CN216210810U

CN216210810U - Memory bank protective sleeve with heat dissipation function and memory bank device

Info

Publication number: CN216210810U
Application number: CN202122439053.1U
Authority: CN
Inventors: 柯尊伟
Original assignee: Wuhan Yixun Information Technology Co ltd
Current assignee: Wuhan Yixun Information Technology Co ltd
Priority date: 2021-10-11
Filing date: 2021-10-11
Publication date: 2022-04-05
Anticipated expiration: 2031-10-11

Abstract

The utility model discloses a memory bank protective sleeve with a heat dissipation function and a memory bank device, relates to the technical field of computer equipment, and solves the technical problems that the existing memory bank is slow in heat dissipation and easy to collect dust, so that the normal use of a computer is influenced.

Description

Memory bank protective sleeve with heat dissipation function and memory bank device

Technical Field

The utility model relates to the technical field of computer equipment, in particular to the technical field of a memory bank protective sleeve with a heat dissipation function and a memory bank device.

Background

The memory bank is an apparatus or a component used for storing a large amount of information in a digital system, and is an important component in a computer and a digital apparatus, the memory bank can be read and written at any time, is fast in speed, and is usually used as a temporary data storage medium of an operating system or other running programs, the memory bank is an indispensable component of the computer, the memory bank needs to be inserted into a memory bank slot when being installed, along with the development of the computer, the existing computer does not have a device specially used for radiating the memory bank, but utilizes a system fan to radiate the memory bank; however, as the capacity and the operating frequency of the memory bank are increased, the heat generation amount is increased, the heat dissipation requirement of the memory bank cannot be met only by using a system fan for heat dissipation, and after the existing memory bank is installed on the mainboard, no protection device is provided, and after the memory bank is used for a long time, a large amount of dust can fall into a connecting gap between the memory bank and the mainboard, so that the contact of the memory bank is poor, the connection between the memory bank and the mainboard is affected, and the computer cannot work normally.

SUMMERY OF THE UTILITY MODEL

The utility model aims to: in order to solve the above technical problems, the present invention provides a memory bank protection cover with a heat dissipation function and a memory bank device.

The technical scheme adopted by the utility model is as follows: the utility model provides a DRAM protective sheath with heat dissipation function, includes the sheath casing, sheath casing top is provided with heat conduction chamber, and the bottom in this heat conduction chamber is provided with the draw-in groove, and the preceding, the back both sides of this draw-in groove are provided with radiating fin respectively, and the left and right both sides of this draw-in groove are provided with the curb plate respectively, the outside perpendicular dust blocking edge that is provided with in radiating fin bottom, the sheath casing cover is established on the DRAM, and the golden finger region of DRAM surpasss the dust blocking edge.

The top in heat conduction chamber is provided with the cooling tube that the tip area pressed from both sides and presss from both sides, and this end that cooling tube area pressed from both sides can be installed at the air intake or the air outlet of mainboard fan through the clip, conveniently induced drafts for heat conduction chamber and takes away the heat or irritate the wind and advance heat conduction chamber and blow away the heat, and the circulation of air in heat conduction chamber can be accelerated in the setting of cooling tube, improves the radiating effect.

The radiating pipe is an elastic hose, and the end close to the clamp is provided with a bell mouth, so that the external fan has better air suction or air exhaust effect on the radiating pipe.

The heat conducting paste is arranged on the inner side of each radiating fin, so that the contact area of the radiating fins is larger, the heat transfer is faster, and the radiating effect is improved.

The heat conduction cavity is a hollow rectangular cavity, the length of the heat conduction cavity corresponds to that of the memory bank, the memory bank can be wrapped, and the hollow structure enables the heat dissipation surface area to be larger.

The heat conduction cavity is made of heat conduction materials, preferably aluminum sheets.

A memory bank device with a heat dissipation function is provided, wherein the memory bank is positioned in a memory bank protective sleeve, and a golden finger area of the memory bank is arranged outside the memory bank protective sleeve.

In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that:

the utility model seals and wraps the element part of the memory bank through the sheath shell, thereby preventing dust, the heat in the two sides of the sheath shell is quickly guided to the radiating fins through the heat conducting paste and is quickly radiated by the radiating fins, the top of the radiating fins is provided with the heat conducting cavity, the two ends of the heat conducting cavity are respectively provided with the radiating filter screens, the top of the heat conducting cavity is communicated with the radiating pipe with the clamp, the other end of the radiating pipe is clamped with the air inlet end or the air outlet end of the large CPU fan or the power supply fan through the clamp, the air flow in the heat conducting cavity is accelerated, and the heat can be quickly radiated.

The dust blocking edge is arranged, when the memory bank is inserted into the connecting groove of the main board, the dust blocking edge can be contacted with the upper surface of the connecting groove, and the influence of dust collection in a gap of the connecting groove on the normal use of a computer can be avoided.

Drawings

The utility model will now be described, by way of example, with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of the structure of a memory bank and a memory bank sheath according to the present invention;

FIG. 2 is a schematic left-view structural diagram of a memory bank and a memory bank sheath according to the present invention;

FIG. 3 is a schematic diagram of a left-view appearance structure of the memory bank and the memory bank sheath according to the present invention;

FIG. 4 is a schematic diagram of a memory bank structure according to the present invention;

labeled as: 1-sheath shell, 2-radiating fins, 3-dust blocking edge, 4-heat conducting cavity, 5-clamp, 6-radiating pipe, 7-radiating filter screen, 8-clamping groove, 9-heat conducting paste, 10-memory bar and 11-side plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

As shown in fig. 1-4, this embodiment provides a memory bank protective sheath with heat dissipation function, including sheath casing 1, sheath casing 1 top is provided with heat conduction chamber 4, and the bottom in this heat conduction chamber 4 is provided with draw-in groove 8, and the preceding, back both sides of this draw-in groove 8 are provided with radiating fin 2 respectively, and the left and right both sides of this draw-in groove 8 are provided with curb plate 11 respectively, radiating fin 2 bottom outwards is provided with the dust blocking edge 3 perpendicularly, sheath casing 1 cover is established on memory bank 10, and the golden finger region of memory bank 10 surpasss the dust blocking edge 3.

The working principle of the utility model is as follows: the memory bank 10 is inserted from the end of the dust-blocking edge 3, the memory bank 10 is clamped through the clamping groove 8, elements on two sides of the memory bank 10 are in contact with the radiating fins 2 through the heat conducting paste 9 in the sheath shell 1, the tops of the clamping groove 8 and the radiating fins 2 are connected with the heat conducting cavity 4, so that heat of the memory bank 10 can be rapidly transmitted to the radiating fins 2 and the heat conducting cavity 4, the heat conducting cavity 4 is communicated with the radiating pipe 6, the end part of the radiating pipe 6 is aligned with a fan in the mainframe box, air in the heat conducting cavity 4 rapidly flows, and the radiating speed of the memory bank 10 is further accelerated, because the clamping end of the memory bank 10, except the end inserted into the connecting groove on the mainboard, is not sealed, other parts are sealed, therefore, the dustproof effect is good, the radiating is not influenced by dust, the dust-blocking edge 3 is arranged, after the memory bank 10 is clamped, the gap of the mainboard connecting groove is also covered, and the dust is avoided, the memory bank 10 and the mainboard are in good contact all the time, and the fault of the computer operation is reduced.

Example 2

On embodiment 1's basis, the top in heat conduction chamber 4 is provided with the cooling tube 6 that the tip took clip 5, and both sides are provided with heat dissipation filter screen 7, and this end that cooling tube 6 took clip 5 can be installed at the air intake or the air outlet of mainboard fan through clip 5, conveniently induced drafts for heat conduction chamber 4 and takes away the heat or irritate the wind and advance heat conduction chamber 4 and blow away the heat, and the circulation of air in heat conduction chamber 4 can be accelerated in the setting of cooling tube 6, improves the radiating effect.

Example 3

On the basis of embodiment 2, the heat dissipation pipe 6 is an elastic hose, and the end close to the clip 5 is provided with a bell mouth, so that the external fan has a better effect of sucking or exhausting air to or from the heat dissipation pipe 6.

Example 4

On the basis of embodiment 1, heat conduction paste 9 is arranged on the inner side of each heat dissipation fin 2, and the arrangement of the heat conduction paste 9 enables the contact area of the heat dissipation fins 2 to be larger, heat transfer to be faster, and the heat dissipation effect to be improved.

Example 5

On the basis of embodiment 1, the heat conduction cavity 4 is a hollow rectangular cavity, the length of the heat conduction cavity corresponds to that of the memory bank 10, the memory bank 10 can be wrapped, and the hollow structure enables the heat dissipation surface area to be larger.

Example 6

On the basis of embodiment 1, the heat conducting cavity 4 is made of a heat conducting material, preferably an aluminum sheet.

Example 7

On the basis of any one of embodiments 1 to 6, in a memory bank device having a heat dissipation function, the memory bank 10 is located in the memory bank protective sheath, wherein a gold finger region of the memory bank 10 is disposed outside the memory bank protective sheath.

Claims

1. The utility model provides a DRAM protective sheath with heat dissipation function, includes sheath casing (1), its characterized in that, sheath casing (1) top is provided with heat conduction chamber (4), and the bottom in this heat conduction chamber (4) is provided with draw-in groove (8), and preceding, the back both sides of this draw-in groove (8) are provided with radiating fin (2) respectively, and the left and right both sides of this draw-in groove (8) are provided with curb plate (11) respectively, radiating fin (2) bottom is outwards provided with perpendicularly and keeps off dirt along (3), sheath casing (1) cover is established on DRAM (10), and the golden finger region of DRAM (10) surpasss and keeps off dirt along (3).

2. The memory bank protective sleeve with the heat dissipation function as claimed in claim 1, wherein the top of the heat conduction cavity (4) is provided with a heat dissipation pipe (6) with a clip (5) at the end part, and the two sides are provided with heat dissipation screens (7).

3. A heat-dissipating memory bank protective casing according to claim 2, wherein the heat dissipating pipe (6) is a flexible hose, and a bell mouth is provided near the end of the clip (5).

4. The memory bank protective sleeve with the heat dissipation function as claimed in claim 1, wherein the heat conduction paste (9) is arranged on the inner side of the heat dissipation fin (2).

5. The memory bank protection cover with heat dissipation function of claim 1, wherein the heat conduction cavity (4) is a hollow rectangular cavity with a length corresponding to the memory bank (10).

6. The memory bank protective cover with heat dissipation function of claim 1, wherein the heat conducting cavity (4) is made of heat conducting material.

7. Memory bank arrangement with heat dissipation, characterized in that it comprises a memory bank (10) and a memory bank protective sheath according to any of claims 1-6, said memory bank (10) being located within said memory bank protective sheath.