CN216146480U - Heating circuit equipment of integrated circuit - Google Patents
Heating circuit equipment of integrated circuit Download PDFInfo
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- CN216146480U CN216146480U CN202122022838.9U CN202122022838U CN216146480U CN 216146480 U CN216146480 U CN 216146480U CN 202122022838 U CN202122022838 U CN 202122022838U CN 216146480 U CN216146480 U CN 216146480U
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- heating
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Abstract
The utility model relates to the technical field of integrated equipment and discloses integrated circuit heating circuit equipment which comprises a fixed plate, a fixed frame and an integrated circuit, wherein the bottom of the fixed frame is fixed with the top of the fixed plate, the bottom of the integrated circuit is fixed with the top of the fixed frame, a heating plate is fixedly arranged above the inner part of the fixed frame, a heating hole is formed in the top of the heating plate, and an electric heating wire is fixedly arranged on one side of the inner wall of the heating plate. According to the utility model, through the matching arrangement of the heating plate, the heating hole, the electric heating wire, the blower, the connecting pipe and the blowing cover, heat can be uniformly blown to the integrated circuit under the action of wind power, so that the heat is uniformly distributed on the integrated circuit, the excessive temperature difference between partial areas is avoided, the heating effect is improved, and through the arrangement of the heat-insulating layer, the heat in the fixing frame can be prevented from being rapidly dissipated, so that the waste of energy can be avoided.
Description
Technical Field
The utility model relates to the technical field of integrated equipment, in particular to heating circuit equipment of an integrated circuit.
Background
The integrated circuit is a miniature electronic device or component, and is made up by adopting a certain technological process, and the components of transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring are interconnected together, and made into a small piece or several small pieces of semiconductor wafer or medium substrate, then packaged in a tube shell so as to obtain the miniature structure with the required circuit function.
Heating circuit devices of some integrated circuits currently on the market:
(1) in the heating process, due to the reason that the heat of the existing heating circuit equipment is not uniformly dispersed, the temperature difference of partial areas on the integrated circuit is large, and the heating effect is poor.
We propose a heating circuit arrangement of an integrated circuit in order to solve the problems set out above.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In view of the above-mentioned shortcomings in the prior art, the present invention provides a heating circuit device for integrated circuits, so as to solve the problem of uneven heat dissipation of some heating circuit devices for integrated circuits currently on the market, which is proposed in the above-mentioned background art.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme:
the heating circuit equipment of the integrated circuit comprises a fixed plate, a fixed frame and the integrated circuit, wherein the bottom of the fixed frame is fixed with the top of the fixed plate, the bottom of the integrated circuit is fixed with the top of the fixed frame, a heating plate is fixedly arranged above the inner part of the fixed frame, and a heating hole is formed in the top of the heating plate;
the utility model discloses a heating plate, including the heating plate, the inner wall one side fixed mounting of heating plate has electric heating wire, the interior diapire fixed mounting of fixed frame has the hair-dryer, the top fixed mounting of hair-dryer has the connecting pipe, the top fixed mounting of connecting pipe has the blower housing, the outside of fixed frame is provided with the heat preservation.
Preferably, the inboard of fixed frame is provided with the inlayer, the inlayer has rock wool material to make, be provided with the vacuum layer between inlayer and the fixed frame.
Preferably, the bottom of integrated circuit is close to the top setting of hot plate, the quantity of heating hole has a plurality ofly, and is a plurality of the heating hole is the rectangular array and distributes.
Preferably, the number of the electric heating wires is multiple, the electric heating wires are arranged at equal intervals, and the electric heating wires are arranged close to the top of the air blowing cover.
Furthermore, the bottom of the heating plate is open, and the bottom of the heating plate and the top of the air blowing cover are positioned on the same horizontal plane.
(III) advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
(1) through the cooperation setting between hot plate, heating hole, electric heating wire, hair-dryer, connecting pipe, the cover of blowing, can be through the effect of wind with the even towards integrated circuit that blows of heat to make heat evenly distributed on integrated circuit, avoid the temperature difference between the subregion too big, thereby improved the heating effect.
(2) Through being equipped with the heat preservation, can prevent the quick scattering and disappearing of heat in the fixed frame to can avoid the waste of the energy.
Drawings
FIG. 1 is a schematic diagram of an overall front view of a heating circuit device of an integrated circuit according to the present invention;
FIG. 2 is a schematic perspective view of a fixing frame of the heating circuit device of the integrated circuit according to the present invention;
fig. 3 is a schematic sectional view of the entire heating circuit device of the integrated circuit of the present invention.
In the figure: 1. a fixing plate; 2. a fixing frame; 3. an integrated circuit; 4. heating plates; 5. heating the hole; 6. an electric heating wire; 7. a blower; 8. a connecting pipe; 9. a blower housing; 10. an inner layer; 11. a heat-insulating layer; 12. and (4) a vacuum layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a heating circuit apparatus for an integrated circuit; the integrated circuit fixing device comprises a fixing plate 1, a fixing frame 2 and an integrated circuit 3, wherein the bottom of the fixing frame 2 is fixed with the top of the fixing plate 1, the bottom of the integrated circuit 3 is fixed with the top of the fixing frame 2, the width of the integrated circuit 3 is smaller than that of the fixing frame 2, a heating plate 4 is fixedly arranged above the inner part of the fixing frame 2, the heating plate 4 is made of aluminum alloy material, and a heating hole 5 is formed in the top of the heating plate 4;
an electric heating wire 6 is fixedly installed on one side of the inner wall of the heating plate 4, a plurality of hair dryers 7 are fixedly installed on the inner bottom wall of the fixing frame 2, the hair dryers 7 are arranged at equal intervals, a connecting pipe 8 is fixedly installed at the top end of each hair dryer 7, a blowing cover 9 is fixedly installed at the top end of each connecting pipe 8, and a heat preservation layer 11 is arranged on the outer side of the fixing frame 2;
according to the illustration in fig. 3, as a preferred embodiment of the present invention: an inner layer 10 is arranged on the inner side of the fixing frame 2, the inner layer 10 is made of rock wool materials, a vacuum layer 12 is arranged between the inner layer 10 and the fixing frame 2, and the heat preservation effect can be further improved by arranging the vacuum layer 12;
according to the illustration in fig. 3, as a preferred embodiment of the present invention: the bottom of the integrated circuit 3 is arranged close to the top of the heating plate 4, a plurality of heating holes 5 are arranged, and the plurality of heating holes 5 are distributed in a rectangular array;
according to the illustration in fig. 3, as a preferred embodiment of the present invention: the number of the electric heating wires 6 is multiple, the electric heating wires 6 are arranged at equal intervals, and the electric heating wires 6 are arranged close to the top of the air blowing cover 9;
according to the illustration in fig. 3, as a preferred embodiment of the present invention: the bottom of the heating plate 4 is open, and the bottom of the heating plate 4 and the top of the blowing cover 9 are in the same horizontal plane.
The working principle of the embodiment is as follows: when the heating circuit device of the integrated circuit is used, as shown in fig. 1-3, the whole device is composed of a fixing plate 1, a fixing frame 2 and an integrated circuit 3, when heating, an electric heating wire 6 is started to preheat, after preheating is finished, a blower 7 is started, at the moment, air blown out by the blower 7 is blown to the inside of a heating plate 4 through a blower cover 9 on a connecting pipe 8, when air passes through the electric heating wire 6, is heated and is blown onto the integrated circuit 3 through a heating hole 5, so that heat is uniformly sent to the integrated circuit 3, which is the working process of the whole device, and the content which is not described in detail in the specification belongs to the prior art known by professionals in the field.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be noted that, in the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, may be fixedly connected or detachably connected; or indirectly through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations; it will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.
Claims (5)
1. The heating circuit equipment of the integrated circuit comprises a fixing plate (1), a fixing frame (2) and the integrated circuit (3), and is characterized in that the bottom of the fixing frame (2) is fixed with the top of the fixing plate (1), the bottom of the integrated circuit (3) is fixed with the top of the fixing frame (2), a heating plate (4) is fixedly installed above the inside of the fixing frame (2), and a heating hole (5) is formed in the top of the heating plate (4);
inner wall one side fixed mounting of hot plate (4) has electric heating wire (6), the interior diapire fixed mounting of fixed frame (2) has hair-dryer (7), the top fixed mounting of hair-dryer (7) has connecting pipe (8), the top fixed mounting of connecting pipe (8) has blower housing (9), the outside of fixed frame (2) is provided with heat preservation (11).
2. A heating circuit arrangement of an integrated circuit according to claim 1, characterized in that the inner side of the fixed frame (2) is provided with an inner layer (10), the inner layer (10) being made of rock wool material, and that a vacuum layer (12) is arranged between the inner layer (10) and the fixed frame (2).
3. A heating circuit device of an integrated circuit according to claim 1, characterized in that the bottom of the integrated circuit (3) is arranged close to the top of the heating plate (4), the number of the heating holes (5) is plural, and the plural heating holes (5) are distributed in a rectangular array.
4. A heating circuit device of an integrated circuit according to claim 1, characterized in that said electric heating wires (6) are provided in plurality, a plurality of said electric heating wires (6) are arranged in equal distance, said electric heating wires (6) are arranged near the top of the blower housing (9).
5. A heating circuit device of an integrated circuit according to claim 1, characterized in that the bottom of the heating plate (4) is open, and the bottom of the heating plate (4) is at the same level as the top of the blower housing (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122022838.9U CN216146480U (en) | 2021-08-26 | 2021-08-26 | Heating circuit equipment of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122022838.9U CN216146480U (en) | 2021-08-26 | 2021-08-26 | Heating circuit equipment of integrated circuit |
Publications (1)
Publication Number | Publication Date |
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CN216146480U true CN216146480U (en) | 2022-03-29 |
Family
ID=80808143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202122022838.9U Active CN216146480U (en) | 2021-08-26 | 2021-08-26 | Heating circuit equipment of integrated circuit |
Country Status (1)
Country | Link |
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CN (1) | CN216146480U (en) |
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2021
- 2021-08-26 CN CN202122022838.9U patent/CN216146480U/en active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221024 Address after: No. 305 (A01), Building 1, No. 606, South Second Section, Second Ring Road, Jiangyang District, Luzhou, Sichuan 646000 Patentee after: Sichuan Zhongjing Smart Technology Co.,Ltd. Address before: 056003 unit 1, building 7, Jinzeyuan phase II, No. 168, Fengze Road, Fuxing District, Handan City, Hebei Province Patentee before: Yuan Qing |
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TR01 | Transfer of patent right |