CN216217747U

CN216217747U - Thermoelectric separation substrate structure

Info

Publication number: CN216217747U
Application number: CN202122902856.6U
Authority: CN
Inventors: 彭融
Original assignee: Dongguan Yafu Electronics Co ltd
Current assignee: Dongguan Yafu Electronics Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-04-05
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses a thermoelectric separation substrate structure, which comprises a substrate main body, wherein a heat dissipation mechanism is arranged on the surface of the substrate main body, the heat dissipation mechanism comprises an insulating layer, a connecting block is arranged on the surface of the insulating layer, a fixing plate is fixedly connected to the bottom end surface of the substrate main body, heat-conducting silica gel is arranged in the fixing plate, a connecting plate is glued to the surface of the heat-conducting silica gel, and a heat dissipation fin is fixedly connected to one side, far away from the heat-conducting silica gel, of the connecting plate. According to the utility model, heat in the substrate main body can be quickly conducted to the surfaces of the radiating fins through the heat conducting silica gel, the radiating fins can be contacted with air, the heat can be reduced, meanwhile, the heat dissipation in the device can be accelerated through the hexagonal through holes formed in the fixing plate, the radiating effect of the radiating fins is improved, the temperature generated in the use process of the substrate main body can be effectively and conveniently reduced, and the service life of an electric element is prolonged.

Description

Thermoelectric separation substrate structure

Technical Field

The utility model relates to the technical field of circuit substrates, in particular to a thermoelectric separation substrate structure.

Background

The heat in the thermoelectric separation refers to a heat conducting bonding pad on the LED aluminum substrate, and the electric refers to an electrode on the LED aluminum substrate, when the two are separated by an insulating material, the thermoelectric separation is called, and the thermoelectric separation substrate has many advantages, and is mainly convenient in the thermal design of the LED.

The substrate can be directly abutted to an electric appliance shell in the using process of the conventional thermoelectric separation substrate, when the substrate is used, the substrate can absorb heat generated by an electric element, and at the moment, the substrate can be attached to the shell, so that the heat dissipation effect of the substrate can be influenced, the aging speed of the electric element mounted on the surface of the substrate is increased, the service life is influenced, and the problem is solved by providing a thermoelectric separation substrate structure.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a thermoelectric separation substrate structure.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a base plate structure of thermoelectric separation, includes the base plate main part, the surface of base plate main part is provided with heat dissipation mechanism, heat dissipation mechanism includes the insulating layer, the surface mounting of insulating layer has the connecting block, the bottom fixed surface of base plate main part is connected with the fixed plate, and the inside of fixed plate is provided with heat conduction silica gel, heat conduction silica gel's surface veneer has the connecting plate, and one side fixedly connected with radiating fin that heat conduction silica gel was kept away from to the connecting plate, the louvre has been seted up to radiating fin's inside, the side of base plate main part is provided with coupling mechanism.

Preferably, the fixed plate sets up to the rectangle frame, heat conduction silica gel sets up to the cuboid, and heat conduction silica gel scribbles the bottom surface at the base plate main part, the inner wall size of fixed plate is greater than heat conduction silica gel's surface size.

Preferably, the radiating fins are arranged on the surface of the connecting plate at equal intervals, and the multiple groups of radiating fins are all arranged into cuboids.

Preferably, radiating holes are formed in the surfaces of the radiating fins at equal intervals, and rectangular holes are formed in the radiating holes.

Preferably, the connecting mechanism comprises a connecting column, a fixing screw is inserted into the connecting column, a supporting sleeve is sleeved on the surface of the fixing screw, a protective pad is glued to one end, away from the connecting column, of the supporting sleeve, and a rubber block is installed on one side, away from the supporting sleeve, of the protective pad.

Preferably, round holes are formed in the connecting column and the supporting sleeve, the fixing screws are cylindrical, and the size of the inner wall of each round hole formed in the connecting column and the supporting sleeve is matched with the surface size of each fixing screw.

Preferably, the rubber blocks are equidistantly arranged around the center of the protection pad in multiple groups, and the rubber blocks are semicircular.

Compared with the prior art, the utility model has the beneficial effects that:

1. the device is through being provided with heat dissipation mechanism, can carry out quick conduction to radiating fin's surface with the inside heat of base plate main part through heat conduction silica gel, and can the air contact through radiating fin, can reduce the heat, simultaneously through the inside hexagonal shape through-hole of seting up of fixed plate, can accelerate the inside heat of ware and give off, the radiating effect of the radiating fin of improvement, the effectual temperature that produces the base plate main part in the use that makes things convenient for reduces, alleviate the ageing of base plate main part surface electrical component, the life of extension electrical component.

2. The device is through being provided with coupling mechanism, through with set screw and electrical apparatus shell interconnect, can make the mutual extrusion in surface of protection pad and electrical apparatus shell to can make the installation of base plate main part accomplish back and electrical apparatus shell have certain interval through supporting the cover, improve the radiating effect, and can play the effect of protection electrical apparatus shell through the protection pad, avoid supporting the extrusion of cover and cause the damage to the electrical apparatus shell stronger.

Drawings

FIG. 1 is a schematic perspective view of a thermoelectric separation substrate structure according to the present invention;

FIG. 2 is a schematic bottom perspective view of a thermoelectric separation substrate structure according to the present invention;

fig. 3 is a perspective exploded view of the heat dissipation mechanism shown in fig. 1;

fig. 4 is a perspective exploded view of the connection mechanism of fig. 1.

In the figure: 1. a substrate main body; 2. a heat dissipation mechanism; 21. an insulating layer; 22. connecting blocks; 23. a fixing plate; 24. heat conducting silica gel; 25. a connecting plate; 26. a heat dissipating fin; 27. heat dissipation holes; 3. a connecting mechanism; 31. connecting columns; 32. a set screw; 33. a support sleeve; 34. a protection pad; 35. a rubber block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-4, a thermoelectric separation's base plate structure, including base plate main body 1, the surface of base plate main body 1 is provided with heat dissipation mechanism 2, heat dissipation mechanism 2 includes insulating layer 21, the surface mounting of insulating layer 21 has connecting block 22, the bottom fixed surface of base plate main body 1 is connected with fixed plate 23, and the inside of fixed plate 23 is provided with heat conduction silica gel 24, the surface veneer of heat conduction silica gel 24 has connecting plate 25, and one side fixedly connected with radiating fin 26 that heat conduction silica gel 24 was kept away from to connecting plate 25, connecting plate 25 and radiating fin 26 set up to the aluminium material, can play quick heat conduction effect, radiating hole 27 has been seted up to radiating fin 26's inside, the side of base plate main body 1 is provided with coupling mechanism 3.

Further, as can be known by referring to fig. 2 and 3, the fixing plate 23 is configured as a rectangular frame, the heat-conducting silica gel 24 is configured as a rectangular parallelepiped, and the heat-conducting silica gel 24 is smeared on the bottom surface of the substrate main body 1, the inner wall size of the fixing plate 23 is larger than the surface size of the heat-conducting silica gel 24, the fixing plate 23 is configured as a rectangular frame, the heat-radiating fins 26 can be conveniently protected inside, and through polygonal through holes formed inside the fixing plate 23, the contact surface with air can be increased, and the heat-radiating effect of the heat-radiating fins 26 is improved.

Further, as can be known from fig. 2 and 3, the plurality of groups of the heat dissipation fins 26 are equidistantly arranged on the surface of the connecting plate 25, and the plurality of groups of the heat dissipation fins 26 are all arranged as cuboids, so that the heat dissipation effect can be increased by the plurality of groups of the heat dissipation fins 26 equidistantly arranged on the surface of the connecting plate 25.

Further, as can be known from fig. 2 and 3, heat dissipation holes 27 are formed in the surfaces of the heat dissipation fins 26 at equal intervals, the heat dissipation holes 27 are formed as rectangular holes, and the contact surface between the heat dissipation fins 26 and the air can be increased through the heat dissipation holes 27, so that the heat dissipation efficiency is improved.

Further, as can be known by referring to fig. 2 and 4, the connecting mechanism 3 includes a connecting column 31, a fixing screw 32 is inserted into the connecting column 31, a support sleeve 33 is sleeved on the surface of the fixing screw 32, a protection pad 34 is glued to one end of the support sleeve 33 far away from the connecting column 31, one side of the protection pad 34 far away from the support sleeve 33 is provided with a rubber block 35, two groups are symmetrically arranged at two ends of the substrate body 1, and each group is provided with two groups, so that the effect of facilitating the installation of the substrate body 1 can be achieved.

Further, as can be known by referring to fig. 2 and 4, the inside of the connecting column 31 and the supporting sleeve 33 are both provided with round holes, the fixing screws 32 are arranged to be cylindrical, the size of the inner wall of the round hole formed in the inside of the connecting column 31 and the supporting sleeve 33 is matched with the surface size of the fixing screws 32, and the fixing screws 32 can be conveniently inserted into the round holes through the round holes formed in the connecting column 31 and the supporting sleeve 33, so that the substrate main body 1 can be conveniently installed.

Further, as can be seen from fig. 2 and 4, a plurality of groups of rubber blocks 35 are equidistantly arranged around the center of the protection pad 34, and the plurality of groups of rubber blocks 35 are all semicircular, so that the rubber blocks 35 can play a role in buffering.

The working principle is as follows: when the base plate main body 1 needs to be used, according to the attached

drawings

1, 2, 3 and 4, the fixing screws 32 are inserted into the connecting columns 31 and the supporting sleeves 33, and the fixing screws 32 are installed and connected with the electric appliance shell, so that the protective pads 34 can drive the rubber blocks 35 to be abutted against the surface of the electric appliance shell, the base plate main body 1 can be installed, when the electric element generates heat in the use process of the base plate main body 1, the heat of the electric element can be absorbed through the base plate main body 1, the heat can be conducted to the surface of the connecting plate 25 through the heat conducting silica gel 24, and the heat can be conducted to the surface of the radiating fins 26 through the connecting plate 25, so that the heat and air can be subjected to heat exchange;

the above is the overall working principle of the present invention.

In the present invention, the installation manner, the connection manner, or the setting manner of all the components described above are all common mechanical manners, and the specific structures, models, and coefficient indexes of all the components are their own technologies, which can be implemented as long as the beneficial effects thereof can be achieved, and thus, the details are not repeated.

The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

In the present invention, unless otherwise specified, the terms "upper, lower, left, right, front, back, inner, outer, vertical and horizontal" and the like included in the terms only represent the orientation of the terms in the conventional use state or are colloquially understood by those skilled in the art, and should not be construed as limiting the terms, and meanwhile, the terms "first", "second" and "third" and the like do not represent specific numbers and sequences, but are merely used for name differentiation, and the terms "include", "include" and any other variations are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or also includes elements inherent to such process, method, article, or apparatus.

Claims

1. The utility model provides a base plate structure of thermoelectric separation, includes base plate main part (1), its characterized in that, the surface of base plate main part (1) is provided with heat dissipation mechanism (2), heat dissipation mechanism (2) include insulating layer (21), the surface mounting of insulating layer (21) has connecting block (22), the bottom fixed surface of base plate main part (1) is connected with fixed plate (23), and the inside of fixed plate (23) is provided with heat conduction silica gel (24), the surface veneer of heat conduction silica gel (24) has connecting plate (25), and one side fixedly connected with radiating fin (26) of heat conduction silica gel (24) are kept away from in connecting plate (25), radiating hole (27) have been seted up to the inside of radiating fin (26), the side of base plate main part (1) is provided with coupling mechanism (3).

2. The thermoelectric separation substrate structure as claimed in claim 1, wherein the fixing plate (23) is configured as a rectangular frame, the heat conductive silicone (24) is configured as a rectangular parallelepiped, the heat conductive silicone (24) is coated on the bottom surface of the substrate body (1), and the inner wall size of the fixing plate (23) is larger than the surface size of the heat conductive silicone (24).

3. A thermoelectric separation substrate structure according to claim 1, wherein the plurality of groups of heat dissipating fins (26) are provided at equal intervals on the surface of the connecting plate (25), and the plurality of groups of heat dissipating fins (26) are each provided in a rectangular parallelepiped shape.

4. The substrate structure for thermoelectric separation according to claim 1, wherein the surface of the heat dissipation fins (26) is provided with heat dissipation holes (27) at equal intervals, and the heat dissipation holes (27) are rectangular holes.

5. The thermoelectric separation substrate structure according to claim 1, wherein the connecting mechanism (3) comprises a connecting column (31), a fixing screw (32) is inserted into the connecting column (31), a supporting sleeve (33) is sleeved on the surface of the fixing screw (32), a protective pad (34) is glued to one end of the supporting sleeve (33) far away from the connecting column (31), and a rubber block (35) is installed on one side of the protective pad (34) far away from the supporting sleeve (33).

6. The thermoelectric separation substrate structure according to claim 5, wherein the connecting column (31) and the supporting sleeve (33) are both provided with circular holes, the fixing screw (32) is cylindrical, and the inner walls of the circular holes formed in the connecting column (31) and the supporting sleeve (33) are matched with the surface size of the fixing screw (32).

7. A substrate structure for thermoelectric separation according to claim 5, wherein the rubber blocks (35) are provided in plural sets at equal intervals around the central position of the protection pad (34), and the plural sets of rubber blocks (35) are all provided in a semicircular shape.