CN216288319U - Demoulding device for demoulding integrated circuit packaging product - Google Patents

Abstract

The utility model discloses a demoulding device for demoulding an integrated circuit packaging product, and relates to the technical field of integrated circuit packaging demoulding. This integrated circuit encapsulates product demoulding and uses shedder, including bottom plate and slewing mechanism, two sets of curb plates of top fixedly connected with of bottom plate, the adjacent lateral wall fixed mounting of two sets of curb plates has diaphragm A, and the adjacent lateral wall of two sets of curb plates is fixed with diaphragm B, and the equal fixedly connected with connecting block of adjacent lateral wall of two sets of curb plates is provided with the sliding plate on the connecting block, and slewing mechanism includes handle, dwang and cam, and the handle can make the cam rotate. This device can be to sliding plate rebound, and the convenience is demolded integrated circuit's mould, and the phenomenon that the card went on is prevented appearing in the setting of two sets of cams, still enough plays the effect of mould simultaneously ejecting effect, and the silica gel top has reduced the risk of damaging the chip.

Description

Demoulding device for demoulding integrated circuit packaging product

Technical Field

The utility model relates to the technical field of integrated circuit packaging demolding, in particular to a demolding device for demolding an integrated circuit packaging product.

Background

An integrated circuit is a miniature electronic device or a component, an integrated circuit packaging mold generally aims at packaging and processing of products such as semiconductors, chips and the like, and the situation of blocking easily occurs when the existing partial demolding device performs demolding, so that the mold cannot be completely ejected, secondary demolding is required manually, and demolding efficiency is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve at least one technical problem in the prior art, and provides a demoulding device for demoulding an integrated circuit packaging product, which can solve the problem that a mould cannot be completely ejected.

In order to achieve the purpose, the utility model provides the following technical scheme: a demoulding device for demoulding of integrated circuit packaging products comprises a bottom plate and a rotating mechanism, wherein the top of the bottom plate is fixedly connected with two groups of side plates, the adjacent side walls of the two groups of side plates are fixedly provided with a transverse plate A, the adjacent side walls of the two groups of side plates are fixedly provided with a transverse plate B, the adjacent side walls of the two groups of side plates are fixedly connected with connecting blocks, and the connecting blocks are provided with sliding plates;

the rotating mechanism comprises a handle, a rotating rod and a cam, and the handle can enable the cam to rotate.

Preferably, the adjacent lateral wall of two sets of curb plates rotates installs the dwang, and the one end of dwang extends to one side and fixed mounting of a set of curb plate has the handle, and fixed cover is equipped with two sets of cams on the outer wall of dwang, and manual rotation handle, handle drive dwang rotate, and the dwang drives the cam rotation, and the outstanding department of cam withstands the sliding plate and upwards slides.

Preferably, the connecting block is provided with a sliding groove, the two sides of the sliding plate are slidably mounted in the sliding groove, the connecting block is slidably mounted with the sliding plate, three groups of fixing rods are fixedly connected to the top of the sliding plate, three groups of springs are fixedly sleeved on the outer walls of the three groups of fixing rods, and the top ends and the bottom ends of the three groups of springs are respectively fixedly connected with the bottom of the transverse plate B and the top of the sliding plate.

Preferably, three groups of openings through which the fixing rods can penetrate are formed in the transverse plate B, the top of each fixing rod is fixedly connected with a U-shaped needle, the top of each U-shaped needle is fixedly connected with two groups of silica gel tops, the sliding plate drives the fixing rods to move upwards, the fixing rods drive the U-shaped needles to move upwards, and the U-shaped needles drive the silica gel tops to move upwards.

Preferably, three groups of strip-shaped openings are formed in the transverse plate A, the strip-shaped openings are fixedly connected with the adjacent inner walls of the strip-shaped openings and are used for placing the plate, two groups of rectangular openings are formed in the placing plate, two groups of fixture blocks are fixedly connected with the top of the placing plate, the chip die of the integrated circuit is placed on the placing plate, the chip is clamped with the two groups of fixture blocks, the silica gel top penetrates through the two groups of rectangular openings of the placing plate to be upwards pushed, and the die is ejected out.

Preferably, two sets of cams do not contact with the bottom plate, are provided with on the bottom plate and store the box, store two sets of T type sliders of the bottom fixedly connected with of box, and two sets of T type spouts have been seted up at the top of bottom plate, and T type slider slidable mounting is in the inside of T type spout, stores box and bottom plate slidable mounting, stores the box and is located between two sets of cams, and ejecting mould drops to storing the box, and the mould is collected in storing the box, conveniently carries out recycle.

Compared with the prior art, the utility model has the beneficial effects that:

this integrated circuit encapsulates product demoulding and uses demoulding device, through the handle, the cooperation of dwang and cam is used, can be to sliding plate rebound, the convenience is demoulded integrated circuit's mould, the phenomenon that the card dunked appears in the setting of two sets of cams, through the spring, the dead lever, U type needle, the silica gel top, shelve the board, the cooperation of fixture block and sliding plate is used the jack-up that makes progress that can cooperate the cam, it is ejecting to the mould of chip, the design on two sets of silica gel tops, the contact point has been increased, can play the effect ejecting effect simultaneously to the mould, the silica gel top has reduced the risk of damaging the chip, avoid the chip to receive the damage, cause the waste of chip, the efficiency of drawing of patterns has been improved.

Drawings

The utility model is further illustrated with reference to the following figures and examples:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front view of the present invention;

FIG. 3 is an enlarged view of part A of the present invention.

Reference numerals: the device comprises a bottom plate 1, side plates 2, a transverse plate A3, a transverse plate B4, a connecting block 5, a rotating mechanism 6, a handle 601, a rotating rod 602, a cam 603, a spring 7, a fixing rod 8, a U-shaped needle 9, a silica gel top 10, a resting plate 11, a fixture block 12, a storage box 13 and a sliding plate 14.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, greater than, less than, exceeding, etc. are understood as excluding the present numbers, and the above, below, inside, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

The first embodiment is as follows:

referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an integrated circuit encapsulates product demoulding and uses shedder, including bottom plate 1 and slewing mechanism 6, two sets of curb plates 2 of top fixedly connected with of bottom plate 1, the adjacent lateral wall fixed mounting of two sets of curb plates 2 has diaphragm A3, the adjacent lateral wall of two sets of curb plates 2 is fixed with diaphragm B4, the equal fixedly connected with connecting block 5 of the adjacent lateral wall of two sets of curb plates 2, be provided with sliding plate 14 on connecting block 5, slewing mechanism 6 includes handle 601, dwang 602 and cam 603, handle 601 can make cam 603 rotate.

Further, the connecting block 5 is provided with a sliding groove, the two sides of the sliding plate 14 are slidably mounted in the sliding groove, the connecting block 5 and the sliding plate 14 are slidably mounted, three groups of fixing rods 8 are fixedly connected to the top of the sliding plate 14, three groups of springs 7 are fixedly sleeved on the outer wall of the three groups of fixing rods 8, and the top ends and the bottom ends of the three groups of springs 7 are respectively fixedly connected with the bottom of the transverse plate B4 and the top of the sliding plate 14.

Furthermore, three groups of openings through which the fixing rod 8 can pass are formed in the transverse plate B4, the U-shaped needle 9 is fixedly connected to the top of the fixing rod 8, the two groups of silica gel tops 10 are fixedly connected to the top of the U-shaped needle 9, the sliding plate 14 drives the fixing rod 8 to move upwards, the fixing rod 8 drives the U-shaped needle 9 to move upwards, and the U-shaped needle 9 drives the silica gel tops 10 to move upwards.

Still further, three groups of strip-shaped openings are formed in the transverse plate A3, the strip-shaped opening is fixedly connected to the adjacent inner wall of the placing plate 11, two groups of rectangular openings are formed in the placing plate 11, two groups of fixture blocks 12 are fixedly connected to the top of the placing plate 11, a chip of an integrated circuit is placed on the placing plate 11, the chip is clamped with the two groups of fixture blocks 12, the silica gel top 10 penetrates through the two groups of rectangular openings of the placing plate 11 to be pushed upwards, the die of the chip is ejected, the contact points are increased due to the design of the two groups of silica gel tops 10, the effect on the die can be simultaneously ejected, the risk of damaging the chip is reduced due to the silica gel top 10, the chip is prevented from being damaged, the waste of the chip is caused, and the demolding efficiency is improved.

Example two:

referring to fig. 1-3, on the basis of the first embodiment, a rotating rod 602 is rotatably installed on adjacent side walls of two sets of side plates 2, one end of the rotating rod 602 extends to one side of one set of side plates 2 and is fixedly installed with a handle 601, two sets of cams 603 are fixedly installed on an outer wall of the rotating rod 602, the handle 601 is manually rotated, the handle 601 drives the rotating rod 602 to rotate, the rotating rod 602 drives the cam 603 to rotate, a protruding portion of the cam 603 props against the sliding plate 14 to slide upwards, so as to facilitate demolding of the mold of the integrated circuit, and the two sets of cams 603 prevent the occurrence of a jamming phenomenon.

Further, two sets of cams 603 do not contact with bottom plate 1, be provided with on bottom plate 1 and store box 13, store two sets of T type sliders of the bottom fixedly connected with of box 13, two sets of T type spouts have been seted up at the top of bottom plate 1, T type slider slidable mounting is in the inside of T type spout, store box 13 and bottom plate 1 slidable mounting, it is located between two sets of cams 603 to store box 13, ejecting mould drops to storing box 13, the mould is collected in storing box 13, conveniently recycle.

The working principle is as follows: during the use, put integrated circuit's chip mould on shelving board 11, the chip blocks with two sets of fixture blocks 12 mutually, manual rotation handle 601, handle 601 drives dwang 602 and rotates, dwang 602 drives cam 603 and rotates, the outstanding department of cam 603 withstands sliding plate 14 and upwards slides, sliding plate 14 drives dead lever 8 upwards, dead lever 8 drives U type needle 9 upwards, U type needle 9 drives silica gel top 10 upwards, silica gel top 10 passes two sets of rectangle openings that shelve board 11 and upwards pushes up, ejecting mould drops to storing box 13, the mould is collected in storing box 13, conveniently recycle.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (6)

1. The utility model provides an integrated circuit encapsulates the product demoulding device for the demolding, includes bottom plate (1) and slewing mechanism (6), its characterized in that: the top of the bottom plate (1) is fixedly connected with two groups of side plates (2), the adjacent side walls of the two groups of side plates (2) are fixedly provided with a transverse plate A (3), the adjacent side walls of the two groups of side plates (2) are fixedly provided with a transverse plate B (4), the adjacent side walls of the two groups of side plates (2) are fixedly connected with connecting blocks (5), and the sliding plates (14) are arranged on the connecting blocks (5);

the rotating mechanism (6) comprises a handle (601), a rotating rod (602) and a cam (603), and the handle (601) can enable the cam (603) to rotate.

2. The integrated circuit package product demolding device as recited in claim 1, wherein: the adjacent lateral wall of two sets of curb plates (2) rotates installs dwang (602), and the one end of dwang (602) extends to one side and fixed mounting of a set of curb plate (2) has handle (601), and fixed cover is equipped with two sets of cams (603) on the outer wall of dwang (602).

3. The integrated circuit package product demolding device as recited in claim 1, wherein: the connecting block (5) is provided with a sliding groove, two sides of the sliding plate (14) are slidably mounted in the sliding groove, the connecting block (5) and the sliding plate (14) are slidably mounted, three groups of fixing rods (8) are fixedly connected to the top of the sliding plate (14), three groups of springs (7) are fixedly sleeved on the outer wall of the three groups of fixing rods (8), and the top ends and the bottom ends of the three groups of springs (7) are respectively fixedly connected with the bottom of the transverse plate B (4) and the top of the sliding plate (14).

4. The integrated circuit package product demolding device as recited in claim 1, wherein: three groups of openings through which the fixing rods (8) can pass are formed in the transverse plate B (4), the top of each fixing rod (8) is fixedly connected with a U-shaped needle (9), and the top of each U-shaped needle (9) is fixedly connected with two groups of silica gel tops (10).

5. The integrated circuit package product demolding device as recited in claim 1, wherein: three groups of strip-shaped openings are formed in the transverse plate A (3), the adjacent inner walls of the strip-shaped openings are fixedly connected with a placing plate (11), two groups of rectangular openings are formed in the placing plate (11), and two groups of clamping blocks (12) are fixedly connected to the top of the placing plate (11).

6. The release device for releasing the film of the integrated circuit package product as recited in claim 2, wherein: two sets of cams (603) do not contact with bottom plate (1), are provided with on bottom plate (1) and store box (13), store two sets of T type sliders of bottom fixedly connected with of box (13), and two sets of T type spouts have been seted up at the top of bottom plate (1), and T type slider slidable mounting is in the inside of T type spout, stores box (13) and bottom plate (1) slidable mounting, stores box (13) and is located between two sets of cams (603).

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