CN216216513U - Power filter packaged by ceramic - Google Patents
Power filter packaged by ceramic Download PDFInfo
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- CN216216513U CN216216513U CN202122583612.6U CN202122583612U CN216216513U CN 216216513 U CN216216513 U CN 216216513U CN 202122583612 U CN202122583612 U CN 202122583612U CN 216216513 U CN216216513 U CN 216216513U
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Abstract
The utility model discloses a ceramic-packaged power filter, which comprises a base and a metal sealing frame which is co-fired with the base at a high temperature into a whole; the base is a high-thermal-conductivity ceramic base which is a multilayer circuit board structure formed by ceramic layers and metal layers which are alternately arranged up and down; the top layer of the high-thermal-conductivity ceramic base is used for installing a filtering component, the middle layer is used for a power layer or a shielding layer, the bottom layer is provided with bottom layer bonding pads used for leading out ends of the filter, and each bottom layer bonding pad is electrically connected with the middle layer and the top layer through a metalized through hole. The high-density interconnection structure is simple in structure, the high-thermal-conductivity ceramic base and the metal sealing frame are co-fired at high temperature, the ceramic material and the metal material are integrated, high-density interconnection is achieved, good heat dissipation and shielding performance is achieved, the base bottom layer is provided with the bottom layer bonding pad, the high-density interconnection structure is suitable for a reflow soldering process, and the electric fitting efficiency is far higher than that of manual soldering.
Description
Technical Field
The utility model relates to the technical field of power filters, in particular to a power filter packaged by ceramics.
Background
At present, most of power filters in the industry are metal shells, circuit boards are made of resin substrates or ceramic substrates, and a small part of the power filters are made of plastic shells and circuit boards are made of resin substrates based on small-size and low-weight requirements.
The metal tube shell has a certain shielding effect and is quite widely applied to the power filter, but the combination of the metal tube shell and the circuit board needs to be finished by adopting welding, bonding and other modes, so that the process complexity is increased, and a gap exists, so that the metal tube shell cannot achieve a completely sealed shielding state; the plastic tube shell can meet the requirements of small size and low weight, but the material has a large dielectric constant, and when the material is applied to a power filter, large parasitic parameters, particularly parasitic capacitance, can be generated under a high-frequency condition, so that high-frequency noise is coupled, and the performance of the filter is influenced.
At present, a common power filter mostly adopts a pin structure, namely, pins are led out from a base in a welding or insulator mode and are used as leading-out ends of the filter, and the filter with the leading-out end mode is only suitable for manual welding and has low efficiency.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a power filter packaged by ceramics.
The utility model discloses a ceramic-packaged power filter, which comprises a base and a metal sealing frame which is co-fired with the base at a high temperature into a whole;
the base is a high-thermal-conductivity ceramic base which is a multilayer circuit board structure formed by ceramic layers and metal layers which are alternately arranged up and down;
the top layer of the high-thermal-conductivity ceramic base is used for mounting a filtering component, the middle layer is used for a power layer or a shielding layer, the bottom layer is provided with bottom bonding pads for leading out ends of the filter, and each bottom bonding pad is electrically connected with the middle layer and the top layer through a metalized through hole.
As a further improvement of the present invention, the high thermal conductivity ceramic mount includes one of an alumina ceramic mount and a silicon nitride ceramic mount.
As a further improvement of the utility model, a top layer bonding pad for welding the filter component is arranged on the top layer, a gold plating layer is arranged on the top layer bonding pad, and the thickness of the gold plating layer is 0.2-1.5 μm;
the top layer pad is electrically connected to the middle layer and the bottom layer through a metalized via.
As a further improvement of the utility model, the filter components comprise a capacitor, a resistor and an inductor.
As a further improvement of the utility model, the arrangement number of the middle layers is 2-10 layers, and the middle layers are used for power supply layers or shielding layers.
As a further improvement of the utility model, the number of the metalized through holes corresponding to each bottom bonding pad and each top bonding pad is 10-200.
As a further improvement of the utility model, the metal layer is a high-melting-point metal, and the melting point of the high-melting-point metal is not less than 1000 ℃.
As a further improvement of the utility model, the metal sealing frame is an iron-nickel alloy sealing frame, and the iron-nickel alloy sealing frame and the high-thermal-conductivity ceramic base are integrally connected through high-temperature co-firing.
Compared with the prior art, the utility model has the beneficial effects that:
the high-thermal-conductivity ceramic base is simple in structure, not only serves as a packaging shell, but also serves as a circuit board for assembling components, has an electric connection function, realizes high-density interconnection by co-firing the high-thermal-conductivity ceramic base and the metal sealing frame at high temperature and integrating a ceramic material and a metal material, has good heat dissipation and shielding properties, is suitable for a reflow soldering process by arranging the bottom layer of the base with the bottom layer of the bonding pad, and has electrical installation efficiency far higher than that of manual soldering.
Drawings
FIG. 1 is a schematic diagram of a ceramic-packaged power filter according to the present invention;
FIG. 2 is a schematic diagram of a top pad of a base of a ceramic packaged power filter according to the present invention;
FIG. 3 is a schematic diagram of the wiring of the middle layer of the base of the ceramic packaged power filter according to the present invention;
fig. 4 is a schematic diagram of a top pad of a base of a power filter of a ceramic package according to the present invention.
In the figure:
1. a metal sealing frame; 2. high thermal conductivity ceramic mount.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model is described in further detail below with reference to the attached drawing figures:
the utility model discloses a ceramic-packaged power filter, which comprises a base and a metal sealing frame 1 which is co-fired with the base at a high temperature into a whole; the base is a high-thermal-conductivity ceramic base 2, and the high-thermal-conductivity ceramic base 2 is a multilayer circuit board structure formed by ceramic layers and metal layers which are alternately arranged up and down; the top layer of the high-thermal-conductivity ceramic base 2 is used for installing a filtering component, the middle layer is used for a power layer or a shielding layer, the bottom layer is provided with bottom layer bonding pads for leading out ends of the filter, and each bottom layer bonding pad is electrically connected with the middle layer and the top layer through a metalized through hole.
The high-thermal-conductivity ceramic base 2 is simple in structure, not only serves as a packaging shell, but also serves as a circuit board for assembling components, has an electric connection function, realizes high-density interconnection by co-firing the high-thermal-conductivity ceramic base 2 and the metal sealing frame 1 at high temperature and integrating a ceramic material and a metal material, has good heat dissipation and shielding properties, is suitable for a reflow soldering process by arranging the bottom layer of the base with the bottom layer of the bonding pad, and has electrical installation efficiency far higher than that of manual soldering.
Specifically, the method comprises the following steps:
as shown in fig. 1, the high thermal conductivity ceramic base 2 of the utility model comprises one of an alumina ceramic base and a silicon nitride ceramic base, has high thermal conductivity and good heat dissipation, can meet the use requirement of high power and large current, realizes the integral connection of the high thermal conductivity ceramic base 2 and the metal sealing frame 1 by adopting a high temperature co-firing (HTCC) technology, has the characteristics of high integration, air tightness and the like, and can also plate gold on the outer layer of the metal sealing frame 1 to meet the corrosion resistance requirement of the metal sealing frame 1.
Furthermore, the metal sealing frame 1 is an iron-nickel alloy sealing frame, and the iron-nickel alloy sealing frame and the high-thermal-conductivity ceramic base 2 are integrally connected through high-temperature co-firing.
As shown in fig. 2, a top bonding pad for welding a filter component is arranged on the top layer of the filter component, a gold plating layer is arranged on the top bonding pad, and the thickness of the gold plating layer is 0.2-1.5 μm; the top layer pad is electrically connected to the middle layer and the bottom layer through a metalized via. The filter element comprises a resistor, a capacitor and an inductor, and the filtering principle is the prior art and is not described herein; the number of the metallized through holes corresponding to the top layer bonding pad is 10-200, and 10-70 are preferred in the utility model.
As shown in fig. 3, the number of the intermediate layers is 2-10, the intermediate layers can be used as power supply layers or shielding layers, the power supply layers are used for passing current, large-area metal is adopted for the layers, large sectional area is achieved, direct current resistance is reduced, and therefore heat power consumption is reduced; the shielding layer also adopts a large-area metal layer, so that the shielding effect on high-frequency space noise is realized, and the filtering performance of the filter is improved.
As shown in FIG. 4, a bottom pad is arranged on a bottom layer of the utility model and used as a leading-out terminal of a power filter, each bottom pad is electrically connected with a middle layer and a top layer through a plurality of metalized through holes, the number of the metalized through holes of the bottom pad of the utility model is 10-200, the number of the metalized through holes of the bottom pad of the utility model is preferably 10-70, and the bottom pad of the utility model can bear the input and output of 0-10A current.
Furthermore, the metal layer in the high thermal conductivity ceramic base 2 of the utility model adopts high melting point metal material, the melting point of the material is more than 1000 ℃, so as to meet the process requirement of high temperature co-firing (HTCC); the ceramic layer is used for the dielectric layer.
Furthermore, the layers in the high-thermal-conductivity ceramic base 2 are electrically connected through the metalized through holes, and the number of the metalized through holes can be adjusted according to the size of the bonding pad and current parameters, so that direct-current resistance is reduced, the requirement of large current is met, and thermal power consumption generated by current is reduced.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A ceramic-packaged power filter is characterized by comprising a base and a metal sealing frame which is co-fired with the base at a high temperature into a whole;
the base is a high-thermal-conductivity ceramic base which is a multilayer circuit board structure formed by ceramic layers and metal layers which are alternately arranged up and down;
the top layer of the high-thermal-conductivity ceramic base is used for mounting a filtering component, the middle layer is used for a power layer or a shielding layer, the bottom layer is provided with bottom bonding pads for leading out ends of the filter, and each bottom bonding pad is electrically connected with the middle layer and the top layer through a metalized through hole.
2. The ceramic packaged power filter of claim 1, wherein the high thermal conductivity ceramic base comprises one of an alumina ceramic base and a silicon nitride ceramic base.
3. The ceramic-packaged power filter according to claim 1, wherein a top pad for welding the filter component is arranged on the top layer, a gold plating layer is arranged on the top pad, and the thickness of the gold plating layer is 0.2-1.5 μm;
the top layer pad is electrically connected with the middle layer and the bottom layer through the metalized via.
4. The ceramic packaged power filter of claim 3, wherein the filter components include capacitors, resistors and inductors.
5. The ceramic-packaged power filter according to claim 3, wherein the number of the intermediate layers is 2-10, and the intermediate layers are used for power layers or shielding layers.
6. The ceramic-packaged power filter according to claim 3, wherein the number of the metalized vias corresponding to each of the bottom pad and the top pad is 10-200.
7. The ceramic packaged power filter according to claim 1, wherein the metal layer is a refractory metal having a melting point of not less than 1000 degrees.
8. The ceramic packaged power filter according to claim 1, wherein the metal sealing frame is an iron-nickel alloy sealing frame, and the iron-nickel alloy sealing frame and the high thermal conductivity ceramic base are integrally connected through high temperature co-firing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122583612.6U CN216216513U (en) | 2021-10-26 | 2021-10-26 | Power filter packaged by ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122583612.6U CN216216513U (en) | 2021-10-26 | 2021-10-26 | Power filter packaged by ceramic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216216513U true CN216216513U (en) | 2022-04-05 |
Family
ID=80889973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122583612.6U Active CN216216513U (en) | 2021-10-26 | 2021-10-26 | Power filter packaged by ceramic |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216216513U (en) |
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2021
- 2021-10-26 CN CN202122583612.6U patent/CN216216513U/en active Active
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