CN216156000U

CN216156000U - Metal layer electroplating device for circuit processing

Info

Publication number: CN216156000U
Application number: CN202122138493.3U
Authority: CN
Inventors: 初亚东
Original assignee: Tewoo Gold Best Microelectronics Co ltd
Current assignee: Tewoo Gold Best Microelectronics Co ltd
Priority date: 2021-09-06
Filing date: 2021-09-06
Publication date: 2022-04-01
Anticipated expiration: 2031-09-06

Abstract

The utility model relates to the technical field of electroplating, in particular to a metal layer electroplating device for circuit processing, which comprises an electroplating table, wherein an electroplating pool is arranged on the upper surface of the electroplating table, a first fixing plate and a second fixing plate are respectively and fixedly arranged on two sides of the upper surface of the electroplating table, a sliding chute is arranged on one surface, close to the electroplating table, of the first fixing plate, a connecting plate is slidably arranged in the sliding chute, a servo motor is fixedly arranged on the upper surface of the electroplating table, the output end of the servo motor is connected with a lead screw, the lead screw is meshed and connected with a lead screw thread sleeve, and a storage mechanism is arranged on the connecting plate. Therefore, the electroplated metal in the storage box can be poured out, and the processing efficiency of the device is improved.

Description

Metal layer electroplating device for circuit processing

Technical Field

The utility model relates to the technical field of electroplating, in particular to a metal layer electroplating device for circuit processing.

Background

The development of the last decades has demonstrated that the evaporation process has the disadvantages of high environmental requirements, cumbersome process and high cost, but requires a dense thick metal layer for the chip to circuit connections. The electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing an electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing an electrolysis effect so as to prevent metal oxidation.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a metal layer electroplating device for circuit processing, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a device is electroplated to metal level for circuit processing, is including electroplating the platform, it is equipped with the electroplating pond to electroplate the platform upper surface, it has first fixed plate and second fixed plate to electroplate platform upper surface both sides fixed mounting respectively, the one side that first fixed plate is close to electroplating the platform is equipped with the spout, the inside slidable mounting of spout has the connecting plate, be equipped with the guide slot on the second fixed plate, the connecting plate passes the guide slot, the one end that first fixed plate was kept away from to the connecting plate is equipped with the lead screw swivel nut, it is equipped with servo motor admittedly to electroplate platform upper surface, the servo motor output is connected with the lead screw, the lead screw is connected with the meshing of lead screw swivel nut, install on the connecting plate and deposit the mechanism.

Preferably, the storage mechanism comprises a fixing rod mounted on a lower surface of the connecting plate.

Preferably, the fixing rod is provided with a storage box through a second lug plate, and the storage box is positioned right above the electroplating pool.

Preferably, one surface of the connecting plate, which is far away from the electroplating table, is provided with a first lug plate, and the first lug plate is provided with a hydraulic cylinder.

Preferably, a third lug plate is installed on one surface, far away from the electroplating table, of the storage box, and the output end of the hydraulic cylinder is arranged on the third lug plate.

Preferably, a box door is rotatably installed on one surface, far away from the third lug plate, of the storage box, and a second clamping plate is fixedly installed on the upper surface of the box door.

Preferably, the upper surface of the storage box is fixedly provided with a first clamping plate, and the first clamping plate is connected with a second clamping plate through a bolt.

Compared with the prior art, the utility model has the following beneficial effects:

(1) after electroplating work is accomplished, through depositing the case and from electroplating pool inside removal, at first open the chamber door, rotate through the dead lever because deposit the case front end and install on the connecting plate, thereby stretch out and draw back through the pneumatic cylinder output and can adjust the inclination of depositing the case to can empty out with the metal of depositing the inside electroplating of case, improved the machining efficiency of this device.

(2) Thereby rotate through the servo motor output and can drive the lead screw and rotate, thereby rotate through the lead screw and can drive the lead screw swivel nut and carry out round trip movement on the lead screw, thereby reciprocate through the lead screw swivel nut and can drive the connecting plate and reciprocate, thereby can drive and deposit the case and reciprocate, through depositing when the case removes the electroplating bath inside, thereby can electroplate the metal of depositing incasement portion, thereby do not need the staff to carry out pulling from top to bottom to depositing the case, alleviateed the labour.

Drawings

FIG. 1 is a schematic view of an overall structure of a metal layer electroplating apparatus for circuit processing according to the present invention;

FIG. 2 is a schematic rear view of a metal layer electroplating apparatus for circuit processing according to the present invention;

FIG. 3 is a schematic diagram of a front view of a metal layer electroplating apparatus for circuit processing according to the present invention;

FIG. 4 is a schematic diagram of a connection board of a metal layer electroplating apparatus for circuit processing according to the present invention.

In the figure: 1. an electroplating table; 2. a first fixing plate; 3. a connecting plate; 4. a second fixing plate; 5. a screw rod; 6. a servo motor; 7. an electroplating pool; 8. a storage mechanism; 801. a first ear plate; 802. a hydraulic cylinder; 803. a second ear panel; 804. fixing the rod; 805. a third ear panel; 806. a storage box; 807. a bolt; 808. a first splint; 809. a box door; 810. a second splint; 9. a chute; 10. a screw sleeve of the screw rod; 11. and a guide groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

As shown in fig. 1-4, a metal layer electroplating device for circuit processing comprises an electroplating table 1, wherein an electroplating pool 7 is arranged on the upper surface of the electroplating table 1, a first fixing plate 2 and a second fixing plate 4 are respectively and fixedly arranged on two sides of the upper surface of the electroplating table 1, a sliding groove 9 is arranged on one surface, close to the electroplating table 1, of the first fixing plate 2, a connecting plate 3 is slidably arranged inside the sliding groove 9, a guide groove 11 is formed in the second fixing plate 4, the connecting plate 3 penetrates through the guide groove 11, a screw rod thread sleeve 10 is arranged at one end, far away from the first fixing plate 2, of the connecting plate 3, a servo motor 6 is fixedly arranged on the upper surface of the electroplating table 1, the output end of the servo motor 6 is connected with a screw rod 5, the screw rod 5 is meshed with the screw rod thread sleeve 10, and a storage mechanism 8 is arranged on the connecting plate 3.

Through the technical scheme, firstly, metal to be electroplated is placed in the storage box 806, the output end of the servo motor 6 rotates to drive the screw rod 5 to rotate, the screw rod 5 rotates to drive the screw rod thread sleeve 10 to move back and forth on the screw rod 5, the screw rod thread sleeve 10 moves up and down to drive the connecting plate 3 to move up and down, so that the storage box 806 can be driven to move up and down, when the storage box 806 is moved into the electroplating pool 7, the metal in the storage box 806 can be electroplated, the working efficiency is improved, after the electroplating work is finished, the storage box 806 is moved out of the electroplating pool 7, the box door 809 is firstly opened, the front end of the storage box 806 is rotatably installed on the connecting plate 3 through the fixing rod 804, the output end of the hydraulic cylinder 802 stretches out and draws back to adjust the inclination angle of the storage box 806, therefore, the metal electroplated inside the storage box 806 can be poured out, the processing efficiency of the device is improved, and the labor force is reduced.

Wherein, deposit mechanism 8 and include dead lever 804, dead lever 804 is installed at connecting plate 3 lower surface, and dead lever 804 is installed through second otic placode 803 and is deposited case 806, deposits case 806 and is located directly over electroplating bath 7, thereby reciprocate through lead screw swivel nut 10 and can drive connecting plate 3 and reciprocate, thereby can drive and deposit case 806 and reciprocate, when removing electroplating bath 7 inside through depositing case 806, thereby can electroplate depositing the inside metal of case 806, improved work efficiency.

It should be noted that a first ear plate 801 is installed on one side of the connecting plate 3 away from the electroplating platform 1, a hydraulic cylinder 802 is installed on the first ear plate 801, a third ear plate 805 is installed on one side of the storage box 806 away from the electroplating platform 1, the output end of the hydraulic cylinder 802 is arranged on the third ear plate 805, a box door 809 is installed on one side of the storage box 806 away from the third ear plate 805 in a rotating mode, a second clamping plate 810 is fixedly installed on the upper surface of the box door 809, the storage box 806 is moved out of the electroplating pool 7, the box door 809 is opened at first, because the front end of the storage box 806 is rotatably installed on the connecting plate 3 through a fixing rod 804, the output end of the hydraulic cylinder 802 is extended and retracted, so that the inclination angle of the storage box 806 can be adjusted, and therefore metal electroplated inside the storage box 806 can be poured out, the processing efficiency of the device is improved, and labor force is reduced.

In a specific arrangement, a first clamping plate 808 is fixedly mounted on the upper surface of the storage box 806, the first clamping plate 808 is connected with a second clamping plate 810 through a bolt 807, and the first clamping plate 808 is connected with the second clamping plate 810 through the bolt 807, so that the box door 809 can be fixed on the storage box 806 and is easy to open and close.

The working principle of the metal layer electroplating device for circuit processing is as follows:

when the electroplating tank is used, firstly, metal to be electroplated is placed in the storage tank 806, the output end of the servo motor 6 rotates to drive the screw rod 5 to rotate, the screw rod 5 rotates to drive the screw rod thread sleeve 10 to move back and forth on the screw rod 5, the screw rod thread sleeve 10 moves up and down to drive the connecting plate 3 to move up and down, so that the storage tank 806 can be driven to move up and down, when the storage tank 806 is moved into the electroplating tank 7, the metal in the storage tank 806 can be electroplated, the working efficiency is improved, after the electroplating work is finished, the storage tank 806 is moved out of the electroplating tank 7, the tank door 809 is firstly opened, because the front end of the storage tank 806 is rotatably arranged on the connecting plate 3 through the fixing rod 804, the output end of the hydraulic cylinder 802 extends and retracts, so that the inclination angle of the storage tank 806 can be adjusted, therefore, the metal electroplated inside the storage box 806 can be poured out, the processing efficiency of the device is improved, and the labor force is reduced.

It should be noted that, the specific model of the servo motor 6 is YM5004-6, and the type selection needs to be determined according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a circuit processing is with metal level electroplating device, includes electroplating platform (1), its characterized in that: an electroplating pool (7) is arranged on the upper surface of the electroplating table (1), a first fixing plate (2) and a second fixing plate (4) are respectively and fixedly arranged on two sides of the upper surface of the electroplating table (1), one surface of the first fixing plate (2) close to the electroplating platform (1) is provided with a sliding chute (9), the connecting plate (3) is arranged in the sliding chute (9) in a sliding way, the second fixing plate (4) is provided with a guide groove (11), the connecting plate (3) passes through the guide groove (11), one end of the connecting plate (3) far away from the first fixing plate (2) is provided with a screw rod threaded sleeve (10), a servo motor (6) is fixedly arranged on the upper surface of the electroplating platform (1), the output end of the servo motor (6) is connected with a screw rod (5), the screw rod (5) is meshed with the screw rod thread sleeve (10), and the storage mechanism (8) is installed on the connecting plate (3).

2. The metal layer plating apparatus for circuit processing according to claim 1, wherein: the storage mechanism (8) comprises a fixing rod (804), and the fixing rod (804) is installed on the lower surface of the connecting plate (3).

3. The metal layer plating apparatus for circuit processing according to claim 2, wherein: the fixing rod (804) is provided with a storage box (806) through a second lug plate (803), and the storage box (806) is positioned right above the electroplating pool (7).

4. The metal layer plating apparatus for circuit processing according to claim 3, wherein: one side of the connecting plate (3) far away from the electroplating table (1) is provided with a first lug plate (801), and the first lug plate (801) is provided with a hydraulic cylinder (802).

5. The metal layer plating apparatus for circuit processing according to claim 4, wherein: one surface of the storage box (806) far away from the electroplating platform (1) is provided with a third lug plate (805), and the output end of the hydraulic cylinder (802) is arranged on the third lug plate (805).

6. The metal layer plating apparatus for circuit processing according to claim 3, wherein: one surface of the storage box (806) far away from the third ear plate (805) is rotatably provided with a box door (809), and the upper surface of the box door (809) is fixedly provided with a second clamping plate (810).

7. The metal layer plating apparatus for circuit processing according to claim 3, wherein: a first clamping plate (808) is fixedly installed on the upper surface of the storage box (806), and the first clamping plate (808) is connected with a second clamping plate (810) through a bolt (807).