CN216172653U - Reducing mechanism is used in semiconductor manufacture - Google Patents
Reducing mechanism is used in semiconductor manufacture Download PDFInfo
- Publication number
- CN216172653U CN216172653U CN202122096951.1U CN202122096951U CN216172653U CN 216172653 U CN216172653 U CN 216172653U CN 202122096951 U CN202122096951 U CN 202122096951U CN 216172653 U CN216172653 U CN 216172653U
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- Prior art keywords
- fixedly connected
- collecting box
- box
- silica
- semiconductor production
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 40
- 238000001914 filtration Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims 2
- 235000017491 Bambusa tulda Nutrition 0.000 claims 2
- 241001330002 Bambuseae Species 0.000 claims 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims 2
- 239000011425 bamboo Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 2
- 241000220317 Rosa Species 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007670 refining Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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Landscapes
- Silicon Compounds (AREA)
Abstract
The utility model relates to the technical field of semiconductors, in particular to a crushing device for semiconductor production, which solves the problem that in the prior art, a crusher cannot completely crush silica by one-time crushing, and massive silica is mixed with powder, so that the quality of a supported semiconductor is poor. The crushing device for semiconductor production comprises a collecting box fixed on the ground through a bearing plate, a crusher used for crushing silica is arranged on the collecting box, a mounting frame is fixedly connected onto the collecting box, a filtering mechanism used for filtering silica is arranged in the collecting box, a conveying cylinder is fixedly connected to the ground on the left side of the collecting box, a conveying mechanism used for repeatedly crushing is arranged in the conveying cylinder, and an installation cylinder with an opening at the lower end is fixedly connected into the collecting box. The utility model can filter the semiconductor raw material silica, and can crush the silica for many times to ensure that the required refinement degree is reached.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a crushing device for semiconductor production.
Background
The semiconductor is widely applied in the fields of integrated circuits, photovoltaic power generation, illumination, high-power conversion and the like, wherein the semiconductor also comprises a diode, and the semiconductor is closely related to the core unit of most electronic products.
Most of the conventional semiconductors use silicon as a raw material, and silicon is originally silica in the production process, so that it is necessary to pulverize silicon, and then to perform a series of processes after the pulverization, thereby obtaining a desired semiconductor material.
The existing silica can be basically and automatically fed and crushed during crushing, but because some silicon carbide is contained in the silica, the hardness is very high, the Mohs hardness is 9.5, so that part of the silica is not crushed during the crushing process, and because the existing crusher only carries out the sequential crushing, the quality of a semiconductor is poor when the crushed silica is used for preparing the semiconductor.
Therefore, a semiconductor manufacturing pulverizing apparatus is required to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a crushing device for semiconductor production, which solves the problems that in the prior art, a crusher can not completely crush silica by one-time crushing, and massive silica is mixed with powder, so that the quality of a supported semiconductor is poor.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the crushing device for semiconductor production comprises a collecting box fixed on the ground through a bearing plate, a crusher used for crushing silica is arranged on the collecting box, a mounting frame is fixedly connected onto the collecting box, a filtering mechanism used for filtering silica is arranged in the collecting box, a conveying cylinder is fixedly connected to the ground on the left side of the collecting box, a conveying mechanism used for repeatedly crushing is arranged in the conveying cylinder, an installation cylinder with an opening at the lower end is fixedly connected into the collecting box, and a transmission mechanism used for providing power required by the conveying mechanism is arranged in the installation cylinder.
Preferably, the filtering mechanism comprises a pair of openings arranged on the collecting box, a filtering box with an opening at the lower end is connected between the pair of openings in a sliding manner, and a storage box is arranged on the lower side of the collecting box.
Preferably, conveying mechanism includes the motor of fixed connection on the mounting bracket, the pivot of being connected is rotated to the bottom in fixedly connected with and the conveying cylinder on the output shaft of motor, fixedly connected with helical blade in the pivot, the left end of rose box is equipped with the discharge gate, fixedly connected with and discharge gate complex transport box on the loading board, the transport box passes through inlet pipe and conveying cylinder intercommunication, the upper end of conveying cylinder is passed through the discharging pipe and is carried the rubbing crusher in with the material.
Preferably, the transmission mechanism comprises a reciprocating lead screw rotatably connected in the installation cylinder, a lead screw sleeve slidably connected with the inner wall of the installation cylinder is arranged on the reciprocating lead screw, and a U-shaped rod is fixedly connected onto the lead screw sleeve.
Preferably, the tail end of the U-shaped rod is fixedly connected with an electric telescopic rod through a connecting block, and the telescopic tail end of the electric telescopic rod is fixedly connected with a scraper matched with the filter box.
Preferably, the mounting bracket is rotatably connected with a transmission shaft, the transmission shaft and the motor output shaft are fixedly connected with belt wheels, the belt wheels are connected through a belt, the right side wall of the collecting box is fixedly connected with a support frame, the right end of the filter box is elastically connected with the support frame through a spring, and the lower end of the transmission shaft is fixedly connected with two transmission plates matched with the filter box.
Preferably, the left end of the reciprocating screw rod is fixedly connected with a first bevel gear through a connecting shaft, and the transmission shaft is fixedly connected with a second bevel gear meshed with the first bevel gear.
The utility model has at least the following beneficial effects:
1. through setting up filter mechanism conveying mechanism, realize smashing many times to the silica, the silica after smashing falls into the rose box in, tiny silica powder falls into the containing box through the hole on the rose box in, great silica rotates through helical blade and feeds into the rubbing crusher again with the silica, guarantees the degree of refining of silica for the finished product quality of semiconductor is better.
2. Through setting up the spring in the driving plate, realize the vibration to the rose box, when the transmission shaft pivoted, can drive the rotor plate motion, cooperation spring for reciprocating motion about the rose box makes the filter effect better, can avoid the hole jam on the rose box simultaneously.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a first perspective of a semiconductor manufacturing shredder according to the present invention;
FIG. 2 is a schematic view of a second perspective of a semiconductor manufacturing crushing apparatus according to the present invention;
FIG. 3 is an enlarged schematic view of the crushing apparatus for semiconductor manufacturing at A point;
FIG. 4 is a schematic view of a third perspective of a semiconductor manufacturing crushing apparatus according to the present invention;
fig. 5 is a schematic diagram of the internal structure of a conveying cylinder of a crushing device for semiconductor production according to the present invention.
In the figure: 1. a collection box; 2. a pulverizer; 3. a mounting frame; 4. a drive shaft; 5. a delivery cartridge; 6. mounting the cylinder; 7. a filter box; 8. a storage box; 9. a motor; 10. a helical blade; 11. a transfer box; 12. a reciprocating screw; 13. a U-shaped rod; 14. an electric telescopic rod; 15. a squeegee; 16. a pulley; 17. a belt; 18. a support frame; 19. a spring; 20. a drive plate; 21. a first bevel gear; 22. a second bevel gear.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1-5, a crushing device for semiconductor production comprises a collecting box 1 fixed on the ground through a bearing plate, a crusher 2 for crushing silica is arranged on the collecting box 1, a mounting frame 3 is fixedly connected to the collecting box 1, a filtering mechanism for filtering silica is arranged in the collecting box 1, a conveying cylinder 5 is fixedly connected to the left side of the collecting box 1 on the ground, a conveying mechanism for repeatedly crushing is arranged in the conveying cylinder 5, a mounting cylinder 6 with an opening at the lower end is fixedly connected to the collecting box 1, and a transmission mechanism for providing power needed by the conveying mechanism is arranged in the mounting cylinder 6.
Further, as can be known by referring to fig. 1, the filtering mechanism includes a pair of openings provided on the collection box 1, a filter box 7 having an opening at the lower end is slidably connected between the pair of openings, a storage box 8 is provided at the lower side of the collection box 1, and by providing the filter box 7, when the crushed silica falls into the filter box 7, the silica can be automatically filtered, thereby ensuring the quality of the semiconductor product.
Further, refer to fig. 1 and 5 and learn, conveying mechanism includes motor 9 of fixed connection on mounting bracket 3, fixedly connected with rotates the pivot of being connected with the bottom in 5 in the feed cylinder on the output shaft of motor 9, fixedly connected with helical blade 10 in the pivot, the left end of rose box 7 is equipped with the discharge gate, fixedly connected with and discharge gate complex transfer box 11 on the loading board, transfer box 11 passes through inlet pipe and 5 intercommunications of feed cylinder, the upper end of feed cylinder 5 is passed through the discharging pipe and is carried the material in rubbing crusher 2, through setting up helical blade 10 and transfer box 11, the realization can drive the pivot rotation when motor 9 output shaft pivoted, make helical blade 10 rotate and send the silica into rubbing crusher 2 again, guarantee the degree of refining of silica.
Further, as can be known by referring to fig. 2, the transmission mechanism comprises a reciprocating screw 12 rotatably connected in the installation cylinder 6, a screw sleeve slidably connected with the inner wall of the installation cylinder 6 is arranged on the reciprocating screw 12, a U-shaped rod 13 is fixedly connected on the screw sleeve, and by arranging the reciprocating screw 12, the silica which is not completely crushed is automatically scraped into the transfer box 11 and finally enters the conveying cylinder 5.
Further, as can be known by referring to fig. 2 and 3, the end of the U-shaped rod 13 is fixedly connected with an electric telescopic rod 14 through a connecting block, the electric telescopic rod 14 is in the prior art, and details are not described herein, the telescopic end of the electric telescopic rod 14 is fixedly connected with a scraper 15 matched with the filter box 7, and the electric telescopic rod 14 is arranged to realize that the electric telescopic rod 14 contracts in the rightward process, so as to avoid scraping silica into the right end of the filter box 7.
Further, can learn with reference to fig. 1 and 2, it is connected with transmission shaft 4 to rotate on the mounting bracket 3, equal fixedly connected with band pulley 16 on transmission shaft 4 and the output shaft of motor 9, connect through belt 17 between two band pulleys 16, fixedly connected with support frame 18 on the right side wall of collecting box 1, the right-hand member of rose box 7 passes through spring 19 and support frame 18 elastic connection, two lower extreme fixedly connected with of transmission shaft 4 and rose box 7 complex driving plate 20, lead to the effect and set up driving plate 20 and spring 19, realize reciprocating motion about rose box 7, make the filter effect better, can avoid the hole jam on the rose box 7 simultaneously.
Further, as can be known from fig. 1, the left end of the reciprocating screw 12 is fixedly connected with a first bevel gear 21 through a connecting shaft, the transmission shaft 4 is fixedly connected with a second bevel gear 22 engaged with the first bevel gear 21, and by arranging the first bevel gear 21 and the second bevel gear 22, the reciprocating power of the filter box 7 is shared by the scraper 15 to save power resources.
The working principle is as follows: silica is sent into the pulverizer 2, after the silica is pulverized by the pulverizer 2, the silica falls into the filter box 7, fine silica powder falls into the containing box 8 through the hole on the filter box 7, larger silica is continuously remained in the filter box 7, then the motor 9 is started, the output shaft of the motor 9 rotates to drive the belt pulley 16 to rotate, the transmission shaft 4 is driven to rotate through the belt 17, thereby the second bevel gear 21 rotates to drive the first bevel gear 21 to rotate, the reciprocating lead screw 12 rotates to drive the lead screw sleeve to move, so that the U-shaped rod 13 reciprocates left and right, in the process of rightward, the electric telescopic rod 14 contracts, the silica is prevented from being scraped into the right end of the filter box 7, the scraper 15 moves due to the movement of the U-shaped rod 13, thereby the silica with larger particles is scraped into the transfer box 11, and finally enters into the conveying cylinder 5 through the feeding pipe.
Can drive the pivot rotation when motor 9 output shaft rotates for helical blade 10 rotates and in sending the silica into rubbing crusher 2 again, guarantee the degree of refining of silica, when transmission shaft 4 pivoted, can drive the motion of rotor plate 20, cooperation spring 19 makes reciprocating motion about rose box 7, makes the filter effect better.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the utility model, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a reducing mechanism for semiconductor production, includes fixes at subaerial collecting box (1) through the loading board, its characterized in that, be equipped with rubbing crusher (2) that are used for smashing the silica on collecting box (1), fixedly connected with mounting bracket (3) on collecting box (1), be equipped with the filter mechanism who is used for filtering the silica in collecting box (1), subaerial fixedly connected with conveying cylinder (5) in the left side of collecting box (1), be equipped with in conveying cylinder (5) and be used for repeated kibbling conveying mechanism, fixedly connected with lower extreme open-ended installation section of thick bamboo (6) in collecting box (1), be equipped with the drive mechanism who is used for providing the required power of conveying mechanism in installation section of thick bamboo (6).
2. The semiconductor production crushing device according to claim 1, wherein the filtering mechanism comprises a pair of openings arranged on the collecting box (1), a filtering box (7) with a lower end provided with a hole is connected between the pair of openings in a sliding way, and a containing box (8) is arranged on the lower side of the collecting box (1).
3. The crushing device for the semiconductor production according to claim 2, wherein the conveying mechanism comprises a motor (9) fixedly connected to the mounting frame (3), a rotating shaft is fixedly connected to an output shaft of the motor (9) and rotatably connected with the bottom of the conveying cylinder (5), a helical blade (10) is fixedly connected to the rotating shaft, a discharge port is arranged at the left end of the filter box (7), a transfer box (11) matched with the discharge port is fixedly connected to the bearing plate, the transfer box (11) is communicated with the conveying cylinder (5) through a feed pipe, and the upper end of the conveying cylinder (5) conveys materials into the crusher (2) through a discharge pipe.
4. The crushing device for semiconductor production according to claim 3, wherein the transmission mechanism comprises a reciprocating lead screw (12) rotatably connected in the mounting cylinder (6), a lead screw sleeve slidably connected with the inner wall of the mounting cylinder (6) is arranged on the reciprocating lead screw (12), and a U-shaped rod (13) is fixedly connected on the lead screw sleeve.
5. The smashing device for semiconductor production according to claim 4, wherein an electric telescopic rod (14) is fixedly connected to the tail end of the U-shaped rod (13) through a connecting block, and a scraper (15) matched with the filter box (7) is fixedly connected to the telescopic tail end of the electric telescopic rod (14).
6. The smashing device for semiconductor production according to claim 4, wherein a transmission shaft (4) is rotatably connected to the mounting frame (3), belt pulleys (16) are fixedly connected to output shafts of the transmission shaft (4) and the motor (9), the two belt pulleys (16) are connected through a belt (17), a support frame (18) is fixedly connected to the right side wall of the collecting box (1), the right end of the filter box (7) is elastically connected with the support frame (18) through a spring (19), and two transmission plates (20) matched with the filter box (7) are fixedly connected to the lower end of the transmission shaft (4).
7. The crushing device for semiconductor production according to claim 6, wherein a first bevel gear (21) is fixedly connected to the left end of the reciprocating screw (12) through a connecting shaft, and a second bevel gear (22) meshed with the first bevel gear (21) is fixedly connected to the transmission shaft (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122096951.1U CN216172653U (en) | 2021-09-01 | 2021-09-01 | Reducing mechanism is used in semiconductor manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122096951.1U CN216172653U (en) | 2021-09-01 | 2021-09-01 | Reducing mechanism is used in semiconductor manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216172653U true CN216172653U (en) | 2022-04-05 |
Family
ID=80917597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122096951.1U Expired - Fee Related CN216172653U (en) | 2021-09-01 | 2021-09-01 | Reducing mechanism is used in semiconductor manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216172653U (en) |
-
2021
- 2021-09-01 CN CN202122096951.1U patent/CN216172653U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220405 |