CN216280726U

CN216280726U - LED filament structure, bulb and lighting device

Info

Publication number: CN216280726U
Application number: CN202122534274.7U
Authority: CN
Inventors: 陈甜; 周芃宇; 张斌
Original assignee: Shenzhen Refond Optoelectronics Co Ltd
Current assignee: Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2022-04-12
Anticipated expiration: 2031-10-21

Abstract

The utility model discloses an LED filament structure, a bulb and a lighting device, and belongs to the technical field of lighting. The LED filament structure comprises a circuit board, a first LED wafer and a second LED wafer; the circuit board is provided with a first connecting module and a second connecting module which are alternately arranged on the circuit board in a single row; the first connecting module is used for being connected with the first LED wafer and an external power supply respectively, the second connecting module is used for being connected with the second LED wafer and the external power supply respectively, and the first LED wafer and the second LED wafer are used for receiving input signals of the external power supply and changing the working state according to the input signals. According to the LED filament structure, the LED wafer is used for receiving an input signal of an external power supply, and the working state is changed according to the input signal, wherein the first connecting module and the second connecting module which are used for connecting the LED wafer are arranged on the circuit board in a single-row alternate arrangement mode, so that the width of the LED filament can be effectively reduced.

Description

LED filament structure, bulb and lighting device

Technical Field

The utility model relates to the technical field of illumination, in particular to an LED filament structure, a bulb and an illuminating device.

Background

At present, most of LED filaments are in a double-row LED wafer mode to realize double-color light emission of the LED filaments, but the width of the LED filaments can be increased in the double-row LED wafer mode, so that how to provide an LED filament structure and reducing the width of the LED filaments become problems to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides an LED filament structure which can reduce the width of an LED filament.

The utility model further provides a bulb with the LED filament structure.

The utility model also provides a lighting device with the bulb.

The LED filament structure comprises a circuit board, a first LED wafer and a second LED wafer;

the circuit board is provided with a first connecting module and a second connecting module, and the first connecting module and the second connecting module are alternately arranged on the circuit board in a single row;

the first connecting module is used for being connected with the first LED wafer and an external power supply respectively, the second connecting module is used for being connected with the second LED wafer and the external power supply respectively, and the first LED wafer and the second LED wafer are used for receiving input signals of the external power supply and changing working states according to the input signals.

The LED filament structure provided by the embodiment of the utility model at least has the following beneficial effects: according to the LED filament structure, the LED wafer is used for receiving an input signal of an external power supply, and the working state is changed according to the input signal, wherein the first connecting module and the second connecting module which are used for connecting the LED wafer are arranged on the circuit board in a single-row alternate arrangement mode, so that the width of the LED filament can be effectively reduced.

According to some embodiments of the present invention, the first connection module includes first pads respectively connected to the first electrodes of the first LED chips and the first input terminal of the external power supply, and second pads respectively connected to the second electrodes of the first LED chips and the second input terminal of the external power supply.

According to some embodiments of the present invention, the second connection module includes third pads and fourth pads, the third pads are respectively connected to the first electrodes of the second LED chips and the second input terminals of the external power source, and the fourth pads are respectively connected to the second electrodes of the second LED chips and the first input terminals of the external power source.

According to some embodiments of the utility model, the first pad and the fourth pad are the same in size and shape, and the second pad and the third pad are the same in size and shape.

According to some embodiments of the utility model, the LED filament structure further comprises a control module, the control module is configured to be connected to the external power supply, and the control module is configured to output a control signal so as to change an input signal of the external power supply through the control signal.

According to some embodiments of the utility model, the LED filament structure further comprises a conductive adhesive, and the first LED chip and the second LED chip are connected to the circuit board through the conductive adhesive.

According to some embodiments of the utility model, the LED filament structure further comprises a conductive member for connecting the first connection module and the second connection module with the external power supply through the conductive member.

According to some embodiments of the present invention, the first LED wafer and the second LED wafer include a light emitting layer, wherein the light emitting layer is made of a fluorescent material.

A bulb according to an embodiment of the second aspect of the utility model comprises the LED filament structure according to the embodiment of the first aspect.

The bulb provided by the embodiment of the utility model has at least the following beneficial effects: the bulb adopts the LED filament structure to receive an input signal of an external power supply through the LED wafer and change the working state according to the input signal, wherein the first connecting module and the second connecting module which are used for connecting the LED wafer are arranged on the circuit board in a single-row alternate arrangement mode, so that the width of the LED filament can be effectively reduced.

A lighting device according to an embodiment of the third aspect of the utility model comprises a bulb according to the embodiment of the second aspect.

The lighting device provided by the embodiment of the utility model has at least the following beneficial effects: the lighting device adopts the bulb to receive the input signal of an external power supply through the LED wafer and changes the working state according to the input signal, wherein the first connecting module and the second connecting module which are used for connecting the LED wafer are arranged on the circuit board in a single-row alternate arrangement mode, so that the width of the LED filament can be effectively reduced.

Drawings

The utility model is further described with reference to the following figures and examples, in which:

fig. 1 is a schematic block diagram of an LED filament structure according to an embodiment of the present invention;

FIG. 2 is a schematic block diagram of an LED filament structure according to another embodiment of the present invention;

fig. 3 is a schematic structural diagram of an LED filament structure according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of an LED filament structure according to another embodiment of the present invention;

fig. 5 is a schematic structural diagram of an LED filament structure according to another embodiment of the present invention;

fig. 6 is a schematic structural diagram of an LED filament structure according to another embodiment of the present invention.

Reference numerals: 100. a circuit board; 110. a first connection module; 111. a first pad; 112. a second pad; 120. a second connection module; 121. a third pad; 122. a fourth pad; 200. a first LED wafer; 300. a second LED wafer; 400. an external power supply; 500. and a control module.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.

In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In a first aspect, referring to fig. 1, an LED filament structure according to an embodiment of the present invention includes a circuit board 100, a first LED chip 200, and a second LED chip 300; the circuit board 100 is provided with a first connection module 110 and a second connection module 120, and the first connection module 110 and the second connection module 120 are alternately arranged on the circuit board 100 in a single row; the first connection module 110 is used to connect the first LED chip 200 and the external power supply 400, respectively, the second connection module 120 is used to connect the second LED chip 300 and the external power supply 400, respectively, and the first LED chip 200 and the second LED chip 300 are used to receive an input signal of the external power supply 400 and change an operating state according to the input signal. Specifically, the first connection module 110 and the second connection module 120 are respectively connected to LED chips with different light emitting colors, for example, the first connection module 110 may be connected to an LED chip emitting blue light, and the second connection module 120 may be connected to an LED chip emitting yellow light, and it should be noted that the first connection module 110 and the second connection module 120 may also be connected to LED chips emitting light with other colors, but is not limited thereto. When the external power source 400 makes the LED chip of the first connection module 110 emit blue light, the LED chip of the second connection module 120 is not emitting light at this time; when the external power source 400 makes the LED chip of the second connection module 120 emit yellow light, the LED chip of the first connection module 110 is not emitting light. The double-color light emission of the LED filament can be realized by adjusting the direction of the input current of the external power supply 400. Meanwhile, the LED chips are arranged on the circuit board 100 in a single row, which can effectively reduce the width of the LED filament. In this way, the filament with the width less than 2mm can be manufactured, and the filament with the width of only 0.5mm can be manufactured at the thinnest. Through the mode, the double-color light emitting of the LED lamp filament is realized, and the width of the LED lamp filament is effectively reduced.

Referring to fig. 3 and 4, in some embodiments, the first connection module 110 includes first pads 111 and second pads 112, the first pads 111 respectively connect the first electrodes of the first LED chip 200 and the first input terminals of the external power supply 400, and the second pads 112 respectively connect the second electrodes of the second LED chip 300 and the second input terminals of the external power supply 400. It should be noted that the first LED chip 200 and the second LED chip 300 may be LED chips having the same specification and different light emission colors. Specifically, if the first bonding pad 111 is connected to the positive electrode of the first LED chip 200 and the second bonding pad 112 is connected to the negative electrode of the first LED chip 200, the first LED chip 200 on the first connection module 110 emits light when the first bonding pad 111 is connected to the positive electrode input terminal of the external power supply 400 and the second bonding pad 112 is connected to the negative electrode input terminal of the external power supply 400; when the first bonding pad 111 is connected to the negative input terminal of the external power source 400 and the second bonding pad 112 is connected to the positive input terminal of the external power source 400, the first LED chip 200 on the first connection module 110 does not emit light.

Referring to fig. 3 and 4, in some embodiments, the second connection module 120 includes third pads 121 and fourth pads 122, the third pads 121 are respectively connected to the first electrodes of the second LED chips 300 and the second input terminals of the external power supply 400, and the fourth pads 122 are respectively connected to the second electrodes of the second LED chips 300 and the first input terminals of the external power supply 400. Specifically, if the third bonding pad 121 is connected to the anode of the second LED chip 300 and the fourth bonding pad 122 is connected to the cathode of the second LED chip 300, when the third bonding pad 121 is connected to the anode input terminal of the external power source 400 and the fourth bonding pad 122 is connected to the cathode input terminal of the external power source 400, the second LED chip 300 on the second connection module 120 emits light; and when the third pad 121 is connected to the negative input terminal of the external power source 400 and the fourth pad 122 is connected to the positive input terminal of the external power source 400, the second LED chip 300 on the second connection module 120 does not emit light. By changing the direction of the input current of the external power supply 400, bi-color light emission of the LED filament can be achieved.

Referring to fig. 5 and 6, in some embodiments, the first LED chips 200 and the second LED chips 300 are arranged on the circuit board 100 in a same direction and in a single row alternately.

Referring to fig. 3 and 4, in some embodiments, the first pad 111 and the fourth pad 122 are the same in size and shape, and the second pad 112 and the third pad 121 are the same in size and shape. It should be noted that, in some other embodiments, the sizes and shapes of the first pad 111, the second pad 112, the third pad 121, and the fourth pad 122 may be different from each other. The shape structure design of the first bonding pad 111, the second bonding pad 112, the third bonding pad 121 and the fourth bonding pad 122 is simple, and the production cost of the LED filament structure can be reduced.

Referring to fig. 2, in some embodiments, the LED filament structure further includes a control module 500, the control module 500 is configured to be connected to the external power source 400, and the control module 500 is configured to output a control signal to change an input signal of the external power source 400 according to the control signal. Specifically, the control module 500 may be an ac power supply, and the LED filament may exhibit a two-color light mixing effect by adjusting the switching frequency of the anode and the cathode of the ac power supply, so as to improve the applicability of the LED filament structure.

In some embodiments, the LED filament structure further includes a conductive adhesive, and the first LED chip 200 and the second LED chip 300 are connected to the circuit board 100 through the conductive adhesive. The first LED chip 200 is fixed on the first connection module 110 by a conductive adhesive, and the second LED chip 300 is fixed on the second connection module 120, specifically, the positive electrode or the negative electrode of the first LED chip 200 and the positive electrode or the negative electrode of the second LED chip 300 are connected to the bonding pad on the circuit board 100 by a conductive adhesive, so that the LED chips can work normally, and the working stability of the LED chips is improved.

In some embodiments, the LED filament structure further includes a conductive member for connecting the first connection module 110 and the second connection module 120 with the external power source 400 through the conductive member. Specifically, the conductive member may be a metal pad extended from the circuit board 100, and the first connection module 110 and the second connection module 120 are connected to the external power supply 400 through the metal pad; in addition, the conductive member may also be a metal terminal, and the first connection module 110 and the second connection module 120 are connected to the external power source 400 through the metal terminal. It should be noted that, in some other embodiments, other conductive members may be used, and are not limited thereto.

In some embodiments, the first LED wafer 200 and the second LED wafer 300 include a light emitting layer, wherein the light emitting layer is made of a fluorescent material. In some other embodiments, the first LED chip 200 on the first connection module 110 has blue dot-shaped fluorescent glue, and the second LED chip 300 on the second connection module 120 has yellow dot-shaped fluorescent glue, so that when the positive input terminal of the external power source 400 is connected to the first pad 111 and the negative input terminal is connected to the second pad 112, the first LED chip 200 on the first connection module 110 having blue dot-shaped fluorescent glue emits blue light, and when the positive and negative terminals of the external power source 400 are changed, the second LED chip 300 on the second connection module 120 having yellow dot-shaped fluorescent glue emits yellow light. It should be noted that the LED chips on the first connection module 110 and the second connection module 120 may also be fluorescent glue with other colors, but not limited thereto. In addition, in some other embodiments, the first connection module 110 may further include a transparent stripe-shaped fluorescent glue, and the second connection module 120 may further include a translucent stripe-shaped fluorescent glue, in which manner, the dual-color light emission of the LED filament can also be achieved.

The dot-shaped fluorescent glue includes a mixture of transparent curable glue such as silica gel and epoxy glue, and yellow, green, red fluorescent powder. The strip-shaped transparent and semitransparent glue is a mixture of transparent curable glue such as silica gel and epoxy glue and inorganic material particles such as silicon dioxide, titanium dioxide and barium sulfate.

In some embodiments, the first LED chip 200 and the second LED chip 300 are LED chips with fluorescent glue, for example, CSP LED chips, the CSP LED chip of the first connection module 110 is provided with fluorescent glue of one color, and the CSP LED chip of the second connection module 120 is provided with fluorescent glue of another color.

In some embodiments, the first connection module 110 and the second connection module 120 are connected to the first LED chip 200 and the second LED chip 300 by metal wires, respectively, and are not limited to the connection manner of the metal pads.

In addition, the circuit board 100 may be a hard board, a soft board, or a rigid-flexible printed circuit board, and may be made of a transparent, translucent, or opaque material. In addition, the circuit board may also be a single-layer board or a double-layer board, if the circuit board is a double-layer board, the first pad 111, the second pad 112, the third pad 121 and the fourth pad 122 are disposed on the front side of the double-layer board, and the first connection module 110 and the second connection module 120 are disposed on the back side of the double-layer board, so that a filament with a width smaller than 0.5mm can be manufactured.

In a second aspect, the utility model also provides a bulb comprising the LED filament structure shown in the first aspect.

The bulb adopts the LED filament structure of the above embodiment to receive the input signal of the external power source 400 through the LED chip and change the operating state according to the input signal, wherein the first connection module 110 and the second connection module 120 for connecting the LED chip are arranged on the circuit board 100 in a single-row alternate arrangement manner, so that the width of the LED filament can be effectively reduced.

In a third aspect, the present invention also provides a lighting device, including the bulb shown in the second aspect.

The lighting device adopts the bulb of the above embodiment to receive the input signal of the external power source 400 through the LED chip and change the operating state according to the input signal, wherein the first connecting module 110 and the second connecting module 120 for connecting the LED chip are arranged on the circuit board 100 in a single row alternating arrangement manner, so that the width of the LED filament can be effectively reduced.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.

Claims

The LED filament structure is characterized by comprising a circuit board, a first LED wafer and a second LED wafer;

the circuit board is provided with a first connecting module and a second connecting module, and the first connecting module and the second connecting module are alternately arranged on the circuit board in a single row;

the first connecting module is used for being connected with the first LED wafer and an external power supply respectively, the second connecting module is used for being connected with the second LED wafer and the external power supply respectively, and the first LED wafer and the second LED wafer are used for receiving input signals of the external power supply and changing working states according to the input signals.
2. The LED filament structure according to claim 1, wherein the first connection module comprises a first bonding pad and a second bonding pad, the first bonding pad is respectively connected to the first electrode of the first LED chip and the first input terminal of the external power supply, and the second bonding pad is respectively connected to the second electrode of the first LED chip and the second input terminal of the external power supply.
3. The LED filament structure according to claim 2, wherein the second connection module comprises a third pad and a fourth pad, the third pad is respectively connected to the first electrode of the second LED chip and the second input terminal of the external power supply, and the fourth pad is respectively connected to the second electrode of the second LED chip and the first input terminal of the external power supply.
4. The LED filament structure of claim 3, wherein the first and fourth solder pads are the same size and shape, and the second and third solder pads are the same size and shape.
5. The LED filament structure according to any one of claims 1 to 4, further comprising a control module, wherein the control module is connected to the external power supply, and the control module is configured to output a control signal so as to change an input signal of the external power supply through the control signal.
6. The LED filament structure of claim 5, wherein the LED filament structure further comprises a conductive adhesive, and the first LED chip and the second LED chip are connected to the circuit board through the conductive adhesive.
7. The LED filament structure according to claim 6, further comprising a conductive member for connecting the first connection module and the second connection module with the external power supply through the conductive member.
8. The LED filament structure of claim 7, wherein the first and second LED dies comprise a luminescent layer, wherein the luminescent layer is made of a fluorescent material.
9. A light bulb, characterized in that it comprises an LED filament arrangement according to any of claims 1 to 8.
10. A lighting device, characterized in that the lighting device comprises a light bulb as claimed in claim 9.