CN216189092U

CN216189092U - IC packaging frame feeding and grabbing mechanism

Info

Publication number: CN216189092U
Application number: CN202122430099.7U
Authority: CN
Inventors: 袁楠稀
Original assignee: Dongguan Jixiao Technology Co ltd
Current assignee: Dongguan Jixiao Technology Co ltd
Priority date: 2021-10-09
Filing date: 2021-10-09
Publication date: 2022-04-05
Anticipated expiration: 2031-10-09

Abstract

The utility model relates to a grabbing mechanism, in particular to a feeding and grabbing mechanism for an IC packaging frame. The technical problem to be solved is as follows: provided is an IC package frame feeding and grabbing mechanism capable of preventing an IC package frame from being damaged by a punch press when the IC package frame which is not punched is fed to a punch press die. The technical scheme of the utility model is as follows: a feeding and grabbing mechanism for an IC packaging frame comprises a supporting plate, a supporting block, a mounting frame and the like; the supporting shoe left and right sides all is connected with the backup pad, and the left side of preceding collateral branch backup pad is connected with the mounting bracket. The IC packaging frame which is not punched is convenient to place by arranging the object placing plate; the first connecting block and the wedge-shaped block are arranged, so that the IC packaging frame which is not punched can be clamped conveniently; through being equipped with the cylinder, be convenient for continue the propelling movement to the punching machine mould with the IC package frame that does not carry out the punching press of grabbing.

Description

IC packaging frame feeding and grabbing mechanism

Technical Field

The utility model relates to a grabbing mechanism, in particular to a feeding and grabbing mechanism for an IC packaging frame.

Background

The IC is an integrated circuit, and the IC package frame is naturally a package frame for the integrated circuit, and during manufacturing, the IC package frame which is not punched needs to be placed on a punching machine die to be punched with various holes. At present, the IC packaging frame is fed in a manner that the IC packaging frame which is not punched is manually placed on a punching machine die for punching, and the hand of people is easily damaged by the punching machine in the manner.

Therefore, it is highly desirable to design a feeding and grabbing mechanism for an IC package frame, which can prevent the IC package frame from being damaged by the pressing of the pressing machine when the IC package frame which is not pressed is fed to the pressing machine.

SUMMERY OF THE UTILITY MODEL

In order to overcome the shortcoming that the mode of present pay-off easily makes the hand press wounded to the punching machine, the technical problem that solve is: provided is an IC package frame feeding and grabbing mechanism capable of preventing an IC package frame from being damaged by a punch press when the IC package frame which is not punched is fed to a punch press die.

The technical scheme of the utility model is as follows: a feeding and grabbing mechanism for an IC packaging frame comprises supporting plates, supporting blocks, a mounting frame, a motor, a rotating wheel, a flat belt, a first connecting block, a limiting rod, a first spring, a wedge block, a storage plate, a support, a baffle plate, a cylinder, a second connecting block, a pressing plate, a stop lever, a second spring and a fixing block, wherein the supporting plates are connected to the front side and the rear side of the supporting block respectively, the mounting frame is connected to the left side of the front side supporting plate, the motor is mounted in the mounting frame, the rotating wheel is rotatably connected to the left side and the right side between the supporting plates on the front side and the rear side respectively, the front end of the rotating wheel on the left side is connected with an output shaft of the motor, the flat belt is wound between the front portion and the rear portion of the rotating wheel on the left side and between the rear portion of the rotating wheel on the left side and the rotating wheel on the right side, the flat belt on the front side and the rear side is connected with the limiting rod between the left side and the middle right side of the first connecting block respectively, the equal slidingtype of opposite face of both sides gag lever post is connected with the wedge, the inclined plane of both sides wedge is located the opposite face of both sides wedge, both sides wedge respectively with be connected with first spring between the left and right sides of first connecting block, a plurality of first connecting block left part downside all is connected with the polylith and puts the thing board, the top left side of preceding collateral branch fagging is connected with the baffle, the rear portion left side of back collateral branch fagging is connected with the support, support upper portion slidingtype is connected with the cylinder, be connected with the second connecting block on the piston rod of cylinder, sideslip dynamic formula is connected with the clamp plate behind the second connecting block bottom, clamp plate left part rear side is connected with the shelves pole, be connected with the second spring between clamp plate rear side and the second connecting block, second connecting block bottom front side is connected with the fixed block.

As a preferred technical scheme, the air cylinder further comprises a supporting frame, a connecting rod and a third spring, the supporting frame is arranged in the middle of the air cylinder, the connecting rod is connected to the top of the supporting frame and penetrates through the top of the support, and the third spring is connected between the top of the connecting rod and the support.

As a preferred technical scheme of the utility model, the lower side of the front part of the pressure plate is provided with a groove, so that the rear side of the IC packaging frame can be inserted into the groove, and the front side of the IC packaging frame is attached to the rear side of the fixed block, thereby completing the grabbing of the IC packaging frame.

As a preferable technical scheme of the utility model, the holes at the front side and the rear side of the upper part of the bracket are in the shape of a football court of a gymnasium, and the air cylinder can move up and down.

As a preferable technical scheme of the utility model, the right side of the pressure plate is in a trapezoid with an inclined surface inclining backwards.

As a preferable technical scheme of the utility model, the right side of the fixed block is in a trapezoid with an inclined plane inclined forwards.

The utility model has the beneficial effects that: the IC packaging frame which is not punched is convenient to place by arranging the object placing plate; the first connecting block and the wedge-shaped block are arranged, so that the IC packaging frame which is not punched can be clamped conveniently; through being equipped with the cylinder, be convenient for continue propelling movement to the punching machine mould with the IC encapsulation frame who grabs not carrying out the punching press of getting, so people need not manual material loading, have reached the effect that prevents the hand and is wounded by the punching machine crushing.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

FIG. 2 is a schematic view of a first partial body structure according to the present invention.

FIG. 3 is a schematic view of a second partial body structure according to the present invention.

Fig. 4 is a perspective view of a third embodiment of the present invention.

Fig. 5 is a partial cross-sectional view of the present invention.

Wherein: 1-supporting plate, 2-supporting block, 3-mounting frame, 4-motor, 5-rotating wheel, 6-flat belt, 7-first connecting block, 8-limiting rod, 9-first spring, 10-wedge block, 11-object placing plate, 12-support, 13-baffle, 14-cylinder, 15-second connecting block, 16-pressing plate, 17-baffle rod, 18-second spring, 19-fixing block, 20-supporting frame, 21-connecting rod and 22-third spring.

Detailed Description

The utility model is described in detail below with reference to the drawings and specific examples, but the utility model is not limited thereto.

Example 1

A feeding and grabbing mechanism for an IC packaging frame is shown in figures 1-5 and comprises a supporting plate 1, a supporting block 2, an installation frame 3, a motor 4, a rotating wheel 5, a flat belt 6, a first connecting block 7, a limiting rod 8, a first spring 9, a wedge block 10, a storage plate 11, a support 12, a baffle 13, a cylinder 14, a second connecting block 15, a pressing plate 16, a baffle rod 17, a second spring 18 and a fixing block 19, wherein the front side and the rear side of the supporting block 2 are connected with the supporting plate 1 in a welding mode, the left side of the front side supporting plate 1 is connected with the installation frame 3 in a screw connection mode, the motor 4 is installed inside the installation frame 3 in a bolt connection mode, the rotating wheel 5 is rotatably connected to the left side and the right side between the front side and rear side supporting plates 1, the front end of the rotating wheel 5 on the left side is connected with an output shaft of the motor 4, the flat belt 6 is wound between the front portion and the rear portion of the rotating wheel 5 on the left side and between the front portion and the rear portion and the rotating wheel 5 on the right side, a plurality of first connecting blocks 7 are connected between the front and rear flat belts 6 in a glue connection mode, the left and right sides of each first connecting block 7 are respectively connected with a limiting rod 8 between the middle left side and the middle right side of the first connecting block 7, the opposite surfaces of the limiting rods 8 on the two sides are respectively connected with a wedge 10 in a sliding mode, a first spring 9 is connected between each wedge 10 on the two sides and the left and right sides of each first connecting block 7, the lower sides of the left parts of the first connecting blocks 7 are respectively connected with a plurality of object placing plates 11, the left side of the top part of the front side supporting plate 1 is connected with a baffle 13 in a welding mode, the left side of the rear part of the rear side supporting plate 1 is connected with a bracket 12 in a welding mode, holes on the front side and the rear side of the upper part of the bracket 12 are in the shape of a football court of a sports stadium, the upper part of the bracket 12 is connected with a cylinder 14 in a sliding mode, the cylinder 14 can enable the cylinder 14 to move up and down, a piston rod of the cylinder 14 is connected with a second connecting block 15, second connecting block 15 bottom rear side sliding type is connected with clamp plate 16, clamp plate 16 right side is the trapezoidal that the inclined plane inclines backward, can be with rear side wedge 10 back-pushing open through the inclined plane on the clamp plate 16, clamp plate 16 front portion downside is opened flutedly, clamp plate 16 left part rear side is connected with shelves pole 17, be connected with second spring 18 between clamp plate 16 rear side and the second connecting

block

15, 15 bottom front sides of second connecting block are connected with fixed block 19 through the welded mode, 19 right sides of fixed block are the trapezoidal that the inclined plane leaned forward, can be with front side wedge 10 forward-pushing open through the inclined plane on the fixed block 19, the IC packaging frame front side that does not carry out the punching press pastes at 19 rear side of fixed block, the rear side can slide in the recess on the clamp plate 16, accomplish snatching of IC packaging frame.

Firstly, the first spring 9 and the second spring 18 are both in an original state, when an IC packaging frame which is not punched needs to be grabbed and placed on a punching machine die for punching through feeding, the motor 4 needs to be adjusted to reduce the rotating speed, then the motor 4 is started, an output shaft of the motor 4 drives the left rotating wheel 5 to slowly rotate, the left rotating wheel 5 drives the right rotating wheel 5 to rotate through the flat belts 6 on the front side and the rear side, when the flat belts 6 rotate, the first connecting blocks 7 are driven to move, the first connecting blocks 7 drive the limiting rods 8, the first spring 9, the wedge blocks 10 and the object placing plate 11 to move, at the moment, the IC packaging frame which is not punched is placed on the object placing plate 11 which is moved to be right above the supporting block 2, at the moment, the wedge blocks 10 on the front side and the rear side are respectively pushed to opposite surfaces along the limiting rods 8 on the front side and the rear side through the first spring 9 in the original state, clamping the IC packaging frame which is not punched on the object placing plate 11, moving the IC packaging frame which is not punched to the left under the action of moving the flat belt 6 and the first connecting block 7 to the left, when the IC packaging frame which is not punched moves to the right of the pressing plate 16 and the fixed block 19, the left side of the IC packaging frame which is not punched firstly contacts the pressing plate 16 and the fixed block 19, the rear side of the IC packaging frame which is not punched slides leftwards along the groove on the pressing plate 16 until the inclined planes on the two sides of the wedge-shaped block 10 contact the inclined planes on the pressing plate 16 and the fixed block 19, the pressing plate 16 and the fixed block 19 can push the wedge-shaped blocks 10 on the two sides to the front side and the rear side respectively, at the moment, the first spring 9 is in a compressed state, the IC packaging frame which is not punched is not clamped by the wedge-shaped blocks 10 on the two sides any more, but continuously receives a force for pushing the IC packaging frame which is not punched to the left when the first connecting block 7 moves leftwards, the rear side of the IC packaging frame which is not punched is pushed into the groove on the pressing plate 16, the left side is attached to the rear side of the fixed block 19, at the moment, the air cylinder 14 is rapidly pulled upwards along the holes on the two sides of the support 12, the piston rod of the air cylinder 14 drives the second connecting block 15 to move upwards, the second connecting block 15 drives the pressing plate 16, the stop rod 17, the second spring 18, the fixed block 19 and the IC packaging frame which is not punched between the pressing plate 16 and the fixed block 19 to move upwards, and because the wedges 10 on the two sides are not in contact with the pressing plate 16 and the fixed block 19 and the IC packaging frame which is not punched on the object placing plate 11 is also taken away, the wedges 10 on the two sides move towards respective opposite surfaces under the reset action of the first spring 9, the air cylinder 14 is opened again, and the piston rod of the air cylinder 14 drives the second connecting block 15, the pressing plate 16, the stop rod 17 and the second spring 18, The IC package frame which is not punched between the fixed block 19 and the pressure plate 16 and the fixed block 19 moves forwards until the IC package frame is pushed onto a die of a punching machine, the stop rod 17 is contacted with the stop plate 13, the stop plate 13 stops the stop rod 17, the pressure plate 16 stops moving forwards, the second spring 18 is in a compressed state at the moment, the fixed block 19 continues moving forwards due to the stop of the movement of the pressure plate 16, the IC package frame which is not punched is dropped on the die, the air cylinder 14 is closed at the moment, the piston rod of the air cylinder 14 drives the second connecting block 15, the pressure plate 16, the stop rod 17, the second spring 18 and the fixed block 19 to move backwards, the stop rod 17 moves rightwards without contacting with the stop plate 13, the pressure plate 16 resets forwards under the action of the reset of the second spring 18, the air cylinder 14 moves downwards, and the next placing plate 11 which is positioned right above the supporting block 2 is used for placing the next IC package frame which is not punched, and repeating the operations to carry out feeding and grabbing for the second time, so that the IC packaging frame which is not punched can be fed and grabbed onto the punching machine die. And finally, feeding and grabbing all IC packaging frames which are not punched to the punching machine die to finish punching, and then closing the motor 4. So need not the manual IC packaging frame pay-off that will not carry out the punching press of people and snatch punching press on punching machine mould, effectually prevent that people from being damaged by punching machine during operation pressure.

Example 2

On the basis of embodiment 1, as shown in fig. 1 and 4, the air cylinder further comprises a support frame 20, a connecting rod 21 and a third spring 22, the support frame 20 is arranged in the middle of the air cylinder 14, the connecting rod 21 is connected to the top of the support frame 20 in a welding and placing mode, the connecting rod 21 penetrates through the top of the bracket 12, and the third spring 22 is connected between the top of the connecting rod 21 and the bracket 12.

At first, the third spring 22 is in an original state, when the air cylinder 14 needs to be moved downwards, the connecting rod 21 needs to be pressed, at this time, the third spring 22 is in a compressed state, and the connecting rod 21 drives the supporting frame 20 and the air cylinder 14 to move downwards, when the air cylinder needs to be moved upwards, the connecting rod 21 stops being pressed, and under the reset effect of the third spring 22, the connecting rod 21 is jacked upwards, and the connecting rod 21 drives the supporting frame 20 and the air cylinder 14 to move upwards.

It should be understood by those skilled in the art that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the scope of the present invention.

Claims

1. The utility model provides a mechanism is snatched in feeding of IC encapsulation frame which characterized in that: comprises a supporting plate (1), supporting blocks (2), a mounting frame (3), a motor (4), rotating wheels (5), a flat belt (6), a first connecting block (7), a limiting rod (8), a first spring (9), a wedge block (10), a storage plate (11), a support (12), a baffle (13), a cylinder (14), a second connecting block (15), a pressing plate (16), a baffle rod (17), a second spring (18) and a fixing block (19), wherein the front side and the rear side of the supporting block (2) are respectively connected with the supporting plate (1), the left side of the front side supporting plate (1) is connected with the mounting frame (3), the motor (4) is arranged in the mounting frame (3), the rotating wheels (5) are respectively rotatably connected on the left side and the right side between the front side and the rear side of the supporting plate (1) on the front side and the rear side, the front portion and the rear portion of the rotating wheels (5) on the left side are connected with an output shaft of the motor (4), the flat belt (6) are respectively wound between the front portion and the rotating wheels (5) on the right side and the rear portion, a plurality of first connecting blocks (7) are connected between the front and rear side flat belts (6), the left and right sides of each first connecting block (7) are respectively connected with a limiting rod (8) between the middle left side and the middle right side of the first connecting block, the opposite surfaces of the limiting rods (8) on the two sides are respectively connected with wedges (10) in a sliding manner, the inclined surfaces of the wedges (10) on the two sides are positioned on the opposite surfaces of the wedges (10) on the two sides, first springs (9) are respectively connected between the wedges (10) on the two sides and the left and right sides of the first connecting blocks (7), a plurality of object placing plates (11) are respectively connected on the lower sides of the left parts of the first connecting blocks (7), a baffle (13) is connected on the left side of the top of the front side supporting plate (1), a support (12) is connected on the left side of the rear part of the rear side supporting plate (1), an air cylinder (14) is connected on the upper part of the sliding manner, a second connecting block (15) is connected on a piston rod of the air cylinder (14), the rear side of the bottom of the second connecting block (15) is connected with a pressing plate (16) in a sliding mode, the rear side of the left part of the pressing plate (16) is connected with a blocking rod (17), a second spring (18) is connected between the rear side of the pressing plate (16) and the second connecting block (15), and the front side of the bottom of the second connecting block (15) is connected with a fixing block (19).

2. The IC package frame feeding and grabbing mechanism of claim 1, wherein: the air cylinder is characterized by further comprising a supporting frame (20), a connecting rod (21) and a third spring (22), the supporting frame (20) is arranged in the middle of the air cylinder (14), the connecting rod (21) is connected to the top of the supporting frame (20), the connecting rod (21) penetrates through the top of the support (12), and the third spring (22) is connected between the top of the connecting rod (21) and the support (12).

3. The IC package frame feeding and grabbing mechanism of claim 2, wherein: a groove is formed in the lower side of the front portion of the pressing plate (16), so that the rear side of the IC packaging frame can be inserted into the groove, and the front side of the IC packaging frame is attached to the rear side of the fixing block (19), and the IC packaging frame is grabbed.

4. The IC package frame feeding and grabbing mechanism of claim 3, characterized in that: the holes at the front and rear sides of the upper part of the bracket (12) are in the shape of a football court of a gymnasium, and the air cylinder (14) can move up and down.

5. The IC package frame feeding and grabbing mechanism of claim 4, wherein: the right side of the pressure plate (16) is in a trapezoid shape with an inclined plane inclining backwards.

6. The IC package frame feeding and grabbing mechanism of claim 5, wherein: the right side of the fixed block (19) is in a trapezoid with an inclined plane inclined forwards.