CN216253338U

CN216253338U - PCB substrate of specific heat dissipation through groove assembly

Info

Publication number: CN216253338U
Application number: CN202122763440.0U
Authority: CN
Inventors: 张学宝
Original assignee: SHANGHAI ZHIQI ELECTRONIC TECHNOLOGY CO LTD
Current assignee: SHANGHAI ZHIQI ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-04-08
Anticipated expiration: 2031-11-12

Abstract

The utility model discloses a PCB (printed circuit board) substrate of a specific heat dissipation through groove component, which comprises a bottom air box, wherein the upper surface of the bottom air box is fixedly connected with an outer shell, the upper surface of the outer shell is fixedly connected with a cover plate, air outlet grooves are formed in the left side surface of the outer shell and the right side surface of the outer shell, a first through hole is formed in the inner top wall of the bottom air box, a second through hole is formed in the bottom surface of the outer shell, and the second through hole is positioned right above the first through hole. This PCB base plate of logical groove subassembly specifically dispels heat, through the inner diapire fixedly connected with spring of settling the box and set up spout and slider and be connected with the support plate at the inner wall of settling the box, can carry out the shock attenuation buffering to the PCB board like this, the effectual PCB board that has protected, through set up little fan in the inside of base and set up the filter screen in the both sides of two little fans, can continue to dispel the heat to the PCB board of settling the box inside, can block external dust again, prevent that the dust from entering into the inside of settling the box.

Description

PCB substrate of specific heat dissipation through groove assembly

Technical Field

The utility model belongs to the technical field of PCB (printed circuit board) substrates, and particularly relates to a PCB substrate of a heat dissipation through groove assembly.

Background

The PCB is called a Printed Circuit Board (PCB) because the PCB is manufactured by adopting an electronic printing technology, so the PCB is called a Printed Circuit Board (PCB), is an important electronic component, is a support body of the electronic component, is a carrier for electrically connecting the electronic component, mostly has no heat dissipation function, and can cause certain influence on a PBC (printed Circuit Board) substrate when the temperature is too high, so the PCB substrate of a specific heat dissipation through groove component is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a PCB substrate and aims to solve the problems that most of the existing PCB substrates do not have a heat dissipation function and can cause certain influence on the PBC substrate when the temperature is too high.

The PCB substrate of the specific heat dissipation through groove component comprises a bottom air box, wherein the upper surface of the bottom air box is fixedly connected with an outer shell, the upper surface of the outer shell is fixedly connected with a cover plate, air outlet grooves are formed in the left side surface of the outer shell and the right side surface of the outer shell, a first through hole is formed in the inner top wall of the bottom air box, a second through hole is formed in the bottom surface of the outer shell and is located right above the first through hole, two symmetrical sliding grooves are formed in the inner wall of the outer shell, sliding blocks are clamped in the two sliding grooves, a side surface, close to each other, of the two sliding blocks is fixedly connected with a support plate, and a circuit board is fixedly connected to the upper surface of the support plate.

Preferably, the inner bottom wall of the bottom air box is fixedly connected with two symmetrical stabilizing plates, the upper surfaces of the two stabilizing plates are fixedly connected with the inner top wall of the bottom air box, an air inlet hole is formed in one side face, away from each other, of the two stabilizing plates, and a small fan is fixedly connected to one side face, close to each other, of the two stabilizing plates.

Preferably, the inner bottom wall of bottom bellows fixedly connected with two symmetrical filter screens, two the filter screen all is located the both sides of two firm boards, two the upper surface of filter screen all with the inner roof fixed connection of bottom bellows, the inner bottom wall fixedly connected with two symmetrical water conservancy diversion blocks of bottom bellows, two the water conservancy diversion block all is located the centre of two firm boards.

Preferably, the inner bottom wall of the outer shell is fixedly connected with three springs, the top end of each spring is fixedly connected with a supporting block, and the upper surface of each supporting block is fixedly connected with the bottom surface of the carrier plate.

Preferably, a rubber pad is arranged below the sliding block, the upper surface of the rubber pad is fixedly connected with the bottom surface of the sliding block, and two buffer plates are fixedly connected to the inner wall of the outer shell and are located below the sliding groove.

Preferably, a warning board is arranged in front of the outer shell, the back of the warning board is fixedly connected with the front of the outer shell, a nameplate is arranged above the cover plate, and the bottom surface of the nameplate is fixedly connected with the upper surface of the cover plate.

Compared with the prior art, the utility model has the beneficial effects that: this PCB base plate of logical groove subassembly specifically dispels heat, through the inner diapire fixedly connected with spring of settling the box and set up spout and slider and be connected with the support plate at the inner wall of settling the box, can carry out the shock attenuation buffering to the PCB board like this, the effectual PCB board that has protected, through set up little fan in the inside of base and set up the filter screen in the both sides of two little fans, can continue to dispel the heat to the PCB board of settling the box inside, can block external dust again, prevent that the dust from entering into the inside of settling the box, heat dissipation and barrier propterty are better.

Drawings

FIG. 1 is a schematic perspective view of a bottom windbox according to the present invention;

FIG. 2 is a cross-sectional view of a front view of a bottom windbox of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 2 according to the present invention.

In the figure: 1. a bottom bellows; 2. an outer housing; 3. a cover plate; 4. an air outlet groove; 5. a filter screen; 6. a warning board; 7. a nameplate; 8. a flow guide block; 9. a second port; 10. a spring; 11. a slider; 12. a chute; 13. a support block; 14. a circuit board; 15. a carrier plate; 16. a rubber pad; 17. a buffer plate; 18. a stabilizing plate; 19. a first port; 20. an air inlet hole; 21. a small fan.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1-3, a PCB substrate of a heat dissipation through slot assembly specifically includes a bottom air box 1, an outer casing 2 is fixedly connected to an upper surface of the bottom air box 1, a cover plate 3 is fixedly connected to an upper surface of the outer casing 2, air outlet slots 4 are respectively formed in a left side surface of the outer casing 2 and a right side surface of the outer casing 2, a first through opening 19 is formed in an inner top wall of the bottom air box 1, a second through opening 9 is formed in a bottom surface of the outer casing 2, the second through opening 9 is located right above the first through opening 19, two symmetrical sliding slots 12 are formed in an inner wall of the outer casing 2, sliding blocks 11 are respectively clamped inside the two sliding slots 12, a support plate 15 is fixedly connected to a side surface of the two sliding blocks 11, and a circuit board 14 is fixedly connected to an upper surface of the support plate 15.

In the utility model, two symmetrical stabilizing plates 18 are fixedly connected to the inner bottom wall of a bottom air box 1, the upper surfaces of the two stabilizing plates 18 are fixedly connected with the inner top wall of the bottom air box 1, one side surface of the two stabilizing plates 18, which is far away from each other, is provided with an air inlet hole 20, one side surface of the two stabilizing plates 18, which is close to each other, is fixedly connected with a small fan 21, the small fan 21 can blow air to dissipate heat inside an outer shell 2, the inner bottom wall of the bottom air box 1 is fixedly connected with two symmetrical filter screens 5, the two filter screens 5 are positioned at two sides of the two stabilizing plates 18, the upper surfaces of the two filter screens 5 are fixedly connected with the inner top wall of the bottom air box 1, the inner bottom wall of the bottom air box 1 is fixedly connected with two symmetrical flow guide blocks 8, the two flow guide blocks 8 are positioned between the two stabilizing plates 18, and by arranging the filter screens 5, the filter screens 5 can prevent external impurities from entering the inner portion of the bottom air box 1, three spring 10 of the interior diapire fixedly connected with of shell body 2, the equal fixedly connected with supporting shoe 13 in top of every spring 10, the upper surface of every supporting shoe 13 all with the bottom surface fixed connection of support plate 15, spring 10 can play the effect of buffering to support plate 15, the below of slider 11 is equipped with rubber pad 16, the upper surface of rubber pad 16 and the bottom surface fixed connection of slider 11, two buffer boards 17 of the inner wall fixedly connected with of shell body 2, two buffer boards 17 all are located the below of spout 12, rubber pad 16 can play the buffering effect to spout 12, the place ahead of shell body 2 is equipped with warning board 6, the back of warning board 6 and the positive fixed connection of shell body 2, the top of apron 3 is equipped with data plate 7, the bottom surface of data plate 7 and the last fixed surface of apron 3 are connected, through setting up data plate 7, can make things convenient for the technical staff in time to know the information of product.

The working principle of the utility model is as follows: when the PCB is cooled, the small fan 21 rotates to generate cool air, the cool air is blown into the outer shell 2 through the guide of the flow guide block 8 to cool the PCB, the filter screen 5 can prevent external impurities from entering the bottom air box 1, and the spring 10 at the bottom of the support plate 15 can buffer the PCB.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The PCB base plate of concrete heat dissipation through groove subassembly, including bottom bellows (1), its characterized in that: the utility model discloses a bottom bellows (1) is characterized in that the last fixed surface of bottom bellows (1) is connected with shell body (2), last fixed surface of shell body (2) is connected with apron (3), air-out groove (4) have all been seted up with the right flank of shell body (2) to the left surface of shell body (2), first opening (19) have been seted up to the interior roof of bottom bellows (1), second opening (9) have been seted up to the bottom surface of shell body (2), second opening (9) are located directly over first opening (19), two symmetrical spout (12) have been seted up to the inner wall of shell body (2), two the equal joint in inside of spout (12) has slider (11), two the common fixedly connected with support plate (15) of a side that slider (11) are close to each other, the last fixed surface of support plate (15) is connected with circuit board (14).

2. The PCB substrate with a specific heat dissipating through slot assembly of claim 1, wherein: the inner bottom wall of the bottom air box (1) is fixedly connected with two symmetrical stabilizing plates (18), the upper surfaces of the stabilizing plates (18) are fixedly connected with the inner top wall of the bottom air box (1), the stabilizing plates (18) are separated from one side face of the bottom air box (1) by one side face, an air inlet hole (20) is formed in each side face, and the stabilizing plates (18) are close to one another by one side face and are fixedly connected with small fans (21).

3. The PCB substrate with a specific heat dissipating through slot assembly of claim 2, wherein: the utility model discloses a wind-proof structure, including bottom bellows (1), inner diapire fixedly connected with two symmetrical filter screen (5), two of bottom bellows (1) filter screen (5) all are located the both sides of two firm board (18), two the upper surface of filter screen (5) all with the interior roof fixed connection of bottom bellows (1), inner diapire fixedly connected with two symmetrical water conservancy diversion piece (8) of bottom bellows (1), two water conservancy diversion piece (8) all are located the centre of two firm board (18).

4. The PCB substrate with a specific heat dissipating through slot assembly of claim 1, wherein: the inner bottom wall of the outer shell (2) is fixedly connected with three springs (10), the top end of each spring (10) is fixedly connected with a supporting block (13), and the upper surface of each supporting block (13) is fixedly connected with the bottom surface of the carrier plate (15).

5. The PCB substrate with a specific heat dissipating through slot assembly of claim 1, wherein: the lower part of slider (11) is equipped with rubber pad (16), the upper surface of rubber pad (16) and the bottom surface fixed connection of slider (11), two buffer board (17) of the inner wall fixedly connected with of shell body (2), two buffer board (17) all are located the below of spout (12).

6. The PCB substrate with a specific heat dissipating through slot assembly of claim 1, wherein: the place ahead of shell body (2) is equipped with warning sign (6), the back of warning sign (6) and the positive fixed connection of shell body (2), the top of apron (3) is equipped with data plate (7), the bottom surface of data plate (7) and the last fixed surface of apron (3) are connected.