CN216250732U

CN216250732U - Photoelectric image sensor

Info

Publication number: CN216250732U
Application number: CN202122803613.7U
Authority: CN
Inventors: 王建庄; 王瑜
Original assignee: Wuhan Yijiawen Technology Co ltd
Current assignee: Wuhan Haicheng Technology Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-04-08
Anticipated expiration: 2031-11-16

Abstract

The utility model discloses a photoelectric image sensor, which comprises a resin packaging shell, wherein a sensor body is packaged in the resin packaging shell, a group of circuit pins are fixedly arranged on two sides of the sensor body, a micro lens is fixedly embedded and connected in the middle of the top end of the resin packaging shell, two symmetrical heat absorption cylinders are fixedly arranged in the resin packaging shell, two ends of each heat absorption cylinder are fixedly connected with a heat conduction silica gel column, and the front surface and the back surface of the resin packaging shell are fixedly connected with extension bars. The heat dissipation effect is improved, and the normal operation of the sensor body is guaranteed.

Description

Photoelectric image sensor

Technical Field

The utility model relates to a sensor, in particular to a photoelectric image sensor, and belongs to the technical field of sensors.

Background

The image sensor is a functional device which converts the light image on the light receiving surface into an electric signal in a corresponding proportional relation with the light image by utilizing the photoelectric conversion function of a photoelectric device, and compared with a photosensitive element of a point light source such as a photosensitive diode and a photosensitive triode, the image sensor divides the light image on the light receiving surface into a plurality of small units and converts the small units into usable electric signals. The image sensor is divided into a photoconductive camera tube and a solid-state image sensor, and compared with the photoconductive camera tube, the solid-state image sensor has the characteristics of small volume, light weight, high integration level, high resolution, low power consumption, long service life, low price and the like, so that the solid-state image sensor is widely applied to various industries.

However, the existing image sensor has some disadvantages, for example, the existing image sensor is easy to generate a large amount of heat when in use, the processing efficiency of the image sensor is reduced due to the fact that the heat cannot be timely discharged, the definition is reduced, the quality of image processing is affected, and meanwhile, the existing image sensor is easy to cause pin breakage due to the fact that pins are not welded on the back side, and the production yield is reduced.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to provide a photoelectric image sensor to solve the above-mentioned problems in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: a photoelectric image sensor comprises a resin packaging shell, a sensor body is packaged in the resin packaging shell, a group of circuit pins are fixedly arranged on both sides of the sensor body, one ends of the two groups of circuit pins respectively extend to the outer side of the front surface and the outer side of the back surface of the resin packaging shell, the middle part of the top end of the resin packaging shell is fixedly embedded and connected with a micro lens, the micro lens corresponds to the sensor body up and down, two symmetrical heat absorption columns are fixedly arranged inside the resin packaging shell, two ends of each heat absorption column are fixedly connected with a heat conduction silica gel column, the front and the back of the resin packaging shell are fixedly connected with extension bars, a plurality of pin limiting grooves are formed in the bottom ends of the two extension bars and are connected with corresponding circuit pins in a matched mode, and a plurality of breathable dustproof sleeves are embedded in two sides of the resin packaging shell.

According to a preferable technical scheme of the utility model, a plurality of diamond columns are fixedly arranged on both sides of the sensor body.

As a preferred technical scheme of the present invention, one end of each of the four heat-conducting silica gel columns and one end of each of the diamond columns are respectively connected to a corresponding dust cap in an embedded manner.

As a preferred technical scheme of the utility model, a plurality of micro hole sites are arranged on both sides of the top end of the resin packaging shell, and a breathable dustproof shield is arranged in each of the micro hole sites.

As a preferred technical scheme of the utility model, a plurality of heat absorption hole sites are arranged on the surfaces of the two heat absorption columns.

According to a preferable technical scheme of the utility model, the two epitaxial strips are both made of insulating impregnating resin materials, and insulating viscose glue is fixedly arranged at the bottom ends of the two epitaxial strips.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the photoelectric image sensor, the circuit pins are well limited and protected through the extension strips and the pin limiting grooves, the circuit pins can be prevented from being broken, and the yield is improved.

2. According to the photoelectric image sensor, the diamond column, the heat absorption column, the heat conduction silica gel column and the heat absorption hole position are arranged, so that the rapid flow of heat is ensured, the heat in the resin packaging shell can be better dissipated, the heat dissipation effect is improved, and the normal operation of the sensor body is ensured.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view showing the internal structure of the resin package case according to the present invention;

fig. 3 is a schematic structural view of the resin package housing of the present invention.

In the figure: 1. a resin package housing; 2. a ventilating dustproof sleeve; 3. a breathable dustproof shield; 4. a microlens; 5. an extension strip; 6. a sensor body; 7. a diamond column; 8. a heat absorbing column; 9. a heat conducting silica gel column; 10. heat absorption hole sites; 11. a pin limiting groove; 12. a circuit pin; 13. and (5) micro hole sites.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution of a photoelectric image sensor:

according to the drawings 1-3, the sensor comprises a resin packaging shell 1, a sensor body 6 is packaged in the resin packaging shell 1, a group of circuit pins 12 are fixedly mounted on two sides of the sensor body 6, one ends of the two groups of circuit pins 12 extend to the outer sides of the front side and the back side of the resin packaging shell 1 respectively, a micro lens 4 is fixedly embedded in the middle of the top end of the resin packaging shell 1, the micro lens 4 corresponds to the sensor body 6 up and down, two symmetrical heat absorption cylinders 8 are fixedly arranged in the resin packaging shell 1, heat conduction silica gel columns 9 are fixedly connected to two ends of the two heat absorption cylinders 8, extension bars 5 are fixedly connected to the front side and the back side of the resin packaging shell 1 respectively, a plurality of pin limiting grooves 11 are formed in the bottom ends of the two extension bars 5, the pin limiting grooves 11 are connected with the corresponding circuit pins 12 in a matched mode, and a plurality of air-permeable dust covers 2 are embedded in two sides of the resin packaging shell 1.

According to the drawings of fig. 1 and 2, a plurality of diamond columns 7 are fixedly arranged on both sides of a sensor body 6, which has good heat dissipation performance and can rapidly dissipate heat around the sensor body 6, one ends of four heat-conducting silica gel columns 9 are respectively embedded and connected with a dust-proof sleeve 2 corresponding to one ends of the diamond columns 7, so that the dust-proof effect is improved, and the rapid flow of heat is ensured, a plurality of micro hole sites 13 are respectively arranged on both sides of the top end of a resin packaging shell 1, a breathable dust-proof shield 3 is arranged inside each micro hole site 13, so that ventilation is facilitated, the rapid heat dissipation is ensured, a plurality of heat-absorbing hole sites 10 are respectively arranged on the surfaces of two heat-absorbing cylinders 8, the heat-absorbing efficiency of the heat-absorbing cylinders 8 is improved, the rapid heat dissipation is facilitated, the two extension bars 5 are both made of insulating impregnated resin materials, and insulating adhesive is fixedly arranged at the bottom ends of the two extension bars 5, the insulating property is improved, and the connection stability with the circuit board is improved.

When the photoelectric image sensor is used specifically, the circuit pins 12 are connected with the pin limiting grooves 11 at the bottom ends of the epitaxial strips 5 in a matched mode, the circuit pins can be prevented from being broken, the yield is improved, the circuit pins 12 are connected into a circuit, when the sensor body 6 works, the rapid flowing of heat inside the resin packaging shell 1 is guaranteed through the diamond columns 7, the heat absorption columns 8, the heat conduction silica gel columns 9 and the heat absorption hole sites 10, the heat inside the resin packaging shell 1 is conveniently dissipated, the heat dissipation effect is improved, and the normal operation of the sensor body 6 is guaranteed.

In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The photoelectric image sensor comprises a resin packaging shell (1) and is characterized in that a sensor body (6) is packaged in the resin packaging shell (1), a group of circuit pins (12) are fixedly mounted on two sides of the sensor body (6), one ends of the two groups of circuit pins (12) extend to the outer side of the front face and the outer side of the back face of the resin packaging shell (1) respectively, a micro lens (4) is fixedly embedded and connected in the middle of the top end of the resin packaging shell (1), the micro lens (4) corresponds to the sensor body (6) up and down, two symmetrical heat absorption cylinders (8) are fixedly arranged in the resin packaging shell (1), heat conduction silica gel columns (9) are fixedly connected at two ends of the two heat absorption cylinders (8), and extension bars (5) are fixedly connected on the front face and the back face of the resin packaging shell (1), the bottom of two epitaxial strip (5) has all seted up a plurality of pin spacing groove (11), and is a plurality of pin spacing groove (11) are connected with circuit pin (12) cooperation that correspond, the both sides of resin package shell (1) all inlay and are equipped with a plurality of ventilative dirt proof boot (2).

2. An optoelectronic image sensor as recited in claim 1, wherein: and a plurality of diamond columns (7) are fixedly arranged on two sides of the sensor body (6).

3. An optoelectronic image sensor as recited in claim 2, wherein: one ends of the four heat-conducting silica gel columns (9) are connected with the dust-proof sleeves (2) corresponding to one ends of the diamond columns (7) in an embedded mode.

4. An optoelectronic image sensor as recited in claim 1, wherein: a plurality of miniature hole sites (13) have all been seted up to the both sides side on resin package shell (1) top, and is a plurality of ventilative dust guard (3) are all installed to the inside of miniature hole site (13).

5. An optoelectronic image sensor as recited in claim 1, wherein: the surfaces of the two heat absorption columns (8) are provided with a plurality of heat absorption hole sites (10).

6. An optoelectronic image sensor as recited in claim 1, wherein: the two extension strips (5) are both made of insulating impregnated resin materials, and insulating viscose glue is fixedly arranged at the bottom ends of the two extension strips (5).