CN216213446U - POP packaging structure - Google Patents
POP packaging structure Download PDFInfo
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- CN216213446U CN216213446U CN202122460567.5U CN202122460567U CN216213446U CN 216213446 U CN216213446 U CN 216213446U CN 202122460567 U CN202122460567 U CN 202122460567U CN 216213446 U CN216213446 U CN 216213446U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73207—Bump and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a POP packaging structure, which comprises a first packaging body, a second packaging body and a third packaging body, wherein the first packaging body comprises a substrate surface solder ball, a base pad, a first plastic packaging body, a first wire, a first substrate, a substrate back solder ball, a substrate bottom solder ball and a first chip; the second packaging bodies comprise a second plastic packaging body, a second chip, a second wire and a second substrate, and the second packaging bodies are positioned at the top of the first packaging bodies; the metal body is arranged between the first packaging body and the second packaging body as an intermediate layer and comprises a metal sheet, and the metal sheet is attached to one surface of the plastic packaging body; the outer part is a sputtered metal layer, and the first packaging body, the plurality of second packaging bodies and the metal body are all located inside the sputtered metal layer. The utility model uses the middle layer metal sheet as an electromagnetic shielding grounding end to connect with the peripheral sputtering metal layer of the POP product, thereby achieving the electromagnetic shielding function.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a POP (package on package) structure.
Background
With the rapid development of the semiconductor industry, electronic products are miniaturized with higher density, more functions, smaller product size and smaller distance between solder balls, so that a pop (package on package) stacking structure is widely applied to the semiconductor industry. The chip packaging structure has the advantages that chips with different functions are packaged and stacked, high-density integration is achieved, the size of a packaged product is small, the performance of the product is excellent, the signal transmission frequency is high, and the like. Because whole POP packaging body packaging material uses the difference, leads to the POP product easily, in addition, along with the electronic product applies to communication field high frequency signal, so the demand product possesses electromagnetic shield structure, prevents that the electromagnetic interference phenomenon that various chips and components and parts produced each other from taking place.
Fig. 1 is a diagram of a conventional POP structure, which includes a first package and a second package, wherein 1 in the first package is a first substrate, 2 is a first chip, 3 is a base pad, 4 is a first wire, 5 is a base surface solder ball, 6 is a first plastic package, 11 is a substrate back solder ball, 12 is a substrate bottom solder ball, 7 in the second package is a second plastic package, 8 is a second wire, 9 is a second chip, and 10 is a second substrate;
the current POP structure packaging process comprises the following steps:
the first package process: base plate tin ball implantation, chip pasting, routing, encapsulation, ball implantation, laser tapping, second packaging body stacking and reflow
The second package process: chip mounting-routing-packaging-cutting
1. Implanting solder balls on the substrate: planting tin balls on the surface of the substrate by using a tin ball planting machine, and reflowing and curing the tin balls;
2. chip bonding/routing: finishing chip mounting and routing processes on the surface of the substrate;
3. and (3) encapsulation: the connected chip circuits are plastically packaged by using a plastic packaging material to play a role in protection;
4. ball planting: implanting solder balls on the back surface of the substrate by using a ball implanting machine, and reflowing and curing the solder balls;
4. laser drilling: digging a bottom substrate solder ball on the plastic package body by using a laser machine to form a hole;
5. and (3) stacking a second plastic package body: and dipping the solder balls at the bottom of the second plastic package substrate into flux by an SMT (surface mount technology) machine, stacking the solder balls in the hole digging area to combine the solder balls of the first plastic package substrate with the solder balls at the bottom of the second plastic package substrate, and finishing the POP process by reflux curing.
The prior art at present has the following defects:
in the POP packaging body in the prior art, different packaging body materials are used differently, CTE coefficients among the materials are different, and the product is easy to warp in the reflow soldering process of the product, so that bridging/false soldering between the solder balls (middle layer solder balls and bottom substrate solder balls) is caused;
secondly, in the POP packaging body in the prior art, no electromagnetic shielding layer exists between the packaging bodies and between the packaging bodies, and no electromagnetic shielding layer exists around the whole POP packaging body, so that the electromagnetic shielding effect cannot be achieved;
thirdly, in the POP packaging body in the prior art, heat energy between the packaging body and the packaging body cannot be effectively radiated, so that the performance of a product is influenced due to overhigh heat energy when the product runs;
and fourthly, in the POP packaging body in the prior art, electromagnetic shielding of a plurality of functional chips cannot be realized.
Based on this, the present invention provides a POP package structure to solve the above mentioned problems.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the utility model.
The present invention has been made in view of the above and/or problems occurring in the existing POP package structure.
Therefore, the problem to be solved by the present invention is how to provide a POP package structure.
In order to solve the technical problems, the utility model provides the following technical scheme: a POP packaging structure comprises a package substrate,
the first packaging body comprises a substrate surface tin ball, a base pad, a first plastic packaging body, a first wire line, a first substrate, a substrate back tin ball, a substrate bottom tin ball and a first chip, wherein the substrate bottom tin ball is uniformly arranged at the bottom of the first substrate, the substrate back tin ball and the first chip are arranged in the middle of the top of the first substrate, the substrate back tin ball is positioned at the rear side of the first chip, the first wire line is connected with the first chip, the substrate surface tin ball is arranged on the left side and the right side of the top of the first substrate, the base pad is arranged on the substrate surface tin ball and the substrate back tin ball, the first plastic packaging body is positioned at the top of the first substrate, and the substrate surface tin ball, the substrate back tin ball, the first chip and the first wire line are all positioned in the first plastic packaging body;
the second packaging bodies comprise a second plastic packaging body, a second chip, a second wire and a second substrate, the second packaging body is positioned at the top of the first packaging body, the second plastic packaging body is positioned at the top of the second substrate, the second wire is connected with the second chip, and the second wire and the second chip are both positioned inside the second plastic packaging body;
the metal body is arranged between the first packaging body and the second packaging body as an intermediate layer and comprises a metal sheet, and the metal sheet is attached to one surface of the plastic packaging body;
the outer part is a sputtered metal layer, and the first packaging body, the plurality of second packaging bodies and the metal body are all located inside the sputtered metal layer.
As a preferred scheme of the POP package structure of the present invention, wherein: the top of the metal sheet is provided with a plurality of functional area metal columns, and when a plurality of packaging bodies such as a second packaging body are pasted, the effect of isolating different functional chip areas is achieved, and partitioned electromagnetic shielding is achieved.
As a preferred scheme of the POP package structure of the present invention, wherein: and a laser opening area is arranged on the metal sheet, and the laser digs out the solder ball at the bottom of the substrate through the laser opening area to form a hole on the plastic package body.
As a preferred scheme of the POP package structure of the present invention, wherein: the laser opening area is provided with a metal bulge, and when the second packaging body is stacked, the solder balls at the bottom of the substrate and the solder balls on the surface of the substrate are in solder ball welding to contact with the metal bulge, so that the grounding end is connected, and the electromagnetic shielding is realized.
The utility model has the beneficial effects that:
firstly, the middle layer metal sheet plays a supporting role, so that the warping of the substrate is reduced, and the bridging and the insufficient soldering of the solder balls are reduced.
And secondly, connecting the periphery of the POP product with a sputtering metal layer by using the middle layer metal sheet as an electromagnetic shielding grounding end to achieve the electromagnetic shielding function.
And thirdly, reserving metal bulges in the laser opening area on the middle layer metal sheet to ensure that the grounding end of the solder ball is connected with the metal sheet, and the solder ball of the substrate is connected with the solder ball on the back of the substrate to ensure that the upper and lower packaging body products are connected with the ground.
Fourthly, the metal sheet is added through the middle layer, the heat conduction function conducts the heat inside the middle to the peripheral metal sputtering layer, and the heat dissipation function is achieved.
Fifthly, the metal sheet is used as an isolation layer to achieve different functions of POP product electromagnetic shielding.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise. Wherein:
fig. 1 is a schematic diagram of a conventional POP structure;
fig. 2 is a schematic diagram of a POP package structure according to the present invention;
FIG. 3 is a schematic diagram showing the position of the laser via region and the metal bump on the metal sheet according to the present invention;
in the drawings, the components represented by the respective reference numerals are listed below:
100. a first package body; 101. solder balls are arranged on the surface of the substrate; 102. a base pad; 103. a plastic package body I; 104. a wire I; 105. a first substrate; 106. solder balls are arranged on the back of the substrate; 107. solder balls are arranged at the bottom of the substrate; 108. a first chip;
200. a second package body; 201. a second plastic package body; 202. a second chip; 203. a wire II; 204. a second substrate;
300. a metal body; 301. a functional region metal pillar; 302. a metal sheet; 3021. laser perforating area; 3022. and (4) a metal bump.
400. An outer member; 401. and sputtering a metal layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the utility model. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Example 1
Referring to fig. 2, a POP package structure includes,
the first package body 100, the first package body 100 includes a substrate surface solder ball 101, a basic pad102, a first plastic package body 103, a first wire line 104, a first substrate 105, a substrate back solder ball 106, a substrate bottom solder ball 107 and a first chip 108, the substrate bottom solder ball 107 is uniformly disposed at the bottom of the first substrate 105, the substrate back solder ball 106 and the first chip 108 are disposed in the middle of the top of the first substrate 105, the substrate back solder ball 106 is located at the rear side of the first chip 108, the first wire line 104 is connected with the first chip 108, the substrate surface solder balls 101 are disposed on the left and right sides of the top of the first substrate 105, the basic pad102 is disposed on the substrate surface solder ball 101 and the substrate back solder ball 106, the first plastic package body 103 is located at the top of the first substrate 105, and the substrate surface solder ball 101, the substrate back solder ball 106, the first chip 108 and the first wire line 104 are all located inside the first plastic package body 103;
the second packaging bodies 200 comprise second plastic packaging bodies 201, second chips 202, second wire lines 203 and second substrates 204, the second packaging bodies 200 are located at the tops of the first packaging bodies 100, the second plastic packaging bodies 201 are located at the tops of the second substrates 204, the second wire lines 203 are connected with the second chips 202, and the second wire lines 203 and the second chips 202 are located inside the second plastic packaging bodies 201;
the metal body 300 is arranged between the first packaging body 100 and the second packaging body 200 as an intermediate layer, the metal body 300 comprises a metal sheet 302, and the metal sheet 302 is attached to the surface of the first plastic packaging body 103 to play a supporting role, so that the warpage of the substrate is reduced, and the bridging and the cold joint of the solder balls are reduced;
the outer part 400 is a sputtered metal layer 401, the first package body 100, the plurality of second package bodies 200 and the metal body 300 are all located inside the sputtered metal layer 401, and the metal sheet 302 is connected when the POP product is sputtered on the metal layer on the periphery, reaches the electromagnetic shielding and conducts heat energy to the periphery.
Example 2
Based on embodiment 1, please refer to fig. 2 and fig. 3, the present invention provides another technical solution: a plurality of functional area metal posts 301 are arranged on the top of a metal sheet 302, and when a plurality of packaging bodies such as a second packaging body 200 are mounted, the function of isolating different functional chip areas is achieved, and partitioned electromagnetic shielding is achieved.
The metal sheet 302 is provided with a laser opening area 3021, and the solder balls 107 at the bottom of the substrate are dug out by laser through the laser opening area 3021 to form a hole for placing the solder ball on the plastic package body.
The laser opening area 3021 is provided with a metal protrusion 3022, and when the second package body 200 is stacked, the solder ball 107 at the bottom of the substrate contacts the metal protrusion 3022 when being soldered to the solder ball 101 on the surface of the substrate, so as to reach the ground terminal for connection and achieve electromagnetic shielding.
The improved SIP-Hybrid chip packaging process comprises the following steps:
the first package process: base plate tin ball implantation, chip bonding, routing, encapsulation, metal sheet mounting, ball implantation, laser tapping, second packaging body stacking, backflow and metal layer sputtering
The second package process: chip mounting-routing-packaging-cutting
1) Implanting solder balls on the substrate: planting tin balls on the surface of the substrate by using a tin ball planting machine, and reflowing and curing the tin balls;
2) chip bonding/routing: finishing chip mounting and routing processes on the surface of the substrate;
3) and (3) encapsulation: the connected chip circuits are plastically packaged by using a plastic packaging material to play a role in protection;
4) and (3) metal sheet mounting: a machine is utilized to mount a metal sheet, so that supporting operation and electromagnetic shielding are achieved, and the metal column achieves a chip isolation function area;
5) ball planting: implanting solder balls on the back surface of the substrate by using a ball implanting machine, and reflowing and curing the solder balls;
6) laser drilling: digging tin balls on the surface of the grooved substrate on the plastic package body by using a laser machine according to the tin ball area of the metal sheet opening to form a hole;
7) and (3) stacking a second plastic package body: dipping the solder balls at the bottom of the second plastic package substrate into flux by an SMT machine, stacking the solder balls in the hole digging area to combine the solder balls of the first plastic package substrate with the solder balls at the bottom of the second plastic package substrate, and performing reflux curing;
8) sputtering a metal layer: and sputtering the peripheral metal layer again on the cured POP to connect the middle metal sheet with the peripheral metal layer so as to achieve electromagnetic shielding.
A novel electromagnetic shielding POP manufacturing method comprises the following specific steps:
the method comprises the following steps: firstly, the metal sheet 302 is attached to the surface of the first plastic package body 103;
step two: performing laser hole digging to leak the bottom solder balls;
step three: mounting a plurality of packages such as a second package 200, and completing the welding of the solder balls 107 at the bottom of the substrate and the solder balls 101 on the surface of the substrate to complete the POP stacking;
step four: and finishing the connection of the POP peripheral sputtering metal layer 401 and the metal sheet 302.
One specific application of this embodiment is: the POP packaging structure is reasonable in structural design, and the intermediate layer metal sheet 302 plays a supporting role, so that the substrate warpage is reduced, and the solder ball bridging and the cold solder joint are reduced; the middle layer metal sheet 302 is used as an electromagnetic shielding grounding end and is connected with the peripheral sputtering metal layer 401 of the POP product to achieve the electromagnetic shielding function; the metal bump 3022 in the laser opening area 3021 is reserved in the middle layer metal sheet 302 to connect the solder ball grounding end with the metal sheet 302, and connect the substrate solder ball with the substrate back solder ball 106 to connect the upper and lower package products to ground; the metal sheet 302 is added in the middle layer, so that the heat conduction function is used for conducting the heat in the middle to the peripheral metal sputtering layer 401, and the heat dissipation function is achieved; the metal sheet 302 is used as an isolating layer to achieve electromagnetic shielding of POP products with different functions.
Substrate pad notes: the substrate is a basic material for manufacturing the PCB, generally, the substrate is a Copper Clad Laminate, and in the manufacturing process of the single-sided and double-sided printed boards, hole machining, chemical Copper plating, Copper electroplating, etching and other machining are selectively carried out on a substrate material-Copper Clad Laminate (CCL) to obtain a required circuit pattern; the pad is called a bonding pad and is divided into a pin bonding pad and a surface-mounted bonding pad; the pin bonding pad is provided with a welding hole and is mainly used for welding pin elements; the surface-mounted bonding pad is not provided with a welding hole and is mainly used for welding a surface-mounted element.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (4)
1. A POP packaging structure is characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the first packaging body (100), the first packaging body (100) comprises a substrate surface solder ball (101), a basic pad (102), a plastic packaging body I (103), a wire I (104), a substrate I (105), a substrate back solder ball (106), a substrate bottom solder ball (107) and a chip I (108), the substrate bottom solder ball (107) is uniformly arranged at the bottom of the substrate I (105), the substrate back solder ball (106) and the chip I (108) are arranged in the middle of the top of the substrate I (105), the substrate back solder ball (106) is positioned at the rear side of the chip I (108), the wire I (104) is connected with the chip I (108), the substrate surface solder ball (101) is arranged on the left side and the right side of the top of the substrate I (105), the basic pad (102) is arranged on the substrate surface solder ball (101) and the substrate back solder ball (106), and the plastic packaging body I (103) is positioned at the top of the substrate I (105), the solder balls (101) on the surface of the substrate, the solder balls (106) on the back of the substrate, the first chip (108) and the first wire (104) are all positioned in the first plastic package body (103);
the second packaging bodies (200) comprise a second plastic packaging body (201), a second chip (202), a second wire (203) and a second substrate (204), the second packaging bodies (200) are located at the top of the first packaging body (100), the second plastic packaging body (201) is located at the top of the second substrate (204), the second wire (203) is connected with the second chip (202), and the second wire (203) and the second chip (202) are both located inside the second plastic packaging body (201);
the metal body (300) is arranged between the first packaging body (100) and the second packaging body (200) as an intermediate layer, the metal body (300) comprises a metal sheet (302), and the metal sheet (302) is attached to the surface of the first plastic packaging body (103);
an outer part (400) which is a sputtered metal layer (401), wherein the first packaging body (100), the plurality of second packaging bodies (200) and the metal body (300) are all positioned inside the sputtered metal layer (401).
2. The POP package structure of claim 1, wherein: the top of the metal sheet (302) is provided with a plurality of functional area metal columns (301).
3. The POP package structure of claim 1, wherein: the metal sheet (302) is provided with a laser opening area (3021).
4. The POP package structure of claim 3, wherein: the laser opening region (3021) is provided with a metal bump (3022).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122460567.5U CN216213446U (en) | 2021-10-13 | 2021-10-13 | POP packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122460567.5U CN216213446U (en) | 2021-10-13 | 2021-10-13 | POP packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216213446U true CN216213446U (en) | 2022-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122460567.5U Active CN216213446U (en) | 2021-10-13 | 2021-10-13 | POP packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN216213446U (en) |
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2021
- 2021-10-13 CN CN202122460567.5U patent/CN216213446U/en active Active
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