CN216213364U

CN216213364U - Wafer fixing device

Info

Publication number: CN216213364U
Application number: CN202122636576.5U
Authority: CN
Inventors: 赵廷刚; 林志东; 陈家诚
Original assignee: Quanzhou San'an Integrated Circuit Co ltd
Current assignee: Quanzhou San'an Integrated Circuit Co ltd
Priority date: 2021-10-29
Filing date: 2021-10-29
Publication date: 2022-04-05
Anticipated expiration: 2031-10-29

Abstract

The utility model discloses a wafer fixing device, which comprises a support plate and a clamp mechanism arranged on the support plate; the carrier plate is provided with a circular groove for accommodating the wafer, and the clamp mechanism is arranged outside the circular groove; the clamp mechanism comprises a strip-shaped clamping piece, an elastic piece, a supporting rod and a limiting piece; the support plate is provided with a guide groove, the bottom end of the support rod is in guide connection with the guide groove, the top end of the support rod is connected with the middle part between the two ends of the strip-shaped clamping piece through a rotating shaft, and the limiting part is matched with the support rod and the guide groove to adjust the distance between the middle part of the strip-shaped clamping piece and the support plate; the strip-shaped clamping piece is characterized in that one end of the strip-shaped clamping piece is a pressing end, the elastic piece is abutted between the pressing end and the support plate, the other end of the strip-shaped clamping piece is bent downwards to form a contact end, the contact end can be operated to fix a wafer through the pressing end, the wafer can be efficiently and quickly taken and placed, the operation is convenient, the pressure of the wafer can be adjusted, and the universality is high.

Description

Wafer fixing device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer fixing device.

Background

With the development of the semiconductor industry, wafers are used as basic materials for manufacturing semiconductor chips, and various chips can be manufactured by processing the wafers, so that the requirements of different consumers are met. Therefore, the processing and manufacturing of wafers is always the core area of research. The evaporation process related to the semiconductor production process is that a wafer is placed on an evaporation machine disc for rotary evaporation, and due to the existence of centrifugal force during rotation, the wafer has the risk of being thrown out of the disc. To avoid this risk, a wafer fixture is typically provided. The existing fixing device adopts a spring plate structure, one end of the spring plate is connected to a disc carrier plate, the other end of the spring plate is bent and fluctuated and then pressed downwards to fix a wafer, and the structure has the following defects: 1) the pulling elastic sheet is required to be grabbed to be close to the fluctuated part of the wafer to pick and place the wafer, the operation is inconvenient, and the surface of the wafer is easy to scratch; 2) the pressure of the wafer with different thicknesses is difficult to adjust, the universality is poor, and particularly for the wafer with a brittle texture such as GaAs, the surface of the wafer is easy to scratch, and even the wafer is cracked due to excessive pressure.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects in the prior art and provides a wafer fixing device.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a wafer fixing device comprises a support plate and a clamp mechanism arranged on the support plate; the carrier plate is provided with a circular groove for accommodating the wafer, and the clamp mechanism is arranged outside the circular groove; the clamp mechanism comprises a strip-shaped clamping piece, an elastic piece, a supporting rod and a limiting piece; the support plate is provided with a guide groove, the bottom end of the support rod is arranged in the guide groove and forms guide connection, the top end of the support rod is connected with the middle part between two ends of the strip-shaped clamping piece through a rotating shaft, and the limiting piece is matched with the support rod and the guide groove to adjust the distance between the middle part of the strip-shaped clamping piece and the support plate; one end of the strip-shaped clamping piece is a pressing end, the elastic piece is abutted between the pressing end and the support plate, and the other end of the strip-shaped clamping piece is bent downwards to form a contact end.

Optionally, at least a partial region of the supporting rod is provided with a thread, the limiting members are two nuts in threaded connection with the supporting rod, the two nuts are respectively located above and below the carrier plate, and the width of the two nuts is greater than that of the guide groove.

Optionally, the guide groove is an arc-shaped groove, and a circle center point of the arc-shaped groove is correspondingly located below the elastic part; the contact end of the strip-shaped clamping piece is driven by the support rod to enter or leave the upper part of the circular groove along the movement of the guide groove.

Optionally, the clamping device further comprises a support shaft, and the pressing end of the strip-shaped clamping piece is rotatably sleeved on the support shaft; the elastic piece is a spring and is sleeved outside the supporting shaft.

Optionally, the support plate is further provided with a protruding portion, the protruding portion is provided with a groove matched with the support shaft, and the spring abuts against the lower surface of the strip-shaped clamping piece and the top surface of the protruding portion.

Optionally, the pressing device further comprises an operation pressing sheet, the operation pressing sheet is arranged on the pressing end of the strip-shaped clamping sheet, the operation pressing sheet is arranged in parallel with the strip-shaped clamping sheet, one end of the operation pressing sheet is bent and fixed with the strip-shaped clamping sheet, and the other end of the operation pressing sheet extends out of the pressing end of the strip-shaped clamping sheet.

Optionally, the strip-shaped clamping piece has a straight area, a downward bending area and an upward bending area which are sequentially arranged, the pressing end and the middle part are located in the straight area, and the contact end is located in the upward bending area.

Optionally, the upward bending region and the part of the downward bending region connected with the upward bending region have a plurality of hollowed-out patterns arranged in parallel.

Optionally, three clamp mechanisms are arranged along the periphery of the circular groove at equal intervals.

Optionally, the circular groove has an annular step.

The utility model has the beneficial effects that:

(1) the wafer can be effectively fixed, and the risk that the wafer is thrown away due to centrifugal force during operations such as rotary evaporation and the like is avoided;

(2) the wafer can be taken and placed efficiently and quickly, the structure is stable, and the operation is convenient;

(3) the adjustable pressure to the wafer size is applicable to the fixed wafer of different thickness and different materials, and the universality is strong.

Drawings

FIG. 1 is a schematic front view illustrating an overall structure of a wafer fixing device according to an embodiment;

FIG. 2 is a schematic view of the backside of the wafer fixing device according to an embodiment;

FIG. 3 is a schematic view of the overall structure of the clamping mechanism;

FIG. 4 is an exploded view of the clamping mechanism;

fig. 5 is a schematic structural view of a clamp mechanism according to another embodiment.

Detailed Description

The utility model is further explained below with reference to the figures and the specific embodiments.

Referring to fig. 1 to 4, a wafer fixing apparatus includes a carrier plate 1 and a clamping mechanism 2 disposed on the carrier plate 1. The carrier plate is provided with a circular groove 11 for accommodating the wafer, and the clamp mechanism 2 is arranged outside the circular groove 11. The clamping mechanism 2 includes a bar-shaped clamping piece 21, an elastic piece 22, a supporting rod 23 and a limiting piece 24. The support plate 1 is provided with a guide groove 12, the bottom end of the support rod 23 is arranged in the guide groove 12 and forms guide connection, the top end of the support rod is connected with the middle part between two ends of the strip-shaped clamping piece 21 through a rotating shaft 25, and the limiting part 24 is matched with the support rod 23 and the guide groove 12 to adjust the distance between the middle part of the strip-shaped clamping piece 21 and the support plate 1. One end of the strip-shaped clamping piece 21 is a pressing end 21a, the elastic piece 22 is abutted between the pressing end 21a and the carrier plate 1, and the other end of the strip-shaped clamping piece 21 extends downwards to form a contact end 21 b. Therefore, the two ends of the bar-shaped clamping piece 21 swing up and down by taking the supporting rod 23 as a fulcrum, the contact end 21b tilts by applying force to the pressing end 21a and compressing the elastic piece 22, the supporting rod 23 slides along the guide groove 12 to drive the contact end 21b to enter the upper part of the circular groove 11, the force applied to the pressing end 21a is released, and the elastic piece 22 releases the elastic force to press the contact end 21b downwards, so that the purpose of fixing the wafer can be achieved.

Specifically, at least a partial region of the supporting rod 23 is provided with a thread 23a, the limiting parts 24 are two nuts in threaded connection with the supporting rod 23, the bottom of the supporting rod 23 penetrates through the guide groove 12, the two nuts (the limiting parts 24) are respectively positioned above and below the support plate 1, the width of each nut is larger than that of the guide groove 12, so that the support plate 1 is clamped up and down to fix the supporting rod 23 and the support plate 1 in the vertical direction, the length of the supporting rod 23 above the support plate 1 can be adjusted by adjusting the connection between the two nuts and the supporting rod 23, the distance between the strip-shaped clamping pieces 21 and the support plate 1 is adjusted to adjust the elasticity of the elastic part 22, and finally the contact force of the wafer pressed by the contact end 21b is adjusted, so that the wafer pressing device is suitable for wafers with different thicknesses and different materials.

The guide slot 12 is an arc-shaped slot, and the center point of the arc-shaped slot is correspondingly located below the elastic element 22, that is, the bar-shaped clamping piece 21 horizontally rotates with the pressing end 21a as a circular point, and the contact end 21b of the bar-shaped clamping piece horizontally rotates along the inner movement of the guide slot 12 by the supporting rod 23 and enters or leaves the upper part of the circular slot 11. Through the setting of arc wall, the stable level in route is rotated can be realized to the bar clamping piece, is convenient for control the position of contact end 21 b.

The elastic member 22 is preferably a spring, and is sleeved on a supporting shaft 26, and the pressing end 21a of the clip strip 21 is rotatably sleeved on the top end of the supporting shaft 26, and is rotatably connected with the supporting shaft 26 through a nut 27 to limit the clip strip 21 from being separated from the supporting shaft 26. Still be equipped with bellying 13 on the support plate 1, bellying 13 is equipped with the recess 131 with back shaft 26 complex, and elastic component 22 butt is between the lower surface of bar clamping piece 21 and the top surface of bellying 13, along with elastic component 22 compression and expansion, back shaft 26 bottom stretches into or leaves recess 131 to make elastic component 22 have stable flexible route, and form good cooperation between and the bar clamping piece, avoid taking place unnecessary removal and shake.

In addition, the pressing end 21a may further be provided with an operation pressing piece 28, the operation pressing piece 28 is parallel to the strip-shaped clamping piece 21, and one end of the operation pressing piece 28 is bent and fixed with the strip-shaped clamping piece 21, and the other end of the operation pressing piece extends out of the pressing end of the strip-shaped clamping piece 21. The operation of the pressing piece 28 as a handle can achieve more convenient and faster operation.

The strip-shaped clamping piece 21 has a flat area 211, a downward bending area 212 and an upward bending area 213 arranged in sequence, the pressing end 21a and the middle part are located in the flat area 211, the contact end 21b is located in the upward bending area 213, the upward bending area 213 is contacted with the surface of the wafer when the wafer is fixed, and applies a downward pressure to the wafer to limit the wafer from moving up and down. The bar-shaped clamping pieces 21 and the supporting rod 23 can be connected by the rotation of the rotating shaft 25, for example, the bottom surface of the middle part of the bar-shaped clamping pieces 21 is provided with a connecting part 214, the connecting part 214 can be inserted into the top end of the supporting rod 23, the rotating shaft 25 passes through the connecting part 214 and the supporting rod 23, and the like, so that the up-and-down swinging of the two ends is realized by taking the supporting rod 23 as a fulcrum. When a wafer needs to be fixed, the contact end 21b is tilted by pressing the operation pressing sheet 28 downwards, then the strip-shaped clamping piece 21 is rotated until the contact end 21b reaches the edge of the wafer, the applied external force is released, and the elastic piece 22 releases the elastic force to press the contact end 21b downwards to be in contact with the surface of the wafer, so that the purpose of fixing can be achieved; when the wafer needs to be taken down, the contact end 21b is tilted by pressing the operation pressing sheet 28 downwards, and then the strip-shaped clamping sheet 21 is rotated until the contact end 21b leaves the wafer, so that the wafer taking action can be executed, and the operation is simple and efficient.

Referring to the drawings, in another embodiment, the upward bending region 213 and the portion of the downward bending region 212 connected to the upward bending region have a plurality of hollow patterns 214 arranged in parallel, so that the ends of the strip-shaped clamping pieces 21 form a spacer structure, thereby reducing the contact area between the strip-shaped clamping pieces 21 and the wafer, sharing the pressure, and further avoiding the damage to the wafer.

The circular groove 11 is provided with an annular step, and the wafer is arranged on the annular step, so that the limit is realized through the side wall of the annular step, and the horizontal movement of the wafer is avoided. Three fixture mechanisms 2 are preferably arranged at equal intervals along the periphery of the circular groove 11, the included angle between every two fixture mechanisms is 120 degrees, the three areas with equal distances from the surface are limited, and the wafer is prevented from moving vertically. The arrangement of the structure can effectively fix the wafer, and the risk that the wafer is thrown out due to the centrifugal force during the operations such as rotary evaporation and the like is avoided.

The above embodiments are only used to further illustrate the wafer fixing device of the present invention, but the present invention is not limited to the embodiments, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention fall within the protection scope of the technical solution of the present invention.

Claims

1. A wafer fixing device is characterized in that: comprises a carrier plate and a clamp mechanism arranged on the carrier plate; the carrier plate is provided with a circular groove for accommodating the wafer, and the clamp mechanism is arranged outside the circular groove; the clamp mechanism comprises a strip-shaped clamping piece, an elastic piece, a supporting rod and a limiting piece; the support plate is provided with a guide groove, the bottom end of the support rod is arranged in the guide groove and forms guide connection, the top end of the support rod is connected with the middle part between two ends of the strip-shaped clamping piece through a rotating shaft, and the limiting piece is matched with the support rod and the guide groove to adjust the distance between the middle part of the strip-shaped clamping piece and the support plate; one end of the strip-shaped clamping piece is a pressing end, the elastic piece is abutted between the pressing end and the support plate, and the other end of the strip-shaped clamping piece is bent downwards to form a contact end.

2. The wafer fixture device of claim 1, wherein: at least partial region of branch is equipped with the screw thread, the locating part be with branch threaded connection's two nuts, two nuts are located respectively the top and the below of support plate and width all are greater than the guide way.

3. The wafer fixture device of claim 1, wherein: the guide groove is an arc-shaped groove, and the circle center point of the arc-shaped groove is correspondingly positioned below the elastic part; the contact end of the strip-shaped clamping piece is driven by the support rod to enter or leave the upper part of the circular groove along the movement of the guide groove.

4. The wafer fixture device of claim 1, wherein: the pressing end of the strip-shaped clamping piece is rotatably sleeved on the supporting shaft; the elastic piece is a spring and is sleeved outside the supporting shaft.

5. The wafer fixture device of claim 4, wherein: still be equipped with the bellying on the support plate, the bellying be equipped with back shaft complex recess, the spring butt in the lower surface of bar clamping piece with between the top surface of bellying.

6. The wafer fixture device of claim 1, wherein: still include an operation preforming, the operation preforming is located the pressing of bar clamping piece is served, and is fixed with bar clamping piece parallel arrangement and one end is buckled, and the other end extends to outside the pressing end of bar clamping piece.

7. The wafer fixture device of claim 1, wherein: the strip-shaped clamping piece is provided with a straight area, a downward bending area and an upward bending area which are sequentially arranged, the pressing end and the middle part are located in the straight area, and the contact end is located in the upward bending area.

8. The wafer fixture device of claim 7, wherein: the upward bending area and the part of the downward bending area connected with the upward bending area are provided with a plurality of hollowed-out patterns which are arranged in parallel.

9. The wafer fixture device of claim 1, wherein: and three clamp mechanisms are arranged along the periphery of the circular groove at equal intervals.

10. The wafer fixture device of claim 1, wherein: the circular groove has an annular step.