CN216290923U

CN216290923U - Data receiving and transmitting device and assembly and data transmission system

Info

Publication number: CN216290923U
Application number: CN202122088555.4U
Authority: CN
Inventors: 周鹏; 马静言; 刘庆柏; 赵壮; 杨松; 李玉衡
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-04-12
Anticipated expiration: 2031-08-31
Also published as: WO2023030155A1

Abstract

The embodiment of the application provides a data receiving and transmitting device, a data receiving and transmitting assembly and a data transmission system. The device comprises: the metal shell comprises a main shell and a cover plate, the main shell is provided with a cavity with an opening, the cover plate covers the opening of the cavity, the cavity comprises a first mounting space, and a first mounting hole and a second mounting hole are formed in a first side wall of the cavity; the first metal sleeve is arranged at the first mounting hole and is used for sleeving the first plastic waveguide; the second metal sleeve is arranged at the second mounting hole and is used for sleeving the second plastic waveguide; a printed circuit board including a substrate, a transmitting and receiving chip, and first and second antennas; the first sub-terahertz signal generated by the sending chip can be transmitted to the first plastic waveguide through the first antenna coupling; the receiving chip can receive a second sub-terahertz signal transmitted by the second plastic waveguide through the second antenna coupling. The embodiment of the application is suitable for transmitting the sub-terahertz signals, a conversion module is not required to be arranged, power consumption is reduced, heat generation is reduced, and high transmission bandwidth and high transmission rate can be achieved.

Description

Data receiving and transmitting device and assembly and data transmission system

Technical Field

The present application relates to the field of communications, and in particular, to a data transceiver, a data transceiver module, and a data transmission system.

Background

The optical module is used for photoelectric conversion, an electric signal is converted into an optical signal by a sending end, and the optical signal is converted into the electric signal by a receiving end after being transmitted by an optical fiber, so that the power consumption is low, but the loss in the transmission process is large, and the transmission distance is limited; and electromagnetic interference needs to be considered, and the weight of the copper cable is large.

In the optical fiber-based data transmission system, an optical module is required to convert an electrical signal into an optical signal at a transmitting end, then the optical signal is transmitted to the transmitting end through an optical fiber, and then the optical signal is converted into the electrical signal at the transmitting end through the optical module, so that data transmission is completed. Also, optical fibers are lighter and smaller than cables, and travel faster over long distances than cables.

However, as the transmission capacity and bandwidth requirements in the field of optical communications continue to increase, the performance of data transmission systems also escalate. In particular, in response to market demand for high bandwidth and high rate data transmission, module designs are increasingly being developed in a direction of miniaturization and high density. The improvement of the speed of the optical module generally accompanies with the improvement of power, and as the power of the optical module increases, the volume heat density also increases, so that the working temperature of the optical module increases, the performance of an electro-optical/photoelectric conversion component and a chip which are sensitive to temperature in the optical module can be greatly reduced, and even the whole module cannot work normally or fails.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a data transceiver and subassembly, data transmission system, can directly transmit the sub-terahertz signal to the plastic waveguide by sending chip through antenna coupling or receive the sub-terahertz signal in the plastic waveguide by receiving chip through antenna coupling, can prevent electromagnetic interference to plastic waveguide weight is less, owing to need not photoelectricity/electric-to-optical conversion, has effectively reduced the consumption and has reduced thermal production, can realize higher transmission bandwidth and rate.

Therefore, the embodiment of the application adopts the following technical scheme:

in a first aspect, an embodiment of the present application provides a data transceiver, where the data transceiver includes: the metal shell comprises a main shell body and a cover plate, wherein a cavity is arranged on the main shell body and provided with an opening, the cover plate covers the opening of the cavity, the cavity comprises a first mounting space, and a first mounting hole and a second mounting hole are formed in a first side wall of the first mounting space; the first metal sleeve is arranged at the first mounting hole and used for sleeving the first end of the first plastic waveguide; the second metal sleeve is arranged at the second mounting hole and used for sleeving the first end of the second plastic waveguide; the printed circuit board comprises a substrate, and a transmitting chip, a receiving chip, a first antenna and a second antenna which are arranged on the substrate; one end of the first antenna is connected with the sending chip, and the other end of the first antenna extends to the first end of the substrate and corresponds to the first plastic waveguide; the transmitting chip is used for generating a first sub-terahertz signal which can be transmitted to the first plastic waveguide through the first antenna coupling; one end of the second antenna is connected with the receiving chip, and the other end of the second antenna extends to the first end of the substrate and corresponds to the second plastic waveguide; the receiving chip can receive a second sub-terahertz signal transmitted by the second plastic waveguide through the second antenna coupling.

In the above scheme, the data transceiver is suitable for transmitting the sub-terahertz signal, a photoelectric conversion module is not required to be arranged, power consumption is effectively reduced, heat generation is reduced, meanwhile, higher transmission bandwidth and speed can be realized, and compared with a copper cable, the plastic waveguide is lighter in weight. The first metal sleeve and the second metal sleeve can reduce signal crosstalk of the first sub-terahertz signal and the second sub-terahertz signal at the coupling position, and therefore the sub-terahertz signals can be better transmitted. Moreover, the metal sleeve can be cylindrical, and can also be formed by surrounding a metal foil; in addition, the first antenna and the second antenna can be microstrip lines, and the first antenna and the second antenna can also be arranged at a certain distance to prevent signal crosstalk. In order to make the structure compact, the spacing distance can take into consideration factors such as the wavelength of the sub-terahertz signal and the specific structure of the antenna, for example, the spacing distance is 2-3 wavelengths. Alternatively, in order to make the structure compact, when the first antenna and the second antenna are spaced apart by a small distance, an isolation structure, such as a slot and a metal spacer, or a plurality of metal posts, etc., which will be described below, may be provided on the printed circuit board.

In a possible implementation manner, a plurality of metal columns are arranged between the first antenna and the second antenna and penetrate through the substrate, and the plurality of metal columns are arranged at intervals along the direction from the sending chip to the first end of the substrate. In this implementation, electromagnetic waves, i.e., sub-terahertz signals, can be made to resonate at a plurality of metal cylinders, which can be solid or hollow structures with both ends closed, avoiding coupling to adjacent antennas, thereby preventing crosstalk. In addition, the metal pillar may be cylindrical, for example, or may have another shape.

In a possible implementation manner, the sending chip and the receiving chip are arranged side by side, and the plurality of metal pillars extend from the first end of the substrate to or beyond the sending chip. Therefore, the metal columns can better play a role in preventing the sub-terahertz signals from crosstalk.

In a possible implementation manner, a slot is disposed at a first end of the substrate, and the slot is located between the first antenna and the second antenna, the data transceiver further includes a metal partition plate, where: the metal partition plate is connected with the first side wall and is positioned in the open groove, and the metal partition plate and the main shell are integrally formed; or, the metal baffle with main casing body components of a whole that can function independently shaping, the metal baffle include the division board and with the locating plate that the division board links to each other, the division board is located in the fluting, be provided with the mounting groove on the first lateral wall, the locating plate with mounting groove location fit. In this implementation, the slots can function to some extent to prevent crosstalk of the first sub-terahertz signal and the second sub-terahertz signal, and the metal partition can further enhance the effect of preventing crosstalk of the sub-terahertz signal at the coupling position.

In one possible implementation, the slot extends from the first end of the substrate to or beyond the transmitting chip. Therefore, the metal partition plates with enough lengths can be accommodated in the slots, and the slots and the metal partition plates can be matched to better prevent signal crosstalk.

In a possible implementation manner, the chamber further includes a second installation space, the first side wall is located between the first installation space and the second installation space, an end of the second installation space opposite to the first side wall is open, the data transceiver further includes a clamping component, wherein: the first end of the clamping component can be clamped and installed in the second installation space, a first arc-shaped open groove and a second arc-shaped open groove are arranged at the first end of the clamping component side by side, the first arc-shaped open groove is used for clamping and fixing the first plastic waveguide and/or the first metal sleeve, and the second arc-shaped open groove is used for clamping and fixing the second plastic waveguide and/or the second metal sleeve; the second end of the clamping component is of a hollow structure, the hollow structure is communicated with the first arc-shaped open groove and the second arc-shaped open groove, and the hollow structure is used for installing the parts of the first plastic waveguide and the second plastic waveguide with the isolating layers. In this implementation, the two plastic waveguides at the first sidewall do not have a spacer layer or the spacer layer is relatively thin, and therefore need to be disposed within a metal sleeve for isolation. And, the arc-shaped slot on the clamping part can only clamp the plastic waveguide, so that the end surface of the first end of the clamping part can abut against the two metal sleeves, thereby limiting the movement of the two metal sleeves along the axial direction, or the arc-shaped slot on the clamping part can clamp and fix the plastic waveguide and the metal sleeves at the same time. That is to say, the clamping component can clamp and fix the plastic waveguide to be coupled with the antenna, so that the coupling mode with the sub-THz plastic waveguide can be performed in a plugging mode, and the operation is convenient. In addition, the clamping component can be made of plastic materials and manufactured in an injection molding mode.

In a possible implementation manner, one of the clamping component and the cover plate is provided with a clamping groove, the other is provided with a clamping block, and the clamping groove and the clamping block can be clamped and connected. For example, the clamping part is provided with a clamping groove, the cover plate is provided with a clamping block, the first end of the clamping part can be clamped and installed in the second installation space of the main shell, the cover plate covers the main shell, the clamping block on the cover plate is connected with the clamping groove on the clamping part in a clamping mode, the clamping part can be prevented from moving along the axial direction of the metal sleeve, positioning is achieved, assembly is facilitated, and meanwhile the cover plate is more reliable in connection with the clamping part.

In a possible implementation manner, the data transceiver further includes a sleeve, the sleeve is installed in the hollow structure, at least a portion of the sleeve extends out of the second end of the clamping component, and the portions of the first plastic waveguide and the second plastic waveguide with the isolation layer are used for being installed in the sleeve. In the implementation mode, at least part of the sleeve extends out of the second end of the clamping part, so that the extension direction of the plastic waveguide is consistent with the extension direction of the hollow structure and the arc-shaped groove of the clamping part in advance, and the plastic waveguide and the data transceiver device are convenient to assemble.

In one possible implementation, the first installation space is a rectangular body, wherein: through holes for heat dissipation are formed in at least one of second side walls of the first installation space, which are located on two sides of the first side wall, and the cover plate; and/or, a positioning column is arranged on one of the second side walls of the first mounting space, which are positioned on two sides of the first side wall, and the printed circuit board, and a positioning groove is arranged on the other side wall, and the positioning column can be in positioning fit with the positioning groove. In the implementation mode, the heat dissipation through holes are arranged, so that the temperature in the first installation space can be prevented from being too high, and the normal work of the chip can be ensured; in addition, set up constant head tank and reference column, if can set up the constant head tank on printed circuit board, can set up the reference column on the second lateral wall of first installation space, can fix a position installation printed circuit board, make printed circuit board's rigidity, help promoting the equipment speed.

In one possible implementation, the data transceiver further includes a buckle assembly, and the buckle assembly includes: the main plate body is fixedly connected with the bottom of the main shell; the clamping hook is positioned between the main plate body and the main shell and comprises a clamping hook main body and a rotating shaft arranged in the middle of the clamping hook main body, and the rotating shaft is rotatably arranged on the main plate body; the first elastic piece comprises a fixed part and an elastic part, the fixed part is fixedly connected with the main shell, one end of the elastic part is connected with the fixed part, and the other end of the elastic part abuts against the first end of the hook main body on the side surface, far away from the main shell, of the hook main body; the first end of the pulling piece extends out of the main plate body, the second end of the pulling piece is positioned between the hook main body and the main shell body and is provided with a groove, the pulling piece can move between a first position and a second position, and the pulling piece comprises: when the cage is in the first position, the first end of the hook main body is positioned in the groove under the abutting of the elastic part, and the second end of the hook main body is far away from the main shell so as to be clamped with the through hole on the cage; when the first end of the pulling piece moves to the second position along the direction far away from the rotating shaft under the action of external force, the flat part at the second end of the pulling piece abuts against the first end of the hook main body, so that the first end of the hook main body is far away from the main shell to rotate, and meanwhile, the second end of the hook main body rotates towards the main shell to be separated from the through hole in the cage. In this implementation, the data transceiver is connected to the cage primarily by a snap assembly. In order to avoid occupying first installation space, the buckle subassembly can set up in data transceiver's bottom (the bottom of the main casing body promptly), the cage bottom that corresponds is equipped with the through hole that supplies the pothook of buckle subassembly to stretch into, when data transceiver inserts the cage like this, the first end of pothook main part is located the recess under the support of elasticity portion, the main casing body is kept away from to the second end of pothook main part to stretch into the through hole on the cage, realize the block connection, thereby with data transceiver fixed mounting in the cage. When the data transceiver needs to be pulled out from the cage, external force can be applied to the first end of the pulling piece along the direction far away from the rotating shaft, the second end of the pulling piece is switched from the first end of the groove-contact hook main body to the flat part beside the groove to abut against the first end of the hook main body, so that the first end of the hook main body is far away from the main shell to rotate, meanwhile, the second end of the hook main body rotates towards the main shell and is separated from the through hole in the cage, at the moment, the extending direction of the hook main body can be basically parallel to the bottom wall of the main shell, and then the data transceiver can be pulled out from the cage. That is to say, the data transceiver generally needs to be provided with the structure of moving back, makes the data transceiver can be blocked and prevent to loosen and come out when inserting the cage use, avoids the interrupt of transmission signal, and also can easily pull out from the cage when needs take out.

In a possible implementation manner, a groove body is arranged on the main plate body, the second end of the pulling piece is located in the groove body, the buckle assembly further comprises a second elastic piece, one end of the second elastic piece abuts against a flat portion at the second end of the pulling piece, the other end of the second elastic piece abuts against the groove body and is far away from the side wall of the rotating shaft, wherein: when the pulling piece moves from the first position to the second position under the action of external force, the second elastic piece is compressed; the second elastic piece which is compressed can provide restoring force for moving the pulling piece from the second position to the first position when no external force acts. In this implementation, through setting up the second elastic component, can be so that when not having the exogenic action, the pulling part can be by second position automatic re-setting to the first position, like this when inserting data transceiver in the cage, can make the automatic through-hole block on with the cage of second end of the pothook main part of buckle subassembly.

In a second aspect, an embodiment of the application provides a data transceiver component, data transceiver component includes cage and the data transceiver device that the above-mentioned first aspect provided, the one end of cage is opened, just be provided with the shell fragment structure on the diapire of the open end of cage, the structural through hole that is provided with of shell fragment, data transceiver device is provided with printed circuit board's part is located in the cage, when the primary importance, the second end of the pothook main part among data transceiver device's the buckle subassembly can stretch into in the structural through hole of shell fragment, realize the block connection.

In a third aspect, an embodiment of the present application provides a data transmission system, including: the data transceiver device provided in the first aspect; the first end of the first plastic waveguide is arranged at the first mounting hole of the data transceiver; and the first end of the second plastic waveguide is arranged at the second mounting hole of the data transceiver.

Additional features and advantages of the utility model will be set forth in the detailed description which follows.

Drawings

The drawings that accompany the detailed description can be briefly described as follows.

Fig. 1 is a schematic assembly structure diagram of a data transmission system according to an embodiment of the present application;

fig. 2 is a schematic assembly structure diagram of a data transceiver in the data transmission system shown in fig. 1;

fig. 3 is an exploded view of the data transceiver shown in fig. 2;

FIG. 4 is an enlarged view of a portion E of the data transceiver shown in FIG. 3;

FIG. 5 is a schematic diagram of another exploded structure of the data transceiver shown in FIG. 2;

FIG. 6 is a schematic diagram of a partial structure of a printed circuit board in the data transceiver shown in FIG. 2;

fig. 7 is a partial structural schematic diagram of the data transceiver shown in fig. 2;

fig. 8 is an exploded schematic view of a data transceiver module according to an embodiment of the present disclosure;

figure 9 is a simplified block diagram of the cage in the data transceiver assembly shown in figure 8.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may include, for example, a fixed connection, a detachable connection, an interference connection, or an integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

With the increasing demand of transmission capacity in the field of optical communication, the bandwidth is increasing, and the bandwidth of the data transmission system is also upgraded. In response to the market demand for high bandwidth and high rate data transmission, module design is developing in a direction of miniaturization and high density (i.e. more optical modules can be installed in the same space, so that bandwidth and transmission capacity/rate are higher). The improvement of the speed of the optical module generally accompanies with the improvement of power, and as the power of the optical module increases, the volume heat density also increases, so that the working temperature of the optical module increases, the performance of an electro-optical/photoelectric conversion component and a chip which are sensitive to temperature in the optical module can be greatly reduced, and even the whole module cannot work normally or fails.

In response to the above problems, sub-terahertz (sub-THz) based data transmission systems have been developed. Terahertz (THz) is one of the units of fluctuation frequency, also known as terahertz, or terahertz. Equal to 1,000,000,000,000Hz, commonly used to represent the electromagnetic wave frequency. The terahertz is located at the low end of the terahertz spectrum, is overlapped with the high end of the microwave frequency band, has a plurality of atmospheric windows such as 0.14THz and 0.22THz, is one of important frequency bands for the research of the sixth generation mobile communication, and can be widely applied to the fields of radar, remote sensing, nondestructive testing, biomedicine, environmental monitoring and the like.

The prior art photoelectric conversion device for optical fiber communication generally includes a PCB and electronic components performing a photoelectric conversion function. The transmitting end in one module converts the electric signal into an optical signal through electro-optical conversion, then transmits the optical signal to the receiving end of the other module through an optical fiber, and then performs photoelectric conversion to convert the optical signal into the electric signal, thereby completing data transmission. The coupling structure of the transceiving end can be designed by matching with the optical fiber SC connector.

Since the data transmission system is based on optical transmission data, the structural design is a coupling packaging structure matched with an optical module, and the structural design is not suitable for a plastic cable coupling packaging of a sub-terahertz data module in size and structure. Specifically, the shell access port is small and cannot be adapted to a plastic waveguide for transmitting sub-THz signals; and the shielding wall is not arranged in the shell, so that the sub-THz signal shielding of the adjacent channel can not be carried out. That is, the prior art is completely an optical-based data transmission system, and therefore, the structural design is a coupling packaging structure matched with the optical module, and the prior art is not suitable for the plastic cable coupling packaging of the sub-THz data module in size and structure.

In view of this, the embodiments of the present application provide a data transceiver, a data transceiver component, and a data transmission system. The data transceiver transmits data based on Sub-Terahertz signals (Sub-THz), and thus, the data transceiver may also be referred to as a Sub-THz module. The embodiment of the application is based on the short-distance transmission technology of the CMOS chip, the antenna coupling and the THz plastic waveguide, photoelectric conversion and electro-optical conversion are not needed, the plastic waveguide can directly transmit sub-terahertz signals, power consumption is effectively reduced, heat generation is reduced, high transmission bandwidth and high transmission speed can be achieved, and the transmission bandwidth can reach more than 25G.

Fig. 1 is an assembly structure diagram of a data transmission system according to an embodiment of the present disclosure. As shown in fig. 1, the data transmission system includes a data transceiver 10, a first plastic waveguide 20, and a second plastic waveguide 30, and a first end of the first plastic waveguide 20 is mounted at a first mounting hole of the data transceiver 10. A first end of the second plastic waveguide 30 is mounted at the second mounting hole of the data-transceiving equipment 10.

Further, the data transmission system may further comprise a second data transceiving means, not shown in fig. 1. The second data-transceiving equipment may be the same as the data-transceiving equipment 10 described above. At this time, the second end of the first plastic waveguide 20 is mounted at the second mounting hole of the second data transceiving device. The second end of the second plastic waveguide 30 is mounted at the first mounting hole of the second data-transceiving equipment. That is, the plastic waveguide is a transmission line connecting the data-transceiving equipment 10 and the second data-transceiving equipment.

The following describes a specific structure of the data transceiver according to the embodiment of the present application with reference to the drawings.

Fig. 2 is an assembly structure diagram of the data transceiver in the data transmission system shown in fig. 1. Fig. 3 is an exploded schematic view of the data transceiver shown in fig. 2. As shown in fig. 2 and 3, the data transceiving apparatus includes a metal housing 1, a first metal sleeve T1, a second metal sleeve T2, and a printed circuit board 2. The metal housing 1 includes a main housing 11 and a cover plate 12, the main housing 11 is provided with a chamber, the chamber has an opening, and the cover plate 12 covers the opening of the chamber. The chamber may include a first mounting space Q1, and a first mounting hole and a second mounting hole are provided on the first side wall D1 of the first mounting space Q1. A first metal sleeve T1 is disposed at the first mounting hole for nesting the first end of the first plastic waveguide. A second metal sleeve T2 is provided at the second mounting hole for nesting the first end of the second plastic waveguide.

Fig. 4 is an enlarged view of a portion E of the data transceiver shown in fig. 3. As shown in fig. 3 and 4, the printed circuit board 2 includes a substrate 21, and a transmitting chip X1, a receiving chip X2, a first antenna a1, and a second antenna a2 provided on the substrate 21. One end of the first antenna a1 is connected to the transmitting chip X1, and the other end of the first antenna a1 extends to the first end of the substrate 21 and corresponds to the first plastic waveguide. The transmitting chip X1 is used to generate a first sub-terahertz signal that can be coupled and transmitted to the first plastic waveguide through the first antenna a 1. One end of the second antenna a2 is connected to the receiving chip X2, and the other end of the second antenna a2 extends to the first end of the substrate 21 and corresponds to the second plastic waveguide. The receiving chip X2 can receive the second sub-terahertz signal transmitted by the second plastic waveguide through the second antenna a2 in a coupled manner.

The data transceiver is suitable for transmitting the sub-terahertz signals, an optical module is not required to be arranged, power consumption is effectively reduced, and heat generation is reduced. The sub-terahertz signals are electromagnetic waves, the metal sleeves T1 and T2 can play a role in isolating interference, namely the first metal sleeve T1 and the second metal sleeve T2 can reduce signal crosstalk of the first sub-terahertz signal and the second sub-terahertz signal at the coupling position, and can better transmit the signals.

Moreover, the metal sleeves T1 and T2 can be cylindrical, and can also be formed by surrounding metal foils; in addition, the first antenna a1 and the second antenna a2 may be spaced apart by a distance to further prevent signal crosstalk, and the spacing distance may be determined by taking into consideration factors such as the wavelength and the specific structure of the antenna, for example, the spacing distance is 2-3 wavelengths. In addition, in order to make the structure compact, other isolation structures, such as a slot K and a metal spacer B (shown in fig. 3 and 4) which will be described below, or a plurality of metal columns Z (shown in fig. 6), etc., may be provided on the printed circuit board.

With continued reference to fig. 3 and 4, the first end of the substrate 21 is provided with a slot K, and the slot K is located between the first antenna a1 and the second antenna a2, the data transceiver further includes a metal partition B, the metal partition B is located in the slot K and connected to the first sidewall D1, and the metal partition B is integrally formed with the main housing 11. The slot K can play a role in preventing crosstalk of the first sub-terahertz signal and the second sub-terahertz signal to some extent, and the metal partition B can further enhance the function of preventing crosstalk of the sub-terahertz signal at the coupling position. That is, the metal separator B has a strong crosstalk prevention performance, for example, a crosstalk lower than-45 dB. In addition, the slot K may extend from the first end of the substrate 21 to or beyond the transmitting chip X1. Guarantee like this that can hold the metal partition board B of sufficient length in the fluting K, fluting K and the cooperation of metal partition board B can play the effect that prevents signal emergence crosstalk better.

Fig. 5 is another exploded schematic view of the data transceiver shown in fig. 2. As shown in fig. 5, the metal partition B is formed separately from the main housing 11, the metal partition B includes a partition B1 and a positioning plate B2 connected to the partition B1, the partition B1 is located in the slot K, the first side wall D1 is provided with an installation slot, and the positioning plate B2 is in positioning fit with the installation slot.

As shown in fig. 3 and 5, the first mounting space Q1 may be a rectangular body, and through holes for heat dissipation are provided on at least one of the second side wall D2 of the first mounting space Q1 at both sides of the first side wall D1 and the cover plate 12. Set up the heat dissipation through-hole, can avoid the high temperature in the first installation space Q1, guarantee that chip X1, X2 can normally work. In addition, in order to facilitate positioning and mounting the printed circuit board 2, one of the second side wall D2 of the first mounting space Q1, which is located on both sides of the first side wall D1, and the printed circuit board 2 is provided with a positioning column C, and the other is provided with a positioning groove G, and the positioning column C can be in positioning fit with the positioning groove G. As shown in fig. 3, a positioning groove G may be formed on the printed circuit board 2, and a positioning post C may be formed on the second side wall D2 of the first mounting space Q1, so that the position of the printed circuit board 2 is fixed, which helps to increase the assembly speed.

Further, the chamber 11 may further include a second installation space Q2, the first side wall D1 is located between the second installation space Q2 and the first installation space Q1, an end of the second installation space Q2 opposite to the first side wall D1 is open, and the data transceiver further includes a snap member 3. The first end of the clamping component 3 can be clamped and installed in the second installation space Q2, the first end of the clamping component 3 is provided with a first arc-shaped open groove K1 and a second arc-shaped open groove K2 side by side, the first arc-shaped open groove K1 is used for clamping and fixing the first plastic waveguide and/or the first metal sleeve T1, and the second arc-shaped open groove K2 is used for clamping and fixing the second plastic waveguide and/or the second metal sleeve T2. The second end of the clamping component 3 is a hollow structure, the hollow structure is communicated with the first arc-shaped slot K1 and the second arc-shaped slot K2, and the hollow structure is used for installing the parts of the first plastic waveguide and the second plastic waveguide with the isolating layers.

The engaging member 3 may be made of plastic and manufactured by injection molding. The two plastic waveguides at the first side wall D1 have no isolation layer or the isolation layer is relatively thin, and therefore need to be disposed within the metal sleeves T1, T2, respectively, for isolation. The arc-shaped slots K1, K2 on the snap member 3 may only snap the plastic waveguide, so that the end surface of the first end of the snap member 3 may abut against the two metal sleeves T1, T2, thereby restricting the movement of the two metal sleeves T1, T2 in the axial direction, or the arc-shaped slots K1, K2 on the snap member 3 may snap-fix the plastic waveguide and the metal sleeves T1, T2 at the same time. That is to say, the clamping component can clamp and fix the plastic waveguide to be coupled with the antenna, so that the coupling mode with the sub-THz plastic waveguide can be performed in a plugging mode, and the operation is convenient.

One of the clamping component 3 and the cover plate 12 can be provided with a clamping groove N, the other can be provided with a clamping block, and the clamping groove N and the clamping block can be clamped and connected. For example, the engaging member 3 is provided with a slot N, and the cover plate 12 is provided with a latch, such that the first end of the engaging member 3 can be first engaged with the second mounting space Q2 of the main housing 11, and then the cover plate 12 is covered on the main housing 11, and the latch on the cover plate 12 is engaged with the slot N on the engaging member 3, so as to prevent the engaging member 3 from moving along the axial direction of the metal sleeves T1 and T2, and achieve positioning, thereby facilitating assembly, and simultaneously making the connection between the cover plate 12 and the engaging member 3 more reliable.

Further, as shown in fig. 3 and 5, an aperture may be disposed on the cover plate 12, a baffle plate W may be disposed in the second installation space Q2, the baffle plate W may be parallel to the first side wall D1, a threaded hole may be disposed on the baffle plate W, a fastener J2 penetrates through the aperture on the cover plate 12 and is fixed in the threaded hole on the baffle plate W, so that the cover plate 12 and the main housing 11 are reliably connected, the fastener J2 may be a screw, and in order to reduce weight and save material, the second side wall D2 of the main housing 11 is generally thin under the condition of meeting the strength requirement, in order to facilitate the provision of the threaded hole at the connection position of the baffle plate W and the two side walls of the second installation space Q2, the two side walls of the second installation space Q2 may be thickened for increasing strength.

In addition, the data transceiver device further comprises a sleeve 4, the sleeve 4 is installed in the hollow structure, at least part of the sleeve 4 extends out of the second end of the clamping component, and the parts with the isolation layers of the first plastic waveguide and the second plastic waveguide are used for being installed in the sleeve 4. Because at least part of the sleeve 4 extends out of the second end of the clamping part 3, the extension direction of the plastic waveguide can be in advance consistent with the extension directions of the hollow structure of the clamping part 3 and the arc-shaped slots K1 and K2, and the plastic waveguide and the data transceiver are convenient to assemble.

Fig. 6 is a partial schematic structural diagram of a printed circuit board in the data transceiver shown in fig. 2. As shown in fig. 6, a plurality of metal pillars Z are provided through the substrate 21 between the first antenna a1 and the second antenna a2, and are arranged at intervals in a direction from the transmitting chip X1 to the first end of the substrate 21. Therefore, electromagnetic waves, namely sub-terahertz signals can resonate at a plurality of metal columns Z, coupling to adjacent antennas is avoided, and crosstalk is prevented, wherein the metal columns Z can be solid or hollow structures with two closed ends. In addition, the metal column Z may be cylindrical, for example, or may have another shape.

Further, the transmitting chip X1 and the receiving chip X2 are disposed side by side, and a plurality of metal pillars Z extend from the first end of the substrate 21 to or beyond the transmitting chip X1. Therefore, the metal columns can better play a role in preventing the sub-terahertz signals from crosstalk.

Fig. 7 is a partial structural schematic diagram of the data transceiver shown in fig. 2. As shown in fig. 3, 5 and 7, the data transceiver device of the above embodiment further includes a latch assembly 5, and the latch assembly 5 includes a main plate 51, a hook 52, a first elastic member 53 and a pulling member 54. The main plate 51 is fixedly connected to the bottom of the main housing 11. The hook 52 is located between the main board body 51 and the main housing 11, and includes a hook main body 521 and a rotating shaft 522 disposed in the middle of the hook main body 521, and the rotating shaft 522 is rotatably disposed on the main board body 51. The first elastic element 53 includes a fixing portion 531 and an elastic portion 532, the fixing portion 531 is fixedly connected to the main housing 11, one end of the elastic portion 532 is connected to the fixing portion 531, and the other end of the elastic portion abuts against the first end of the hook main body 521 at the side of the hook main body 521 away from the main housing 11. In one example, as shown in fig. 3 and 5, a first hole is formed on the main plate 51, and a second hole is formed on the fixing portion 531, as shown in fig. 7, a threaded hole is formed in the bottom of the main housing 11, and a fastening member J1 is sequentially inserted through the first hole and the second hole of the fastening member J1 and then fixed in the threaded hole in the bottom of the main housing 11, so as to fixedly connect the main plate 51 and the first elastic member 53 to the main housing 11, wherein the fastening member J1 may be a screw.

As shown in fig. 3, 5 and 7, a first end of the pulling member 54 extends out of the main plate body 51, a second end of the pulling member 54 is located between the hook main body 521 and the main housing 11 and is provided with a groove R, and the pulling member 54 can move between a first position and a second position. In the first position, the first end of the hook main body 521 is located in the recess R under the abutting of the elastic portion 532, and the second end of the hook main body 521 is away from the main housing 11 to engage with the through hole of the cage. When the first end of the pulling element 54 moves to the second position along the direction away from the rotating shaft 522 under the action of an external force, the flat portion P at the second end of the pulling element 54 abuts against the first end of the hook main body 521, so that the first end of the hook main body 521 rotates away from the main housing 11, and the second end of the hook main body 521 rotates towards the main housing 11 and disengages from the through hole on the cage.

The data transceiver generally needs to have a shell withdrawing structure, so that the data transceiver can be clamped to prevent the data transceiver from being loosened when the data transceiver is inserted into the cage, interruption of transmission signals is avoided, and the data transceiver can be easily pulled out of the cage when the data transceiver needs to be taken out. In the embodiment of the application, the shell withdrawing structure of the data transceiver is a buckle component. A plurality of cages can be generally installed in a case, a data transceiver can be installed in each cage, the data transceiver can be clamped with the cage through a clamping component 5, the cage is used for limiting and fixing the data transceiver, and the cage is also used for shielding electromagnetic radiation in the data transceiver so as to prevent the electromagnetic radiation among the data transceivers 10 from interfering with each other.

In addition, in order to avoid occupying the first installation space Q1, the clip assembly 5 may be disposed at the bottom of the main housing 11, which is the data transceiver, and correspondingly, the bottom of the cage is provided with a through hole for the hook of the clip assembly 5 to extend into, so that when the data transceiver is inserted into the cage, the first end of the hook main body 521 is located in the groove R under the abutting of the elastic portion 532, and the second end of the hook main body 521 is away from the main housing 11 to be engaged with the through hole of the cage, thereby limiting the data transceiver in the cage. When the data transceiver needs to be pulled out, an external force far away from the rotating shaft needs to be applied to the first end of the pulling part 54, the flat part P at the second end of the pulling part 54 abuts against the first end of the hook main body 521, so that the first end of the hook main body 521 rotates far away from the main casing 11, meanwhile, the second end of the hook main body 521 rotates towards the main casing 11, and is separated from the through hole on the cage, and then the data transceiver is pulled out from the cage.

Further, a slot S is disposed on the main plate 51, the second end of the pulling member 54 is located in the slot S, the buckle assembly 5 further includes a second elastic member 55, and the second elastic member 55 is disposed between the flat portion P at the second end of the pulling member 54 and the side wall of the slot S far away from the rotating shaft 522. When the movable member 54 is moved from the first position to the second position by an external force, the second elastic member 55 is compressed; the compressed second elastic member 55 can provide a restoring force for moving the pulling member 54 from the second position to the first position when no external force is applied. Through setting up the second elastic component, can be so that do not have the exogenic action, the pulling piece can be by second position automatic re-setting to the first position, when inserting data transceiver in the cage like this, can make the automatic through hole block with the cage of the second end of the pothook main part of buckle subassembly.

The assembly process of the data transceiver may be as follows:

1) assembling the snap assembly 5, and then mounting the snap assembly 5 on the main housing 11;

2) placing a Printed Circuit Board (PCB) 2 into the main shell 11, and positioning a positioning groove G on the PCB to be positioned and matched with a positioning column C on the main shell 11 so as to position and fix the PCB; if the metal partition plate B and the main housing 11 are of a separate structure, the metal partition plate B may be mounted on the main housing 11;

3) mounting a first metal sleeve T1 at the first mounting hole and a second metal sleeve T2 at the second mounting hole; the first end of the engaging member 3 is engaged and fixed in the second mounting space Q2 of the main housing 11, wherein the first end of the engaging member 3 can contact with the first metal sleeve T1 and the second metal sleeve T2, so as to limit the movement of the first metal sleeve T1 and the second metal sleeve T2 along the axial direction;

4) the first plastic waveguide is sequentially arranged at a first metal sleeve T1 through the hollow structure and the first arc-shaped slot K1 at the second end of the clamping part 3, and the second plastic waveguide is sequentially arranged at a first metal sleeve T2 through the hollow structure and the second arc-shaped slot K2 at the second end of the clamping part 3;

5) the cover 12 is closed at the opening of the main housing 11, the latch of the cover 12 is engaged with the latch N of the first end of the engaging member 3, and the fastening member J2 is fixed at the threaded hole of the blocking wall W of the main housing 11 after passing through the cover, thereby securely fixing the cover 12 and the main housing 11 together.

It should be noted that the above-mentioned assembly process is only one possible implementation manner, and the steps may also be adjusted, for example, after the step 1) is adjusted to the step 5), the specific assembly process may be flexibly adjusted according to the need.

Fig. 8 is an exploded schematic structural diagram of a data transceiving component according to an embodiment of the present application. Figure 9 is a simplified block diagram of the cage in the data transceiver assembly shown in figure 8. As shown in fig. 8 and 9, the data transceiver module includes a cage L and the data transceiver 10, one end of the cage L is open, a spring structure L1 is disposed on a bottom wall of the open end of the cage L, a through hole L11 is disposed on the spring structure L1, and a portion of the data transceiver where the printed circuit board 2 is disposed is located inside the cage L, that is, a mounting portion of the data transceiver 10 in fig. 8 is located inside the cage L. In addition, in the first position, the second end of the hook main body 521 in the buckle assembly 5 of the data transceiver 10 can extend into the through hole L11 of the elastic sheet structure L1, so as to realize the snap connection.

In one example, as shown in fig. 7, the outer contour of the end of the second end of the hook main body 521 can be triangular, as shown in fig. 8, and the through hole of the cage L can also be triangular, and the shapes of the two triangles match. As shown in fig. 7, the triangular protrusion is provided on the side of the triangular end of the hook main body 521 away from the main housing 11. When the hook main body 521 is in the first position, the triangular end of the hook main body 521 extends into the triangular through hole of the cage L, and the bottom edge of the triangular through hole of the cage L is clamped by the bottom edge of the triangular protrusion on the triangular end of the hook main body 521, so that the clamping connection is realized.

In addition, since the extending direction of the hook main body 521 is substantially parallel to the bottom wall of the main housing 11 in the second position, and the first end of the hook main body 521 is close to the bottom wall of the main housing 11 and the second end of the hook main body 521 is far away from the bottom wall of the main housing 11 in the first position, the space occupied by the hook main body 521 in the direction perpendicular to the bottom wall of the main housing 11 is relatively large, that is, a sufficient space needs to be formed between the bottom wall of the main housing 11 and the bottom wall of the cage L to accommodate the hook main body 521. Therefore, can set up shell fragment structure L1 on cage L's the bottom wall, this shell fragment structure L1's first end is connected with cage L's bottom wall, and the second end is the free end, and this shell fragment structure L1's both sides and cage L's bottom wall separation for this shell fragment structure L1 can rotate around its first end, and triangular through-hole L11 can set up on this shell fragment structure L1. In this way, in the first position, the first end of the hook main body 521 is located in the groove R under the abutting of the elastic part 532, and the second end of the hook main body 521 can press down the spring structure L1 on the cage, so that a sufficiently large space is formed between the spring structure L1 and the bottom wall of the main housing 11, and the second end of the hook main body 521 can be ensured to rotate away from the main housing 11, and, as described above, the triangular end of the second end of the hook main body 521 can be engaged with the triangular through hole L11 on the cage L.

The embodiment of the application mainly solves the packaging problem of the data transmission assembly in the sub-THz wave band (less than or equal to 1THz), can reliably fix the plastic waveguide for transmitting the sub-THz signal, can efficiently couple energy when transmitting and receiving the sub-THz wave band data, effectively prevents signal crosstalk, realizes higher transmission bandwidth and speed, simplifies a coupling structure and improves manufacturability. Specifically, the clamping component can clamp and fix the plastic waveguide to be coupled with the antenna, so that the coupling mode with the sub-THz plastic waveguide can be performed in a plugging mode, and the operation is convenient. Moreover, the two plastic waveguides can be aligned and fixed by adopting a metal sleeve, a slot can be arranged in the middle of the PCB and has a certain gap, so that the PCB is isolated from a transmitting end (a transmitting chip and a first antenna)/a receiving end (a receiving chip and a second antenna), and a metal partition plate can be arranged in the slot to further enhance the isolation effect and prevent signal crosstalk; alternatively, a metal column may be constructed by a PCB to isolate the electromagnetic field, thereby achieving low crosstalk coupling. In addition, the metal shell may be drilled to aid in heat dissipation.

Finally, the description is as follows: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A data transmission/reception apparatus, comprising:

the metal shell (1) comprises a main shell (11) and a cover plate (12), wherein a cavity is arranged on the main shell (11), the cavity is provided with an opening, the cover plate (12) covers the opening of the cavity, the cavity comprises a first mounting space (Q1), and a first mounting hole and a second mounting hole are arranged on a first side wall (D1) of the first mounting space (Q1);

a first metal sleeve (T1) disposed at the first mounting hole for sleeving a first end of the first plastic waveguide;

a second metal sleeve (T2) arranged at the second mounting hole and used for sleeving the first end of the second plastic waveguide;

a printed circuit board (2) including a substrate (21), and a transmitting chip (X1), a receiving chip (X2), a first antenna (A1), and a second antenna (A2) provided on the substrate (21); one end of the first antenna (a1) is connected with the transmitting chip (X1), and the other end of the first antenna (a1) extends to the first end of the substrate (21) and corresponds to the first plastic waveguide; the transmitting chip (X1) is used for generating a first sub-terahertz signal which can be coupled and transmitted to the first plastic waveguide through the first antenna (A1); one end of the second antenna (a2) is connected with the receiving chip (X2), and the other end of the second antenna (a2) extends to the first end of the substrate (21) and corresponds to the second plastic waveguide; the receiving chip (X2) can be used for coupling and receiving a second sub-terahertz signal transmitted by the second plastic waveguide through the second antenna (A2).

2. The data transceiving apparatus of claim 1, wherein a plurality of metal pillars (Z) are disposed through the substrate (21) between the first antenna (a1) and the second antenna (a2), the plurality of metal pillars (Z) being spaced apart in a direction from the transmitting chip (X1) to the first end of the substrate (21).

3. The data transceiving apparatus of claim 2, wherein the transmitting chip (X1) and the receiving chip (X2) are disposed side by side, and the plurality of metal pillars (Z) extend from the first end of the substrate (21) to or beyond the transmitting chip (X1).

4. The data transceiving device of claim 1, wherein the first end of the substrate (21) is provided with a slot (K) and the slot (K) is located between the first antenna (a1) and the second antenna (a2), the data transceiving device further comprising a metal spacer (B), wherein:

the metal partition plate (B) is connected with the first side wall (D1) and is positioned in the slot (K), and the metal partition plate (B) is integrally formed with the main shell (11); or the like, or, alternatively,

metal baffle (B) with main casing body (11) components of a whole that can function independently shaping, metal baffle (B) include division board (B1) and with locating plate (B2) that division board (B1) link to each other, division board (B1) are located in fluting (K), be provided with the mounting groove on first lateral wall (D1), locating plate (B2) with mounting groove location fit.

5. The data transceiving device of claim 4, wherein the slot (K) extends from the first end of the substrate (21) to or beyond the transmitting chip (X1).

6. The data transceiving apparatus according to claim 1, wherein the chamber further comprises a second mounting space (Q2), the first sidewall (D1) is located between the first mounting space (Q1) and the second mounting space (Q2), an end of the second mounting space (Q2) opposite to the first sidewall (D1) is open, the data transceiving apparatus further comprises a snap-in part (3), wherein:

the first end of the clamping component (3) can be clamped and installed in the second installation space (Q2), a first arc-shaped slot (K1) and a second arc-shaped slot (K2) are arranged at the first end of the clamping component (3) side by side, the first arc-shaped slot (K1) is used for clamping and fixing the first plastic waveguide and/or the first metal sleeve (T1), and the second arc-shaped slot (K2) is used for clamping and fixing the second plastic waveguide and/or the second metal sleeve (T2);

the second end of the clamping component (3) is of a hollow structure, the hollow structure is communicated with a first arc-shaped slot (K1) and a second arc-shaped slot (K2), and the hollow structure is used for installing the parts, with the isolating layers, of the first plastic waveguide and the second plastic waveguide.

7. The data transceiver device according to claim 6, wherein one of the engaging member (3) and the cover plate is provided with a engaging groove (N), and the other is provided with a locking block, and the engaging groove (N) and the locking block can be engaged.

8. Data transceiver device according to claim 6, characterized in that the data transceiver device further comprises a sleeve (4), the sleeve (4) being mounted in the hollow structure with at least a part of the sleeve (4) protruding out of the second end of the snap means, the parts of the first and second plastic waveguides with the isolating layer being intended to be mounted in the sleeve (4).

9. The data transceiving apparatus according to any one of claims 1 to 8, wherein the first installation space (Q1) is a rectangular body in which:

through holes for heat dissipation are provided on at least one of a second side wall (D2) of the first mounting space (Q1) on both sides of the first side wall (D1) and the cover plate (12); and/or the presence of a gas in the gas,

the second side wall (D2) of the first installation space (Q1) positioned at two sides of the first side wall (D1) and one of the printed circuit boards (2) is provided with a positioning column (C), the other one of the second side wall and the printed circuit boards is provided with a positioning groove (G), and the positioning column (C) can be matched with the positioning groove (G) in a positioning way.

10. The data transceiving apparatus according to any one of claims 1 to 8, further comprising a snap assembly (5), the snap assembly (5) comprising:

the main plate body (51) is fixedly connected with the bottom of the main shell (11);

the hook (52) is positioned between the main plate body (51) and the main shell (11), and comprises a hook main body (521) and a rotating shaft (522) arranged in the middle of the hook main body (521), wherein the rotating shaft (522) is rotatably arranged on the main plate body (51);

the first elastic piece (53) comprises a fixed part (531) and an elastic part (532), the fixed part (531) is fixedly connected with the main shell (11), one end of the elastic part (532) is connected with the fixed part (531), and the other end of the elastic part abuts against the first end of the hook main body (521) on the side surface, far away from the main shell (11), of the hook main body (521);

a pulling member (54), a first end of the pulling member (54) extends out of the main plate body (51), a second end of the pulling member (54) is located between the hook main body (521) and the main housing (11) and is provided with a groove (R), the pulling member (54) can move between a first position and a second position, wherein:

when the cage is in the first position, the first end of the hook main body (521) is positioned in the groove (R) under the abutting of the elastic part (532), and the second end of the hook main body (521) is far away from the main shell (11) to be clamped with the through hole on the cage;

when the first end of the pulling part (54) enables the pulling part (54) to move to the second position along the direction far away from the rotating shaft (522) under the action of external force, the flat part (P) at the second end of the pulling part (54) abuts against the first end of the hook main body (521), so that the first end of the hook main body (521) is enabled to rotate far away from the main shell (11), and meanwhile, the second end of the hook main body (521) rotates towards the main shell (11) and is disengaged from the through hole in the cage.

11. The data transceiver device according to claim 10, wherein a slot (S) is disposed on the main board body (51), the second end of the pulling member (54) is located in the slot (S), the buckle assembly (5) further includes a second elastic member (55), one end of the second elastic member (55) abuts against the flat portion (P) at the second end of the pulling member (54), and the other end of the second elastic member (55) abuts against the side wall of the slot (S) far away from the rotating shaft (522), wherein:

when the pulling piece (54) moves from the first position to the second position under the action of external force, the second elastic piece (55) is compressed;

the second spring (55) is capable of providing a restoring force to move the pulling member (54) from the second position to the first position when no external force is applied.

12. A data transceiver component, characterized in that, the data transceiver component includes a cage (L) and a data transceiver device (10) according to any one of claims 10 or 11, one end of the cage (L) is open, and a spring structure (L1) is disposed on a bottom wall of the open end of the cage (L), a through hole (L11) is disposed on the spring structure (L1), a portion of the data transceiver device where the printed circuit board (2) is disposed is located in the cage (L), and when in a first position, a second end of a hook main body (521) in a buckle assembly (5) of the data transceiver device (10) can extend into the through hole (L11) on the spring structure (L1) to realize a snap-fit connection.

13. A data transmission system, characterized in that the data transmission system comprises:

data transceiving apparatus (10) as claimed in any one of claims 1 to 11;

a first plastic waveguide (20), a first end of the first plastic waveguide (20) is installed at a first installation hole of the data transceiver device (10);

a second plastic waveguide (30), a first end of the second plastic waveguide (30) being mounted at a second mounting hole of the data transceiving device (10).