CN216265081U - Round edge device for quartz wafer production - Google Patents

Abstract

The utility model discloses a round edge device for quartz wafer production, relates to the field of quartz wafer production, and aims to solve the problems that an existing self-service terminal device cannot protect and prevent dust on a screen when not used, cannot adjust the height of the existing self-service terminal device, limits a use group, reduces the use efficiency and has low utilization value. The quartz wafer polishing device is novel in structure, manual operation polishing is replaced by the quartz wafer polishing device, circular edge polishing is performed by using a machine, and the polishing device can be adjusted according to the size of the quartz wafer, so that the production efficiency of the quartz wafer is improved.

Description

Round edge device for quartz wafer production

Technical Field

The utility model relates to the field of quartz wafer production, in particular to a round edge device for quartz wafer production.

Background

The quartz crystal is an electronic material with the second use amount to monocrystalline silicon, is used for manufacturing electronic components for selecting and controlling frequency, is widely applied to various fields of electronic information industry, such as color TV, air conditioners, computers, DVDs, radio communication and the like, is increasingly applied to high-performance electronic equipment and digital equipment, and is a necessary material for producing SMD (surface mounted device) frequency chips and mobile phone frequency chips.

The edge of the existing quartz crystal is required to be rounded during processing, most of round edges are polished manually, so that the edge of the quartz crystal is not smooth enough, the production efficiency of the quartz crystal is reduced, and the round edge device for quartz crystal production is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The round edge device for quartz wafer production provided by the utility model solves the problem that most round edges are polished manually, so that the edge of a quartz wafer is not polished smoothly enough, and the production efficiency of the quartz wafer is reduced.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a round edge device for quartz wafer production, includes installation piece and quartz wafer body, installation piece top difference fixed mounting has and is the first fixed block of symmetric distribution and second fixed block, just rotate between first fixed block and the second fixed block and install fixture, installation piece top fixed mounting has the piece of polishing, just the piece of polishing is installed between first fixed block and second fixed block, polishing piece top fixed mounting has the sword of whetting a knife, just polishing piece bottom fixed mounting has drive mechanism.

Preferably, fixture includes dead lever and first drive lever, just the second fixed block is close to one side rotation of first fixed block and installs the dead lever, dead lever one end fixed mounting has first drive lever, just first drive lever runs through the second fixed block and rotates the installation, the one end fixed mounting that the dead lever was kept away from to first drive lever has the handle.

Preferably, fixture still includes hydraulic stem, sucking disc, commentaries on classics piece and spacing ring, just first fixed block has seted up the spacing groove near second fixed block one side, the commentaries on classics piece is installed to the spacing inslot internal rotation, just commentaries on classics piece circumference lateral wall fixed mounting has the spacing ring, spacing ring and spacing groove phase-match, just one side fixed mounting that the commentaries on classics piece is close to the second fixed block has the hydraulic stem.

Preferably, the clamping mechanism further comprises two symmetrically distributed suckers, the two suckers are respectively installed at one end of the fixed rod, which is close to the hydraulic rod, and the quartz wafer body is installed between the two suckers.

Preferably, the transmission mechanism comprises a driving motor, a second transmission rod and a worm, the driving motor is fixedly mounted on one side of the mounting block, the second transmission rod is fixedly connected to an output shaft of the driving motor and penetrates through the mounting block to extend inwards, and the worm is fixedly mounted at one end, far away from the driving motor, of the second transmission rod.

Preferably, drive mechanism still includes gag lever post and worm wheel, just sanding block bottom fixed mounting has the gag lever post, the gag lever post bottom is rotated and is installed the worm wheel, just worm wheel and worm phase-match.

The utility model has the beneficial effects that:

be equipped with fixture in the device, can press from both sides quartz wafer tightly through fixture, and can adapt to the different quartz wafer of various sizes and sizes, stabilize the clamp with it and carry out the round edge and polish, be equipped with the piece of polishing that can go up and down and whet a knife on the device top, the size that can polish as required is adjusted from top to bottom, is convenient for polish its round edge.

In conclusion, the device replaces manual operation to polish, uses the machine to polish the round edge, and can adjust the polishing device according to the size of the quartz wafer, thereby improving the production efficiency of the quartz wafer.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a side sectional view of the present invention;

FIG. 3 is an enlarged view of A of FIG. 2 according to the present invention;

FIG. 4 is an enlarged view of B of FIG. 2 according to the present invention.

Reference numbers in the figures: 1. mounting blocks; 2. a first fixed block; 3. a second fixed block; 4. a quartz wafer body; 5. a hydraulic lever; 6. a suction cup; 7. fixing the rod; 8. a first drive lever; 9. a limiting rod; 10. a drive motor; 11. grinding blocks; 12. sharpening the knife; 13. rotating the block; 14. a limiting ring; 15. a worm gear; 16. a second transmission rod; 17. a limiting groove; 18. a worm.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-2, a round edge device for quartz wafer production comprises an installation block 1 and a quartz wafer body 4, wherein the top end of the installation block 1 is respectively and fixedly provided with a first fixed block 2 and a second fixed block 3 which are symmetrically distributed, a clamping mechanism is rotatably arranged between the first fixed block 2 and the second fixed block 3, the top end of the installation block 1 is fixedly provided with a grinding block 11, the grinding block 11 is arranged between the first fixed block 2 and the second fixed block 3, the top end of the grinding block 11 is fixedly provided with a knife 12, and the bottom end of the grinding block 11 is fixedly provided with a transmission mechanism.

Referring to fig. 1-3, the clamping mechanism comprises a fixed rod 7 and a first transmission rod 8, a fixed rod 7 is rotatably mounted on one side of a second fixed block 3 close to a first fixed block 2, a first transmission rod 8 is fixedly mounted at one end of the fixed rod 7, the first transmission rod 8 is rotatably mounted through the second fixed block 3, a handle is fixedly mounted at one end of the first transmission rod 8 far away from the fixed rod 7, the clamping mechanism further comprises a hydraulic rod 5, a suction cup 6, a rotating block 13 and a limiting ring 14, a limiting groove 17 is formed on one side of the first fixed block 2 close to the second fixed block 3, the rotating block 13 is rotatably mounted in the limiting groove 17, the limiting ring 14 is fixedly mounted on the circumferential side wall of the rotating block 13, the limiting ring 14 is matched with the limiting groove 17, the hydraulic rod 5 is fixedly mounted on one side of the rotating block 13 close to the second fixed block 3, the clamping mechanism further comprises two suction cups 6 which are symmetrically distributed, and the two suction cups 6 are respectively mounted at one ends of the fixed rod 7 and the hydraulic rod 5 close to each other, and quartz wafer body 4 installs between two sucking discs 6, place quartz wafer body 4 between two sucking discs 6, start hydraulic stem 5, hydraulic stem 5 promotes one side sucking disc 6 and moves to dead lever 7 one side, until two sucking discs 6 press from both sides tight quartz wafer body 4, the handle rotates, the handle drives first transfer line 8 and rotates, first transfer line 8 rotates and drives dead lever 7 and rotate, dead lever 7 drives sucking disc 6 and quartz wafer body 4 and rotates, drive hydraulic stem 5 and commentaries on classics piece 13 and rotate, 12 whets a knife of bottom carry out the round edge to quartz wafer body 4 and polish.

Referring to fig. 2 and 4, the transmission mechanism includes a drive motor 10, a second transmission rod 16 and a worm 18, and one side of the mounting block 1 is fixedly provided with a driving motor 10, an output shaft of the driving motor 10 is fixedly connected with a second transmission rod 16, and the second transmission rod 16 penetrates the mounting block 1 and extends inwards, one end of the second transmission rod 16, which is far away from the driving motor 10, is fixedly provided with a worm 18, the transmission mechanism further comprises a limiting rod 9 and a worm wheel 15, and the bottom end of the grinding block 11 is fixedly provided with a limiting rod 9, the bottom end of the limiting rod 9 is rotatably provided with a worm wheel 15, and worm wheel 15 and worm 18 phase-match start driving motor 10, and driving motor 10 drives second transfer line 16 and rotates, and second transfer line 16 drives worm 18 and rotates, and worm 18 rotates and worm wheel 15 mesh transmission mutually, and worm wheel 15 rotates the limit and moves upwards simultaneously, promotes gag lever post 9 and moves upwards, and sanding block 11 and whetstone 12 follow upward movement.

The working principle is as follows: when the device is used, a quartz wafer body 4 is placed between two suckers 6, a hydraulic rod 5 is started, the hydraulic rod 5 pushes one sucker 6 to move towards one side of a fixing rod 7 until the two suckers 6 clamp the quartz wafer body 4 tightly, a driving motor 10 is started at the moment, the driving motor 10 drives a second transmission rod 16 to rotate, the second transmission rod 16 drives a worm 18 to rotate, the worm 18 rotates to be meshed with a worm wheel 15 for transmission, the worm wheel 15 rotates and moves upwards, a limiting rod 9 is pushed to move upwards, and a grinding block 11 and a grinding knife 12 move upwards along with the rotation.

The handle is rotated, the handle drives the first transmission rod 8 to rotate, the first transmission rod 8 rotates to drive the fixed rod 7 to rotate, the fixed rod 7 drives the sucker 6 and the quartz wafer body 4 to rotate, the hydraulic rod 5 and the rotating block 13 are driven to rotate, and the knife grinder 12 at the bottom end grinds the quartz wafer body 4 in a round edge mode.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims (6)

1. The utility model provides a round edge device for quartz wafer production, includes installation piece (1) and quartz wafer body (4), its characterized in that, installation piece (1) top fixed mounting respectively has and is first fixed block (2) of symmetric distribution and second fixed block (3), just rotate between first fixed block (2) and second fixed block (3) and install fixture, installation piece (1) top fixed mounting has grinding block (11), just grinding block (11) are installed between first fixed block (2) and second fixed block (3), grinding block (11) top fixed mounting has whets a knife (12), just grinding block (11) bottom fixed mounting has drive mechanism.

2. The round edge device for quartz wafer production as claimed in claim 1, wherein the clamping mechanism comprises a fixing rod (7) and a first transmission rod (8), and the fixing rod (7) is rotatably installed on one side of the second fixing block (3) close to the first fixing block (2), the first transmission rod (8) is fixedly installed at one end of the fixing rod (7), the first transmission rod (8) is rotatably installed through the second fixing block (3), and a handle is fixedly installed at one end of the first transmission rod (8) far away from the fixing rod (7).

3. The round edge device for quartz wafer production according to claim 2, wherein the clamping mechanism further comprises a hydraulic rod (5), a suction cup (6), a rotating block (13) and a limiting ring (14), a limiting groove (17) is formed in one side of the first fixing block (2) close to the second fixing block (3), the rotating block (13) is rotatably mounted in the limiting groove (17), the limiting ring (14) is fixedly mounted on the circumferential side wall of the rotating block (13), the limiting ring (14) is matched with the limiting groove (17), and the hydraulic rod (5) is fixedly mounted on one side of the rotating block (13) close to the second fixing block (3).

4. A round edge device for quartz wafer production according to claim 3, characterized in that the clamping mechanism further comprises two symmetrically distributed suction cups (6), and the two suction cups (6) are respectively installed at one end of the fixed rod (7) and the hydraulic rod (5) close to each other, and the quartz wafer body (4) is installed between the two suction cups (6).

5. The round edge device for quartz wafer production according to claim 1, wherein the transmission mechanism comprises a driving motor (10), a second transmission rod (16) and a worm (18), the driving motor (10) is fixedly installed on one side of the installation block (1), the second transmission rod (16) is fixedly connected to an output shaft of the driving motor (10), the second transmission rod (16) penetrates through the installation block (1) to extend inwards, and the worm (18) is fixedly installed at one end, far away from the driving motor (10), of the second transmission rod (16).

6. The round edge device for quartz wafer production according to claim 5, wherein the transmission mechanism further comprises a limiting rod (9) and a worm gear (15), the limiting rod (9) is fixedly installed at the bottom end of the polishing block (11), the worm gear (15) is rotatably installed at the bottom end of the limiting rod (9), and the worm gear (15) is matched with the worm (18).

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