
The application relates to the technical field of camera modules, in particular to a lens mounting structure, a camera module and an electronic device.
Background
In the terminal electronics field, the module of making a video recording needs to adopt drive assembly to realize auto focus and optics anti-shake function usually. The automatic focusing needs to drive the lens to move along the optical axis of the lens, and the optical anti-shake needs to drive the photosensitive element to move in a plane perpendicular to the optical axis of the lens. Regarding the movement of the lens and the photosensitive element, in each moving direction, a sensing chip is required to sense the moving state of the lens or the photosensitive element, and a driving chip is required to control the moving state of the lens or the photosensitive element, which results in complicated and numerous circuits in the camera module.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a camera lens mounting structure, a camera module and electronic equipment, and can solve the problem that wiring in the camera module is complicated.
In a first aspect, an embodiment of the present application provides a lens mounting structure for a camera module, including:
the fixed mounting part is used for connecting with a lens of the camera module;
the conductive elastic piece is connected with the fixed mounting part;
the movable mounting part is used for mounting a photosensitive element of the camera module and is connected with the conductive elastic piece;
the optical anti-shake driving assembly is connected with the movable mounting part and drives the movable mounting part to move so as to drive the photosensitive element to move;
the automatic focusing driving component is used for connecting the lens and driving the lens to move; and
a plurality of integrated chips, wherein a part of the integrated chips are connected with the fixed installation part and electrically connected with the automatic focusing driving assembly so as to drive and sense the movable state of the lens along the optical axis direction of the lens; the other part of the integrated chip is connected with the movable installation part and is electrically connected with the optical anti-shake driving component so as to drive and sense the movable state of the photosensitive element in the direction vertical to the optical axis of the lens; the integrated chip arranged on the fixed installation part is also electrically connected with the conductive elastic part and is led to be connected with the integrated chip arranged on the movable installation part in parallel through the conductive elastic part.
A camera lens mounting structure for making a video recording module based on this application embodiment collects drive and sensing function in a plurality of integrated chips of an organic whole through setting up to line circuit quantity is walked in simplifying optical lens mounting structure, need not to set up sensing chip and drive chip alone again and carries out sensing function and drive function respectively, and simple structure effectively simplifies optical lens mounting structure's overall structure. The integrated chips are respectively arranged on the fixed installation part and the movable installation part so as to respectively sense and drive the movable states in multiple directions. The integrated chip arranged on the fixed installation part is connected with the integrated chip arranged on the movable installation part in parallel through the conductive elastic part, so that a signal transmission line in the optical lens installation structure can be further effectively simplified.
In some exemplary embodiments, the integrated chip has a power-on pin, a ground pin, a data transmission pin, a control pin, and a driving pin; the power-on pins, the grounding pins, the data transmission pins and the control pins of all the integrated chips are connected in parallel in a one-to-one correspondence manner;
the driving pin of the integrated chip arranged on the fixed mounting part is electrically connected with the automatic focusing driving component; and the driving pin of the integrated chip arranged on the movable installation part is electrically connected with the optical anti-shake driving component.
Based on the embodiment, the integrated chips can be electrically connected with the external circuit through only four lines, so that the lines are effectively simplified, the wiring is convenient, and the installation space is saved.
In some exemplary embodiments, the lens mounting structure further includes a driving circuit board electrically connected to an external circuit, an optical anti-shake circuit board electrically connected to the optical anti-shake driving assembly, and an auto-focus circuit board electrically connected to the auto-focus driving assembly, wherein the auto-focus circuit board is electrically connected to the conductive elastic member, and the conductive elastic member is electrically connected to the optical anti-shake circuit board;
wherein, a part of the integrated chips are arranged on the optical anti-shake circuit board, the optical anti-shake circuit board is arranged on the movable installation part, and the power-on pin, the grounding pin, the data transmission pin and the control pin of the integrated chips arranged on the optical anti-shake circuit board are electrically connected with the drive circuit board through the optical anti-shake circuit board;
the other part of the integrated chip is arranged on the automatic focusing circuit board, the automatic focusing circuit board is arranged on the movable installation part, and the power-on pin, the grounding pin, the data transmission pin and the control pin of the integrated chip arranged on the automatic focusing circuit board are electrically connected with the driving circuit board through the automatic focusing circuit board, the conductive elastic part and the optical anti-shake circuit board in sequence.
Based on the embodiment, each conductive structure of the lens mounting structure is fully utilized to route, each line in the lens mounting structure can be orderly routed, the wiring is convenient, and the lens mounting structure is effectively simplified.
In some exemplary embodiments, the lens mounting structure further includes first, second, third and fourth electrical terminals electrically connected to the optical anti-shake circuit board; the power-on pin of each integrated chip is connected in parallel to the first electric terminal, the grounding pin of each integrated chip is connected in parallel to the second electric terminal, the data transmission pin of each integrated chip is connected in parallel to the third electric terminal, and the control pin of each integrated chip is connected in parallel to the fourth electric terminal;
the first electric connection terminal, the second electric connection terminal, the third electric connection terminal and the fourth electric connection terminal are respectively and electrically connected to the driving circuit board.
Based on the embodiment, the four electric terminals are arranged so as to connect the integrated chips to the driving circuit board in parallel, so that the switching circuit is simplified.
In some exemplary embodiments, the lens mounting structure includes at least four integrated chips of a first integrated chip, a second integrated chip, a third integrated chip, and a fourth integrated chip;
the first integrated chip is connected with the fixed installation part and electrically connected with the automatic focusing driving component and is used for driving and sensing the state of the lens moving along the optical axis direction of the lens;
the second integrated chip, the third integrated chip and the fourth integrated chip are all connected to the movable mounting part and electrically connected with the optical anti-shake driving component so as to be used for driving the photosensitive element to move in a plane vertical to the optical axis of the lens;
the second integrated chip is used for sensing the state of the photosensitive element moving along a first direction perpendicular to the optical axis of the lens; the third integrated chip is used for sensing the state of the photosensitive element moving along a second direction perpendicular to the optical axis of the lens, and the second direction is perpendicular to the first direction; the fourth integrated chip is used for sensing the state that the photosensitive element rotates by taking the optical axis of the lens as a central axis.
Based on the above-described embodiment, the state in which the photosensitive element moves in a plurality of directions in a plane perpendicular to the optical axis of the lens is sensed and controlled by providing a plurality of integrated chips.
In some exemplary embodiments, the lens mounting structure further includes a driving chip; the driving chip is mounted on the movable mounting part and electrically connected with the optical anti-shake driving component, and is used for driving the photosensitive element to move in a plane perpendicular to the optical axis of the lens together with the second integrated chip, the third integrated chip and the fourth integrated chip.
Based on the embodiment, the three integrated chips and the driving chip are used for controlling the photosensitive element to move in the plane vertical to the optical axis of the lens, so that the photosensitive element can move more flexibly.
In some exemplary embodiments, the optical anti-shake driving assembly includes an optical anti-shake coil, and an optical anti-shake magnet coupled and butted with the optical anti-shake coil, wherein the optical anti-shake magnet is mounted on the fixed mounting portion, the optical anti-shake coil is mounted on the movable mounting portion, and the integrated chip mounted on the movable mounting portion is electrically connected with the optical anti-shake coil and used for controlling the optical anti-shake coil to generate a magnetic field to act on the optical anti-shake magnet; the integrated chip arranged on the movable installation part is also used for sensing the magnetic field of the optical anti-shake magnet;
the automatic focusing driving assembly comprises a detection magnet, an automatic focusing reed, an automatic focusing coil and an automatic focusing magnet coupled and butted with the automatic focusing coil, the automatic focusing magnet and the detection magnet are installed on the fixed installation part in a staggered mode, the focusing reed is used for connecting the lens and the fixed installation part, the automatic focusing coil is used for being installed on the lens, an integrated chip installed on the fixed installation part is electrically connected with the automatic focusing coil through the automatic focusing reed and is used for controlling the automatic focusing coil to generate a magnetic field to act on the automatic focusing magnet; the integrated chip mounted on the fixed mounting portion is also used for sensing the magnetic field of the detection magnet.
Based on the above embodiment, the photosensitive element and the lens are driven to move through magnetic induction, and the integrated chip is set to be capable of sensing the change of the magnetic field so as to correspondingly sense the moving state of the photosensitive element and the lens.
In some exemplary embodiments, the optical anti-shake driving assembly includes at least three sets of optical anti-shake coils and at least three sets of optical anti-shake magnets, which are equal in number to the optical anti-shake coils and correspond to the optical anti-shake coils one by one, and at least two of the sets of optical anti-shake coils are arranged at an included angle;
the automatic focusing driving assembly comprises a group of automatic focusing coils surrounding the periphery of the lens and at least three groups of automatic focusing magnets corresponding to the automatic focusing coils;
the automatic focusing magnet and the optical anti-shake magnet are both arranged in the fixed mounting part, the automatic focusing magnet and the optical anti-shake magnet are arranged in a stacked mode in the direction of the optical axis of the lens, and the detection magnet is arranged between two adjacent automatic focusing magnets.
Based on the above embodiments, the magnetic field interference between the magnets can be reduced, and the interference of the magnets to the integrated chip electrically connected to the auto-focusing coil can be reduced.
In some exemplary embodiments, the number of the optical anti-shake coils, the optical anti-shake magnets, and the auto-focus magnets is four, and the four optical anti-shake coils are arranged to be rotationally symmetric around the optical axis of the lens.
Based on the embodiment, the requirement for driving the photosensitive element to move in multiple angles is met, and the moving stability of the photosensitive element is ensured.
In a second aspect, an embodiment of the present application provides a camera module, which includes a lens, a photosensitive element, a sensing circuit board, and the lens mounting structure described above. The light sensing element is provided with a sensing circuit board corresponding to the lens and used for mounting the light sensing element, the lens is mounted on a fixed mounting part of the lens mounting structure, and the sensing circuit board is mounted on a movable mounting part of the lens mounting structure. Through set up like above lens mounting structure in the module of making a video recording, on the basis that circuit structure is simple in lens mounting structure, can make the module simple structure of making a video recording, and the miniaturized design of the module of making a video recording of being convenient for.
In a third aspect, an embodiment of the present application provides an electronic device, including the camera module as described above, and by installing the camera module as described above, the miniaturization design requirement of the electronic device can be satisfied on the simple structure basis of the camera module.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic perspective view of a lens mounting structure according to an embodiment of the present application;
fig. 2 is a schematic perspective view illustrating a lens mounting structure without a driving circuit board according to an embodiment of the present application;
FIG. 3 is a schematic perspective view of a lens mount structure without a fixed mount and a movable mount according to an embodiment of the present application;
FIG. 4 is a schematic diagram of an IC layout according to an embodiment of the present application;
FIG. 5 is an exploded view of a lens mount structure according to an embodiment of the present application;
FIG. 6 is a schematic diagram of an optical anti-shake coil according to an embodiment of the present application;
fig. 7 is a schematic perspective view of a camera module according to an embodiment of the present application;
FIG. 8 is a perspective view of a lens mounted to a lens mounting structure according to an embodiment of the present application;
fig. 9 is an exploded view of a camera module according to an embodiment of the present application.
Reference numerals: 100. a lens mounting structure; 110. a fixed mounting portion; 120. a conductive elastic member; 130. a movable mounting portion; 140. an optical anti-shake drive assembly; 141. an optical anti-shake coil; 141a, a first sub-coil; 141b, a second sub-coil; 141c, a third sub-coil; 142. an optical anti-shake magnet; 143. an optical anti-shake substrate; 144. an optical anti-shake circuit board; 144a, a mounting opening; 144b, mounting a sub-region; 150. an autofocus drive assembly; 151. detecting the magnet; 152. an auto-focus reed; 153. an auto-focus coil; 154. an auto-focusing magnet; 155. an auto-focus circuit board; 161. a first integrated chip; 162. a second integrated chip; 163. a third integrated chip; 164. a fourth integrated chip; 165. a driving chip; 170. a drive circuit board; 181. a first electrical terminal; 182. a second electrical terminal; 183. a third electrical terminal; 184. a fourth electrical terminal; 200. a camera module; 210. a camera housing; 220. a lens; 230. a photosensitive element; 240. the sensing circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The embodiment of the application provides a camera lens mounting structure for a camera module, which can solve the problem that the camera module is complicated in wiring. As shown in fig. 1 to 4, the lens mounting structure 100 includes a fixed mounting portion 110, a conductive elastic member 120, a movable mounting portion 130, an optical anti-shake driving assembly 140, an auto-focus driving assembly 150, and a plurality of integrated chips.
Specifically, the fixed mounting portion 110 is used for mounting a lens of the camera module, the conductive elastic element 120 is connected to the fixed mounting portion 110, the movable mounting portion 130 is used for mounting a photosensitive element of the camera module, and the movable mounting portion 130 is connected to the conductive elastic element 120. As shown in fig. 2, the fixed mount portion 110 and the movable mount portion 130 may be stacked along the optical axis H of the lens, and the conductive elastic element 120 may be a metal elastic element (e.g., a metal elastic sheet structure) capable of deforming so that the movable mount portion 130 can move relative to the fixed mount portion 110.
The optical anti-shake driving assembly 140 is mounted on the fixed mount 110 and connected to the movable mount 130 to drive the movable mount 130 to move relative to the fixed mount 110 in a plane perpendicular to the optical axis H of the lens. The auto-focus driving assembly 150 is mounted on the fixed mounting portion 110 and is used for connecting with the lens to drive the lens to move in the direction of the lens optical axis H relative to the fixed mounting portion 110.
Some of the integrated chips are connected to the fixed mounting portion 110 and electrically connected to the autofocus driving assembly 150 for driving and sensing the state of the lens moving along the direction of the optical axis H of the lens; another part of the integrated chips is connected to the movable mounting portion 130 and electrically connected to the optical anti-shake driving assembly 140 for driving and sensing the movable state of the photosensitive element in the plane perpendicular to the optical axis H of the lens; the ic mounted on the fixed mounting portion 110 is further electrically connected to the conductive elastic member 120, and is led to be connected in parallel with the ic mounted on the movable mounting portion 130 through the conductive elastic member 120.
Based on optical lens mounting structure 100 of this application embodiment, through setting up a plurality of integrated chips that collect drive and sensing function in an organic whole to line circuit quantity is walked in simplifying optical lens mounting structure 100, need not to set up separately again sensing chip and drive chip and carry out sensing function and drive function respectively, simple structure effectively simplifies optical lens mounting structure 100's overall structure. The plurality of integrated chips are respectively provided to the fixed mount 110 and the movable mount 130 to respectively sense and drive the movable state in a plurality of directions. The ic mounted on the fixed mount 110 is connected in parallel to the ic mounted on the movable mount 130 via the conductive elastic member 120, so as to further effectively simplify the signal transmission line in the optical lens mounting structure 100.
As shown in fig. 1 and 4, the lens mounting structure 100 further includes a driving circuit board 170 electrically connected to an external circuit, an optical anti-shake circuit board 144 electrically connected to the optical anti-shake driving assembly 140, and an auto-focus circuit board 155 electrically connected to the auto-focus driving assembly 150, wherein the optical anti-shake circuit board 144 is mounted on the movable mounting portion 130, the auto-focus circuit board 155 is mounted on the fixed mounting portion 110, the auto-focus circuit board 155 is electrically connected to the conductive elastic member 120, the conductive elastic member 120 and the optical anti-shake circuit board 144 are electrically connected to the driving circuit board 170, and the driving circuit board 170 is connected to the movable mounting portion 130 and extends to be electrically connected to the external circuit. The integrated chip can be a chip with a built-in hall element or other magnetic sensing type position sensing elements.
Specifically, as shown in fig. 3, the optical anti-shake driving assembly 140 may include an optical anti-shake coil 141, and an optical anti-shake magnet 142 coupled to the optical anti-shake coil 141, wherein the optical anti-shake coil 141 may be mounted on the movable mount 130, the optical anti-shake coil 141 may be disposed in a plane perpendicular to the lens optical axis H, and the optical anti-shake magnet 142 may be coupled to the optical anti-shake coil 141 in a direction parallel to the lens optical axis H and mounted on the fixed mount 110. The ic mounted on the movable mount 130 is electrically connected to the optical anti-shake coil 141, and is configured to control the optical anti-shake coil 141 to generate a magnetic field to act on the optical anti-shake magnet 142, so as to drive the photosensitive element to move in a plane perpendicular to the optical axis H of the lens; the ic mounted on the movable mount 130 is also used for sensing the magnetic field of the optical anti-shake magnet 142 to sense the moving state of the photosensitive element in the plane perpendicular to the optical axis H of the lens.
The optical anti-shake driving assembly 140 may further include an optical anti-shake substrate 143, the optical anti-shake coil 141 is mounted on the optical anti-shake substrate 143, the optical anti-shake coil 141 is supported by the optical anti-shake substrate 143, so as to facilitate the mounting of the optical anti-shake coil 141, and the optical anti-shake substrate 143 may be mounted on the optical anti-shake circuit board 144. The ic chip electrically connected to the optical anti-shake coil 141 may be mounted on the optical anti-shake circuit board 144 to be mounted on the movable mounting portion 130 through the optical anti-shake circuit board 144. The ic chip electrically connected to the optical anti-shake coil 141 can also be electrically connected to the optical anti-shake circuit board 144, so as to be electrically connected to the optical anti-shake coil 141 through the optical anti-shake circuit board 144.
The optical anti-shake coil 141 may be disposed on a side of the optical anti-shake circuit board 144 facing the fixed mounting portion 110, so that the optical anti-shake coil 141 is abutted against the optical anti-shake magnet 142. An ic chip electrically connected to the optical anti-shake coil 141 may be disposed on a side of the optical anti-shake circuit board 144 away from the fixed mounting portion 110, or a mounting opening 144a is disposed on the optical anti-shake circuit board 144, and the ic chip is disposed in the mounting opening 144a of the optical anti-shake circuit board 144. It can be understood that the photosensitive elements may be arranged in a rectangular structure, and the solder points of the optical anti-shake circuit board 144 electrically connected to the optical anti-shake coils 141 may be arranged corresponding to the long sides of the photosensitive elements, so as to save the installation space.
As shown in fig. 3 and 5, the autofocus driving assembly 150 may include a detection magnet 151, an autofocus reed 152, an autofocus coil 153, and an autofocus magnet 154 coupled to the autofocus coil 153, the autofocus magnet 154 and the detection magnet 151 are alternately mounted to the fixed mount 110, the autofocus reed 152 is used to connect the lens to the fixed mount 110, the autofocus reed 152 may be elastically deformed to enable the lens to move relative to the fixed mount 110, for example, the autofocus reed 152 may be a metal reed. The auto-focusing coil 153 is used for being installed on the lens, one end of the auto-focusing reed 152 connected to the fixed installation part 110 is electrically connected with the integrated chip, one end of the auto-focusing reed 152 connected to the lens is also electrically connected with the auto-focusing coil 153, so that the integrated chip installed on the fixed installation part 110 can be electrically connected with the auto-focusing coil 153 through the auto-focusing reed 152, and is used for controlling the auto-focusing coil 153 to generate a magnetic field to act on the auto-focusing magnet 154 so as to drive the lens to move in the direction of the optical axis H of the lens; the ic mounted on the fixed mount 110 is also used for sensing the magnetic field of the detection magnet 151 to sense the moving state of the lens in the direction of the optical axis H of the lens.
Further, an integrated chip electrically connected to the autofocus coil 153 may be mounted on the autofocus circuit board 155 to be mounted on the fixed mounting portion 110 through the autofocus circuit board 155. The ic electrically connected to the autofocus coil 153 and the detecting magnet 151 may be disposed opposite to each other along a direction perpendicular to the optical axis H of the lens, so that the ic mounted on the fixed mounting portion 110 can sense the moving state of the lens along the optical axis H of the lens.
The housing capable of being provided with the lens has an open slot, the detection magnet 151 is installed in the open slot, and in the direction parallel to the optical axis H of the lens, the detection magnet 151 and the auto-focusing coil 153 are arranged in a staggered manner, and in the circumferential direction with the optical axis H of the lens as the center, the detection magnet 151 and the auto-focusing magnet 154, the detection magnet 151 and the optical anti-shake magnet 142 are arranged in a staggered manner, so that the magnetic field interference among the magnets is reduced.
The auto-focus magnets 154 and the optical anti-shake magnets 142 are mounted in the fixed mounting portion 110, as shown in fig. 3, the auto-focus magnets 154 and the optical anti-shake magnets 142 are stacked along the optical axis H of the lens, the detection magnet 151 is disposed between two adjacent auto-focus magnets 154, and the detection magnet 151 is disposed between two adjacent optical anti-shake magnets 142. As shown in fig. 5, the end of each of the autofocus magnets 154 has a tapered surface, and the tapered surfaces of two adjacent autofocus magnets 154 have a gradually increasing distance from each other in a direction toward the autofocus coil 153, so as to further reduce the magnetic field interference between the magnets and reduce the interference of the magnets with the ic electrically connected to the autofocus coil 153.
As shown in fig. 6, the optical anti-shake circuit board 144 may include four sets of coil mounting regions for corresponding to the optical anti-shake coils 141, the four sets of coil mounting regions being disposed opposite to each other two by two, and the four sets of coil mounting regions being rotationally symmetric about the optical axis H of the lens, each set of coil mounting regions including two mounting sub-regions 144b disposed side by side. When the optical anti-shake driving assembly 140 includes four sets of optical anti-shake coils 141, each set of optical anti-shake coils 141 may include a first sub-coil 141a and a second sub-coil 141b, and the first sub-coils 141a and the second sub-coils 141b of the four sets of optical anti-shake coils 141 are disposed in the 8 mounting sub-regions 144b in a one-to-one correspondence manner.
The lens mounting structure 100 may be configured to include four integrated chips including a first integrated chip 161, a second integrated chip 162, a third integrated chip 163, and a fourth integrated chip 164. The first ic 161 is connected to the fixed mounting portion 110, and the second ic 162, the third ic 163 and the fourth ic 164 are connected to the movable mounting portion 130.
Specifically, the first ic 161 is mounted on the fixed mounting portion 110 through the auto-focus circuit board 155, and the first ic 161 is electrically connected to the auto-focus coil 153 through the auto-focus circuit board 155 for driving and sensing a state of the lens moving along the lens optical axis H direction.
The second, third, and fourth integrated chips 162, 163, and 164 are mounted to the movable mounting portion 130 through the optical anti-shake circuit board 144. The second integrated chip 162 is electrically connected to the first sub-coils 141a of the two optical anti-shake coils 141 oppositely disposed along the first direction a, controls the first sub-coils 141a to generate a magnetic field and generates a magnetic force under the influence of the magnetic field generated by the optical anti-shake magnets 142 to drive the anti-shake coils 141 and the photosensitive elements to move along the first direction a, and the second integrated chip 162 is used for sensing the moving state of the optical anti-shake coils 141 along the first direction a. The third ic 163 is electrically connected to the first sub-coils 141a of the two optical anti-shake coils 141 oppositely disposed along the second direction B, and controls the first sub-coils 141a to generate a magnetic field and generate a magnetic force under the influence of the magnetic field generated by the optical anti-shake magnets 142 to drive the anti-shake coils 141 and the photosensitive elements to move along the second direction B, and the third ic 163 is configured to sense the moving state of the optical anti-shake coils 141 along the second direction B. The fourth ic 164 is electrically connected to the second sub-coils 141b of the four optical anti-shake coils 141, controls the four second sub-coils 141b to generate a magnetic field, and generates a magnetic force under the influence of the magnetic field generated by the optical anti-shake magnet 142 to drive the anti-shake coils 141 and the photosensitive elements to rotate around the optical axis H of the lens, and the fourth ic 164 is further configured to sense the rotation of the optical axis H of the lens of the anti-shake coils 141 around the optical axis H. The second direction B is perpendicular to the first direction a and is perpendicular to the optical axis H of the lens.
Optionally, the lens mounting structure 100 may further include a driving chip 165 mounted on the movable mounting portion, the driving chip 165, the second integrated chip 162, the third integrated chip 163, and the fourth integrated chip 164 are respectively electrically connected to the four optical anti-shake coils 141 in a one-to-one correspondence manner, and respectively control the four optical anti-shake coils 141 to generate magnetic fields to cooperate with each other and generate magnetic force under the influence of the magnetic fields generated by the optical anti-shake magnets 142, so as to drive the anti-shake coils 141 and the photosensitive element to move along the first direction a, move along the second direction B, or rotate around the optical axis H of the lens. The second ic 162 is configured to sense a state that the optical anti-shake coil 141 moves along the first direction a, the third ic 163 is configured to sense a state that the optical anti-shake coil 141 moves along the second direction B, and the fourth ic 164 is configured to sense a state that the optical anti-shake coil 141 rotates around the optical axis H of the lens.
The ic integrates driving and sensing functions, and particularly, the ic may have a power-on pin (VDD power-on pin), a ground pin (GND ground pin), a data transmission pin (SDA communication pin), a control pin (SCL control pin), and a driving pin (OUT driving pin). The electrifying pins, the grounding pins, the data transmission pins and the control pins of all the integrated chips are connected in parallel in a one-to-one correspondence mode, so that the integrated chips can be electrically connected with an external circuit only through four lines, the lines are effectively simplified, the wiring is convenient, and the installation space is saved. And all pins of the integrated chip are arranged in a mirror image manner, so that crossed wiring is avoided.
As shown in fig. 3, the driving pin of the first ic 161 mounted on the auto-focus circuit board 155 is electrically connected to the auto-focus coil 153 sequentially through the auto-focus circuit board 155 and the auto-focus reed 152, and inputs an auto-focus driving signal to the auto-focus coil 153, so as to control the auto-focus coil 153 to generate a magnetic field to act on the auto-focus magnet 154, so as to control the auto-focus driving assembly 150 to drive the lens to move along the optical axis H of the lens.
As shown in fig. 4, the driving pins of the second ic 162, the third ic 163, and the fourth ic 164 mounted on the optical anti-shake circuit board 144 are electrically connected to the corresponding optical anti-shake coils 141 through the optical anti-shake circuit board 144, and respectively input optical anti-shake driving signals to the optical anti-shake coils 141 to control the optical anti-shake coils 141 to generate a magnetic field, so as to control the optical anti-shake driving assembly 140 to drive the photosensitive elements to move in a plane perpendicular to the lens optical axis H.
The power-on pins, the ground pin, the data transmission pin, and the control pin of the second ic 162, the third ic 163, and the fourth ic 164 mounted on the optical anti-shake circuit board 144 may be electrically connected to the conductive traces on the optical anti-shake circuit board 144, and electrically connected to the driving circuit board 170 through the optical anti-shake circuit board 144.
The power-on pin, the ground pin, the data transmission pin, and the control pin of the first ic 161 mounted on the auto-focus circuit board 155 are electrically connected to the conductive traces on the driving circuit board 170 through the auto-focus circuit board 155, the conductive elastic element 120, and the optical anti-shake circuit board 144, or are electrically connected to the conductive traces on the driving circuit board 170 through the auto-focus circuit board 155 and the conductive elastic element 120. The power-on pins, the ground pins, the data transmission pins and the control pins of each integrated chip can be connected in parallel to the driving circuit board 170 in a one-to-one correspondence manner, and then electrically connected with an external circuit through the driving circuit board 170.
The number of the conductive elastic members 120 that can connect the fixed mounting portion 110 and the movable mounting portion 130 is four, the four conductive elastic members 120 are electrically connected to the auto-focusing circuit board 155 at four corners, the power-on pin, the ground pin, the data transmission pin, and the control pin of the first ic 161 are electrically connected to the four conductive elastic members 120 correspondingly, and the four conductive elastic members 120 are routed to electrically connect to the conductive traces on the driving circuit board 170.
Furthermore, the optical anti-shake circuit board 144 may be provided with an I1C bus, an I2C bus, an I3C bus, and an I4C bus, wherein power-on pins of each ic mounted on the optical anti-shake circuit board 144 are connected to the I1C bus, ground pins of each ic mounted on the optical anti-shake circuit board 144 are connected to the I2C bus, data transmission pins of each ic mounted on the optical anti-shake circuit board 144 are connected to the I3C bus, control pins of each ic mounted on the optical anti-shake circuit board 144 are connected to the I4C bus, and the I1C bus, the I2C bus, the I3C bus, and the I4C bus of the optical anti-shake circuit board 144 are electrically connected to the driving circuit board 170 in four ways. The four conductive elastic elements 120 may be disposed to be connected to the I1C bus, the I2C bus, the I3C bus, and the I4C bus in a one-to-one correspondence manner, or a portion of the four conductive elastic elements 120 may be disposed to be connected to the corresponding bus of the four buses, and another portion of the four conductive elastic elements may be directly electrically connected to the driving circuit board 170 without passing through the optical anti-shake circuit board 144.
The lens mounting structure 100 further includes a first electrical terminal 181 electrically connected to an I1C bus, a second electrical terminal 182 electrically connected to an I2C bus, a third electrical terminal 183 electrically connected to an I3C bus, and a fourth electrical terminal 184 electrically connected to an I4C bus, such that the power-on pin of each ic is connected in parallel to the first electrical terminal 181, the ground pin of each ic is connected in parallel to the second electrical terminal 182, the data transmission pin of each ic is connected in parallel to the third electrical terminal 183, and the control pin of each ic is connected in parallel to the fourth electrical terminal 184. Meanwhile, the first electrical terminal 181, the second electrical terminal 182, the third electrical terminal 183 and the fourth electrical terminal 184 are electrically connected to the driving circuit board 170, respectively, and are disposed adjacent to the driving circuit board 170, so that the plurality of integrated chips are connected to the driving circuit board 170 in parallel by disposing the four electrical terminals as described above, thereby simplifying a switching circuit.
The first electrical terminal 181, the second electrical terminal 182, the third electrical terminal 183, and the fourth electrical terminal 184 may be metal spring pieces, and the metal spring pieces may be abutted to the driving circuit board 170 to improve the stability of the electrical connection between the four electrical terminals and the driving circuit board 170, wherein the two adjacent electrical terminals are arranged at intervals. The sensing circuit board 240 of the camera module for mounting the photosensitive element may be mounted on the movable mounting portion 130, and the four electrical terminals may be mounted on the sensing circuit board 240 to be mounted on the movable mounting portion 130 through the sensing circuit board 240.
Based on the routing requirements of the camera module, the lens mounting structure 100 can be configured to include two driving circuit boards 170. The first, second, third and fourth electrical terminals 181, 182, 183 and 184 may be adjacent to one of the driving circuit boards 170 and directly electrically connected to the driving circuit board 170. In other embodiments, the first electrical terminal 181, the second electrical terminal 182, the third electrical terminal 183, and the fourth electrical terminal 184 can also be electrically connected to the conductive traces on the sensing circuit board 240 between the two driving circuit boards 170, and the conductive traces of the sensing circuit board 240 are electrically connected to one of the driving circuit boards 170, so as to electrically connect the first electrical terminal 181, the second electrical terminal 182, the third electrical terminal 183, and the fourth electrical terminal 184 with the driving circuit boards 170 through the sensing circuit boards 240.
As shown in fig. 8 to 9, an embodiment of the present application further provides a camera module 200, where the camera module 200 includes a lens 220, a photosensitive element 230, a sensing circuit board 240 and the lens mounting structure 100 as described above, the lens 220 is mounted on the fixed mounting portion 110 of the lens mounting structure 100, the sensing circuit board 240 is mounted on the movable mounting portion 130 of the lens mounting structure 100, the camera module 200 further includes a camera housing 210, the fixed mounting portion 110 is mounted in the camera housing 210, and the camera housing 210 further extends to cover the periphery of the movable mounting portion 130 to protect other components in the camera module 200. By providing the lens mounting structure 100 as above in the camera module 200, the camera module 200 can be made simple in structure and the camera module 200 can be made compact in design on the basis of the simple circuit structure in the lens mounting structure 100.
The embodiment of the application further provides an electronic device, the electronic device can be mobile terminals such as mobile phones, tablet computers and smart watches, the electronic device can include an installation part and the camera module 200 as above, the camera module 200 is installed in the installation part, the installation part can be a shell, or the installation part can also be a supporting structure for fixing the camera module 200. The electronic equipment of this application embodiment through the installation as above module 200 of making a video recording, on the simple basis of module 200 structure of making a video recording, also can satisfy the miniaturized design demand of electronic equipment.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
1. The utility model provides a lens mounting structure for making a video recording module which characterized in that includes:
the fixed mounting part is used for connecting with a lens of the camera module;
the conductive elastic piece is connected with the fixed mounting part;
the movable mounting part is used for mounting a photosensitive element of the camera module and is connected to the conductive elastic part;
the optical anti-shake driving component is connected to the movable mounting part and drives the movable mounting part to move so as to drive the photosensitive element to move;
the automatic focusing driving component is connected with the lens and drives the lens to move; and
a plurality of integrated chips, wherein a part of the integrated chips are connected to the fixed mounting part and electrically connected to the auto-focus driving assembly for driving and sensing the state of the lens moving along the direction of the optical axis of the lens; the other part of the integrated chip is connected with the movable installation part and is electrically connected with the optical anti-shake driving component so as to be used for driving and sensing the movable state of the photosensitive element in the direction vertical to the optical axis of the lens; the integrated chip is arranged on the fixed installation part, is electrically connected with the conductive elastic part and is led to and arranged on the integrated chip of the movable installation part in parallel through the conductive elastic part.
2. The lens mounting structure for a camera module according to claim 1, wherein the integrated chip has a power-on pin, a ground pin, a data transmission pin, a control pin, and a driving pin; the power-on pin, the grounding pin, the data transmission pin and the control pin of each integrated chip are connected in parallel in a one-to-one correspondence manner;
the driving pin of the integrated chip arranged on the fixed installation part is electrically connected with the automatic focusing driving component; the driving pin of the integrated chip arranged on the movable installation part is electrically connected with the optical anti-shake driving component.
3. The lens mounting structure for a camera module according to claim 2, further comprising a driving circuit board electrically connected to an external circuit, an optical anti-shake circuit board electrically connected to the optical anti-shake driving assembly, and an auto-focus circuit board electrically connected to the auto-focus driving assembly, wherein the auto-focus circuit board is electrically connected to the conductive elastic member, and the conductive elastic member is electrically connected to the optical anti-shake circuit board;
wherein a part of the integrated chip is mounted on the optical anti-shake circuit board, the optical anti-shake circuit board is mounted on the movable mounting part, and the power-on pin, the ground pin, the data transmission pin and the control pin of the integrated chip mounted on the optical anti-shake circuit board are electrically connected with the driving circuit board through the optical anti-shake circuit board;
the other part of the integrated chip is arranged on the automatic focusing circuit board, the automatic focusing circuit board is arranged on the movable installation part and is arranged on the automatic focusing circuit board, and the power-on pin, the grounding pin, the data transmission pin and the control pin of the integrated chip sequentially pass through the automatic focusing circuit board, the conductive elastic piece and the optical anti-shaking circuit board and are electrically connected with the driving circuit board.
4. The lens mounting structure for a camera module according to claim 3, further comprising a first electrical terminal, a second electrical terminal, a third electrical terminal and a fourth electrical terminal electrically connected to the optical anti-shake circuit board; the power-on pin of each integrated chip is connected to the first electric terminal in parallel, the ground pin of each integrated chip is connected to the second electric terminal in parallel, the data transmission pin of each integrated chip is connected to the third electric terminal in parallel, and the control pin of each integrated chip is connected to the fourth electric terminal in parallel;
the first electric terminal, the second electric terminal, the third electric terminal and the fourth electric terminal are respectively and electrically connected to the driving circuit board.
5. The lens mounting structure for a camera module according to claim 1, wherein the lens mounting structure comprises at least four of a first integrated chip, a second integrated chip, a third integrated chip and a fourth integrated chip;
the first integrated chip is connected to the fixed mounting part and electrically connected with the automatic focusing driving assembly and is used for driving and sensing the moving state of the lens along the optical axis direction of the lens;
the second integrated chip, the third integrated chip and the fourth integrated chip are all connected to the movable installation part and electrically connected with the optical anti-shake driving component so as to be used for driving the photosensitive element to move in a plane perpendicular to the optical axis of the lens;
the second integrated chip is used for sensing the state of the photosensitive element moving along a first direction perpendicular to the optical axis of the lens; the third integrated chip is used for sensing the state of the photosensitive element moving along a second direction perpendicular to the optical axis of the lens, and the second direction is perpendicular to the first direction; the fourth integrated chip is used for sensing the state that the photosensitive element rotates by taking the optical axis of the lens as a central axis.
6. The lens mounting structure for a camera module according to claim 5, wherein the lens mounting structure further comprises a driving chip;
the driving chip is installed in the movable installation part and electrically connected with the optical anti-shake driving component, and is used for driving the photosensitive element to move in a plane perpendicular to the optical axis of the lens together with the second integrated chip, the third integrated chip and the fourth integrated chip.
7. The lens mounting structure for a camera module according to claim 1,
the optical anti-shake driving assembly comprises an optical anti-shake coil and an optical anti-shake magnet coupled and butted with the optical anti-shake coil, the optical anti-shake magnet is mounted on the fixed mounting part, the optical anti-shake coil is mounted on the movable mounting part, and the integrated chip mounted on the movable mounting part is electrically connected with the optical anti-shake coil and used for controlling the optical anti-shake coil to generate a magnetic field to act on the optical anti-shake magnet; the integrated chip arranged on the movable installation part is also used for sensing the magnetic field of the optical anti-shake magnet;
the automatic focusing driving assembly comprises a detection magnet, an automatic focusing reed, an automatic focusing coil and an automatic focusing magnet coupled and butted with the automatic focusing coil, the automatic focusing magnet and the detection magnet are installed on the fixed installation part in a staggered mode, the focusing reed is used for connecting the lens and the fixed installation part, the automatic focusing coil is used for being installed on the lens, the integrated chip installed on the fixed installation part is electrically connected with the automatic focusing coil through the automatic focusing reed and is used for controlling the automatic focusing coil to generate a magnetic field to act on the automatic focusing magnet; the integrated chip arranged on the fixed installation part is also used for sensing the magnetic field of the detection magnet.
8. The lens mounting structure for a camera module according to claim 7, wherein the optical anti-shake driving assembly includes at least three sets of the optical anti-shake coils and at least three sets of the optical anti-shake magnets, which are equal in number to the optical anti-shake coils and correspond to the optical anti-shake coils one by one, and at least two sets of the optical anti-shake coils are arranged at an included angle;
the automatic focusing driving assembly comprises a group of automatic focusing coils surrounding the periphery of the lens and at least three groups of automatic focusing magnets corresponding to the automatic focusing coils;
the automatic focusing magnet and the optical anti-shake magnet are arranged in the fixed mounting part, the automatic focusing magnet and the optical anti-shake magnet are arranged in a stacking mode in the direction of the optical axis of the lens, and the detection magnet is arranged between two adjacent automatic focusing magnets.
9. The lens mounting structure for a camera module according to claim 8, wherein the number of the optical anti-shake coils, the optical anti-shake magnets and the auto-focus magnets is four, and the four optical anti-shake coils are arranged to be rotationally symmetric about an optical axis of the lens.
10. The utility model provides a module of making a video recording which characterized in that includes:
a lens;
a photosensitive element arranged corresponding to the lens
The sensing circuit board is used for mounting the photosensitive element; and
a lens mounting structure as claimed in any one of claims 1 to 9, the lens being mounted to the fixed mount portion of the lens mounting structure, the sensing circuit board being mounted to the movable mount portion of the lens mounting structure.
11. An electronic device, comprising:
a camera module as claimed in claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122511250.XU CN216291132U (en) | 2021-10-19 | 2021-10-19 | Lens mounting structure, camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122511250.XU CN216291132U (en) | 2021-10-19 | 2021-10-19 | Lens mounting structure, camera module and electronic equipment |
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| Publication Number | Publication Date |
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| CN216291132U true CN216291132U (en) | 2022-04-12 |
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| CN202122511250.XU Active CN216291132U (en) | 2021-10-19 | 2021-10-19 | Lens mounting structure, camera module and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023197996A1 (en) * | 2022-04-14 | 2023-10-19 | 宁波舜宇光电信息有限公司 | Driving assembly and camera module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023197996A1 (en) * | 2022-04-14 | 2023-10-19 | 宁波舜宇光电信息有限公司 | Driving assembly and camera module |
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