CN216217803U

CN216217803U - PCB circuit board mould that production efficiency is high

Info

Publication number: CN216217803U
Application number: CN202122675605.9U
Authority: CN
Inventors: 刘龙威; 王辉; 邹建楠; 谢超
Original assignee: Weihai Xinyu Precision Electronics Co ltd
Current assignee: Weihai Xinyu Precision Electronics Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-04-05
Anticipated expiration: 2031-11-04

Abstract

The utility model discloses a PCB (printed circuit board) die with high production efficiency, which comprises a bottom plate, a lower die plate and a top plate, wherein butt joints are fixedly arranged on the periphery of the upper surface of the bottom plate, butt joint blocks are fixedly arranged at the center of the upper surface of the bottom plate, butt joint grooves are formed in the periphery of the lower surface of the lower die plate, a rubber pad is adhered at the center of the lower surface of the lower die plate, a die holder is fixedly arranged on the upper surface of the lower die plate, a second spring is fixedly arranged in the die holder, a forming plate is movably arranged on the upper surface in the die holder, and a convex block is fixedly arranged on one side of the forming plate. The utility model enables the die to have the buffering function, can effectively relieve the impact force generated during stamping, avoids the influence on the service life of the die due to overlarge impact force, improves the production efficiency of the die during producing a circuit board, enables the die to rapidly demould a stamping forming finished product, and has practicability.

Description

PCB circuit board mould that production efficiency is high

Technical Field

The utility model relates to the technical field of stamping dies, in particular to a PCB (printed circuit board) die with high production efficiency.

Background

The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. Because it is made by electronic printing, so it is called "printed" circuit board, the mould is used in the industrial production to get the various moulds and tools of the required products by injection moulding, blow moulding, extrusion, die casting or forging and pressing forming, smelting, stamping, etc., in the production of PCB, it is used to punch the circuit board;

the existing circuit board die has certain defects, the circuit board after stamping forming is not easy to take out from the inside of the die, more time can be wasted due to the problem of taking out, the production efficiency can be influenced, the existing circuit board die does not have the buffering function, the lower die plate can directly receive the force of stamping and is easy to damage, and therefore the PCB circuit board die with high production efficiency is provided at present.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a PCB (printed circuit board) mould with high production efficiency, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a PCB circuit board mould that production efficiency is high, includes bottom plate, lower bolster and roof, the equal fixed mounting of upper surface of bottom plate has the butt joint all around, the upper surface center department fixed mounting of bottom plate has the butt joint piece, the butt joint groove has all been seted up all around to the lower surface of lower bolster, the lower surface center department of lower bolster pastes there is the rubber pad, the last fixed surface of lower bolster installs the die holder, the inside fixed mounting of die holder has No. two springs, the inside upper surface movable mounting of die holder has the shaping board, one side fixed mounting of shaping board has the lug, the opposite side fixed mounting of shaping board has the movable rod, the last fixed surface of roof installs the connector, the lower surface center department fixed mounting of roof has the punching press head.

Preferably, the butt joint is positioned in the butt joint groove and fixedly connected with the first spring, and the bottom plate and the lower template are movably connected with the lower template through the first spring and the butt joint groove.

Preferably, all fixed mounting has the butt joint post around the upper surface of lower bolster, the guide way has all been seted up around the surface of roof, the guide way is located the position directly over the butt joint post.

Preferably, the inner wall both sides of die holder have all seted up the mounting groove, the spout has been seted up to the inner wall that is located one of them group of mounting groove in the die holder, the movable rod slidable mounting is in the spout, the profiled sheeting passes through movable rod and spout and die holder swing joint.

Preferably, the number of the second springs is four, and the four groups of the second springs are distributed in the die holder at equal intervals.

Preferably, the stamping head is located right above the forming plate, a notch is formed in the center of the lower surface of the lower template, and the rubber pad is adhered to the notch.

Compared with the prior art, the utility model has the following beneficial effects:

1. the die has a buffering function through the arranged butt joint groove, the notch, the rubber pad, the butt joint, the first spring and the butt joint block, so that impact force generated during stamping can be effectively relieved, the influence on the service life of the die due to overlarge impact force is avoided, and the loss of a manufacturer is avoided;

2. production efficiency when having improved the mould production circuit board through No. two springs, spout, profiled sheeting, movable rod and the lug that sets up makes its finished product quick drawing of patterns with stamping forming that can be quick to the piece that produces when being convenient for clean punching press has improved user of service's use and has experienced, has the practicality.

Drawings

FIG. 1 is a schematic view of the overall structure of a PCB mold with high production efficiency according to the present invention;

FIG. 2 is a schematic view of a connection structure of a molding board and a mold base in the PCB mold with high production efficiency;

FIG. 3 is a schematic view of a connection structure between a lower mold plate and a bottom plate of a PCB mold with high production efficiency;

fig. 4 is a schematic structural diagram of a top plate in the PCB circuit board mold with high production efficiency according to the present invention.

In the figure: 1. a lower template; 2. a butt joint groove; 3. a notch; 4. a rubber pad; 5. a base plate; 6. a butt joint; 7. a first spring; 8. a butt joint block; 9. butting columns; 10. a die holder; 11. a second spring; 12. a chute; 13. forming a plate; 14. a movable rod; 15. a bump; 16. a top plate; 17. a connector; 18. a guide groove; 19. and (5) stamping the head.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

As shown in fig. 1-4, a PCB circuit board mold with high production efficiency, which comprises a bottom plate 5, a lower mold plate 1 and a top plate 16, wherein a butt joint 6 is fixedly installed around the upper surface of the bottom plate 5, a butt joint block 8 is fixedly installed at the center of the upper surface of the bottom plate 5, a butt joint groove 2 is formed around the lower surface of the lower mold plate 1, a rubber pad 4 is pasted at the center of the lower surface of the lower mold plate 1, a mold base 10 is fixedly installed on the upper surface of the lower mold plate 1, a second spring 11 is fixedly installed inside the mold base 10, a forming plate 13 is movably installed on the inner upper surface of the mold base 10, a convex block 15 is fixedly installed on one side of the forming plate 13, a movable rod 14 is fixedly installed on the other side of the forming plate 13, a connector 17 is fixedly installed on the upper surface of the top plate 16, and a stamping head 19 is fixedly installed at the center of the lower surface of the top plate 16.

The butt joint 6 is located butt joint groove 2 and is connected with spring 7 fixed connection, and bottom plate 5 and lower bolster 1 are through spring 7 and butt joint groove 2 and lower bolster 1 swing joint, and spring 7 can absorb the power of pushing down, provides the time of a buffering.

Equal fixed mounting all around of upper surface of lower bolster 1 has docking post 9, and guide way 18 has all been seted up all around to the surface of roof 16, and guide way 18 is located the position directly over docking post 9, and inside docking post 9 can pierce through guide way 18, mainly ensured the accuracy of position, avoided the dislocation.

The mounting groove has all been seted up to the inner wall both sides of die holder 10, and the spout 12 has been seted up to the inner wall that is arranged in one of them set of mounting groove in the die holder 10, and movable rod 14 slidable mounting is in spout 12, and profiled sheeting 13 passes through movable rod 14 and spout 12 and die holder 10 swing joint, and movable rod 14 can guarantee that profiled sheeting 13 can rotate and bring out circuit board and the piece on the profiled sheeting 13.

The number of the second springs 11 is four, the four groups of the second springs 11 are distributed in the die holder 10 at equal intervals, and the second springs 11 can bounce the forming plate 13 after the punching is finished, so that the punched circuit board is convenient to collect.

The punching head 19 is located at a position right above the forming plate 13, the notch 3 is formed in the center of the lower surface of the lower template 1, the rubber pad 4 is adhered to the notch 3, and the rubber pad 4 can relieve impact force generated during punching.

It should be noted that, the present invention is a PCB circuit board mold with high production efficiency, when in use, the bottom plate 5 is fixed on the punch, then the top plate 16 is installed at the output end of the punch through the connector 17, the punched circuit board is placed on the forming plate 13 on the mold base 10, the punch 19 will punch downwards, the butt-joint column 9 on the lower mold plate 1 will enter into the guide groove 18, then the punch 19 will be attached to the circuit board on the forming plate 13, the mold base 10 will preferentially receive pressure to transfer it to the lower mold plate 1, the lower mold plate 1 will move towards the bottom plate 5, the first spring 7 on the bottom plate 5 and the butt-joint head 6 will absorb the force of vibration, the butt-joint block 8 will buffer the impact force on the rubber pad 4 in the notch 3, thereby pressing the forming plate 13 downwards, the forming plate 13 will press the second spring 11 downwards, the movable rod 14 on the forming plate 13 will slide downwards in the slide groove 12 opened on the mold base 10, then, the forming is carried out, the top plate 16 moves the second spring 11 upwards to jack the forming plate 13, the lug 15 is held to pick up the forming plate 13, the movable rod 14 slides and rotates in the sliding groove 12, and therefore the circuit board on the forming plate 13 is taken out and can be cleaned of debris.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a PCB circuit board mould that production efficiency is high, includes bottom plate (5), lower bolster (1) and roof (16), its characterized in that, equal fixed mounting has butt joint (6) all around of the upper surface of bottom plate (5), the upper surface center department fixed mounting of bottom plate (5) has butt joint piece (8), butt joint groove (2) have all been seted up all around to the lower surface of lower bolster (1), the lower surface center department of lower bolster (1) pastes rubber pad (4), the upper surface fixed mounting of lower bolster (1) has die holder (10), the inside fixed mounting of die holder (10) has No. two springs (11), the inside upper surface movable mounting of die holder (10) has forming plate (13), one side fixed mounting of forming plate (13) has lug (15), the opposite side fixed mounting of forming plate (13) has movable rod (14), the upper surface fixed mounting of roof (16) has connector (17), the lower surface center department fixed mounting of roof (16) has punching press head (19).

2. The PCB die with high production efficiency as claimed in claim 1, wherein the butt joint (6) is positioned in the butt joint groove (2) and fixedly connected with a first spring (7), and the bottom plate (5) and the lower die plate (1) are movably connected with the lower die plate (1) through the first spring (7) and the butt joint groove (2).

3. The PCB die with high production efficiency as claimed in claim 1, wherein docking posts (9) are fixedly mounted on the periphery of the upper surface of the lower die plate (1), guide grooves (18) are formed in the periphery of the outer surface of the top plate (16), and the guide grooves (18) are located right above the docking posts (9).

4. The PCB circuit board die with high production efficiency as claimed in claim 1, wherein the die holder (10) has mounting slots on both sides of the inner wall thereof, the inner wall of the die holder (10) in one set of the mounting slots has sliding slots (12), the movable rod (14) is slidably mounted in the sliding slots (12), and the forming plate (13) is movably connected with the die holder (10) through the movable rod (14) and the sliding slots (12).

5. The PCB die with high production efficiency as claimed in claim 1, wherein the number of the second springs (11) is four, and the four sets of the second springs (11) are distributed in the die holder (10) at equal intervals.

6. The PCB die with high production efficiency as claimed in claim 1, wherein the stamping head (19) is located right above the forming plate (13), the lower surface center of the lower die plate (1) is provided with a notch (3), and the rubber pad (4) is adhered in the notch (3).