CN216249038U - Heat radiator for electronic product treater - Google Patents
Heat radiator for electronic product treater Download PDFInfo
- Publication number
- CN216249038U CN216249038U CN202120940090.8U CN202120940090U CN216249038U CN 216249038 U CN216249038 U CN 216249038U CN 202120940090 U CN202120940090 U CN 202120940090U CN 216249038 U CN216249038 U CN 216249038U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- electronic product
- fan
- seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 20
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 206010010904 Convulsion Diseases 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation device of an electronic product processor, which comprises an aluminum heat dissipation seat, wherein the aluminum heat dissipation seat is rectangular, four support columns are fixedly connected with four corners of the bottom of the aluminum heat dissipation seat, the bottom ends of the four support columns are connected with a heat conduction silica gel gasket, four screw holes penetrating through the support columns and the heat conduction silica gel gasket are arranged at four corners of the aluminum heat dissipation seat, at least one fan mounting hole is arranged on the aluminum heat dissipation seat, a heat dissipation fan is arranged on the fan mounting hole, and an air outlet of the heat dissipation fan is arranged on the side wall of the aluminum heat dissipation seat, and the heat dissipation device has the beneficial effects that: the whole volume of this heat abstractor is less, and thickness is more frivolous, and the miniature desktop computer of comparison adaptation, radiator fan through this heat abstractor can realize the heat dissipation of treater to discharge the heat that sends the treater from the box lateral wall, further, through the setting of heat conduction silica gel gasket and waterproof stripe, make the computer box have certain waterproof function.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device of an electronic product processor.
Background
The commercial microcomputer (also called MINI PC or MINI computer) is popular with many consumers because of its small host size, convenient to carry, but because the size is less, and the microcomputer is generally placed horizontally, the upper and lower walls are all the metal casing of integral type, the thermovent sets up in the lateral wall all around, traditional CPU radiator fan is difficult to dispel the heat with it is compatible, consequently need carry out professional design to the heat radiation structure of commercial microcomputer treater, make its adaptation its treater.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a heat dissipation device of an electronic product processor.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a heat abstractor of electronic product treater, installs on the treater of electronic product mainboard, includes the aluminium radiating seat, the aluminium radiating seat is the cuboid, four support columns of the bottom four corners fixedly connected with of aluminium radiating seat, a heat conduction silica gel gasket is connected to the bottom of four support columns, the four corners of aluminium radiating seat is provided with four screw holes that run through support column and heat conduction silica gel gasket, be provided with at least one fan mounting hole on the aluminium radiating seat, install radiator fan on the fan mounting hole, radiator fan's air outlet sets up the lateral wall at the aluminium radiating seat.
Preferably, the heat radiation fan is a centrifugal fan.
Preferably, the thickness of the heat-conducting silica gel gasket is 2-3 mm.
Preferably, the number of the heat radiation fans is 2.
Preferably, waterproof adhesive tapes are arranged in the gap between the heat-conducting silica gel gasket and the main board.
Preferably, the fan mounting hole is a through hole penetrating vertically.
Preferably, the bottom of the fan mounting hole is provided with a protective mesh enclosure.
Preferably, the bottom of the waterproof rubber strip on the main board is provided with a groove
Compared with the prior art, the utility model has the beneficial effects that: the whole volume of this heat abstractor is less, and thickness is more frivolous, and the miniature desktop computer of comparison adaptation, radiator fan through this heat abstractor can realize the heat dissipation of treater to discharge the heat that sends the treater from the box lateral wall, further, through the setting of heat conduction silica gel gasket and waterproof stripe, make the computer box have certain waterproof function.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the motherboard assembly of the present invention.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides the following technical solutions: an embodiment of a heat dissipation device of an electronic product processor is installed on a processor 10 of an electronic product mainboard 1, the electronic product of the embodiment is a micro desktop computer (or called mini desktop computer host) which is shaped like a same square box, the embodiment comprises an aluminum heat dissipation seat 11, the aluminum heat dissipation seat 11 is rectangular, four support columns 2 are fixedly connected with four corners of the bottom of the aluminum heat dissipation seat 11, and a heat-conducting silica gel gasket 3 is connected with the bottom ends of the four support columns 2, so that a hollow interlayer is formed between the heat-conducting silica gel gasket and the aluminum heat dissipation seat 11 and is communicated with the whole box inner space, heat of the whole box inner space is conveniently discharged by a heat dissipation fan 5, four screw holes 4 (corresponding screw holes are formed on the mainboard 1) penetrating through the support columns 2 and the heat-conducting silica gel gasket 3 are arranged at four corners of the aluminum heat dissipation seat 11, the device can be fixedly installed on the mainboard 1 through four screws 41, this moment treater 10 upper surface hugs closely heat conduction silica gel gasket 3 and sets up, is favorable to the heat dissipation of treater, be provided with at least one fan mounting hole on the aluminium radiating seat 11, this embodiment is preferred to adopt two fan mounting holes, install 2 radiator fan 5 on the fan mounting hole, radiator fan 5 is preferred to adopt centrifugal fan, and radiator fan 5's air outlet 12 sets up the lateral wall at aluminium radiating seat 11, because the louvre of present miniature desktop computer host computer all sets up on the lateral wall, consequently sets up air outlet 12 in aluminium radiating seat 11's lateral wall, can be with the heat that the treater produced according to the direction of arrow mark in the picture, through centrifugal fan's convulsions, upwards get into from the hollow intermediate layer, then from the air outlet 12 heat of arranging away that is located the lateral wall.
The thickness of heat conduction silica gel gasket 3 is 2-3mm, the preferred 2mm that adopts of this embodiment, heat conduction silica gel gasket is with silica gel as the substrate, add various supplementary materials such as metallic oxide, it has sealedly, functions such as shock attenuation and insulation, waterproof stripe 7 has been beaten to clearance department between heat conduction silica gel gasket 3 and the mainboard 1, it is preferred, the bottom that lies in waterproof stripe 7 on mainboard 1 is provided with recess 71, this kind of design is convenient for beat when waterproof stripe, waterproof gel can flow into in the recess 71, after waterproof stripe solidifies, waterproof stripe 71 can not break away from easily, this kind of seal structure design, make external moisture be difficult to enter into in the treater, and can not influence the heat dissipation of treater.
The bottom of the fan mounting hole is provided with a protective mesh enclosure 6, so that impurities can be prevented from entering the cooling fan 5, and the blades are damaged.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a heat abstractor of electronic product treater, installs on the treater of electronic product mainboard, includes the aluminium radiating seat, its characterized in that: the aluminum heat dissipation seat is a rectangular body, four support columns are fixedly connected to four corners of the bottom of the aluminum heat dissipation seat, a heat-conducting silica gel gasket is connected to the bottom ends of the four support columns, four screw holes penetrating through the support columns and the heat-conducting silica gel gasket are formed in the four corners of the aluminum heat dissipation seat, at least one fan mounting hole is formed in the aluminum heat dissipation seat, a heat dissipation fan is installed on the fan mounting hole, and an air outlet of the heat dissipation fan is formed in the side wall of the aluminum heat dissipation seat.
2. The heat dissipation device of an electronic product processor as recited in claim 1, wherein: the heat radiation fan is a centrifugal fan.
3. The heat dissipation device of an electronic product processor of claim 2, wherein: the thickness of the heat-conducting silica gel gasket is 2-3 mm.
4. The heat dissipation device of an electronic product processor of claim 3, wherein: the number of the heat radiation fans is 2.
5. The heat dissipation device of an electronic product processor of claim 4, wherein: waterproof adhesive tape is arranged in the gap between the heat-conducting silica gel gasket and the main board.
6. The heat dissipation device of an electronic product processor of claim 5, wherein: the fan mounting hole is a through hole which penetrates through the fan mounting hole from top to bottom.
7. The heat dissipation device of an electronic product processor of claim 6, wherein: and a protective mesh enclosure is arranged at the bottom of the fan mounting hole.
8. The heat dissipation device of an electronic product processor of claim 7, wherein: the bottom of the waterproof adhesive tape on the main board is provided with a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120940090.8U CN216249038U (en) | 2021-05-06 | 2021-05-06 | Heat radiator for electronic product treater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120940090.8U CN216249038U (en) | 2021-05-06 | 2021-05-06 | Heat radiator for electronic product treater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216249038U true CN216249038U (en) | 2022-04-08 |
Family
ID=80939338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120940090.8U Expired - Fee Related CN216249038U (en) | 2021-05-06 | 2021-05-06 | Heat radiator for electronic product treater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216249038U (en) |
-
2021
- 2021-05-06 CN CN202120940090.8U patent/CN216249038U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220408 |