CN216243772U - High-efficient heat dissipation type LED lighting device - Google Patents

High-efficient heat dissipation type LED lighting device Download PDF

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Publication number
CN216243772U
CN216243772U CN202122087585.3U CN202122087585U CN216243772U CN 216243772 U CN216243772 U CN 216243772U CN 202122087585 U CN202122087585 U CN 202122087585U CN 216243772 U CN216243772 U CN 216243772U
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China
Prior art keywords
heat
accommodating cavity
heat dissipation
circuit board
lighting device
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Expired - Fee Related
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CN202122087585.3U
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Chinese (zh)
Inventor
陈建
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Hubei Fengyuan Technology Co ltd
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Hubei Fengyuan Technology Co ltd
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Priority to CN202122087585.3U priority Critical patent/CN216243772U/en
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Abstract

The utility model discloses a high-efficiency heat-dissipation type LED lighting device which comprises a shell, a circuit board, a plurality of heat-conducting pieces and a plurality of heat-dissipating pieces, wherein the circuit board is arranged on the shell; the shell is provided with a first closed accommodating cavity and a second closed accommodating cavity, and the second accommodating cavity is used for packaging heat-conducting liquid; the circuit board is arranged in the first accommodating cavity; one end of each heat conducting piece is connected with the circuit board, and the other end of each heat conducting piece is positioned in the second accommodating cavity; the one end of each radiating piece all is located the second and holds the intracavity, and the other end of each radiating piece all is located the second and holds the chamber outside. The utility model has the beneficial effects that: when the local of circuit board produced heat, in the heat conduction liquid that the second held the intracavity with the heat transfer that the heat conduction spare of connecting here was produced, heat conduction liquid with heat transfer to each radiating piece on to release in passing through the radiating piece with heat transfer to the air, thereby at the radiating process, more radiating pieces participated in the heat dissipation, and the radiating effect is good, has improved the life of LED lamps and lanterns.

Description

High-efficient heat dissipation type LED lighting device
Technical Field
The utility model relates to the technical field of LED lamps, in particular to a high-efficiency heat-dissipation type LED lighting device.
Background
The LED lamp is widely used because of its advantages of low voltage power, low power consumption, strong adaptability, strong stability, short response time, no environmental pollution, and multi-color light emission (refer to chinese utility model patent with application number CN 201520700534.5).
When the LED lamp works, a circuit board (PCB) of the LED lamp can generate a large amount of heat, and if the circuit board is poor in heat dissipation, the service life of the LED lamp can be greatly shortened.
In the prior art, a circuit board heat dissipation method of an LED lamp is to use a plurality of fins to connect a circuit board, and to dissipate heat through the fins uniformly arranged around the circuit board. However, the heat generating source on the circuit board is often concentrated on a local part, so that during heat dissipation, heat dissipation can be performed only by means of the fins near the heat generating source, and other fins do not participate or participate less in heat dissipation, which results in low heat dissipation efficiency of the circuit board of the existing LED lamp.
SUMMERY OF THE UTILITY MODEL
In view of the above, there is a need to provide an efficient heat dissipation type LED lighting device, so as to solve the technical problem of low heat dissipation efficiency of the circuit board of the conventional LED lamp.
In order to achieve the above object, the present invention provides a high-efficiency heat-dissipation LED lighting device, which includes a housing, a circuit board, a plurality of heat-conducting members, and a plurality of heat-dissipating members;
the shell is provided with a first closed accommodating cavity and a second closed accommodating cavity, and the second accommodating cavity is used for packaging heat-conducting liquid;
the circuit board is arranged in the first accommodating cavity;
one end of each heat conducting piece is connected with the circuit board, and the other end of each heat conducting piece is located in the second accommodating cavity;
and one end of each heat dissipation piece is positioned in the second accommodating cavity, and the other end of each heat dissipation piece is positioned outside the second accommodating cavity.
Preferably, the housing includes a bottom plate, an outer cylinder and an inner cylinder, the outer cylinder is fastened to the bottom plate, the outer cylinder and the bottom plate form the second accommodating cavity, the inner cylinder is fastened to the bottom plate and located in the second accommodating cavity, and the inner cylinder and the bottom plate form the first accommodating cavity.
Preferably, the heat conducting member is a heat conducting fin, one end of each heat conducting fin is connected to the circuit board, and the other end of each heat conducting fin is located in the second accommodating cavity.
Preferably, a plurality of first abdicating holes communicated with the first accommodating cavity are formed in the inner barrel, the first abdicating holes are arranged in one-to-one correspondence with the heat conducting fins, and each heat conducting fin penetrates through the corresponding first abdicating hole; and a first filling body is filled between the inner wall of each first yielding hole and the corresponding outer wall of the heat conduction fin, so that each first yielding hole is in a closed state.
Preferably, the heat dissipation piece is a heat dissipation fin, one end of each heat dissipation fin is located in the second accommodating cavity, and the other end of each heat dissipation fin is located outside the second accommodating cavity.
Preferably, a plurality of second abdicating holes communicated with the second accommodating cavity are formed in the outer barrel, the second abdicating holes are arranged in one-to-one correspondence with the radiating fins, and each radiating fin penetrates through the corresponding second abdicating hole; and a second filling body is filled between the inner wall of each second yielding hole and the corresponding outer wall of each radiating fin, so that each second yielding hole is in a closed state.
Preferably, the high-efficiency heat dissipation type LED lighting device further comprises a lead; a third abdicating hole communicated with the first accommodating cavity is formed in the inner barrel, a fourth abdicating hole communicated with the second accommodating cavity is formed in the outer barrel, and the lead is arranged in the third abdicating hole and the fourth abdicating hole in a penetrating manner; and a third filling body is filled between the inner wall of the third yielding hole and the outer wall of the lead so that the third yielding hole is in a closed state, and a fourth filling body is filled between the inner wall of the fourth yielding hole and the outer wall of the lead so that the fourth yielding hole is in a closed state.
Preferably, the high-efficiency heat dissipation type LED lighting device further includes a lamp tube, one end of the lamp tube is fixed to the end surface of the bottom plate far away from the outer cylinder, and the other end of the lamp tube is electrically connected to the circuit board.
Preferably, a fifth yielding hole is formed in the bottom plate, the lamp tube penetrates through the fifth yielding hole, and a fifth filling body is filled between the inner wall of the fifth yielding hole and the outer wall of the lamp tube, so that the fifth yielding hole is in a closed state.
Preferably, the efficient heat dissipation type LED lighting device further includes a heat sink, one end of the heat sink is fixed to the circuit board, and the other end of the heat sink is connected to each of the heat conducting members.
Compared with the prior art, the technical scheme provided by the utility model has the beneficial effects that: when the local of circuit board produced heat, in the heat conduction liquid that the second held the intracavity with the heat transfer that the heat conduction spare of connecting here was produced, heat conduction liquid with heat transfer to each radiating piece on to release in passing through the radiating piece with heat transfer to the air, thereby at the radiating process, more radiating pieces participated in the heat dissipation, and the radiating effect is good, has improved the life of LED lamps and lanterns.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of a high-efficiency heat dissipation LED lighting device provided in the present invention;
FIG. 2 is a schematic structural diagram of the high-efficiency heat dissipation type LED lighting device in FIG. 1;
in the figure: 1-shell, 2-circuit board, 3-heat conducting piece, 4-heat radiating piece, 5-lead, 6-lamp tube, 7-heat radiating body, 11-bottom plate, 12-outer cylinder and 13-inner cylinder.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the utility model and together with the description, serve to explain the principles of the utility model and not to limit the scope of the utility model.
Referring to fig. 1 and 2, the present invention provides a high-efficiency heat dissipation LED lighting device, which includes a housing 1, a circuit board 2, a plurality of heat conducting elements 3, and a plurality of heat dissipating elements 4.
The shell 1 is provided with a first closed accommodating cavity and a second closed accommodating cavity, and the second accommodating cavity is used for packaging heat-conducting liquid. The circuit board 2 is disposed in the first accommodating cavity. One end of each of the heat-conducting members 3 is connected to the circuit board 2 (and is uniformly disposed on each portion of the circuit board 2), and the other end of each of the heat-conducting members 3 is located in the second accommodating cavity. One end of each heat dissipation element 4 is located in the second accommodating cavity, and the other end of each heat dissipation element 4 is located outside the second accommodating cavity.
When using, when the local production of heat of circuit board 2, in the heat conduction liquid that the second holds the intracavity is transmitted to the heat conduction piece 3 of being connected with this department, heat conduction liquid is transmitted heat to each radiating part 4, and release in transmitting the air heat through radiating part 4, thereby in the radiating process, more radiating parts 4 have participated in the heat dissipation, the radiating effect is good, the life of LED lamps and lanterns has been improved, in addition, can use the higher heat conduction liquid of specific heat capacity, thereby can absorb the heat that the circuit board produced through heat conduction liquid, thereby can improve the radiating effect of circuit board 2.
In order to realize the functions of the housing 1 specifically, referring to fig. 1 and fig. 2, in a preferred embodiment, the housing 1 includes a bottom plate 11, an outer cylinder 12 and an inner cylinder 13, one end of the outer cylinder 12 is closed, and the other end is open, the outer cylinder 12 is fastened to the bottom plate 11, the outer cylinder 12 and the bottom plate 11 define the second accommodating cavity, one end of the inner cylinder 13 is closed, and the other end is open, the inner cylinder 13 is fastened to the bottom plate 11 and located in the second accommodating cavity, the inner cylinder 13 and the bottom plate 11 define the first accommodating cavity, and by disposing the inner cylinder 13 in the outer cylinder 12, a heat conducting liquid is encapsulated between the outer cylinder 12 and the inner cylinder 13, so that the heat conducting liquid is located at the periphery of the inner cylinder 13, and heat dissipation of the heat conducting liquid is facilitated.
To realize the function of the heat conducting member 3, referring to fig. 1 and fig. 2, in a preferred embodiment, the heat conducting member 3 is a heat conducting fin, one end of each heat conducting fin is connected to the circuit board 2, and the other end of each heat conducting fin is located in the second accommodating cavity.
In order to keep the first accommodating cavity sealed, please refer to fig. 1 and 2, in a preferred embodiment, a plurality of first yielding holes communicated with the first accommodating cavity are formed in the inner cylinder 13, the first yielding holes and the heat conducting fins are arranged in a one-to-one correspondence manner, and each heat conducting fin penetrates through the corresponding first yielding hole; each first hole of stepping down and the outer wall that corresponds heat conduction fin between all pack and have first obturator to make each first hole of stepping down all is in airtight state, thereby can make first chamber of holding keep sealed, in order to prevent that heat conduction liquid from getting into first chamber of holding and making circuit board 2 damage.
In order to specifically realize the functions of the heat dissipation member 4, referring to fig. 1 and fig. 2, in a preferred embodiment, the heat dissipation member 4 is a heat dissipation fin, one end of each heat dissipation fin is located in the second accommodation cavity, and the other end of each heat dissipation fin is located outside the second accommodation cavity.
In order to keep the second accommodating cavity sealed, please refer to fig. 1 and 2, in a preferred embodiment, a plurality of second yielding holes communicated with the second accommodating cavity are formed in the outer cylinder 12, the second yielding holes and the heat dissipation fins are arranged in a one-to-one correspondence manner, and each heat dissipation fin penetrates through the corresponding second yielding hole; and a second filling body is filled between the inner wall of each second yielding hole and the corresponding outer wall of each radiating fin, so that each second yielding hole is in a closed state, and the second containing cavity is kept sealed to prevent heat conduction liquid from flowing outwards.
In order to electrically connect the lamp, please refer to fig. 1 and fig. 2, in a preferred embodiment, the high efficiency heat dissipation LED lighting device further includes a wire 5; a third abdicating hole communicated with the first accommodating cavity is formed in the inner barrel 13, a fourth abdicating hole communicated with the second accommodating cavity is formed in the outer barrel 12, and the lead 5 penetrates through the third abdicating hole and the fourth abdicating hole; the inner wall in third hole of stepping down with it has the third obturator to fill between the outer wall of wire 5, so that the third hole of stepping down is in airtight state, the inner wall in fourth hole of stepping down with it has the fourth obturator to fill between the outer wall of wire 5, so that the fourth hole of stepping down is in airtight state to can make first chamber and the second chamber that holds all be in encapsulated situation.
In order to realize the lighting function, referring to fig. 1 and fig. 2, in a preferred embodiment, the high-efficiency heat dissipation type LED lighting device further includes a lamp tube 6, one end of the lamp tube 6 is fixed on the end surface of the bottom plate 11 away from the outer cylinder 12, and the other end of the lamp tube 6 is electrically connected to the circuit board 2.
In order to enhance the sealing effect of the first accommodating cavity, referring to fig. 1 and fig. 2, in a preferred embodiment, a fifth yielding hole is formed in the bottom plate 11, the lamp tube 6 is inserted into the fifth yielding hole, and a fifth filling body is filled between an inner wall of the fifth yielding hole and an outer wall of the lamp tube 6, so that the fifth yielding hole is in a sealed state.
In order to improve the heat dissipation effect of the circuit board 2, referring to fig. 1 and fig. 2, in a preferred embodiment, the efficient heat dissipation type LED lighting device further includes a heat dissipation body 7, one end of the heat dissipation body 7 is fixed on the circuit board 2, and the other end of the heat dissipation body 7 is connected to each of the heat conduction members 3.
For better understanding of the present invention, the following describes the operation of the high efficiency heat dissipation LED lighting device provided by the present invention in detail with reference to fig. 1 and 2: when using, when the local production of heat of circuit board 2, in the heat conduction liquid that the second holds the intracavity is transmitted to the heat conduction piece 3 of being connected with this department, heat conduction liquid is transmitted heat to each radiating part 4, and release in transmitting the air heat through radiating part 4, thereby in the radiating process, more radiating parts 4 have participated in the heat dissipation, the radiating effect is good, the life of LED lamps and lanterns has been improved, in addition, can use the higher heat conduction liquid of specific heat capacity, thereby can absorb the heat that the circuit board produced through heat conduction liquid, thereby can improve the radiating effect of circuit board 2.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.

Claims (10)

1. A high-efficiency heat-dissipation type LED lighting device is characterized by comprising a shell, a circuit board, a plurality of heat conducting pieces and a plurality of heat dissipation pieces;
the shell is provided with a first closed accommodating cavity and a second closed accommodating cavity, and the second accommodating cavity is used for packaging heat-conducting liquid;
the circuit board is arranged in the first accommodating cavity;
one end of each heat conducting piece is connected with the circuit board, and the other end of each heat conducting piece is located in the second accommodating cavity;
and one end of each heat dissipation piece is positioned in the second accommodating cavity, and the other end of each heat dissipation piece is positioned outside the second accommodating cavity.
2. The efficient heat dissipation type LED lighting device as recited in claim 1, wherein said housing comprises a bottom plate, an outer barrel and an inner barrel, said outer barrel is fastened to said bottom plate, said outer barrel and said bottom plate define said second receiving cavity, said inner barrel is fastened to said bottom plate and located in said second receiving cavity, and said inner barrel and said bottom plate define said first receiving cavity.
3. The efficient heat dissipation type LED lighting device as recited in claim 2, wherein said heat conducting member is a heat conducting fin, one end of each of said heat conducting fins is connected to said circuit board, and the other end of each of said heat conducting fins is located in said second receiving cavity.
4. The efficient heat dissipation type LED lighting device according to claim 3, wherein a plurality of first abdicating holes communicated with the first accommodating cavity are formed in the inner barrel, the first abdicating holes are arranged in one-to-one correspondence with the heat conducting fins, and each heat conducting fin is arranged in the corresponding first abdicating hole in a penetrating manner;
and a first filling body is filled between the inner wall of each first yielding hole and the corresponding outer wall of the heat conduction fin, so that each first yielding hole is in a closed state.
5. A high efficiency heat dissipating LED lighting device as recited in claim 2, wherein said heat dissipating elements are heat dissipating fins, one end of each of said heat dissipating fins is located in said second accommodating cavity, and the other end of each of said heat dissipating fins is located outside said second accommodating cavity.
6. The efficient heat dissipation type LED lighting device according to claim 5, wherein a plurality of second yielding holes communicated with the second accommodating cavity are formed in the outer barrel, the second yielding holes are arranged in one-to-one correspondence with the heat dissipation fins, and each heat dissipation fin is arranged in the corresponding second yielding hole in a penetrating manner;
and a second filling body is filled between the inner wall of each second yielding hole and the corresponding outer wall of each radiating fin, so that each second yielding hole is in a closed state.
7. The high efficiency heat dissipating LED lighting device of claim 2, further comprising a wire;
a third abdicating hole communicated with the first accommodating cavity is formed in the inner barrel, a fourth abdicating hole communicated with the second accommodating cavity is formed in the outer barrel, and the lead is arranged in the third abdicating hole and the fourth abdicating hole in a penetrating manner;
and a third filling body is filled between the inner wall of the third yielding hole and the outer wall of the lead so that the third yielding hole is in a closed state, and a fourth filling body is filled between the inner wall of the fourth yielding hole and the outer wall of the lead so that the fourth yielding hole is in a closed state.
8. The LED lighting device with high efficiency and heat dissipation capability as recited in claim 2, further comprising a lamp tube, wherein one end of said lamp tube is fixed on the end surface of said bottom plate away from said outer barrel, and the other end of said lamp tube is electrically connected to said circuit board.
9. The efficient heat dissipation type LED lighting device according to claim 8, wherein a fifth abdicating hole is formed in the bottom plate, the lamp tube is inserted into the fifth abdicating hole, and a fifth filling body is filled between an inner wall of the fifth abdicating hole and an outer wall of the lamp tube, so that the fifth abdicating hole is in a closed state.
10. The efficient heat dissipation type LED lighting device according to claim 1, further comprising a heat dissipation body, wherein one end of the heat dissipation body is fixed on the circuit board, and the other end of the heat dissipation body is connected with each of the heat conduction members.
CN202122087585.3U 2021-08-31 2021-08-31 High-efficient heat dissipation type LED lighting device Expired - Fee Related CN216243772U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122087585.3U CN216243772U (en) 2021-08-31 2021-08-31 High-efficient heat dissipation type LED lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122087585.3U CN216243772U (en) 2021-08-31 2021-08-31 High-efficient heat dissipation type LED lighting device

Publications (1)

Publication Number Publication Date
CN216243772U true CN216243772U (en) 2022-04-08

Family

ID=80982597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122087585.3U Expired - Fee Related CN216243772U (en) 2021-08-31 2021-08-31 High-efficient heat dissipation type LED lighting device

Country Status (1)

Country Link
CN (1) CN216243772U (en)

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Granted publication date: 20220408