CN216274353U

CN216274353U - Semiconductor processing equipment

Info

Publication number: CN216274353U
Application number: CN202122209188.9U
Authority: CN
Inventors: 刘柳珍
Original assignee: Individual
Current assignee: Shanghai Siwei Semiconductor Technology Co.,Ltd.
Priority date: 2021-09-13
Filing date: 2021-09-13
Publication date: 2022-04-12
Anticipated expiration: 2031-09-13

Abstract

The utility model discloses semiconductor processing equipment, which relates to the technical field of semiconductor processing and comprises a shell, wherein a first motor is arranged on a mounting plate on one side of the shell, a first rotating shaft penetrating through the shell is arranged at the output end of the first motor, and a connecting frame is arranged inside the shell and positioned on one side of the first rotating shaft. According to the utility model, through the arrangement of the second motor, the first driven bevel gear, the first driving bevel gear, the second driven bevel gear, the second driving bevel gear, the threaded cylinder and the screw, the second motor works, the output end of the second motor drives the third rotating shaft and the second driving bevel gear to rotate, the second driven bevel gear, the second rotating shaft and the first driving bevel gear can be driven to rotate due to the meshing of the second driven bevel gear and the second driving bevel gear, and the first driven bevel gear and the first driving bevel gear can be driven to rotate due to the meshing of the first driven bevel gear and the second driving bevel gear.

Description

Semiconductor processing equipment

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment.

Background

The semiconductor production process comprises wafer manufacturing, wafer testing, chip packaging and post-packaging testing, and after plastic packaging, a series of operations such as post-curing, trimming, forming, coating, printing and the like are carried out, wherein in the step of semiconductor coating, a coating material is heated and volatilized to be attached to the surface of a semiconductor element to form a coating layer, but the distance between the coating material and the semiconductor element cannot be adjusted by the conventional semiconductor coating processing equipment, so that the device has certain coating limitation.

SUMMERY OF THE UTILITY MODEL

The utility model aims to: in order to solve the problem that the distance between a coating material and a semiconductor element cannot be adjusted by the conventional semiconductor coating processing equipment, the semiconductor coating processing equipment is provided.

In order to achieve the purpose, the utility model provides the following technical scheme: a semiconductor processing device comprises a shell, wherein a first motor is installed on an installation plate on one side of the shell, a first rotating shaft penetrating through the shell is arranged at the output end of the first motor, a connecting frame is arranged on one side, located on the first rotating shaft, of the interior of the shell, first movable grooves are formed in the interior of two ends of the connecting frame, first elastic parts are arranged in the first movable grooves, first clamping plates are arranged in the interior of two ends of the connecting frame, a semiconductor element is arranged in the shell, a vacuum chuck is arranged on one side of the semiconductor element, a connecting block is arranged on one side, located in the connecting frame, of the vacuum chuck, first clamping grooves matched with the first clamping plates are formed in the interior of two ends of the connecting block, a taking and placing opening and a second movable groove are formed in the interior of one side of the shell, a rotating door is arranged in the taking and placing opening, a second clamping groove is formed in one side of the rotating door, a second clamping plate matched with the second clamping groove is arranged in the second moving groove, a second elastic part is uniformly arranged on one side, located in the second clamping plate, of the second moving groove, a handle is arranged at one end of the rotating door, a bearing plate is arranged in the shell, a coating device is arranged at the top of the bearing plate, threaded cylinders are arranged on two sides of the bottom of the bearing plate, threaded rods extending into the threaded cylinders are arranged on two sides of the bottom end of the inner portion of the shell, a first driven bevel gear is sleeved on the outer sides of the threaded rods, a second rotating shaft penetrating through the supporting plate is arranged in the shell, a first driving bevel gear and a second driven bevel gear are sleeved on the outer sides of the second rotating shaft respectively, a second motor is mounted on the mounting plate in the shell, and a third rotating shaft penetrating through the supporting plate is arranged at the output end of the second motor, and a second driving bevel gear matched with the second driven bevel gear is sleeved on the outer side of the third rotating shaft.

Preferably, the number of the first clamping plates and the first clamping grooves is two, and the connecting blocks and the connecting frame are clamped through the first clamping plates and the first clamping grooves under the action of the first elastic pieces.

Preferably, the number of the second clamping plates and the second clamping grooves is provided with groups, and the rotating door and the taking and placing port are clamped through the second clamping plates and the second clamping grooves under the action of the second elastic piece.

Preferably, the number of the threaded cylinders, the number of the screw rods, the number of the first driven bevel gears and the number of the first driving bevel gears are two, and the first driven bevel gears and the screw rods, the first driving bevel gears and the second rotating shafts, and the second driving bevel gears and the third rotating shafts are all fixedly connected.

Preferably, the both sides of shells inner wall all seted up the spacing groove, the outer wall of screw thread section of thick bamboo is provided with the stopper with spacing groove assorted.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model is characterized in that the second motor, the first driven bevel gear, the first driving bevel gear, the second driven bevel gear, the second driving bevel gear, the threaded cylinder and the screw are arranged, the second motor works, the output end of the second motor drives the third rotating shaft and the second driving bevel gear to rotate, the second driven bevel gear is meshed with the second driving bevel gear so as to drive the second driven bevel gear, the second rotating shaft and the first driving bevel gear to rotate, the first driven bevel gear is meshed with the first driving bevel gear so as to drive the first driven bevel gear and the screw to rotate, the screw is rotationally connected with the threaded cylinder through the threaded groove, and the threaded cylinder can move in the vertical direction under the limiting action of the limiting block and the limiting groove, so that the distance between a coating material and a semiconductor element can be adjusted Two groups of screws are arranged, so that the position adjustment stability of the film coating device is improved;

2. according to the utility model, the vacuum chuck is connected with the first rotating shaft through the connecting block and the connecting frame through the connecting block, the connecting frame, the first elastic part, the first clamping plate and the first clamping groove, and the connecting block and the connecting frame are clamped through the first clamping plate and the first clamping groove under the action of the first elastic part, so that the first clamping plate can be separated from the first clamping groove by pulling the first clamping plate to two ends, the connecting block can be conveniently separated from the connecting frame, and the vacuum chuck can be detached and replaced when needing to be replaced;

3. according to the utility model, the rotating door and the taking and placing port are clamped through the second clamping plate and the second clamping groove under the action of the second elastic part through the second elastic part, so that the second clamping plate can be pulled to one side to separate the second clamping plate from the second clamping groove, the rotating door can be conveniently opened by pulling the handle, and the semiconductor element can be conveniently taken after the film coating is finished.

Drawings

FIG. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

fig. 3 is a schematic view of a connection structure of the rotating door and the housing according to the present invention.

In the figure: 1. a housing; 2. a vacuum chuck; 3. a first clamping plate; 4. a first elastic member; 5. a connecting frame; 6. a first rotating shaft; 7. connecting blocks; 8. a first card slot; 9. a first movable slot; 10. a film coating device; 11. a carrier plate; 12. a threaded barrel; 13. a screw; 14. a first driven bevel gear; 15. a first drive bevel gear; 16. a second driven bevel gear; 17. a second rotating shaft; 18. a second drive bevel gear; 19. a rotating door; 20. a taking and placing port; 21. a third rotating shaft; 22. a second motor; 23. a second elastic member; 24. a second movable slot; 25. a second clamping plate; 26. a handle; 27. a second card slot; 28. a semiconductor element; 29. a first motor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention based on its overall structure.

The first motor model mentioned in the present invention is: 90YYJ, the second motor type is: 90YYJ is available in either the market or private subscriptions.

Referring to fig. 1-3, a semiconductor processing apparatus includes a housing 1, a first motor 29 is mounted on a mounting plate on one side of the housing 1, a first rotating shaft 6 penetrating through the housing 1 is disposed at an output end of the first motor 29, a connecting frame 5 is disposed inside the housing 1 on one side of the first rotating shaft 6, first movable grooves 9 are disposed inside two ends of the connecting frame 5, first elastic members 4 are disposed inside the first movable grooves 9, first clamping plates 3 are disposed inside two ends of the connecting frame 5, a semiconductor device 28 is disposed inside the housing 1, a vacuum chuck 2 is disposed on one side of the semiconductor device 28, a connecting block 7 is disposed inside the connecting frame 5 on one side of the vacuum chuck 2, first clamping grooves 8 matched with the first clamping plates 3 are disposed inside two ends of the connecting block 7, a pick-and-place port 20, a pick-and place port 20 is disposed inside one side of the housing 1, A second movable groove 24, a rotating door 19 is arranged inside the pick-and-place opening 20, a second clamping groove 27 is formed in the inner portion of one side of the rotating door 19, a second clamping plate 25 matched with the second clamping groove 27 is arranged inside the second movable groove 24, second elastic members 23 are uniformly arranged on one side, located inside the second clamping plate 25, of the inner portion of the second movable groove 24, a handle 26 is arranged at one end of the rotating door 19, a bearing plate 11 is arranged inside the housing 1, a film coating device 10 is arranged on the top of the bearing plate 11, threaded cylinders 12 are arranged on two sides of the bottom of the bearing plate 11, screw rods 13 extending into the threaded cylinders 12 are arranged on two sides of the bottom end inside the housing 1, a first driven bevel gear 14 is sleeved outside each screw rod 13, a second rotating shaft 17 penetrating through the bearing plate is arranged inside the housing 1, a first driving bevel gear 15 and a second driven bevel gear 16 are respectively sleeved outside the second rotating shaft 17, a second motor 22 is installed on the installation plate inside the housing 1, a third rotating shaft 21 penetrating through the support plate is arranged at the output end of the second motor 22, and a second driving bevel gear 18 matched with the second driven bevel gear 16 is sleeved on the outer side of the third rotating shaft 21.

Please refer to fig. 1, the number of the first clamping plates 3 and the first clamping grooves 8 is two, the connecting blocks 7 and the connecting frame 5 are clamped by the first clamping plates 3 and the first clamping grooves 8 under the action of the first elastic members 4, and the vacuum chuck 2 can be detached and replaced when needed.

Please refer to fig. 3, the numbers of the second clamping plates 25 and the second clamping grooves 27 are all set as a group, the rotating door 19 and the pick-and-place port 20 are clamped by the second clamping plates 25 and the second clamping grooves 27 under the action of the second elastic member 23, and the rotating door 19 can be opened by pulling the handle 26 through the set second clamping plates 25, the second clamping grooves 27, the second elastic member 23, the rotating door 19 and the pick-and-place port 20, so that the semiconductor device 28 can be conveniently taken after the film coating is finished.

Please refer to fig. 1, the number of the threaded cylinders 12, the threaded rods 13, the first driven bevel gears 14, and the first driving bevel gears 15 is two, the first driven bevel gears 14 and the threaded rods 13, the first driving bevel gears 15 and the second rotating shafts 17, and the second driving bevel gears 18 and the third rotating shafts 21 are all fixedly connected, and the distance between the coating material and the semiconductor device 28 can be adjusted by the threaded cylinders 12, the threaded rods 13, the first driven bevel gears 14, the first driving bevel gears 15, the third rotating shafts 21, the second rotating shafts 17, the second driving bevel gears 18, and the second driven bevel gears 16.

Please refer to fig. 1, both sides of the inner wall of the housing 1 are provided with a limiting groove, the outer wall of the threaded cylinder 12 is provided with a limiting block matched with the limiting groove, and the limiting groove and the limiting block can play a role in supporting and limiting, so as to prevent the threaded cylinder 12 from rotating along with the screw 13.

The working principle is as follows: when the coating device is used, the second motor 22 is started, the output end of the second motor 22 drives the third rotating shaft 21 and the second driving bevel gear 18 to rotate, the second driven bevel gear 16 is meshed with the second driving bevel gear 18 to drive the second driven bevel gear 16, the second rotating shaft 17 and the first driving bevel gear 15 to rotate, the first driven bevel gear 14 is meshed with the first driving bevel gear 15 to drive the first driven bevel gear 14 and the screw 13 to rotate, the screw 13 is rotationally connected with the threaded barrel 12 through a thread groove, and the threaded barrel 12 can move in the vertical direction under the limiting action of the limiting block and the limiting groove, so that the distance between a coating material and a semiconductor element 28 can be adjusted, and the position adjusting stability of the coating device 10 is improved because the number of the threaded barrel 12 and the screw 13 is two, and the coating device is provided with a plurality of sets, vacuum chuck 2 passes through connecting block 7 with first pivot 6, coupling frame 5 is connected, connecting block 7 passes through first cardboard 3 with coupling frame 5 under the effect of first elastic component 4, 8 joints of first draw-in groove, make can make first cardboard 3 and 8 joints of first draw-in groove separate through to the first cardboard 3 of both ends pulling, thereby can be convenient for make connecting block 7 and 5 joints separate, make and dismantle the change when needing to change vacuum chuck 2, the revolving door 19 passes through second cardboard 25 with getting the mouth 20 under the effect of second elastic component 23, 27 joints of second draw-in groove, make can make second cardboard 25 and second draw-in groove 27 separate to one side pulling second cardboard 25, thereby can be convenient for make revolving door 19 open through pulling handle 26, make and can be convenient for take it after the coating of semiconductor element 28.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A semiconductor processing apparatus comprising a housing (1), characterized in that: a first motor (29) is mounted on a mounting plate on one side of the shell (1), a first rotating shaft (6) penetrating through the shell (1) is arranged at the output end of the first motor (29), a connecting frame (5) is arranged on one side, located on the first rotating shaft (6), of the interior of the shell (1), first movable grooves (9) are formed in the interior of two ends of the connecting frame (5), first elastic pieces (4) are arranged in the first movable grooves (9), first clamping plates (3) are arranged in the interior of two ends of the connecting frame (5), semiconductor elements (28) are arranged in the interior of the shell (1), a vacuum chuck (2) is arranged on one side of each semiconductor element (28), a connecting block (7) is arranged in the interior of the connecting frame (5) on one side of each vacuum chuck (2), and first clamping grooves (8) matched with the first clamping plates (3) are formed in the interior of two ends of each connecting block (7), a taking and placing opening (20) and a second movable groove (24) are respectively formed in one side of the shell (1), a rotating door (19) is arranged in the taking and placing opening (20), a second clamping groove (27) is formed in one side of the rotating door (19), a second clamping plate (25) matched with the second clamping groove (27) is arranged in the second movable groove (24), second elastic pieces (23) are uniformly arranged on one side, located on the second clamping plate (25), of the inside of the second movable groove (24), a handle (26) is arranged at one end of the rotating door (19), a bearing plate (11) is arranged in the shell (1), a coating device (10) is arranged at the top of the bearing plate (11), threaded cylinders (12) are arranged on two sides of the bottom of the bearing plate (11), screws (13) extending into the threaded cylinders (12) are arranged on two sides of the bottom end of the shell (1), the outside of screw rod (13) all is equipped with first driven bevel gear (14) by the cover, the inside of casing (1) is provided with second pivot (17) that runs through the backup pad, second pivot (17) outside is equipped with first drive bevel gear (15), second driven bevel gear (16) by the cover respectively, install second motor (22) on the inside mounting panel of casing (1), the output of second motor (22) is provided with third pivot (21) that runs through the backup pad, the outside cover of third pivot (21) is equipped with and drives bevel gear (16) assorted second drive bevel gear (18) with second.

2. The semiconductor processing apparatus of claim 1, wherein: the number of the first clamping plates (3) and the first clamping grooves (8) is two, and the connecting blocks (7) and the connecting frames (5) are connected in a clamped mode through the first clamping plates (3) and the first clamping grooves (8) under the action of the first elastic pieces (4).

3. The semiconductor processing apparatus of claim 1, wherein: the number of the second clamping plates (25) and the number of the second clamping grooves (27) are all provided with groups, and the rotating door (19) and the taking and placing opening (20) are clamped through the second clamping plates (25) and the second clamping grooves (27) under the action of the second elastic piece (23).

4. The semiconductor processing apparatus of claim 1, wherein: the number of the threaded cylinders (12), the screw rods (13), the first driven bevel gears (14) and the first driving bevel gears (15) is two, and the first driven bevel gears (14) are fixedly connected with the screw rods (13), the first driving bevel gears (15) are fixedly connected with the second rotating shafts (17), and the second driving bevel gears (18) are fixedly connected with the third rotating shafts (21).

5. The semiconductor processing apparatus of claim 1, wherein: the limiting groove is formed in each of two sides of the inner wall of the shell (1), and the limiting block matched with the limiting groove is arranged on the outer wall of the threaded cylinder (12).