CN216266925U

CN216266925U - Liquid supply system of silicon wafer slicing machine

Info

Publication number: CN216266925U
Application number: CN202122456562.5U
Authority: CN
Inventors: 冯震坤; 王臻
Original assignee: Wuxi Rongneng Semiconductor Material Co ltd
Current assignee: Wuxi Rongneng Semiconductor Material Co ltd
Priority date: 2021-10-12
Filing date: 2021-10-12
Publication date: 2022-04-12
Anticipated expiration: 2031-10-12

Abstract

The utility model relates to a liquid supply system of a silicon wafer slicing machine, which comprises a cutting liquid storage cylinder, a cutting water storage cylinder and a flow guide system, wherein the cutting liquid storage cylinder comprises a cylinder body, the cylinder body is connected with a stirring mechanism, a metering pump and a liquid level meter, the stirring mechanism comprises a stirring rod positioned in the cylinder body and a stirring driving part connected to the cylinder body, the metering pump is connected with the cutting liquid storage cylinder and the cutting water storage cylinder, the flow guide system is connected in a cabin of the slicing machine, the flow guide system comprises a flow guide box, one side of the flow guide box is connected with an inclined flow guide plate, the flow guide box is communicated with the cutting water storage cylinder through a pipeline, the liquid supply system of the silicon wafer slicing machine uniformly stirs cutting liquid, and uniformly guides the cutting liquid through the flow guide system after being quantitatively mixed with cutting water, so that the cutting liquid is uniformly distributed, and the cooling effect is good.

Description

Liquid supply system of silicon wafer slicing machine

Technical Field

The utility model relates to a liquid supply system, in particular to a liquid supply system of a silicon wafer slicing machine.

Background

The silicon wafer slicing machine is a linear cutting device for cutting silicon ingots into silicon wafers through diamond wires, cutting and cooling are needed to be carried out through cutting liquid during cutting, and the traditional cutting liquid supply system has the defects that the cutting liquid is not uniformly stirred and the liquid supply is not uniform.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide a wafer slicer liquid supply system that solves one or more of the problems of the prior art.

In order to achieve the purpose, the technical scheme of the utility model is as follows:

the utility model provides a silicon chip slicer liquid supply system, includes cutting liquid storage cylinder, cutting water storage cylinder and water conservancy diversion system, cutting liquid storage cylinder includes the barrel, rabbling mechanism, measuring pump and level gauge are connected to the barrel, rabbling mechanism is including being located the puddler of barrel and connecting the stirring driver part on the barrel, cutting liquid storage cylinder and cutting water storage cylinder are connected to the measuring pump, water conservancy diversion system connects in the cabin of slicer, water conservancy diversion system includes the flow guide case, the slope guide plate is connected to flow guide case one side, the flow guide case passes through pipeline and water pump and cutting water storage cylinder intercommunication.

As a further improvement of the above technical solution:

and a weighing mechanism is arranged on the lower side of the cutting fluid storage cylinder.

The center of the flow guide box is connected with a water distribution pipe which is horizontally arranged through a connecting seat, two ends of the water distribution pipe are opened, and the middle part of the water distribution pipe is connected with a cutting water storage barrel through a pipeline.

The two sides in the cabin of the slicing machine are provided with first clamping seats clamped with the flow guide box, and clamping plates are connected to the two sides of the flow guide box and are matched with the first clamping seats.

The lower end of the first clamping seat is connected with a jacking screw rod through a nut, and the front side of the first clamping seat is connected with a clamping screw rod of a clamping plate.

The washing mechanism is further connected to the inside of the cabin of the slicing machine and comprises a plurality of washing pipes and a washing water tank, the washing water tank is connected to the washing pipes through a water pump and a pipeline, the washing pipes are connected with a plurality of joints, and the joints are rotatably connected with universal nozzles.

And second clamping seats for clamping the flushing pipe are arranged on two sides in the cabin of the slicing machine.

Compared with the prior art, the utility model has the following beneficial technical effects:

1) the cutting fluid is uniformly stirred through the stirring mechanism, and is quantitatively conveyed to the cutting water storage cylinder through the metering pump to be mixed with quantitative cutting water, so that cooling fluid is prepared to be used for cooling diamond wires in the silicon wafer slicing machine;

2) through the liquid level meter and the weighing mechanism, the conveying amount of the cutting fluid in the cutting fluid storage cylinder can be detected in a double mode, the supply amount of the cutting fluid is guaranteed to be accurate, and the concentration of the prepared cutting cooling fluid is accurate;

3) the arrangement of the flushing mechanism can flush the silica powder in the cabin of the slicing machine, so that the cleanness of the cabin of the slicing machine is ensured.

Drawings

FIG. 1 shows a schematic diagram of a liquid supply system of a silicon wafer slicer according to the present invention.

FIG. 2 shows a schematic view of the mounting of the baffle box of the liquid supply system of the silicon wafer slicing machine of the present invention.

In the drawings, the reference numbers:

1. a cutting fluid storage cylinder; 11. a barrel; 12. a stirring mechanism; 13. a metering pump; 14. a liquid level meter; 15. a weighing mechanism; 2. cutting the water storage cylinder; 3. a flow directing system; 31. a flow guide box; 311. clamping a plate; 32. inclining the guide plate; 33. a water distribution pipe; 4. a nacelle; 41. a first card holder; 411. jacking a screw rod; 412. clamping the screw rod; 42. a second card holder; 5. flushing the system; 51. a flush tube; 511. a joint; 512. a universal nozzle; 52. the tank is flushed.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.

As shown in fig. 1 and 2, the liquid supply system of the silicon wafer slicing machine of the embodiment includes a cutting liquid storage barrel 1, a cutting water storage barrel 2 and a diversion system 3, the cutting liquid storage barrel 1 includes a barrel 11, a weighing mechanism 15 is disposed at a lower side of the barrel 11 of the cutting liquid storage barrel 1, the barrel 11 is connected with a stirring mechanism 12, a metering pump 13 and a liquid level meter 14, the stirring mechanism 12 includes a stirring rod located in the barrel 11 and a stirring driving component connected to the barrel 11, the metering pump 13 is connected with the cutting liquid storage barrel 1 and the cutting water storage barrel 2, the diversion system 3 is connected to a cabin 4 of the slicing machine, the diversion system 3 includes a diversion box 31, one side of the diversion box 31 is connected with an inclined diversion plate 32, the center of the diversion box 31 is connected with a horizontally arranged water distribution pipe 33 through a connection seat, two ends of the water distribution pipe 33 are opened, and the middle of the water distribution pipe 33 is connected with the cutting water storage barrel 2 through a pipeline and a water pump.

The first clamping seats 41 for clamping the guide box 31 are arranged on two sides in the cabin 4 of the slicing machine, clamping plates 311 are connected on two sides of the guide box 31 in cooperation with the first clamping seats 41, the lower end of the first clamping seat 41 is connected with a jacking screw 411 through a nut, a clamping screw 412 for clamping the clamping plates 311 is connected to the front side of the first clamping seat 41, the guide box 31 is clamped between the two first clamping seats 41 through the clamping plates 311, the clamping plates 311 can be jacked up through the jacking screw 411, the height of the guide box 31 can be adjusted, and after the height adjustment is completed, the guide box 31 is positioned by clamping and fixing the clamping plates 311 through the clamping screws 412.

The cabin 4 of the slicer is also connected with a flushing system 5, the flushing system 5 comprises a plurality of flushing pipes 51 and a flushing water tank 52 which are connected with the cabin 4 of the slicer, the flushing water tank 52 is connected with the flushing pipes 51 through pipelines and a water pump, the flushing pipes 51 are connected with a plurality of joints 511, and the joints 511 are rotatably connected with universal spray heads 512.

Second clamping seats 42 for clamping the flushing pipe 51 are arranged on two sides in the cabin 4 of the slicer, and the flushing pipe 51 is detachably clamped between the two second clamping seats 42.

When the liquid supply system of the silicon wafer slicing machine is used, cutting liquid is supplemented into the cutting liquid storage cylinder 1, the stirring rod is driven to rotate by the stirring driving part of the stirring mechanism 12, the cutting liquid is stirred uniformly, then the cutting liquid can be quantitatively fed into the cutting water storage cylinder 2 through the metering pump 13 and is mixed with the cutting water in the cutting water storage cylinder 2 to form cooling liquid for cutting, the cooling liquid is supplied to the flow guide system 3 through the water pump of the cutting water storage cylinder 2, cooling firstly enters the water distribution pipe 33, enters the flow guide box 31 from openings at two ends of the water distribution pipe 33, overflows to the inclined flow guide plate 32 from the front side, is guided by the inclined flow guide plate 32 and then uniformly flows onto diamond wires for cooling the diamond wires; after the cutting is completed, the washing water is supplied to the washing pipe 51 through the washing water tank 52, and the washing water is ejected from the universal nozzle 512, so that the inside of the nacelle 4 of the microtome can be washed, the silicon powder inside the nacelle 4 of the microtome can be washed away, and the nacelle 4 of the microtome can be kept clean.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit of the present invention, and these changes and modifications should fall within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a silicon chip slicer solution feed system which characterized in that: including cutting fluid storage cylinder, cutting water storage cylinder and water conservancy diversion system, cutting fluid storage cylinder includes the barrel, rabbling mechanism, measuring pump and level gauge are connected to the barrel, the rabbling mechanism is including being located the puddler of barrel and connecting the stirring driver part on the barrel, cutting fluid storage cylinder and cutting water storage cylinder are connected to the measuring pump, water conservancy diversion system connects in the cabin of slicer, water conservancy diversion system includes the water conservancy diversion case, slope guide plate is connected to water conservancy diversion case one side, the water conservancy diversion case passes through pipeline and water pump and cutting water storage cylinder intercommunication.

2. The wafer slicer liquid supply system of claim 1 wherein: and a weighing mechanism is arranged on the lower side of the cutting fluid storage cylinder.

3. The wafer slicer liquid supply system of claim 1 wherein: the center of the flow guide box is connected with a water distribution pipe which is horizontally arranged through a connecting seat, two ends of the water distribution pipe are opened, and the middle part of the water distribution pipe is connected with a cutting water storage barrel through a pipeline.

4. The wafer slicer liquid supply system of claim 1 wherein: the two sides in the cabin of the slicing machine are provided with first clamping seats clamped with the flow guide box, and clamping plates are connected to the two sides of the flow guide box and are matched with the first clamping seats.

5. The wafer slicer liquid supply system of claim 4 wherein: the lower end of the first clamping seat is connected with a jacking screw rod through a nut, and the front side of the first clamping seat is connected with a clamping screw rod of a clamping plate.

6. The wafer slicer liquid supply system of claim 1 wherein: the washing mechanism is further connected to the inside of the cabin of the slicing machine and comprises a plurality of washing pipes and a washing water tank, the washing water tank is connected to the washing pipes through a water pump and a pipeline, the washing pipes are connected with a plurality of joints, and the joints are rotatably connected with universal nozzles.

7. The wafer slicer liquid supply system of claim 6 wherein: and second clamping seats for clamping the flushing pipe are arranged on two sides in the cabin of the slicing machine.