CN216174811U

CN216174811U - Material frame, inserted sheet equipment are placed to silicon chip

Info

Publication number: CN216174811U
Application number: CN202122678343.1U
Authority: CN
Inventors: 靳立辉; 耿名强; 杨骅; 姚长娟; 赵晓光; 尹擎; 杨鹏; 杨杰; 高洁
Original assignee: Tianjin Huanbo Science and Technology Co Ltd
Current assignee: Tianjin Huanbo Science and Technology Co Ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-04-05
Anticipated expiration: 2031-11-04

Abstract

A silicon wafer placing material frame comprises: the method comprises the following steps: a frame body; the clamping rod and the lower rod are arranged on the inner side of the frame body; the clamping roller can move along the width direction of the frame body so as to clamp the silicon wafer to be placed on the lower rod or loosen the silicon wafer to be separated. The utility model also provides an inserting piece device adopting the silicon wafer placing material frame. According to the silicon wafer separating device, the vertical face of the silicon wafer can be clamped in the cleaning or transferring process only by controlling the push rod and then adjusting the rotating angle of the clamping roller through the limiting block, so that the silicon wafer is stably and vertically placed in the material frame, the clamping roller can be adjusted to loosen the silicon wafer when the wafer is required to be inserted, the wafer separating purpose is achieved, the whole structure is simple and easy to control, the cleaning liquid flows back smoothly during cleaning, the silicon wafer can be stably placed, the wafer falling cannot occur, and the cleaning effect is good.

Description

Material frame, inserted sheet equipment are placed to silicon chip

Technical Field

The utility model belongs to the technical field of silicon wafer cleaning equipment, and particularly relates to a silicon wafer placing material frame and an inserting piece device with the same.

Background

Cleaning and slicing are one of the key links of the whole silicon wafer manufacturing process, and directly influence the silicon wafer cleaning effect and the silicon wafer yield. The existing silicon wafers are directly scattered in the cleaning tank, the silicon wafers are obliquely leaned against the end part of the cleaning tank, no protection is provided, and the silicon wafers are easily broken in the cleaning process; meanwhile, due to the unreasonable structure of the cleaning tank for placing the silicon wafer, the cleaning liquid cannot clean the silicon wafer, and the cleaning effect is poor. And in the subsequent inserting process, the scattered silicon wafers cannot be continuously sliced. How to design a material placing frame which has a simple structure, is stable and controllable in rotation and can clamp a silicon wafer is one of important technologies for improving the cleaning efficiency of the silicon wafer.

SUMMERY OF THE UTILITY MODEL

The utility model provides a silicon wafer placing frame and inserting piece device, which solves the technical problems of poor cleaning effect and easiness in fragmenting caused by unreasonable structural design of the conventional cleaning placing groove, is simple in structural design, is suitable for various devices in a cleaning procedure, and is high in automation degree and good in silicon wafer cleaning effect.

In order to solve the technical problems, the utility model adopts the technical scheme that:

a silicon wafer placing material frame comprises:

a frame body; and

the clamping rods and the lower rods are arranged on the inner side of the frame body;

the clamping roller can move along the width direction of the frame body so as to clamp the silicon wafer to be placed on the lower rod or loosen the silicon wafer to be separated.

Furthermore, the clamping rods are pushed by the limiting blocks on the push rods arranged on the outer sides of the clamping rods, so that the clamping rods can move in a reciprocating mode from the inclined position where the initial opening is arranged outwards to the straight position where the clamping rods are arranged vertically.

Furthermore, the push rod is fixedly arranged on the upright column at the bottom of the frame body, and the push rod is hinged with the upright column.

Furthermore, the two ends of each push rod are provided with an inclined block connected with the push rod, the lower end of each inclined block is connected with the bottom of the frame body, and the inclined blocks are driven by force to move towards or away from the middle of the frame body.

Furthermore, the clamping rods and the low rods are arranged in parallel along the length direction of the frame body;

the clamping rods and the low rods are symmetrically arranged relative to the length axis of the frame body.

Furthermore, the clamping roller is of a sheet-shaped plate strip structure, and the outer wall of the clamping roller is wrapped with a protective sleeve of an elastic structure to directly contact with the silicon wafer.

And the outer wall of the clamping rod is wrapped with a protective sleeve with an elastic structure to directly contact with the silicon wafer.

Further, the lower rod is suspended and fixedly arranged at the bottom of the frame body and used for supporting the bottom surface of the silicon wafer.

Furthermore, a baffle plate for preventing the silicon wafer from inclining is arranged at any end of the frame body, and the baffle plate is vertically and fixedly arranged above the low rod and is arranged on the inner side of the clamping rod.

Further, the end parts of the two sides of the frame body are provided with hook columns for grabbing and positioning.

An inserting piece device adopts the silicon wafer placing material frame.

By adopting the silicon wafer placing material frame and the inserting device adopting the silicon wafer placing material frame, the vertical surface of the silicon wafer can be clamped in the cleaning or transferring process only by controlling the push rod and then adjusting the rotating angle of the clamping roller through the limiting block, so that the silicon wafer can be stably and vertically placed in the material frame, the clamping roller can be adjusted to loosen the silicon wafer when the inserting is needed, the purpose of splitting is achieved, the structure is simple and easy to control, the cleaning liquid flows back smoothly during cleaning, the silicon wafer can be stably placed, the silicon wafer cannot fall, and the cleaning effect is good.

Drawings

Fig. 1 is a perspective view of a silicon wafer placing frame according to an embodiment of the present invention.

In the figure:

10. frame body 20, clamping rod 30 and low rod

40. Piece chamber 50, push rod 60, sloping block

70. Upright column 80, baffle 90 and hook column

100. Limiting block

Detailed Description

The utility model is described in detail below with reference to the figures and specific embodiments.

The embodiment provides a silicon wafer placing material frame, as shown in fig. 1, which includes a frame body 10, and clamping rods 20 and lower rods 30 arranged inside the frame body 10, wherein all the clamping rods 20 and the lower rods 30 enclose a wafer cavity 40 for placing a silicon wafer; the clamping bar 20 can move along the width direction of the wafer cavity 40, reduce the width of the wafer cavity 40 to clamp the silicon wafer standing on the lower rod 30, or enlarge the width of the wafer cavity 40 to loosen the silicon wafer for wafer separation. The material frame structure can ensure that the silicon wafer is stably and intensively vertically placed in the wafer cavity 40 during cleaning, the quality of the whole silicon wafer is not influenced, and the silicon wafer can be completely immersed in water; when inserting the silicon wafer, the width of the clamping roller 20 is adjusted to release the silicon wafer, so that the silicon wafer can be continuously removed for slicing.

Specifically, in the present embodiment, in order to simplify the structure to the maximum, two clamping rollers 20 and two lower rods 30 are provided on the basis of ensuring the stability of the silicon wafer placement, all the clamping rollers 20 and the lower rods 30 are arranged in parallel and at intervals along the length direction of the frame body 10, and both the clamping rollers 20 and the lower rods 30 are symmetrically arranged with respect to the length axis of the frame body 10. The structure is beneficial to immersing the bearing material frame carrying the silicon wafer into water liquid for soaking, so that the gaps at the periphery of the silicon wafer are filled with the water liquid, and the water liquid can overflow from the gaps in time when the silicon wafer bearing material frame rises, thereby ensuring that the silicon wafer is not cracked or washed away; the structural strength is improved, and the resistance of water liquid overflow can be reduced.

The clamping roller 20 is pushed by the push rod 50 arranged at the outer side to move left and right along the width direction of the frame body 10; the clamping roller 20 is a sheet-shaped lath structure with a certain width, the outer wall of the clamping roller 20 is wrapped by a protective sleeve with an elastic structure to directly contact with the silicon wafer, so that the silicon wafer is protected, the silicon wafer is prevented from being cracked due to direct clamping of the silicon wafer, and meanwhile, the silicon wafer is prevented from being polluted by metal impurities due to the fact that the metal lath directly contacts with the silicon wafer, and parameters of the silicon wafer are influenced. When the silicon wafer is placed, the silicon wafer can be guided into the wafer cavity 40 along the height direction of the wafer cavity 40 by the inner wall of the protective sleeve outside the clamping roller 20, and then is clamped and fixed by the clamping roller 20 and the lower rod 30.

The push rod 50 is fixedly arranged on the upright 70 at the bottom of the frame body 10 and can rotate and move relative to the upright 70, the push rod 50 is fixedly provided with a limiting block 100, the limiting block 100 and the push rod 50 are obliquely connected, the limiting block 100 is directly and fixedly connected with the clamping stick 20, and therefore the push rod 50 is hinged with the clamping stick 20 through the limiting block 100. The initial position of the push rod 50 is arranged on one side far away from the wafer cavity 40, at the moment, the clamping roller 20 is of a structure which is arranged obliquely outwards, when the push rod 50 moves towards the central axis of the wafer cavity 40, the push rod 50 pushes the clamping roller 20 to be vertically arranged at the silicon wafer vertical face through the limiting block 100, so that the inner wall face of the clamping roller 20 is in full contact with the silicon wafer vertical face, and the silicon wafer is completely clamped and cubed in the wafer cavity 40. The structure can further ensure the working stability of the clamping roller 20, reduce the production cost of the whole structure and improve the working flexibility and precision of the clamping roller 20.

The two ends of each push rod 50 are respectively provided with an inclined block 60 connected with the two ends of each push rod 50, the lower ends of the inclined blocks 60 are connected with the bottom of the frame body 10, the inclined blocks 60 are stressed to drive the push rods 50 to rotate oppositely, and the push rods 50 drive the clamping rods 20 to rotate through the limiting blocks 100 so that the clamping rods 20 gradually change from an inclined outward structure to a vertical downward structure to move towards the middle direction close to the wafer cavity 40 to complete the clamping of the silicon wafer. When the inclined block 60 is forced to drive the push rod to rotate back and forth, the push rod 50 adjusts the clamping roller 20 through the limiting block 100, and the push rod 50 drives the clamping roller 20 to rotate through the limiting block 100, so that the clamping roller 20 gradually expands outwards from a vertically downward structure to form an inclined outwards structure to move towards the middle direction away from the sheet cavity 40.

At least two groups of limiting blocks 100 capable of adjusting the angle of the clamping rods 20 are arranged on each push rod 50, each limiting block 100 comprises two inclined blocks which are tightly attached to adjacent arrangement, the contact surfaces of the two inclined blocks and the clamping rods 20 are of a staggered structure so as to adjust the inclined or vertical positions of the clamping rods 20, and one ends, far away from the clamping rods 20, of the inclined blocks are fixedly sleeved on the push rods 50. The purpose of the oblique blocks arranged in a staggered manner is to ensure that the clamping roller 20 can rotate from the initial position of the inclined surface and be stabilized at the regular position of the vertical surface, so that more accurate corner rotation can be obtained, the control is easy, the angle of the corner is controllable, the overall structure is simple, and the implementation is easy.

Further, the lower rod 30 is fixedly suspended on a support block at the bottom of the frame body 10 for supporting the bottom surface of the silicon wafer. In order to ensure the height of the whole material bearing frame and the cleaning tank and the adaptation of the placing tank of the wafer inserting machine, a certain distance is reserved between the lower rod 30 and the bottom of the frame body 10, so as to increase the circulation capacity of water liquid in the frame body 10 and improve the cleaning effect of the silicon wafer.

A baffle 80 for preventing the silicon wafer from inclining is arranged at any end part of the wafer cavity 40, the baffle 80 is vertically arranged above the low rod 30, and one end of the wafer cavity 40 far away from the baffle 80 is arranged in a vacant way.

All set the hook post 90 that is used for the manipulator to snatch the location at the both sides tip of support body 10, hook post 90 corresponds the setting and sets up for the axis symmetry of support body 10 to hook post 90 is as the hook point of getting, and the manipulator of being convenient for hangs and gets material frame 10.

An inserting piece device adopts the silicon wafer placing material frame.

During cleaning, the silicon wafers are guided into the wafer cavity 40 along the height direction of the wafer cavity 40 by the inner wall of the protective sleeve on the clamping roller 20, and the silicon wafers are intensively placed at one end close to the baffle 80; meanwhile, the inclined blocks 60 are forced to drive the push rods 50 to rotate towards each other, and the push rods 50 drive the clamping rollers 20 to rotate through the limiting blocks 100 so that the clamping rollers 20 gradually change from an inclined outward structure to a vertical downward structure to move towards the middle direction close to the wafer cavity 40 and then are clamped and fixed by the clamping rollers 20 and the lower rods 30, thereby completing the clamping of the silicon wafer.

During sheet insertion, the inclined block 60 is controlled to be forced to drive the push rod to rotate back and forth, so that the push rod 50 can adjust the clamping roller 20 through the limiting block 100, the push rod 50 drives the clamping roller 20 to rotate through the limiting block 100, the clamping roller 20 gradually expands outwards from a vertical downward structure to form an inclined outwards structure, the clamping roller 20 moves towards the middle direction far away from the sheet cavity 40, and the silicon sheet can be continuously and gradually removed to finish sheet separation.

The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims

1. A silicon wafer placing material frame is characterized by comprising:

a frame body; and

2. The silicon wafer placing frame as claimed in claim 1, wherein the clamping rods are pushed by a stopper on a pushing rod disposed outside the clamping rods so as to reciprocate from an inclined position where the initial opening is disposed outward to a straight position where the clamping rods are disposed vertically.

3. The silicon wafer placing material frame as claimed in claim 2, wherein the push rod is fixedly arranged on the upright at the bottom of the frame body, and the push rod is hinged with the upright.

4. The silicon wafer placing material frame as claimed in claim 2 or 3, wherein two ends of each push rod are provided with an inclined block connected with the push rod, the lower end of each inclined block is connected with the bottom of the frame body, and the inclined blocks drive the push rods to move towards or away from the middle of the frame body under the force of the inclined blocks.

5. The silicon wafer placing material frame according to claim 4, wherein the clamping rods and the low rods are arranged in parallel along the length direction of the frame body;

6. The silicon wafer placing frame as claimed in claim 1, wherein the clamping roller is a sheet-like lath structure, and a protective sleeve of an elastic structure is wrapped on the outer wall of the clamping roller to directly contact the silicon wafer.

7. The silicon wafer placing material frame as claimed in any one of claims 1 to 3 and 5 to 6, wherein the lower rod is fixedly suspended at the bottom of the frame body for supporting the bottom surface of the silicon wafer.

8. The silicon wafer placing material frame as claimed in claim 7, wherein a baffle plate for preventing the silicon wafer from inclining is provided at either end of the frame body, and the baffle plate is vertically fixed above the lower rod and placed inside the clamping roller.

9. The silicon wafer placing material frame as claimed in any one of claims 1 to 3, 5 to 6 and 8, wherein hook posts for grabbing and positioning are provided at both side ends of the frame body.

10. An insert device, characterized in that a silicon wafer placing material frame according to any one of claims 1 to 9 is used.