CN216213310U

CN216213310U - Silicon chip comes unstuck with bearing mechanism

Info

Publication number: CN216213310U
Application number: CN202122678277.8U
Authority: CN
Inventors: 靳立辉; 杨骅; 姚长娟; 李伟; 朱耀彬; 尹擎; 王国瑞; 高洁; 杨杰; 杨鹏
Original assignee: Tianjin Huanbo Science and Technology Co Ltd
Current assignee: Tianjin Huanbo Science and Technology Co Ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-04-05
Anticipated expiration: 2031-11-04

Abstract

A bearing mechanism for degumming silicon wafers comprises: the feeding frame and the discharging frame are stacked; the feeding frame is provided with a cavity for suspending a silicon wafer; the blanking frame is provided with a wafer cavity for placing the silicon wafer; the feeding frame is provided with a turning plate assembly which is used for fixing the material seat when the material seat adhered with the silicon wafer enters the cavity so as to enable the silicon wafer to be suspended in the cavity; the blanking frame is provided with a clamping component which can vertically place the silicon wafer in the wafer cavity after the material seat is separated from the silicon wafer. The bearing mechanism provided by the utility model can bear the silicon wafers with different sizes and specifications, so that the material seat integrally connected with the silicon wafers can be safely and stably suspended and erected in the feeding frame, and after the material seat is separated from the silicon wafers, the silicon wafers can be intensively placed in the discharging frame, and the insertion is convenient.

Description

Silicon chip comes unstuck with bearing mechanism

Technical Field

The utility model belongs to the technical field of silicon wafer manufacturing equipment, and particularly relates to a bearing mechanism for degumming a silicon wafer.

Background

In the process of processing the silicon wafer, the degumming and cleaning of the silicon wafer are one of the key links of the whole silicon wafer manufacturing process, and the cleaning effect of the silicon wafer and the yield of the silicon wafer are directly influenced. During the material frame need be placed with silicon chip body coupling's material seat to the silicon chip before coming unstuck, the current unloading bears the weight of the device and only for carrying the casing groove of water, no matter be to the protectiveness of silicon chip still to the fixed stability of material seat all relatively poor, and collide with the silicon chip easily, leads to the silicon chip piece more, also can't adapt to current automated production, leads to the transportation difficulty between slicer and the degumming machine, and production efficiency is low and product quality is unstable.

SUMMERY OF THE UTILITY MODEL

The utility model provides a bearing mechanism for degumming silicon wafers, which is particularly suitable for degumming and cleaning the sliced silicon wafers, solves the problems of stability and safety of placement of the silicon wafers during blanking in the prior art, and improves the yield.

In order to solve the technical problems, the utility model adopts the technical scheme that:

a bearing mechanism for degumming silicon wafers comprises:

the feeding frame and the discharging frame are stacked;

the feeding frame is provided with a cavity for suspending a silicon wafer;

the blanking frame is provided with a wafer cavity for placing the silicon wafer;

the feeding frame is provided with a turning plate assembly which is used for fixing the material seat when the material seat adhered with the silicon wafer enters the cavity so as to enable the silicon wafer to be suspended in the cavity;

the blanking frame is provided with a clamping component which can vertically place the silicon wafer in the wafer cavity after the material seat is separated from the silicon wafer.

Further, the board subassembly that turns over is located on the material loading frame body and with the material loading frame body encloses into the cavity includes:

the connecting rod and the support plate are symmetrically arranged;

the support plate rotates to be close to or far away from the material seat along the axial direction of the connecting rod between the vertical upward direction and the horizontal direction so as to adjust the width of the cavity to jack and fix the material seat or release the material seat;

one side of the support plate, which is far away from the connecting rod, is a stepped surface, and the width of the upper end surface of the stepped surface is smaller than that of the lower end surface of the stepped surface;

each support plate is provided with a continuous bending surface formed by a plurality of grooves arranged at intervals.

Furthermore, each connecting rod is provided with at least two connecting plates hinged with the connecting rod, and an elastic piece is arranged beside each connecting plate, wherein,

the other end of each connecting plate is connected with the support plate, and the connecting plates are arranged close to the end part of the connecting rod;

the elastic piece is arranged by the connecting rod in a penetrating way, one end of the elastic piece is fixedly arranged on the feeding frame body, and the other end of the elastic piece is fixedly arranged on the connecting plate;

the elastic piece rotates along the axial direction of the connecting rod and then drives the support plate to do reciprocating rotation movement through the connecting plate.

Further, the clamping assembly is arranged on the inner side of the blanking frame body and forms the sheet cavity, and comprises:

a plurality of fixedly arranged low rods and a group of oppositely arranged side rollers which can be movably arranged;

the lower rod is arranged at the bottom of the blanking frame body and used for supporting the bottom surface of the silicon wafer;

the side rollers are symmetrically arranged on two sides of the silicon wafer cavity and used for clamping the vertical surfaces of the silicon wafers;

the side rollers can synchronously rotate and move in the opposite direction or in the opposite direction along the width direction of the silicon wafer cavity so as to tighten the width of the silicon wafer cavity to clamp the vertical surface of the silicon wafer or enlarge the width of the silicon wafer cavity to loosen the silicon wafer.

Furthermore, two groups of inclined blocks are arranged at the end part of the blanking frame body to control the width size between the two side rollers; the inclined blocks slide oppositely or in different directions along the width direction of the bottom of the blanking frame so as to drive the side rollers to rotate.

Furthermore, a side rod is arranged between the two inclined blocks at the end part of each side roller, and the inclined blocks are connected with the side rollers through the side rods.

Furthermore, the outer wall of the side roller is sleeved with a guide sleeve with an elastic structure, and the silicon wafer separated from the material seat is guided into the wafer cavity along the height direction of the wafer cavity by the inner wall of the side roller and is fixed by the side roller and the low rod in a surrounding manner.

Further, a baffle plate for preventing the silicon wafer from inclining is arranged at either end part of the wafer cavity.

Furthermore, both sides of the end part of the feeding frame body and the end part of the discharging frame body are provided with a primary and secondary alignment block and a hook column; and one or more groups of inverted V-shaped, inverted U-shaped or inverted W-shaped boss structures are arranged in the primary and secondary alignment blocks.

Furthermore, the boss structures in the two primary and secondary alignment blocks at any group of end parts of the feeding frame body are arranged in different directions.

The bearing mechanism designed by the utility model is suitable for a linking and carrying tool from slicing and blanking to degumming and between the inserting pieces, has reasonable overall structure arrangement, high matching precision, wide universality, capability of bearing silicon wafers with different sizes and specifications for placement, capability of protecting the safety of separation of the silicon wafers and the material seat, good yield and high efficiency.

Drawings

Fig. 1 is a perspective view of a carrier mechanism for degumming a silicon wafer according to an embodiment of the utility model;

FIG. 2 is a perspective view of an upper frame of one embodiment of the present invention;

FIG. 3 is a schematic structural view of a plate according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a plate according to another embodiment of the present invention;

FIG. 5 is a perspective view of a lower frame according to one embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a plurality of sets of primary and secondary alignment blocks according to a first embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a plurality of sets of child-mother alignment blocks according to a second embodiment of the present invention;

fig. 8 is a schematic structural diagram of a plurality of sets of child-mother alignment blocks according to a third embodiment of the present invention.

In the figure:

10. feeding frame 11, upper frame body 12 and connecting rod

13. Support plate 14, connecting plate 15 and elastic piece

16. Support member 17, cavity 18 and upper alignment block

19. Upper hook column 20, blanking frame 21 and lower frame body

22. Low rod 23, side roller 24, oblique block

25. Side lever 26, baffle 27, sheet cavity

28. Lower alignment block 29, lower hook column 30 and material seat

Detailed Description

The utility model is described in detail below with reference to the figures and specific embodiments.

The embodiment provides a bearing mechanism for degumming silicon wafers, which is suitable for a connecting carrier from slicing and blanking to degumming and inserting pieces, and comprises a feeding frame 10 and a blanking frame 20 which are stacked as shown in fig. 1; the feeding frame 10 is provided with a cavity 17 for placing silicon wafers in a hanging mode, the blanking frame 20 is provided with a wafer cavity 27 for placing the silicon wafers, and when the feeding frame 10 and the blanking frame 20 are stacked up and down, the cavity 17 and the wafer cavity 27 are communicated; the feeding frame 10 is also provided with a turning plate assembly which fixes the material seat 30 in the cavity 17 when the material seat 30 adhered with the silicon wafer enters the cavity 17 so as to enable the silicon wafer to be suspended in the cavity 17 and positioned above the wafer cavity 27, the turning plate assembly can rotate oppositely along the center line of the cavity 17 from the vertical upward direction to the horizontal direction to accurately enable the material seat 30 to be jacked and fixed, so that the silicon wafer is stably suspended in the cavity 17, the quality of the whole silicon wafer can not be influenced, and the silicon wafer can be completely immersed in water. The blanking frame 20 is also provided with a clamping component which can enable the silicon wafer to stand in the wafer cavity 27 after the material seat 30 is separated from the silicon wafer, and the clamping component can clamp the vertical surface of the silicon wafer separated from the material seat 30 along the width direction of the wafer cavity 27 so as to enable the silicon wafer to be intensively and stably clamped in the wafer cavity 27 to be vertically placed; when the silicon wafer is required to be inserted, the width of the clamping assembly is adjusted to release the silicon wafer, so that the silicon wafer is moved away to enter a wafer inserting machine in the next process for inserting the silicon wafer.

Specifically, as shown in fig. 2, the flap assembly is disposed in the upper frame body 11 of the feeding frame 10 and encloses a cavity 17 with the upper frame body 11, and includes a connecting rod 12 and a supporting plate 13 which are symmetrically disposed, the supporting plate 13 rotates between a vertical upward direction and a horizontal direction along an axial direction of the connecting rod 12, so that the supporting plate 13 is close to or away from the material seat 30, the width of the cavity 17 is adjusted to lift the material seat 30 so that a silicon wafer is suspended in the cavity 17, or the material seat 30 is released so that the silicon wafer separated from the material seat 30 can be landed downwards from the cavity 17 into the wafer cavity 27 for placement.

The connecting rod 12 and the support plate 13 are arranged in parallel along the length direction of the cavity 17 at intervals, and the structure is favorable for soaking the bearing material frame carrying the silicon wafer into water liquid, so that the periphery of the silicon wafer is filled with the water liquid in a vacant space, the water liquid can overflow from each interval in time when the silicon wafer bearing material frame rises, and the silicon wafer is prevented from being cracked or washed away. One side of the support plate 13, which is far away from the connecting rod 12, is a stepped surface, and the width of the upper end surface of the stepped surface is smaller than that of the lower end surface thereof, which is also beneficial to matching the side wall surface of the material seat 30 after the support plate 13 rotates from bottom to top to make the material seat 30 be supported and clamped and suspended. The existing material seat 30 is a stepped structure, the silicon rod is adhered to a flitch on the material seat 30, the width of the flitch is smaller than that of the material seat 30, and the silicon wafer is arranged downwards, and correspondingly, the material seat 30 is arranged upside down, so that a stepped surface is arranged to be in contact with the side wall surface of the material seat 30, and the material seat 30 can be supported and erected fixedly by the support plates 13 which are symmetrically arranged in a suspended mode in the cavity 17.

Furthermore, each support plate 13 has a continuous curved surface formed by a plurality of grooves arranged at intervals, and the openings of the grooves are arranged towards one side close to the material seat 30. That is to say, a plurality of grooves are formed, so that the manipulator for grabbing the material seat 30 is matched with the support plate 13, interference cannot occur, the manipulator is avoided, the manipulator is convenient to grab the material seat 30, and the blanking work or the material taking work of the material seat 30 is completed. The width and the depth of the groove are matched with the hand grip of the manipulator. Preferably, the groove can be a groove body with a square structure, as shown in fig. 3, and the groove with the structure has a simple structure and is convenient to process; or the groove body is of an arc structure, as shown in fig. 4, the groove of the structure can reduce the stress concentration of the support plate 13, improve the structural strength of the support plate, and simultaneously reduce the resistance of water liquid overflow. In order to ensure the grabbing stability of the material seat 30, the manipulator is matched with the middle section of the material seat 30, so that the bending surface is located at the middle position of the support plate 13, namely all the grooves are symmetrically arranged relative to the middle position of the length of the support plate 13.

In the present embodiment, the brackets 13 rotate from a vertical upward direction directly below the connecting rod 12 to a horizontal direction, so that the material seat 30 is suspended. In order to ensure that the support plate 13 automatically supports, rotates or is put back, at least two connecting plates 14 hinged with each connecting rod 12 are arranged on each connecting rod 12, and an elastic piece 15 is arranged beside each connecting plate 14, wherein one end of each connecting plate 14 hinged with each connecting rod 12 is of an annular structure and is arranged around the outer diameter of each connecting rod 12, the other end of each connecting plate is connected with the support plate 13, and each connecting plate 14 can be of an independent square structure, as shown in fig. 2; the structure can be a structure with a plurality of plate types, which is not limited in particular, as long as the structure can fix the support plate 13 and drive the support plate 13 to rotate and move together. In order not to influence the rotation of the bending surface where the groove is located, the connecting plates 14 are preferably arranged close to the end portions of the connecting rods 12, so that the connecting rods 12 are easy to fix, the working stability of the plate turning assembly is guaranteed, the production cost of the whole structure can be reduced, and the working flexibility and precision of the plate turning assembly are improved.

The elastic member 15 is penetrated by the connecting rod 12, and preferably, the elastic member 15 is a conventional spring, and one end of the elastic member is fixed on the upper surface of the upper frame 11, and the other end is fixed on the side wall surface of the connecting plate 14. The elastic member 15 is controlled by external force to rotate along the axial direction of the connecting rod 12, and further drives the support plate 13 to do reciprocating rotation movement through the control connecting plate 14.

A support member 16 for supporting the connecting plate 14 when the connecting plate 14 is horizontally arranged is arranged on one side of the end portion of the upper frame body 11 close to the connecting plate 14, the support member 16 is a support frame body with one end fixedly arranged on the upper frame body 11 and the other end fixedly suspended below the connecting plate 14, in the embodiment, the support member 16 is arranged in parallel with the connecting rod 12 and perpendicular to the connecting plate 14 and is a triangular support beam, the horizontally arranged support beam is the upper end face of the support member 16 and is directly contacted with the lower end face of the connecting plate 14, the vertical side beam is fixed with the upper frame body 11, and the inclined support beam is used for reinforcing the overall strength of the support member 16.

As shown in fig. 5, the clamping assembly is disposed inside the lower frame 21 in the blanking frame 20 and forms a sheet cavity 27, including: a plurality of fixedly arranged lower rods 22 and movably arranged side rollers 23; wherein, the lower bar 22 is arranged at the bottom of the lower frame 20 and is fixed on the support block in a suspended manner, and the lower bar 22 is used for supporting the bottom surface of the silicon wafer. The side rollers 23 are symmetrically arranged at two sides of the wafer cavity 27 and are used for clamping the vertical surface of the silicon wafer. In order to ensure the height of the whole material bearing frame and the cleaning tank and the adaptation of the material placing tank of the inserting machine, a certain distance is reserved between the lower rod 22 and the bottom of the lower frame body 20, and meanwhile, the circulation capacity of water liquid in the lower frame body 21 can be increased, so that the cleaning effect of the silicon wafer is improved. The side roller 23 can move left and right along the width direction of the silicon slice cavity 27 so as to clamp the vertical surface of the silicon slice by tightening the width of the silicon slice cavity 27 or enlarge the width of the silicon slice cavity 27 to loosen the silicon slice.

In this embodiment, two low bars 22 are optionally provided to support the silicon wafer bottom surface symmetrically with respect to the axis of the wafer cavity 27. The side roller 23 is a strip with a certain width, and the outer wall of the side roller is sleeved with a guide sleeve with an elastic structure, so that the silicon wafer is protected, the silicon wafer is prevented from being cracked due to clamping of the silicon wafer, and meanwhile, the silicon wafer is prevented from being polluted by metal impurities due to direct contact of the metal strip and the silicon wafer, and the technical parameters of the silicon wafer are influenced. The silicon wafer separated from the material seat 30 is guided into the wafer cavity 27 by the inner wall of the side roller 23 along the height direction of the wafer cavity 27, and then is surrounded and fixed by the side roller 23 and the lower rod 22.

Further, an inclined block 24 having a self-locking function is provided at an end of the lower frame 21, and the inclined block 24 can control the width of the side roller 23 by an external force. A side rod 25 is arranged between adjacent oblique blocks 24 on the same side along the length direction of the sheet cavity 27, and the oblique blocks 24 are connected with the side rollers 23 through the side rods 25; meanwhile, the side rods are fixed on the lower frame body 21 through three upright posts. A baffle 26 for preventing the silicon wafer from inclining is arranged at any end part of the wafer cavity 27, the baffle 26 is vertically arranged above the lower rod 22, and one end of the wafer cavity 27 far away from the baffle 26 is arranged in a vacant way. Further, the side rollers 23, the lower bar 22, and the baffle 26 together enclose a sheet chamber 27.

Furthermore, an inclined block 24 with a self-locking function is provided, one end of the inclined block 24 is fixed at the end part of the side rod 25, and the other end is hinged with the bottom of the lower frame body 21; meanwhile, the inclined block 24 is connected with the side rods 25 through structures such as the elastic piece 15, when the inclined block 24 is pushed by external force, the side rollers 23 are contracted inwards through the elastic piece 15 and locked in position, so that the width of the die cavity 27 is reduced, and the side rollers 23 clamp the silicon wafer; when the inclined block 24 is pulled by an external force, the side roller 23 is expanded outward by the elastic member 15 and locked, thereby expanding the width of the wafer cavity 27 to allow the side roller 23 to release the silicon wafer.

In order to ensure the accuracy of the vertical stacking and matching of the feeding frame 10 and the discharging frame 20, four sets of primary and secondary alignment blocks are arranged at the end part of the upper frame body 11 of the feeding frame 10 and two sides of the end part of the lower frame body 21 of the discharging frame 20, including an upper alignment block 18 and a lower alignment block 28, and at least one set of boss structures for aligning positions are arranged on the butt joint surface of the upper alignment block 18 and the lower alignment block 28; the boss structures in the two primary and secondary alignment blocks at any group of end portions of the frame bodies of the feeding frame 10 and the discharging frame 20 are arranged in different directions, that is, the length of the butt-joint surface in the primary and secondary alignment blocks is arranged along the length direction of the primary and secondary alignment blocks, and as shown in fig. 5, the length of the butt-joint surface in the two primary and secondary alignment blocks at one end of the discharging frame 20 close to the baffle 26 is arranged in parallel with the length of the side roller 23; accordingly, the length of the abutting surface in the two primary and secondary alignment blocks at the end of the blanking frame 20 far from the baffle 26 is perpendicular to the length of the side roller 23. The butt joint surface structure of the composite alignment blocks arranged in different directions can further improve the butt joint precision of the upper material frame and the lower material frame so as to ensure that the silicon wafer can be safely placed in the cavity 17, and is simple and reliable.

Preferably, the boss structure is an inverted V-shaped or inverted U-shaped or inverted W-shaped, as shown in fig. 6-8, one or more groups of V-shaped or U-shaped or W-shaped boss structures may be disposed on the primary and secondary alignment blocks, and the primary and secondary alignment blocks at the end of each frame body are fixed on the frame body in different directions.

Specifically, as shown in fig. 6, in the present embodiment, a set of inverted V-shaped, inverted U-shaped, or inverted W-shaped boss structures is disposed on each of the primary and secondary alignment blocks, where the inverted V-shaped boss structures are shown in fig. 6 (a); the inverted U-shaped boss structure is shown in FIG. 6 (b); the inverted-W boss structure is shown in fig. 6 (c); and the primary and secondary contraposition blocks at the end part of each frame body are fixed on the frame body in different directions. Meanwhile, one end of the upper frame body 11 is an upper alignment block 18 with a boss structure arranged in parallel to the width direction of the upper frame body 11, and the other end of the upper frame body 11 is an upper alignment block 18 with a boss structure arranged perpendicular to the width direction of the upper frame body 11, so that the upper frame body 11 and the lower frame body 21 can be matched conveniently by the aid of the master-slave alignment block arranged in a different direction, and the vertical alignment accuracy is improved; meanwhile, the upper frame body 11 and the lower frame body 21 can be prevented from sliding, and the stability of matching and fixing is improved. Of course, the upper alignment block 18 and the lower alignment block 28 in the primary and secondary alignment blocks can be interchanged, that is, the lower alignment block 28 is disposed on the upper frame body 11, and the upper alignment block 18 is disposed on the lower frame body 21, as shown in fig. 6, both the upper frame body 11 and the lower frame body 21 can be aligned in a matching manner.

Fig. 7 shows a schematic structural diagram of a cross section of another primary and secondary alignment block, and compared with fig. 6, the most significant difference of this embodiment is that two sets of inverted V-shaped, inverted U-shaped, or inverted W-shaped boss structures are arranged on the abutting surface of each primary and secondary alignment block. Wherein, two consecutive inverted V-shaped boss structures are shown in FIG. 7 (a); two consecutive inverted U-shaped boss structures are shown in fig. 7 (b); two consecutive inverted W-shaped boss structures are shown in fig. 7 (c); the primary and secondary alignment blocks with the structure can further improve the matching precision of the primary and secondary alignment blocks, even if one boss structure is worn or a gap is formed, the other boss structure can be matched, and the purpose of accurate butt joint can be achieved.

Fig. 8 shows a schematic structural diagram of a cross section of a third primary and secondary alignment block, and compared with fig. 6, the biggest difference in this embodiment is that two sets of inverted V-shaped, inverted U-shaped, or inverted W-shaped boss structures are arranged on the abutting surface of each primary and secondary alignment block. Wherein, two consecutive inverted V-shaped boss structures oppositely connected and arranged are shown in FIG. 8 (a); two continuous inverted U-shaped boss structures oppositely connected and arranged are shown in fig. 8 (b); two consecutive inverted W-shaped boss structures oppositely and oppositely arranged are shown in fig. 8 (c); the primary and secondary alignment blocks with the structure can further improve the matching precision of the primary and secondary alignment blocks and can also achieve the purpose of accurate butt joint.

Furthermore, two groups of upper hook posts 19 are arranged on two sides of the end portion of the upper frame body 11, two groups of lower hook posts 29 are arranged on two sides of the end portion of the lower frame body 21, the upper hook posts 19 and the lower hook posts 29 are correspondingly arranged up and down and are symmetrically arranged relative to the axis of the sheet cavity 27, and the hook posts are used as hooking points, so that the mechanical clamping jaws can conveniently lift the feeding frame 10 and the discharging frame 20.

In operation, the loading frame 10 is stacked on the unloading frame 20 with the support plate 13 in an initial position vertically upward. When the manipulator operates the material seat 30 with the silicon chip to be fed into the cavity 17 on the feeding frame 10, the elastic members 15 on the connecting rods 12 on the two sides synchronously rotate 90 degrees in opposite directions along the axial direction of the connecting rods 12 to the horizontal direction under the control of external force, at this time, the width of the cavity 17 is minimum, and the step surfaces of the two support plates 13 are respectively contacted with the two side wall surfaces of the material seat 30, so that the material seat 30 is suspended and reinforced in the cavity 17, and the silicon chip blanking work is completed. During blanking, as the silicon wafer is completely softened and peeled off from the adhesive on the material seat 30, the side rollers 23 in the clamping assembly of the blanking frame 20 are controlled to clamp the vertical side elevation of the silicon wafer, and the manipulator grasps the material seat 30 and pulls the material seat 30 to move upwards, so that the silicon wafer is separated from the material seat 30. After the material seat 30 is removed, the upper hook column 19 is hooked through a mechanical gripper so as to remove the material loading frame 10, and meanwhile, the inclined block 24 in the material unloading frame 20 is controlled to be pressed so as to slowly release and lock the side roller 23, so that the silicon wafer can vertically slide downwards along the inner wall surface of the side roller 23 and land in the wafer cavity 27; and the inclined block 24 is controlled to be pulled so that the side rollers 23 are contracted inwards and locked, so that the side rollers 23 completely clamp the silicon wafer, and the bearing and fixing of the silicon wafer are completed.

The turnover plate assembly in the feeding frame can be used for fixing a material seat loaded with a silicon wafer, the material seat integrally connected with the silicon wafer can be safely and stably automatically suspended and erected in a cavity in the feeding frame, the fixation of the material seat is completed, and stable blanking from a slicing machine is realized.

After the material seat is separated from the silicon wafer, the clamping assembly in the blanking frame can clamp the silicon wafer by controlling the side roller, so that the silicon wafer is stably and accurately gathered in the wafer cavity in the blanking frame to be placed, and a foundation is laid for subsequent uniform insertion of the wafer. The linkage of the turning plate assembly and the clamping assembly completely realizes the loading of the silicon wafer conveyed to the degumming, inserting and cleaning integrated machine from the slicing and blanking through the conveyor line body, and automatically completes the degumming and separation of the material seat and the silicon wafer.

The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims

1. A bearing mechanism for degumming of silicon wafers is characterized by comprising:

the feeding frame and the discharging frame are stacked;

the feeding frame is provided with a cavity for suspending a silicon wafer;

2. The carrying mechanism for silicon wafer degumming according to claim 1, wherein the flap assembly is arranged on the feeding frame body and encloses the cavity with the feeding frame body, comprising:

the connecting rod and the support plate are symmetrically arranged;

3. The carrying mechanism for silicon wafer degumming according to claim 2, wherein each connecting rod is provided with at least two connecting plates hinged with the connecting rod, and an elastic element is arranged beside each connecting plate,

4. The carrying mechanism for degumming silicon wafers according to any of the claims 1-3,

the centre gripping subassembly is arranged in the internal side of unloading frame and is formed the piece chamber includes:

5. The bearing mechanism for degumming silicon wafers according to claim 4, wherein two groups of inclined blocks are arranged at the end part of the blanking frame body to control the width dimension between the two side rollers; the inclined blocks slide oppositely or in different directions along the width direction of the bottom of the blanking frame so as to drive the side rollers to rotate.

6. The carrying mechanism for silicon wafer degumming according to claim 5, wherein a side bar is arranged between two sloping blocks at the end part of each side roller, and the sloping blocks are connected with the side rollers through the side bars.

7. The bearing mechanism for degumming of silicon wafers according to claim 5 or 6, wherein the outer wall of the side roller is sleeved with a guide sleeve with an elastic structure, and the silicon wafers separated from the material seat are guided into the wafer cavity by the inner wall of the side roller along the height direction of the wafer cavity and are fixed by the side roller and the low rod surrounding clamp.

8. The carrying mechanism for degumming silicon wafers according to claim 7, wherein a baffle plate for preventing the silicon wafers from tilting is arranged at either end of the wafer cavity.

9. The carrying mechanism for degumming silicon wafers according to any of claims 1-3, 5-6 and 8, wherein both sides of the end part of the feeding frame body and the end part of the discharging frame body are provided with a primary and secondary alignment block and a hook column; and one or more groups of inverted V-shaped, inverted U-shaped or inverted W-shaped boss structures are arranged in the primary and secondary alignment blocks.

10. The carrying mechanism for degumming of silicon wafers according to claim 9, wherein the boss structures in the two primary and secondary alignment blocks at any group of ends of the feeding frame body are arranged in opposite directions.