CN216288404U

CN216288404U - Optical chip packaging structure

Info

Publication number: CN216288404U
Application number: CN202122868311.8U
Authority: CN
Inventors: 李�浩
Original assignee: Wuxi Shenzhou Gaoxin Technology Co ltd
Current assignee: Wuxi Shenzhou Gaoxin Technology Co ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-04-12
Anticipated expiration: 2031-11-22

Abstract

The utility model belongs to the technical field of optical chip packaging, and discloses an optical chip packaging structure which comprises a shell, wherein an optical chip body is placed in the shell, lead pins are arranged on the left side and the right side of the optical chip body, a mounting plate is fixedly connected to the front lower part and the rear lower part of the shell, a collecting groove is formed in the top of one side of the mounting plate adjacent to the shell, a radiating groove is formed in the front middle part and the rear middle part of the shell, a filter screen is fixedly installed in the radiating groove, a protective cover is placed on the top of the shell, a first sealing gasket is fixedly connected to the opposite surfaces of the shell and the protective cover, and threaded holes are formed in the opposite positions of the shell, the protective cover and the first sealing gasket, so that the optical chip body can be better radiated, the optical chip body is not easy to damage when in use, meanwhile, the lead pins can be better positioned, and the stability of the lead pins in use is improved, but also can seal the optical chip body better.

Description

Optical chip packaging structure

Technical Field

The utility model belongs to the technical field of optical chip packaging, and particularly relates to an optical chip packaging structure.

Background

With the increasing demand of the optical communication technology and the continuous development of 5G, the optical chip is used as a core device in the above fields, the manufacturing process flow of the optical chip is complex, the optical chip needs to be packaged after the optical chip is produced, the optical chip is usually packaged in a small box, and the optical chip lead pins penetrate through the small box and are connected with other devices.

The optical chip packaging structure is provided, and the problems are better solved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to: in order to solve the above-mentioned problems: at present, the optical chip packaging structure is single, so that the heat dissipation effect of the optical chip is not ideal, meanwhile, the optical chip is arranged in the shell, a gap can be generated between the shells, the sealing performance is not good, and the positioning of the terminal pins is unstable, so that the optical chip packaging structure needs to be improved, and the optical chip packaging structure is provided.

The technical scheme adopted by the utility model is as follows: a photonic chip packaging structure comprises a shell, a photonic chip body is placed in the shell, terminal pins are arranged on the left side and the right side of the photonic chip body, a mounting plate is fixedly connected with the front lower part and the rear lower part of the shell, a collecting groove is formed in the top of one side of the mounting plate adjacent to the shell, a radiating groove is formed in the middle of the front part and the rear part of the shell, a filter screen is fixedly installed in the radiating groove, a protective cover is placed at the top of the shell, a first sealing gasket is fixedly connected with the opposite surface of the shell and the protective cover, a threaded hole is formed in the opposite positions of the shell, the protective cover and the first sealing gasket, a bolt is connected with the internal thread of the threaded hole, positioning grooves are formed in the positions of the shell, the protective cover and the first sealing gasket opposite to the terminal pins, the terminal pins are clamped in the positioning grooves, and an extrusion block is fixedly connected with the inner parts of the positioning grooves formed in the protective cover opposite to the terminal pins, the bottom of the relative terminal pin of shell seted up some constant head tanks and extrusion piece all fixedly connected with second sealed pad, and the pressfitting of second sealed pad is on the terminal pin.

In a preferred embodiment, the mounting plate is mounted at a position required to be used through a second bolt, the heat dissipation groove is of a through groove structure, and the filter screen is obliquely and fixedly connected inside the heat dissipation groove.

In a preferred embodiment, the length of the heat dissipation groove is smaller than the length of the collection groove, and the first sealing gasket is matched with the opposite surfaces of the casing and the protective cover.

In a preferred embodiment, the threaded hole is formed at the peripheral edges of the housing, the protective cover and the first gasket, and the bolt is matched with the threaded hole.

In a preferred embodiment, the width of the positioning groove is matched with that of the terminal pin, and the terminal pin is of a Z-shaped structure.

In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that: be convenient for better dispel the heat to the optical chip body for the optical chip body is difficult for receiving the damage when using, can carry out better location to the pin simultaneously, increases the pin and makes stability in the use, can carry out better sealed moreover to the optical chip body.

1. According to the utility model, the heat dissipation grooves are formed in the front middle part and the rear middle part of the shell, so that the optical chip body can be conveniently dissipated with heat through the heat dissipation grooves, the optical chip body is not easy to damage, the filter screen is fixedly connected to the inner part of the heat dissipation grooves in an inclined mode, so that dust and other impurities can be conveniently filtered, meanwhile, the dust and other impurities can slide down through the filter screen, the collecting groove is formed in one side of the adjacent shell at the top of the mounting plate, and the dust and other impurities can be conveniently collected in the collecting groove.

2. According to the utility model, the positioning grooves are formed in the positions of the shell and the protective cover relative to the terminal pins, so that the terminal pins can be conveniently clamped in the positioning grooves, the extrusion blocks are fixedly connected inside the positioning grooves formed in the positions of the protective cover relative to the terminal pins, so that the extrusion blocks and the second sealing gaskets can be conveniently extruded on the terminal pins, the positions of the terminal pins can be better positioned, the first sealing gaskets are fixedly connected to the opposite surfaces of the shell and the protective cover, and the optical chip body can be better sealed through the matching of the first sealing gaskets and the second sealing gaskets.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the structure of area A in FIG. 1 according to the present invention;

FIG. 3 is an enlarged view of the structure of the area B in FIG. 1 according to the present invention.

The labels in the figure are: the optical chip comprises a shell 1, an optical chip body 2, a lead pin 3, a mounting plate 4, a collecting tank 5, a radiating groove 6, a filter screen 7, a protective cover 8, a first sealing gasket 9, a threaded hole 10, a bolt 11, a positioning groove 12, a squeezing block 13 and a second sealing gasket 14.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

An optical chip package structure according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.

Example (b):

referring to fig. 1 and 2, an optical chip package structure includes a housing 1, an optical chip body 2 is disposed inside the housing 1, lead pins 3 are disposed on the left and right sides of the optical chip body 2, the lead pins 3 are of a zigzag structure, a mounting plate 4 is fixedly connected to the front and rear lower portions of the housing 1, the mounting plate 4 is mounted at a position to be used by a second bolt, a collecting groove 5 is formed in the top portion of one side of the mounting plate 4 adjacent to the housing 1 for collecting impurities such as dust in the collecting groove 5, a heat dissipating groove 6 is formed in the front and rear middle portions of the housing 1, the heat dissipating groove 6 is of a through groove structure, the length of the heat dissipating groove 6 is smaller than that of the collecting groove 5, so that the optical chip body 2 can be dissipated heat by the heat dissipating groove 6, the optical chip body 2 is not easily damaged, a filter screen 7 is fixedly mounted inside the heat dissipating groove 6, the filter screen 7 is fixedly connected to the inside the heat dissipating groove 6 in an inclined manner, be convenient for filter debris such as dust, debris such as dust carry out the landing through filter screen 7 simultaneously, protective cover 8 has been placed at the top of shell 1, the first sealed pad 9 of opposite face fixedly connected with of shell 1 and protective cover 8, first sealed pad 9 and shell 1 and the 8 opposite face looks adaptations of protective cover, shell 1, protective cover 8 and the first sealed pad 9 relative position set up screw hole 10, screw hole 10 is seted up at shell 1, the edge all around of protective cover 8 and the first sealed pad 9, the inside threaded connection of screw hole 10 has bolt 11, bolt 11 and the 10 looks adaptations of screw hole.

Referring to fig. 1 and 3, a housing 1, a positioning groove 12 has been seted up to the relative terminal pin 3's of protective cover 8 and first sealed pad 9 position, and terminal pin 3 joint is in positioning groove 12, positioning groove 12 width and terminal pin 3 looks adaptation, be convenient for with terminal pin 3 joint in positioning groove 12, protective cover 8 relative terminal pin 3 offers the inside fixedly connected with extrusion piece 13 of constant positioning groove 12 that has, the equal fixedly connected with second of the bottom that the relative terminal pin 3 of housing 1 offered some constant positioning groove 12 and extrusion piece 13 seals up 14, and the sealed 14 pressfitting of second seals up on terminal pin 3, be convenient for with the sealed 14 extrusion of extrusion piece 13 and second on terminal pin 3, can carry out better location to terminal pin 3's position, simultaneously through the sealed cooperation of pad 9 of first sealed and the sealed pad 14 of second, better seal up light chip body 2.

This application advantage: be convenient for better dispel the heat to optical chip body 2 for optical chip body 2 is difficult for receiving the damage when using, can carry out better location to terminal pin 3 simultaneously, increases terminal pin 3 and makes stability using, can carry out better sealing to optical chip body 2 moreover.

The working principle is as follows: when installing light chip body 2, place light chip body 2 in shell 1, this moment lead pin 3 is placed in the constant head tank 12 that sets up some in the 1 left and right sides of shell, with the protective cover 8 joint at 1 top of shell, constant head tank 12 joint that protective cover 8 relative lead pin 3 positions was seted up is in lead pin 3 tops this moment, the sealed 14 pressfittings of pad at lead pin 3 tops of extrusion piece 13 and second simultaneously, with bolt 11 threaded connection in screw hole 10, can be with the better location of light chip body 2 in shell 1, the better location of lead pin 3 is in constant head tank 12 simultaneously, it can to fix the position that needs use mounting panel 4 through the second bolt.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. An optical chip packaging structure comprises a shell (1), and is characterized in that: optical chip body (2) have been placed to the inside of shell (1), and the left and right sides of optical chip body (2) is provided with terminal pin (3), below fixedly connected with mounting panel (4) around shell (1), seted up collecting vat (5) in one side top of adjacent shell (1) of mounting panel (4), radiating groove (6) have been seted up at the middle part around shell (1), and the inside fixed mounting of radiating groove (6) has filter screen (7), protective cover (8) have been placed at the top of shell (1), the first sealed pad (9) of opposite face fixedly connected with of shell (1) and protective cover (8), screw hole (10) have been seted up to shell (1), protective cover (8) and first sealed pad (9) relative position, and the internal thread of screw hole (10) is connected with bolt (11), shell (1), Constant head tank (12) have been seted up to protective cover (8) and the position of the relative pin (3) of first sealed pad (9), and pin (3) joint in constant head tank (12), protective cover (8) relative pin (3) are seted up some constant head tank (12) inside fixedly connected with extrusion piece (13), the equal fixedly connected with second of the bottom of constant head tank (12) and extrusion piece (13) that shell (1) relative pin (3) were seted up fills up (14), and the sealed pad (14) pressfitting of second is on pin (3).

2. The optical chip package structure of claim 1, wherein: the mounting plate (4) is mounted in a position needing to be used through a second bolt, the heat dissipation groove (6) is of a through groove structure, and the filter screen (7) is obliquely and fixedly connected inside the heat dissipation groove (6).

3. The optical chip package structure of claim 2, wherein: the length of radiating groove (6) is less than the length of collecting vat (5), first sealed pad (9) and shell (1) and protective cover (8) opposite face looks adaptation.

4. The optical chip package structure of claim 1, wherein: screw hole (10) are seted up in the edge all around of shell (1), protective cover (8) and first sealed pad (9), bolt (11) and screw hole (10) looks adaptation.

5. The optical chip package structure of claim 1, wherein: the width of the positioning groove (12) is matched with that of the terminal pin (3), and the terminal pin (3) is of a Z-shaped structure.