CN216212617U

CN216212617U - NTC thermistor

Info

Publication number: CN216212617U
Application number: CN202122338588.XU
Authority: CN
Inventors: 陈计好; 刘刚; 张薇
Original assignee: Beijing Ruidaxin Integrated Circuit Design Co ltd
Current assignee: Beijing Ruidaxin Integrated Circuit Design Co ltd
Priority date: 2021-09-26
Filing date: 2021-09-26
Publication date: 2022-04-05
Anticipated expiration: 2031-09-26

Abstract

The utility model provides an NTC thermistor, which comprises an NTC thermistor element and a shell, wherein the shell comprises a first shell and a second shell, the first shell and the second shell are respectively provided with a mounting surface facing each other, and each mounting surface is provided with a mounting cavity; the shell is provided with a through hole; the mounting surface of the first shell is provided with a connecting mechanism, so that the first shell and the second shell form non-detachable connection, and the two mounting cavities are enclosed to form a cavity; the bottom of the cavity is provided with a buffer mechanism which comprises a first supporting structure and a second supporting structure which are connected in a sliding mode along the vertical direction, and a first elastic element is arranged between the first supporting structure and the second supporting structure; the first support structure is provided with a first positioning hole, and the second support structure is provided with a second positioning hole; the NTC thermistor chip is located the top of buffer gear, and the pin stretches out through first locating hole, second locating hole and through-hole in proper order. The utility model solves the technical problems that the shell is difficult to assemble, the pins are easy to fall off when the shell is collided by external force, and the like.

Description

NTC thermistor

Technical Field

The utility model belongs to the technical field of thermistors, and particularly relates to an NTC thermistor.

Background

A thermistor is a sensor resistance whose resistance value changes with changes in temperature. The thermistor is classified into a PTC (Positive Temperature Coefficient) thermistor and an NTC (Negative Temperature Coefficient) thermistor according to a Temperature Coefficient. The NTC thermistor is a semiconductor resistor with resistance values varying in opposite trend with temperature and with great variation rate. Compared with a semiconductor integrated temperature sensor, the NTC thermistor has the characteristics of wide temperature measurement range, convenience in use, low price and the like; compared with a platinum thermistor or thermocouple, the NTC thermistor has the characteristics of high sensitivity, simple circuit and low cost, and therefore, has wide application in the aspects of temperature control, temperature compensation, temperature measurement and the like.

The conventional NTC thermistor is mainly mounted by directly welding pins onto a circuit board. When the NTC thermistor is impacted or vibrated, the NTC thermistor drags the pins, which easily causes the pins to fall off the circuit board. In view of the above problems, the conventional solution is to provide the NTC thermistor with a protective case, but other problems are easily derived. For example, chinese patent CN212748102U discloses an anti-falling NTC thermistor temperature sensor, the anti-falling structure of which includes a buffer disc and a spring wire, the buffer disc is stressed to stretch the spring wire, the spring wire protects two leads, and the problem that the ends of two sets of leads are stressed too much and fall off from the joint between the two sets of leads and the sensor body is avoided. However, the following problems occur in the practical use process of the scheme: because the shell is of an integral structure, workers are time-consuming and labor-consuming when assembling the shell and the NTC thermistor, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model provides the NTC thermistor to solve the technical problems that the NTC thermistor is difficult to assemble and is easy to fall off when being collided by external force and the like.

The NTC thermistor comprises an NTC thermistor element 12 and a shell, wherein the NTC thermistor element comprises an NTC thermistor chip and pins which are electrically connected, the shell comprises a first shell 1 and a second shell 2, the first shell 1 and the second shell 2 are respectively provided with a mounting surface facing each other, and a mounting cavity 3 is formed in the mounting surface; the shell is provided with a through hole;

a connecting mechanism is arranged on the mounting surface of the first shell 1, and the connecting mechanism comprises a positioning plate 6 fixedly connected to the mounting surface of the first shell 1; a connecting groove is formed in the mounting surface of the second shell 2, the connecting mechanism is embedded into the connecting groove, so that the first shell 1 and the second shell 2 are connected in a non-detachable mode, and the two mounting cavities 3 are enclosed to form a cavity;

the bottom of the cavity is provided with a buffer mechanism, the buffer mechanism comprises a first support structure and a second support structure which are connected in a sliding mode along the vertical direction, a first elastic element is arranged between the first support structure and the second support structure, and the first elastic element is compressed or stretched when the first support structure and the second support structure are close to or far away from each other, wherein the first support structure is provided with a first positioning hole 7, and the second support structure is provided with a second positioning hole 14; the NTC thermistor chip is positioned at the top of the buffer mechanism, and the pins sequentially extend out of the first positioning hole 7, the second positioning hole 14 and the through hole.

In a specific possible embodiment, the first support structure is a first support box 9, the second support structure is a second support box 8, and the first elastic element is a first compression spring 13; the first supporting box 9 comprises a top plate and side plates, and a space enclosed by the top plate and the side plates is opened towards the second supporting box 8; the second supporting box 8 comprises a bottom plate and side plates, and a space formed by enclosing the bottom plate and the side plates is opened towards the first supporting box 9; the two ends of the first compression spring 13 are respectively connected with the top plate and the bottom plate, and the pins penetrate through the first compression spring 13.

In a specific embodiment, in the first supporting box 9 and the second supporting box 8, a sliding groove is provided on a side plate of one of the supporting boxes, and the other side plate is inserted into the sliding groove.

In a specific embodiment, in the first supporting box 9 and the second supporting box 8, the opening end of the sliding groove formed in one side plate has a limit edge, so that the opening width is smaller than the inner width of the sliding groove, the top of the other side plate has a protrusion, and the width of the protrusion is larger than the width of the opening.

In a specific embodiment, the first support structure is an upper cover plate, the second support structure is a lower cover plate, and the first elastic element is an elastic shock pad; the elastic shock pad is provided with a hole for the pin to pass through.

In a specific embodiment, the top surface of the positioning plate 6 is flush with the bottom surface of the mounting cavity 3, and the buffer mechanism is fixed on the positioning plate 6 and is lapped on the bottom surface of the mounting cavity 3;

alternatively, the top surface of the positioning plate 6 is lower than the bottom surface of the mounting chamber 3, and the buffer mechanism is fixed to the bottom surface of the mounting chamber 3.

In a specific embodiment, the connecting mechanism further comprises a positioning block 4 fixed on the top of the positioning plate 6; the top of the positioning block 4 is provided with a spring groove 15, a second compression spring 17 is arranged in the spring groove 15, and the top end of the second compression spring 17 is fixedly connected with a fixing rod 5;

the connecting groove comprises a positioning groove 16 for inserting the positioning plate 6, a moving groove 19 communicated with the positioning groove 16, and a fixing groove 18 respectively communicated with the positioning groove 16 and the moving groove 19; during the process of inserting the positioning plate 6 into the positioning slot 16, the positioning block 4 moves towards the inside of the moving slot 19, the side wall of the moving slot 19 presses the second compression spring 17 through the fixing rod 5, and the second compression spring 17 is released when the positioning block 4 enters the fixing slot 18.

In a particular possible embodiment, the longitudinal section of the moving groove 19 is trapezoidal.

In a specific possible embodiment, the first housing 1 and the second housing 2 are each a quarter sphere.

In a specific possible embodiment, the top of the damping mechanism and/or the inner wall of the installation chamber 3 is provided with a damping layer.

Compared with the prior art, the NTC thermistor provided by the utility model has the following beneficial effects:

the housing of the NTC thermistor is arranged into a splicing type mounting structure of the first housing and the second housing, so that the assembly is convenient; the impact force of the NTC thermistor element when the shell is collided by external force is relieved by arranging the buffer mechanism, so that the pin falling of the NTC thermistor element is avoided to a certain extent.

When the shell slightly moves in the vertical direction due to collision, the first compression spring is compressed to buffer collision impact force; and the buffer layer also can protect the NTC thermistor element, prevents the condition that the damage appears when the NTC thermistor element drives the second supporting box to move, and then makes the NTC thermistor element can obtain better protection, improves the life of device.

And thirdly, the first shell and the second shell are spliced into a hemisphere shape, so that impact force from all directions can be dispersed when the first shell and the second shell are impacted by external force, the pins of the NTC thermistor element are prevented from being separated from the circuit board due to overlarge impact to a certain extent, and the NTC thermistor is protected.

(IV) set up to the inclined plane and set up the top of dead lever into the hemisphere through the upper surface with the shifting chute, reduced the frictional force between dead lever and the shifting chute, reduce the dead condition of mechanical card to a certain extent to the device appearance, make that the staff can be more smooth splice first shell and second shell.

Drawings

Fig. 1 is a schematic view of an overall structure of an NTC thermistor provided by the present invention;

fig. 2 is a schematic view of a first housing structure of an NTC thermistor provided by the present invention;

FIG. 3 is a schematic view of a buffering mechanism of an NTC thermistor according to the present invention;

fig. 4 is a schematic diagram of a positioning block splicing plane structure of the NTC thermistor provided by the present invention.

Description of reference numerals: the structure comprises a first shell 1, a second shell 2, a mounting cavity 3, a positioning block 4, a fixing piece 5, a positioning plate 6, a first positioning hole 7, a second supporting box 8, a first supporting box 9, a buffer layer 10, pins 11, a 12NTC thermistor element 13, a first compression spring 13, a second positioning hole 14, a spring groove 15, a positioning groove 16, a second compression spring 17, a fixing groove 18 and a moving groove 19.

Detailed Description

The present invention will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Referring to fig. 1 to 4, an NTC thermistor according to an embodiment of the present invention includes an NTC thermistor element 12 and a case, where the NTC thermistor element 12 includes a pin 11, the case includes a first case 1 and a second case 2, the first case 1 and the second case 2 have mounting surfaces facing each other, and each mounting surface has a mounting cavity 3; the housing is provided with a through hole through which the lead 11 of the NTC thermistor element 12 protrudes.

A connecting mechanism is arranged on the mounting surface of the first shell 1, and the connecting mechanism comprises a positioning plate 6 fixedly connected to the mounting surface of the first shell 1; the mounting surface of the second casing 2 is provided with a connecting groove, the connecting mechanism is embedded into the connecting groove to enable the first casing 1 and the second casing 2 to form non-detachable connection, and the two mounting cavities 3 are enclosed to form a cavity for accommodating the NTC thermistor element 12.

The bottom of the cavity is provided with a buffer mechanism, the buffer mechanism comprises a first support structure and a second support structure which are connected in a sliding mode along the vertical direction, a first elastic element is arranged between the first support structure and the second support structure, when the first support structure and the second support structure are close to or far away from each other, the first elastic element is correspondingly compressed or stretched, the first support structure is provided with a first positioning hole 7, and the second support structure is provided with a second positioning hole 14; the NTC thermistor element 12, specifically the NTC thermistor chip, is located on top of the buffer mechanism, and the pins 11 extend through the first positioning hole 7, the second positioning hole 14 and the through-holes in sequence.

In this embodiment, through holes through which the leads 11 of the NTC thermistor element 12 protrude may be correspondingly provided on the case according to the arrangement position thereof. The two shells can be respectively provided with a through hole, the two shells can also be respectively provided with two semicircular notches, two complete through holes are formed after installation, other modes can also be adopted, and certainly, if the buffer mechanism is arranged on the positioning plate, the positioning plate is also correspondingly provided with through holes for the pins 11 to smoothly extend out of the shells.

In this embodiment, the NTC thermistor component 12 includes an NTC thermistor chip, a protective layer, and a pin 11, where the NTC thermistor chip has an electrode, the electrode is electrically connected to an external circuit through the pin 11, and the protective layer is coated on the periphery of the NTC thermistor chip and the connection between the electrode and the pin 11, so as to perform protection and insulation functions. Generally, the NTC thermistor chip has two electrodes, and correspondingly, the two pins 11 are a positive pin and a negative pin.

When the NTC thermistor is used, the pins 11 sequentially extend into the first positioning hole 7 and the second positioning hole 14, the NTC thermistor element 12 is placed in the installation cavity 3, and the positioning plate 6 extends into the positioning groove 16, so that the first casing 1 and the second casing 2 are spliced into a casing with a convex curved surface. After the first housing 1 and the second housing 2 are mounted, the pins 11 can be soldered on the circuit board, so as to electrically connect with an external circuit.

By splicing the first shell 1 and the second shell 2 into a shell, not only the NTC thermistor element 12 in the shell is protected, but also the impact force of the outside from all directions is dispersed, so that the adverse effect of the outside impact on the NTC thermistor is reduced to a certain extent, and the pins 11 of the NTC thermistor element 12 are prevented from being separated from the circuit board.

When the whole shell slightly moves upwards in the horizontal direction or the vertical direction due to collision, the pins 11 incline or shake up and down in the first positioning holes 7 and the second positioning holes 14, and the NTC thermistor element 12 presses the first supporting structure to displace downwards, so that the first elastic element is compressed to buffer collision impact force.

With further reference to fig. 3, on the basis of the NTC thermistor described above, the damping mechanism of the present embodiment adopts the following preferred structure: the first supporting structure and the second supporting structure both adopt box-type structures, the two boxes are provided with openings, the openings are arranged in opposite directions, and the change and the restoration of the relative position between the first supporting structure and the second supporting structure are realized by means of the side plates of the two boxes and the first elastic element between the two boxes. Specifically, the first support structure is a first support box 9 and the second support structure is a second support box 8. The first supporting box 9 comprises a top plate and side plates, and a space enclosed by the top plate and the side plates is opened towards the second supporting box 8; the second support box 8 includes a bottom plate and side plates, and the space opening formed by the enclosure of the bottom plate and the side plates faces the first support box 9. The first elastic element is a first compression spring 13, the top end of the first compression spring is connected with the top plate of the first supporting box 9, the bottom end of the first compression spring is connected with the bottom plate of the second supporting box 8, and the pins of the NTC thermistor element 12 penetrate through the first compression spring 13.

As shown in fig. 3, the first support box 9 is slidably attached to the surface of the second support box 8. Specifically, the cross section of the side plate of the second supporting box 8 is T-shaped, that is, the thickness of the top of the side plate is greater than that of the rest. Be equipped with the sliding tray on the curb plate of first supporting box 9, the opening of sliding tray is less than the inside width of sliding tray, and the curb plate of first supporting box 9 has plasticity for the curb plate of first supporting box 8 can insert in the sliding tray and two supporting boxes are difficult for separating. Or, the side plate of the first supporting box 9 may be arranged in a T shape, and the side plate of the second supporting box 8 is correspondingly provided with a sliding groove, so that the longitudinal distance between the first supporting box 9 and the second supporting box 8 can be changed, and the balance and the reset between the two supporting boxes can be realized through the first compression spring 13 between the two supporting boxes.

As an alternative, the sliding connection between the second support box 8 and the first support box 9 can also be implemented in other ways: for example, the end of the side plate of the first supporting box 8 has a cylindrical connecting portion, and the end of the opening of the sliding groove formed in the side plate of the first supporting box 9 has a curved surface limiting edge which is engaged with the cylindrical connecting portion, so that the opening width is smaller than the inner width of the sliding groove.

Referring to fig. 3, the first supporting box 9 is provided with a first positioning hole 7 on the top plate. The bottom plate of the second supporting box 8 is provided with a second positioning hole 14, and the first positioning hole 7 corresponds to the second positioning hole 14, so that the pin 11 passes through the second supporting box 8 and the first supporting box 9 through the first positioning hole 7 and the second positioning hole 14.

The bottom plate fixedly connected with first compression spring 13 of second supporting box 8, the top of first compression spring 13 and the roof fixed connection of first supporting box 9, first compression spring 13 cup joints on pin 11, and when first supporting box 9 was gone up vertical removal on second supporting box 8, can make first compression spring 13 stretch and compress thereupon to can keep relatively fixed between first supporting box 9 and the second supporting box 8.

As another possible embodiment, the buffer mechanism may also adopt other structures: the first support structure and the second support structure are respectively an upper cover plate and a lower cover plate, and the first elastic element is an elastic shock pad, namely the upper cover plate and the lower cover plate are connected through the elastic shock pad; the upper cover plate is provided with a first positioning hole 7, the lower cover plate is provided with a second positioning hole 14, and holes for the pins 11 to pass through are further formed in the elastic shock absorption pad. The elastic shock absorption pad can be an elastic rubber pad, an elastic rubber block and the like, so as to buffer external force in all directions and realize a buffering effect.

In this embodiment, the arrangement position and the arrangement mode of the buffer mechanism may be different according to the arrangement position of the positioning plate 6. In one implementation, the top surface of the positioning plate 6 is flush with the bottom surface of the mounting cavity 3, and the buffer mechanism can be fixed to the positioning plate 6 and lap-jointed to the bottom surface of the mounting cavity 3. For example, in the structure shown in fig. 2, a part of the bottom plate of the second support box 8 is fixedly connected with the positioning plate 6, and the bottom surface of the mounting cavity 3 forms a support for a part of the bottom plate of the second support box 8.

In another implementation, the top surface of the positioning plate 6 is not flush with the bottom surface of the mounting cavity 3, for example, the top surface of the positioning plate 6 is lower than the bottom surface of the mounting cavity 3, and the buffering mechanism can be fixed to the bottom surface of the mounting cavity 3. Specifically, in order to facilitate the installation of the NTC thermistor element 12, a part of the bottom of the buffer mechanism is fixedly connected to the bottom surface of the installation cavity 3, and the other part of the bottom is suspended.

In order to reduce the mechanical jamming in the process of splicing the first housing 1 and the second housing 2 and smoothly splice the housings, the embodiment further provides the following preferred connection mechanism design: with further reference to fig. 4, the mounting surface of the second housing 2 is provided with a positioning slot 16 adapted to the positioning plate 6, and the positioning plate 6 can be inserted into the positioning slot 16. Be provided with on the locating plate 6 and can not dismantle fixed knot and construct, can not dismantle fixed knot and construct including locating piece 4, the bottom of locating piece 4 and the top fixed connection of locating

plate

6, 4 tops of locating pieces are equipped with spring groove 15, the bottom fixedly connected with second compression spring 17 of spring groove 15, the top fixedly connected with dead lever 5 of second compression spring 17. The inner side of the second casing 2 is provided with a moving groove 19 communicated with the positioning groove 16, the inner side of the second casing 2 is provided with a fixing groove 18 communicated with the positioning groove 16 and the moving groove 19, and the fixing groove 18 is used for accommodating the fixing rod 5.

In the process of inserting the positioning plate 6 into the positioning slot 16, the positioning block 4 and the fixing rod 5 enter the moving slot 19 and move towards the inside of the moving slot 19, the side wall of the moving slot 19 extrudes the second compression spring 17 through the fixing rod 5, and when the positioning plate 6 continues to stretch into, so that the positioning block 4 enters the fixing slot 18, the second compression spring 17 is released, and the fixing rod 5 is pushed to stretch into the fixing slot 18. Through the structure, the first shell 1 and the second shell 2 are connected in a non-detachable mode, the assembling process of the first shell and the second shell is simple, and operation is facilitated.

In some possible embodiments, the upper surface of the moving groove 19 is a slope, that is, during the process of inserting the positioning plate 6 into the positioning groove 16, the pressing force of the fixing rod 5 on the second compression spring 17 on the upper surface of the moving groove 19 is gradually increased, so that the second compression spring can sufficiently release the resilience when the positioning block 4 enters the fixing groove 18, thereby ensuring a reliable connection between the first housing 1 and the second housing 2.

On this basis, the top of the fixing rod 5 can be further provided with a hemispherical shape. Like this with the in-process of locating plate 6 embedding constant head tank 16, the frictional force between dead lever 5 and the shifting chute 19 is as little as possible, further reduces the dead probability of card to appear to a certain extent, splices first shell 1 and second shell 2 more smoothly. It should be noted that, in the present embodiment, the hemisphere is not an absolute hemisphere, but may be a hemisphere or a hemisphere, as long as the top of the fixing rod 5 has a smooth surface.

In order to optimize the effect of the outer shells on dispersing the external impact force, in some possible embodiments, the outer surfaces of the first and second

outer shells

1 and 2 may be designed to have a convex curved surface, and further, the first and second

outer shells

1 and 2 may be designed to have a quarter-spherical shape, so that they may be spliced into a hemispherical outer shell. The semispherical shape formed by splicing the first casing 1 and the second casing 2 enables the external impact force in each direction to be dispersed and reduced, and further prevents the pins 11 of the NTC thermistor element 12 from being separated from the circuit board due to the impact to a certain extent.

To further improve the damping effect against external forces, in some possible embodiments, a buffer layer 10 may be provided in the housing, for example, the buffer layer 10 may be provided on the top of the buffer mechanism, and specifically, the buffer layer 10 may be provided on the top of the first support box 9 or the upper cover plate; a damping layer 10 can be fixedly connected to the inner wall of the installation space 3, for example. The buffer layer 10 may be made of rubber, sponge, or the like, and may be made of an adaptive elastic material selected according to an application environment of the NTC thermistor, so as to play a buffering role. In addition, the buffer layer 10 can also protect the NTC thermistor element 12, so as to prevent the NTC thermistor element 12 from being damaged when the first supporting box 9 is driven by the NTC thermistor element 12 to move, so that the NTC thermistor element 12 can be better protected, and the service life of the NTC thermistor is prolonged.

It is to be understood that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like, are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present invention and simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive and differentiating purposes only and are not to be construed as indicating or implying relative importance or priority.

The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims

1. An NTC thermistor, characterized in that: the high-power electronic ballast comprises an NTC thermistor element (12) and a shell, wherein the NTC thermistor element (12) comprises an NTC thermistor chip and pins which are electrically connected, the shell comprises a first shell (1) and a second shell (2), the first shell (1) and the second shell (2) are respectively provided with a mounting surface facing each other, and a mounting cavity (3) is formed in the mounting surface; the shell is provided with a through hole;

a connecting mechanism is arranged on the mounting surface of the first shell (1), and the connecting mechanism comprises a positioning plate (6) fixedly connected to the mounting surface of the first shell (1); a connecting groove is formed in the mounting surface of the second shell (2), the connecting mechanism is embedded into the connecting groove, so that the first shell (1) and the second shell (2) are connected in a non-detachable mode, and the two mounting cavities (3) are enclosed to form a cavity;

a buffer mechanism is arranged at the bottom of the cavity and comprises a first support structure and a second support structure which are connected in a sliding mode along the vertical direction, a first elastic element is arranged between the first support structure and the second support structure, and the first elastic element is compressed or stretched when the first support structure and the second support structure are close to or far away from each other, wherein a first positioning hole (7) is formed in the first support structure, and a second positioning hole (14) is formed in the second support structure; the NTC thermistor chip is positioned at the top of the buffer mechanism, and the pins sequentially extend out of the first positioning hole (7), the second positioning hole (14) and the through hole.

2. The NTC thermistor according to claim 1, characterized in that: the first supporting structure is a first supporting box (9), the second supporting structure is a second supporting box (8), and the first elastic element is a first compression spring (13);

the first supporting box (9) comprises a top plate and side plates, and a space enclosed by the top plate and the side plates is opened towards the second supporting box (8);

the second supporting box (8) comprises a bottom plate and side plates, and a space formed by enclosing the bottom plate and the side plates is opened towards the first supporting box (9);

the two ends of the first compression spring (13) are respectively connected with the top plate and the bottom plate, and the pins penetrate through the first compression spring (13).

3. The NTC thermistor according to claim 2, characterized in that in the first support box (9) and the second support box (8), one of the side plates is provided with a slide groove, and the other side plate is inserted into the slide groove.

4. The NTC thermistor according to claim 3, characterized in that: in the first supporting box (9) and the second supporting box (8), the opening end part of the sliding groove formed in one side plate is provided with a limiting edge, so that the opening width is smaller than the inner width of the sliding groove, the top of the other side plate is provided with a bulge, and the width of the bulge part is larger than the width of the opening.

5. The NTC thermistor according to claim 1, characterized in that:

the first supporting structure is an upper cover plate, the second supporting structure is a lower cover plate, and the first elastic element is an elastic shock pad; and holes for the pins to pass through are formed in the elastic shock absorption pads.

6. The NTC thermistor according to any of claims 1-5, characterized in that: the top surface of the positioning plate (6) is flush with the bottom surface of the mounting cavity (3), and the buffer mechanism is fixed on the positioning plate (6) and is lapped on the bottom surface of the mounting cavity (3);

or the top surface of the positioning plate (6) is lower than the bottom surface of the mounting cavity (3), and the buffering mechanism is fixed on the bottom surface of the mounting cavity (3).

7. The NTC thermistor according to any of claims 1-5, characterized in that:

the connecting mechanism also comprises a positioning block (4) fixed at the top of the positioning plate (6); a spring groove (15) is formed in the top of the positioning block (4), a second compression spring (17) is arranged in the spring groove (15), and a fixing rod (5) is fixedly connected to the top end of the second compression spring (17);

the connecting grooves comprise positioning grooves (16) for inserting the positioning plates (6), moving grooves (19) communicated with the positioning grooves (16), and fixing grooves (18) respectively communicated with the positioning grooves (16) and the insides of the moving grooves (19); in the process of inserting the positioning plate (6) into the positioning groove (16), the positioning block (4) moves towards the interior of a moving groove (19), the side wall of the moving groove (19) presses the second compression spring (17) through the fixing rod (5), and the second compression spring (17) is released when the positioning block (4) enters the fixing groove (18).

8. The NTC thermistor according to claim 7, characterized in that: the longitudinal section of the moving groove (19) is trapezoidal.

9. The NTC thermistor according to any of claims 1-5, characterized in that: the first shell (1) and the second shell (2) are both in a quarter-sphere shape.

10. The NTC thermistor according to any of claims 1-5, characterized in that: and a buffer layer is arranged at the top of the buffer mechanism and/or on the inner wall of the mounting cavity (3).